WO2011068114A1 - Illumination apparatus - Google Patents

Illumination apparatus Download PDF

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Publication number
WO2011068114A1
WO2011068114A1 PCT/JP2010/071440 JP2010071440W WO2011068114A1 WO 2011068114 A1 WO2011068114 A1 WO 2011068114A1 JP 2010071440 W JP2010071440 W JP 2010071440W WO 2011068114 A1 WO2011068114 A1 WO 2011068114A1
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Prior art keywords
substrate
lighting device
cover
ceiling
led
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PCT/JP2010/071440
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French (fr)
Japanese (ja)
Inventor
貴仁 大野
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三洋電機株式会社
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Publication of WO2011068114A1 publication Critical patent/WO2011068114A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an illumination device equipped with a light emitting element such as an LED.
  • the lighting device equipped with such an LED has been attracting attention because it has features such that it consumes less power than a conventional fluorescent lamp and further has a long durability time.
  • Patent Literature 1 discloses a straight tube equipped with LEDs in which a gap for heat radiation is formed between mounting substrates. A lighting device of the type is described.
  • the straight tube type lighting device mounted with the LED as shown in the cited document 1 is heavier than the conventional fluorescent tube, and a resin is used for the cylindrical cover, and the structure is supported at both ends in the longitudinal direction. Therefore, when attached to the ceiling or the like, the center part in the longitudinal direction of the cover of the lighting device may be slightly bent downward due to the weight of the cover itself or the LED substrate incorporated therein.
  • the fluorescent lamps appear to bend downward, especially when a plurality of lamps are arranged side by side in a large room, and appear to be wavy in the longitudinal direction, resulting in a very poor appearance. .
  • the illumination device according to claim 1 includes a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate. And the longitudinal center part of the cover of the lighting device is formed to warp in the ceiling direction.
  • the lighting device according to claim 2 is a lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate, and the center of the cover and the substrate in the longitudinal direction of the substrate. The portion is formed so as to warp in the ceiling direction.
  • the illumination device comprising: a substrate on which a plurality of semiconductor light emitting elements are mounted; a heat sink connected to the substrate; and a cylindrical cover that wraps the substrate and the heat sink.
  • substrate of the said illuminating device, the said heat sink, and the said cover is formed so that it may warp in the ceiling direction.
  • the lighting device according to claim 4 is a lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate, and a central portion in the longitudinal direction of the cover of the lighting device includes: It is formed so as to be warped in a ceiling direction and a direction perpendicular to the substrate.
  • the lighting device of the present invention has a structure slightly bent upward from the beginning (at the time of shipment from the factory), the lighting device having the LED mounted thereon is attached to the ceiling, and the weight of the cover itself or the built-in LED substrate, etc. As a result, even if the central portion of the lighting device is bent slightly downward, substantially no bending occurs, and the problem that the lighting device appears to bend toward the ground can be avoided.
  • FIG. 2 is a cross-sectional view taken along the line A-A ′ of FIG. It is sectional drawing which shows another cylindrical cover shape.
  • a straight tube fluorescent lamp type illumination device equipped with an LED is implemented.
  • the illumination device has a structure in which a semiconductor light emitting element such as an LED is installed and supported at both ends in the longitudinal direction.
  • a semiconductor light emitting element such as an LED
  • an illuminating device having a cylindrical cover with a cross-section of the cross section as shown in FIGS.
  • FIG. 1 is a perspective view of an illumination device that is the device of this embodiment.
  • the apparatus of this embodiment includes a cylindrical main body cover 1 made of, for example, polycarbonate, which incorporates an LED substrate 4 on which a plurality of LEDs are mounted and a heat sink 5 (not shown in FIG. 1), and a main body cover 1. It consists of a terminal cover 2 and terminals 3 formed at both ends. The user can use the lighting device by inserting the terminal 3 of the lighting device into a socket arranged on the ceiling in the same manner as a normal fluorescent lamp.
  • FIG. 2 is a side view of the apparatus of this embodiment as viewed from the side. In FIG.
  • the apparatus of this embodiment has a length (a) in the longitudinal direction of about 1198 mm, and the length (b) in the longitudinal direction is about 1212.6 mm when the terminals 3 at both ends are included.
  • the diameter (c) of the terminal cover 2 portion is about 32.5 mm.
  • 3A is a top view of the LED board 4 mounted in the main body cover 1 of the apparatus of the present embodiment
  • FIG. 3B is a side view of the LED board 4, the heat sink 5 and the power supply board 6.
  • FIG. . In FIG. 3, an LED substrate 4 on which a plurality of LED chips 7 are mounted is disposed on the upper surface of the heat radiating plate 5, while a power supply substrate 6 is disposed on the back surface of the heat radiating plate 5.
  • FIG. 4 is a cross-sectional view (a cross-sectional view taken along the line AA ′ in FIG. 1) of the illuminating device which is the apparatus of this embodiment.
  • the LED substrate 4 on which a plurality of LED chips 7 are mounted is disposed on the heat radiating plate 5, and both sides of the heat radiating plate 5 (the side in the left-right direction in FIG. 4) are disposed inside the main body cover 1.
  • the two concave portions 8 are fitted.
  • a power supply substrate 6 is disposed on the rear surface side of the heat sink 5 (the surface side opposite to the surface on which the LED substrate 4 is disposed).
  • the recess 8 extends inside the main body cover 1 toward the longitudinal direction of the main body cover 1.
  • the central portion in the longitudinal direction of the main body cover 1 is previously warped toward the ceiling so that the lighting device warps toward the ceiling. That is, from the central portion (portion B in FIG. 1) of the main body cover 1 shown in FIG. 1 to the ceiling direction (the direction of the arrow in FIG. 1, ie, the direction in which the LED chip 7 is mounted with reference to the LED substrate 4). Is warped by about 3 mm toward the opposite direction). For this reason, the illumination device has an inclination angle of about 0.5 to 0.6 degrees with respect to a line parallel to the ceiling from the point B toward both ends of the illumination device. 1 and 2, the main body cover 1 has a straight shape.
  • the main body cover 1 shown in FIG. The shape is not shown.
  • the value of the warp is as small as 3 mm, when the illumination device is viewed from a distant position, it appears as if it is not warped at all.
  • a force that warps the heat sink 5 and the LED substrate 4 is applied so as to match the warpage of the main body cover 1.
  • the heat radiating plate 5 made of metal is made thin to the extent that heat dissipation is not impaired, thereby contributing to the weight reduction of the entire lighting device.
  • the heat sink 5 itself attached in the main body cover 1 does not have a large rigidity, and has a large resistance along the concave portion 8 of the main body cover 1 that is formed by bending in advance when inserted into the main body cover 1. It will warp without.
  • the lighting device since the lighting device is installed, the lighting device originally warps in the ceiling direction even if the lighting device (particularly the central portion in the longitudinal direction) is applied with a downward force due to its own weight (about 400 grams). Therefore, the lighting device does not have a shape that warps in the direction of the ground.
  • the cylindrical main body cover 1 is warped in the ceiling direction in advance.
  • the cylindrical shape is easier to increase the rigidity (without increasing the weight) than the plate shape.
  • the lighting device that is arranged on the ceiling and illuminates the direction of the ground is shown.
  • the warping direction provided in advance may be the ceiling direction (however, the LED substrate) 4 is a direction opposite to that of the present embodiment, that is, the same direction as the direction in which the LED chip 7 is mounted).
  • the warping direction provided in advance is the ceiling direction, and may be a direction opposite to the warping direction due to its own weight.
  • warpage since the amount of warpage due to its own weight when illuminating in an oblique direction is small, warpage will remain when installed, but the amount of warpage provided in advance is originally small as described above and is not noticeable visually, so warpage remains. It doesn't matter.
  • the direction in which the weight is applied when the lighting device is installed (that is, the direction of gravity) is expressed as the ground direction, and the opposite direction is expressed as the ceiling direction.
  • the length of the warp was 3mm because it was experimentally found that 3 mm was the best mode. However, if the length of the warp is in the range of about 2.0 mm to 4.5 mm, it is installed. It has been experimentally found that even if a deflection due to its own weight occurs later, the deflection as a lighting device is not visually recognized.
  • the amount of warpage provided in advance is less than the amount of warpage when the warp is not provided in advance, about 6 to 10 mm.
  • the present invention can be applied even when various installation angles are used as described above.
  • the main body cover 1 is previously deflected in the ceiling direction, but the LED substrate 4 and the heat radiating plate 5 may be previously warped in the ceiling direction.
  • the power supply board 6 is mounted inside the main body cover 1, but the present invention can be similarly applied to a structure in which a power source is mounted outside the main body cover 1.
  • polycarbonate is used as the main body cover 1, but acrylic, ABS resin, or the like may be used.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Provided is an LED-equipped illumination apparatus which will not bend downwards from the weight of LED substrates. The illumination apparatus is equipped with a substrate (4) upon which a plurality of LED chips (7), which are semiconductor light emitting elements, are installed; and a body cover (1) which covers the substrate (4), the body cover (1) of the illumination apparatus formed such that the central portion thereof is warped 3 mm in the ceiling direction.

Description

照明装置Lighting device
　本発明はＬＥＤ等の発光素子を搭載した照明装置に関する。 The present invention relates to an illumination device equipped with a light emitting element such as an LED.
　近年では、従来の蛍光灯に代わる照明装置として、ＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）を搭載した照明装置が製品化されている。 In recent years, lighting devices equipped with LEDs (Light Emitting Diodes) have been commercialized as lighting devices replacing conventional fluorescent lamps.
　このようなＬＥＤを搭載した照明装置は、従来の蛍光灯に比べて消費電力が少なく、更には耐久時間が長いといった特徴を持っており、注目を浴びている。 The lighting device equipped with such an LED has been attracting attention because it has features such that it consumes less power than a conventional fluorescent lamp and further has a long durability time.
　又、このＬＥＤを搭載した照明装置について数多くの技術が特許文献にて公開されており、例えば特許文献１には、放熱を行う為の空隙を取付基板間に形成した、ＬＥＤを搭載した直管型の照明装置が記載されている。 In addition, a number of techniques for lighting devices equipped with LEDs are disclosed in patent literature. For example, Patent Literature 1 discloses a straight tube equipped with LEDs in which a gap for heat radiation is formed between mounting substrates. A lighting device of the type is described.
特開２００９－２６６４３２号公報JP 2009-266432 A
しかしながら、引用文献１に示すようなＬＥＤを搭載した直管型の照明装置は、従来の蛍光管に比べ重く、円筒状のカバーには樹脂が用いられ、その長手方向の両端で支持される構造であるため、天井等に取り付けるとカバー自体や内蔵されるＬＥＤの基板等の自重により照明装置のカバーの長手方向中央部分が僅かに下方へ撓む場合がある。ここで、カバーや内蔵される基板等の剛性を高くすることで、斯かる撓みを抑えることも可能であるが、照明装置自体の重量増加につながるため、落下時等の危険性や取扱性の観点から、十分な剛性を確保することと軽量化の両立は困難である。
このような撓みが生じると、蛍光灯が下方に向かって曲がって見えてしまい、特に大きな部屋で複数並べて配置する場合、長手方向に波打ったように見え、非常に見栄えが悪いといった問題が生じる。 However, the straight tube type lighting device mounted with the LED as shown in the cited document 1 is heavier than the conventional fluorescent tube, and a resin is used for the cylindrical cover, and the structure is supported at both ends in the longitudinal direction. Therefore, when attached to the ceiling or the like, the center part in the longitudinal direction of the cover of the lighting device may be slightly bent downward due to the weight of the cover itself or the LED substrate incorporated therein. Here, it is possible to suppress such bending by increasing the rigidity of the cover and the built-in substrate, etc., but this leads to an increase in the weight of the lighting device itself. From the viewpoint, it is difficult to ensure sufficient rigidity and reduce the weight.
When such a bending occurs, the fluorescent lamps appear to bend downward, especially when a plurality of lamps are arranged side by side in a large room, and appear to be wavy in the longitudinal direction, resulting in a very poor appearance. .
本発明はこのような課題を解決するためのものであり、請求項１に記載の照明装置は、半導体発光素子を複数搭載した基板と当該基板を包み込む筒状のカバーと、を搭載した照明装置であり、前記照明装置の前記カバーの長手方向中央部分が天井方向に反っているように形成されていることを特徴とする。
請求項２に記載の照明装置は、半導体発光素子を複数搭載した基板と当該基板を包み込む筒状のカバーと、を搭載した照明装置であり、前記照明装置の前記カバー及び前記基板の長手方向中央部分が天井方向に反っているように形成されていることを特徴とする。
請求項３に記載の照明装置は、半導体発光素子を複数搭載した基板と、当該基板に接続された放熱板と、前記基板と前記放熱板とを包み込む筒状のカバーと、を搭載した照明装置であり、前記照明装置の前記基板と前記放熱板と前記カバーの長手方向中央部分が天井方向に反っているように形成されていることを特徴とする。
請求項４に記載の照明装置は、半導体発光素子を複数搭載した基板と当該基板を包み込む筒状のカバーと、を搭載した照明装置であり、前記照明装置の前記カバーの長手方向中央部分が、天井方向であって、前記基板に垂直な方向に反っているように形成されていることを特徴とする。 The present invention is for solving such a problem, and the illumination device according to claim 1 includes a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate. And the longitudinal center part of the cover of the lighting device is formed to warp in the ceiling direction.
The lighting device according to claim 2 is a lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate, and the center of the cover and the substrate in the longitudinal direction of the substrate. The portion is formed so as to warp in the ceiling direction.
The illumination device according to claim 3, comprising: a substrate on which a plurality of semiconductor light emitting elements are mounted; a heat sink connected to the substrate; and a cylindrical cover that wraps the substrate and the heat sink. The longitudinal direction center part of the board | substrate of the said illuminating device, the said heat sink, and the said cover is formed so that it may warp in the ceiling direction.
The lighting device according to claim 4 is a lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate, and a central portion in the longitudinal direction of the cover of the lighting device includes: It is formed so as to be warped in a ceiling direction and a direction perpendicular to the substrate.
本発明の照明装置は、初め（工場出荷時）から上方へわずかに撓んだ構造であるために、ＬＥＤを搭載した照明装置を天井に取り付け、カバー自体や内蔵されるＬＥＤの基板等の自重により照明装置の中央部分が僅かに下方へ撓んでも、実質的には略撓みのない状態となり、照明装置が地面方向に向かって撓んで見えるといった問題を回避できる。 Since the lighting device of the present invention has a structure slightly bent upward from the beginning (at the time of shipment from the factory), the lighting device having the LED mounted thereon is attached to the ceiling, and the weight of the cover itself or the built-in LED substrate, etc. As a result, even if the central portion of the lighting device is bent slightly downward, substantially no bending occurs, and the problem that the lighting device appears to bend toward the ground can be avoided.
本発明を適用してなる実施例装置の斜視図である。It is a perspective view of the Example apparatus formed by applying this invention. 本実施例装置の側面図である。It is a side view of a present Example apparatus. 本実施例装置における内部機構の上面図と側面図である。It is the upper side figure and side view of an internal mechanism in a present Example apparatus. 本実施例装置の図１のＡ－Ａ’線断面図である。FIG. 2 is a cross-sectional view taken along the line A-A ′ of FIG. 他の筒状カバー形状を示す断面図である。It is sectional drawing which shows another cylindrical cover shape.
　次に、本発明を適用してなる一実施例について詳細に説明する。本実施例装置では、ＬＥＤを搭載した直管蛍光灯型の照明装置について実施するが、ＬＥＤ等の半導体発光素子を搭載し、長手方向の両端で支持される構造の照明装置であれば、直管蛍光灯型以外、例えば、図５（ａ）（ｂ）に示すような、断面カマボコ状の筒状カバーを備えた照明装置についても同様に実施可能である。 Next, an embodiment to which the present invention is applied will be described in detail. In this embodiment apparatus, a straight tube fluorescent lamp type illumination device equipped with an LED is implemented. However, if the illumination device has a structure in which a semiconductor light emitting element such as an LED is installed and supported at both ends in the longitudinal direction, Other than the tube fluorescent lamp type, for example, an illuminating device having a cylindrical cover with a cross-section of the cross section as shown in FIGS.
図１は本実施例装置である照明装置の斜視図を示している。図１において、本実施例装置は、ＬＥＤを複数搭載したＬＥＤ基板４と放熱板５（図１中には図示せず）を内蔵した例えばポリカーボネイトからなる円筒状の本体カバー１と、本体カバー１両端に形成された端子カバー２及び端子３からなる。
ユーザはこの照明装置の端子３を通常の蛍光灯と同じように、天井に配置されているソケットに挿入することにより、使用することが可能である。
図２は本実施例装置を横から見た側面図である。図２において、本実施例装置は　長手方向の長さ（ａ）が約１１９８ｍｍ、両端の端子３を含めると　長手方向の長さ（ｂ）が約１２１２．６ｍｍである。又、端子カバー２部分の直径（ｃ）は約３２．５ｍｍである。
図３（ａ）は、本実施例装置の本体カバー１内部に搭載されているＬＥＤ基板４の上面図、図３（ｂ）はＬＥＤ基板４と放熱板５と電源基板６の側面図である。図３において、放熱板５の上面には複数のＬＥＤチップ７が搭載されたＬＥＤ基板４が配置され、一方、放熱板５の裏面には電源基板６が配置されている。
図４は、本実施例装置である照明装置の断面図（図１のＡ－Ａ’線の断面図）を示している。図４において、ＬＥＤチップ７を複数搭載したＬＥＤ基板４が放熱板５上に配置され、この放熱板５は、その両側（図４中左右方向の側）が本体カバー１の内側に配置された２つの凹部８に嵌合されている。更に放熱板５の裏面側（ＬＥＤ基板４の配置されている面と反対の面側）には、電源基板６が配置されている。尚、凹部８は本体カバー１内側の、本体カバー１の長手方向に向かって延在している。
本実施例装置では、この照明装置を天井に配置した際に、照明装置が天井側に反るように、予め本体カバー１の長手方向中央部分を天井方向に向かって反った構造としている。即ち、図１に示す本体カバー１の中央部分（図１中Ｂの部分）から天井方向（図１中矢印の方向、即ち、ＬＥＤ基板４を基準にしてＬＥＤチップ７が搭載されている方向とは反対の方向）に向かって約３ｍｍ程反っている。この為、照明装置は、点Ｂから照明装置の両端へ向かい、天井と並行する線に対して約０．５～０．６度の傾斜角を有している。
尚、図１及び図２を見ると本体カバー１は直線な形状となっているが、反りの長さが上述したように約３ｍｍと非常に小さいため、図に示す本体カバー１ではあえてその反った形状は図示していない。換言すれば、３ｍｍという非常に小さい反りの値であるために、離れた位置から照明装置を一見すると、あたかも全く反っていないように見える。
このように照明装置の本体カバー１を反らすことにより、本体カバー１の反りに合わせるように、放熱板５とＬＥＤ基板４も（天井方向に）反るような力が加わる。ここで、金属からなる放熱板５は、放熱性が損なわれない程度に薄くして、照明装置全体の重量の軽量化に寄与させている。このため、本体カバー１内に取り付けられる放熱板５自体は大きな剛性を持たず、本体カバー１への挿入時には、予め反らせて形成されている本体カバー１の凹部８に沿って、大きな抵抗を持つことなく反ることとなる。
以上の構成により、照明装置の設置後に、照明装置の自重（約４００グラム）により照明装置（特にその長手方向中央部分）に地面方向に下がる力が加わっても、元々照明装置が天井方向に反っているために照明装置が地面方向に反った形状とならない。
本実施例においては、円筒状の本体カバー１を予め天井方向に反らしている。これは、筒状形状の方が、板状形状よりも（重量を増やすことなく）剛性を高めやすいことに基づく。
本実施例では、天井に配置して地面方向を照らす照明装置を示したが、床面に設置し、天井方向を照らす照明装置においても、予め設ける反り方向は天井方向で良い（但し、ＬＥＤ基板４を基準にして見た場合は、本実施例と反対方向、即ち、ＬＥＤチップ７が搭載されている方向と同一の方向となる）。 FIG. 1 is a perspective view of an illumination device that is the device of this embodiment. In FIG. 1, the apparatus of this embodiment includes a cylindrical main body cover 1 made of, for example, polycarbonate, which incorporates an LED substrate 4 on which a plurality of LEDs are mounted and a heat sink 5 (not shown in FIG. 1), and a main body cover 1. It consists of a terminal cover 2 and terminals 3 formed at both ends.
The user can use the lighting device by inserting the terminal 3 of the lighting device into a socket arranged on the ceiling in the same manner as a normal fluorescent lamp.
FIG. 2 is a side view of the apparatus of this embodiment as viewed from the side. In FIG. 2, the apparatus of this embodiment has a length (a) in the longitudinal direction of about 1198 mm, and the length (b) in the longitudinal direction is about 1212.6 mm when the terminals 3 at both ends are included. The diameter (c) of the terminal cover 2 portion is about 32.5 mm.
3A is a top view of the LED board 4 mounted in the main body cover 1 of the apparatus of the present embodiment, and FIG. 3B is a side view of the LED board 4, the heat sink 5 and the power supply board 6. FIG. . In FIG. 3, an LED substrate 4 on which a plurality of LED chips 7 are mounted is disposed on the upper surface of the heat radiating plate 5, while a power supply substrate 6 is disposed on the back surface of the heat radiating plate 5.
FIG. 4 is a cross-sectional view (a cross-sectional view taken along the line AA ′ in FIG. 1) of the illuminating device which is the apparatus of this embodiment. In FIG. 4, the LED substrate 4 on which a plurality of LED chips 7 are mounted is disposed on the heat radiating plate 5, and both sides of the heat radiating plate 5 (the side in the left-right direction in FIG. 4) are disposed inside the main body cover 1. The two concave portions 8 are fitted. Further, a power supply substrate 6 is disposed on the rear surface side of the heat sink 5 (the surface side opposite to the surface on which the LED substrate 4 is disposed). The recess 8 extends inside the main body cover 1 toward the longitudinal direction of the main body cover 1.
In this embodiment device, when the lighting device is arranged on the ceiling, the central portion in the longitudinal direction of the main body cover 1 is previously warped toward the ceiling so that the lighting device warps toward the ceiling. That is, from the central portion (portion B in FIG. 1) of the main body cover 1 shown in FIG. 1 to the ceiling direction (the direction of the arrow in FIG. 1, ie, the direction in which the LED chip 7 is mounted with reference to the LED substrate 4). Is warped by about 3 mm toward the opposite direction). For this reason, the illumination device has an inclination angle of about 0.5 to 0.6 degrees with respect to a line parallel to the ceiling from the point B toward both ends of the illumination device.
1 and 2, the main body cover 1 has a straight shape. However, since the length of the warp is as small as about 3 mm as described above, the main body cover 1 shown in FIG. The shape is not shown. In other words, since the value of the warp is as small as 3 mm, when the illumination device is viewed from a distant position, it appears as if it is not warped at all.
By warping the main body cover 1 of the lighting device in this way, a force that warps the heat sink 5 and the LED substrate 4 (toward the ceiling) is applied so as to match the warpage of the main body cover 1. Here, the heat radiating plate 5 made of metal is made thin to the extent that heat dissipation is not impaired, thereby contributing to the weight reduction of the entire lighting device. For this reason, the heat sink 5 itself attached in the main body cover 1 does not have a large rigidity, and has a large resistance along the concave portion 8 of the main body cover 1 that is formed by bending in advance when inserted into the main body cover 1. It will warp without.
With the above configuration, even after the lighting device is installed, the lighting device originally warps in the ceiling direction even if the lighting device (particularly the central portion in the longitudinal direction) is applied with a downward force due to its own weight (about 400 grams). Therefore, the lighting device does not have a shape that warps in the direction of the ground.
In the present embodiment, the cylindrical main body cover 1 is warped in the ceiling direction in advance. This is based on the fact that the cylindrical shape is easier to increase the rigidity (without increasing the weight) than the plate shape.
In the present embodiment, the lighting device that is arranged on the ceiling and illuminates the direction of the ground is shown. However, even in the lighting device that is installed on the floor and illuminates the ceiling direction, the warping direction provided in advance may be the ceiling direction (however, the LED substrate) 4 is a direction opposite to that of the present embodiment, that is, the same direction as the direction in which the LED chip 7 is mounted).
　又、斜め下方や斜め上方に照らす場合、即ち、ＬＥＤ基板４や放熱板５の平面が、鉛直方向（重力方向）から傾斜して設置される場合では、自重による反りの方向は、地面方向であって、ＬＥＤ基板４や放熱板５の平面に垂直な方向となる。従って、予め設ける反り方向は、天井方向であって、自重による反り方向とは反対の方向とすれば良い。尚、斜め方向に照らす場合の自重による反り量は小さくなるため、設置した場合に反りが残ることになるが、予め設ける反り量は上述の通り元々小さく、目視では目立たないため、反りが残っていても問題とならない。 Further, when illuminating diagonally downward or diagonally upward, that is, when the plane of the LED board 4 or the heat sink 5 is installed inclined from the vertical direction (gravity direction), the direction of warping due to its own weight is the ground direction. Thus, the direction is perpendicular to the plane of the LED substrate 4 and the heat sink 5. Therefore, the warping direction provided in advance is the ceiling direction, and may be a direction opposite to the warping direction due to its own weight. In addition, since the amount of warpage due to its own weight when illuminating in an oblique direction is small, warpage will remain when installed, but the amount of warpage provided in advance is originally small as described above and is not noticeable visually, so warpage remains. It doesn't matter.
　尚、本発明では、便宜上、照明装置が設置されたときの自重の掛かる方向（即ち、重力方向）を地面方向と表現し、その反対方向を天井方向と表現している。 In the present invention, for convenience, the direction in which the weight is applied when the lighting device is installed (that is, the direction of gravity) is expressed as the ground direction, and the opposite direction is expressed as the ceiling direction.
　本実施例では、反りの長さが実験上、３ｍｍがベストモードであることが判明したために３ｍｍと記載したが、反りの長さは約２．０ｍｍ～４．５ｍｍの範囲内であれば設置後に自重による撓みを生じても、目視上、照明装置としての撓みが認識されないことが実験上判明した。この予め設ける反り量は、予め反りを設けなかった場合の反り量が６～１０ｍｍ程度に対し、少ない反り量で済み、加えて、設置後に反り量が残っていても、その量は予め設ける反り量より小さくなり、目視上、より目立たなくなる方向に進むだけであるので、上述のように設置の角度が種々用いられる場合であっても適用できるものである。
又、本実施例では本体カバー１を予め天井方向にそらす構造としたが、ＬＥＤ基板４や放熱板５も予め天井方向に反らした形状としても良い。
更に、以上の実施例では、電源基板６を本体カバー１内部に搭載したが、電源を本体カバー１外部に搭載した構造においても本発明を同様に適用することが可能である。
又、以上の実施例では、本体カバー１としてポリカーボネイトを使用したが、アクリル、ABS樹脂等を用いても良い。 In this embodiment, the length of the warp was 3mm because it was experimentally found that 3 mm was the best mode. However, if the length of the warp is in the range of about 2.0 mm to 4.5 mm, it is installed. It has been experimentally found that even if a deflection due to its own weight occurs later, the deflection as a lighting device is not visually recognized. The amount of warpage provided in advance is less than the amount of warpage when the warp is not provided in advance, about 6 to 10 mm. In addition, even if the amount of warpage remains after installation, the amount of warpage provided in advance Since it is smaller than the amount and only proceeds in a direction that is less noticeable visually, the present invention can be applied even when various installation angles are used as described above.
In the present embodiment, the main body cover 1 is previously deflected in the ceiling direction, but the LED substrate 4 and the heat radiating plate 5 may be previously warped in the ceiling direction.
Further, in the above embodiment, the power supply board 6 is mounted inside the main body cover 1, but the present invention can be similarly applied to a structure in which a power source is mounted outside the main body cover 1.
In the above embodiment, polycarbonate is used as the main body cover 1, but acrylic, ABS resin, or the like may be used.
１　本体カバー
２　端子カバー
３　端子
４　ＬＥＤ基板
５　放熱板
６　電源基板
７　ＬＥＤチップ
８　凹部
  DESCRIPTION OF SYMBOLS 1 Main body cover 2 Terminal cover 3 Terminal 4 LED board 5 Heat sink 6 Power supply board 7 LED chip 8 Recessed part

Claims (4)

  1. 半導体発光素子を複数搭載した基板と当該基板を包み込む筒状のカバーと、を搭載した照明装置であり、
    前記照明装置の前記カバーの長手方向中央部分が天井方向に反っているように形成されていることを特徴とする照明装置。     A lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate,
    The lighting device is characterized in that a central portion in the longitudinal direction of the cover of the lighting device is warped in a ceiling direction.
  2. 半導体発光素子を複数搭載した基板と当該基板を包み込む筒状のカバーと、を搭載した照明装置であり、
    前記照明装置の前記カバー及び前記基板の長手方向中央部分が天井方向に反っているように形成されていることを特徴とする照明装置。     A lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate,
    The illumination device, wherein the cover of the illumination device and a central portion in the longitudinal direction of the substrate are warped in a ceiling direction.
  3. 半導体発光素子を複数搭載したＬＥＤ基板と、当該ＬＥＤ基板に接続された放熱板と、前記基板と前記放熱板とを包み込む筒状のカバーと、を搭載した照明装置であり、
    前記照明装置の前記基板と前記放熱板と前記カバーの長手方向中央部分が天井方向に反っているように形成されていることを特徴とする照明装置。     An illumination device including an LED substrate on which a plurality of semiconductor light emitting elements are mounted, a heat dissipation plate connected to the LED substrate, and a cylindrical cover that wraps the substrate and the heat dissipation plate,
    The lighting device, wherein the substrate, the heat radiating plate, and the cover in the longitudinal direction center portion of the lighting device are warped in a ceiling direction.
  4. 半導体発光素子を複数搭載した基板と当該基板を包み込む筒状のカバーと、を搭載した照明装置であり、
    前記照明装置の前記カバーの長手方向中央部分が、天井方向であって、前記基板に垂直な方向に反っているように形成されていることを特徴とする照明装置。
          A lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate,
    The lighting device is characterized in that a central portion in the longitudinal direction of the cover of the lighting device is formed to be warped in a ceiling direction and a direction perpendicular to the substrate.
PCT/JP2010/071440 2009-12-03 2010-12-01 Illumination apparatus WO2011068114A1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD732234S1 (en) 2014-03-26 2015-06-16 Elite Lighting Body for light fixture
US9447949B2 (en) 2014-04-25 2016-09-20 Elite Lighting Light fixture
USD790753S1 (en) 2016-05-17 2017-06-27 Elite Lighting Body for a light fixture
USD797349S1 (en) 2016-05-17 2017-09-12 Elite Lighting Ballast room cover for a light fixture
JP2018107136A (en) * 2018-02-08 2018-07-05 三菱電機株式会社 Illumination lamp and luminaire

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Publication number Priority date Publication date Assignee Title
JPH08162677A (en) * 1994-12-05 1996-06-21 Nireco Corp Slender light source using light emitting diode
JP2002141555A (en) * 2000-10-31 2002-05-17 Hitachi Building Systems Co Ltd Led illumination lamp and method for manufacturing led illumination lamp
JP2008282793A (en) * 2007-04-09 2008-11-20 Lead Corporation:Kk Led type fluorescent lamp type illuminating device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08162677A (en) * 1994-12-05 1996-06-21 Nireco Corp Slender light source using light emitting diode
JP2002141555A (en) * 2000-10-31 2002-05-17 Hitachi Building Systems Co Ltd Led illumination lamp and method for manufacturing led illumination lamp
JP2008282793A (en) * 2007-04-09 2008-11-20 Lead Corporation:Kk Led type fluorescent lamp type illuminating device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD732234S1 (en) 2014-03-26 2015-06-16 Elite Lighting Body for light fixture
US9447949B2 (en) 2014-04-25 2016-09-20 Elite Lighting Light fixture
USD790753S1 (en) 2016-05-17 2017-06-27 Elite Lighting Body for a light fixture
USD797349S1 (en) 2016-05-17 2017-09-12 Elite Lighting Ballast room cover for a light fixture
JP2018107136A (en) * 2018-02-08 2018-07-05 三菱電機株式会社 Illumination lamp and luminaire

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