WO2011068114A1 - Illumination apparatus - Google Patents

Illumination apparatus Download PDF

Info

Publication number
WO2011068114A1
WO2011068114A1 PCT/JP2010/071440 JP2010071440W WO2011068114A1 WO 2011068114 A1 WO2011068114 A1 WO 2011068114A1 JP 2010071440 W JP2010071440 W JP 2010071440W WO 2011068114 A1 WO2011068114 A1 WO 2011068114A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
lighting device
direction
cover
led
Prior art date
Application number
PCT/JP2010/071440
Other languages
French (fr)
Japanese (ja)
Inventor
貴仁 大野
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2009-275529 priority Critical
Priority to JP2009275529 priority
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Publication of WO2011068114A1 publication Critical patent/WO2011068114A1/en

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

Provided is an LED-equipped illumination apparatus which will not bend downwards from the weight of LED substrates. The illumination apparatus is equipped with a substrate (4) upon which a plurality of LED chips (7), which are semiconductor light emitting elements, are installed; and a body cover (1) which covers the substrate (4), the body cover (1) of the illumination apparatus formed such that the central portion thereof is warped 3 mm in the ceiling direction.

Description

Lighting device

The present invention relates to an illumination device equipped with a light emitting element such as an LED.

In recent years, lighting devices equipped with LEDs (Light Emitting Diodes) have been commercialized as lighting devices replacing conventional fluorescent lamps.

The lighting device equipped with such an LED has been attracting attention because it has features such that it consumes less power than a conventional fluorescent lamp and further has a long durability time.

In addition, a number of techniques for lighting devices equipped with LEDs are disclosed in patent literature. For example, Patent Literature 1 discloses a straight tube equipped with LEDs in which a gap for heat radiation is formed between mounting substrates. A lighting device of the type is described.

JP 2009-266432 A

However, the straight tube type lighting device mounted with the LED as shown in the cited document 1 is heavier than the conventional fluorescent tube, and a resin is used for the cylindrical cover, and the structure is supported at both ends in the longitudinal direction. Therefore, when attached to the ceiling or the like, the center part in the longitudinal direction of the cover of the lighting device may be slightly bent downward due to the weight of the cover itself or the LED substrate incorporated therein. Here, it is possible to suppress such bending by increasing the rigidity of the cover and the built-in substrate, etc., but this leads to an increase in the weight of the lighting device itself. From the viewpoint, it is difficult to ensure sufficient rigidity and reduce the weight.
When such a bending occurs, the fluorescent lamps appear to bend downward, especially when a plurality of lamps are arranged side by side in a large room, and appear to be wavy in the longitudinal direction, resulting in a very poor appearance. .

The present invention is for solving such a problem, and the illumination device according to claim 1 includes a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate. And the longitudinal center part of the cover of the lighting device is formed to warp in the ceiling direction.
The lighting device according to claim 2 is a lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate, and the center of the cover and the substrate in the longitudinal direction of the substrate. The portion is formed so as to warp in the ceiling direction.
The illumination device according to claim 3, comprising: a substrate on which a plurality of semiconductor light emitting elements are mounted; a heat sink connected to the substrate; and a cylindrical cover that wraps the substrate and the heat sink. The longitudinal direction center part of the board | substrate of the said illuminating device, the said heat sink, and the said cover is formed so that it may warp in the ceiling direction.
The lighting device according to claim 4 is a lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate, and a central portion in the longitudinal direction of the cover of the lighting device includes: It is formed so as to be warped in a ceiling direction and a direction perpendicular to the substrate.

Since the lighting device of the present invention has a structure slightly bent upward from the beginning (at the time of shipment from the factory), the lighting device having the LED mounted thereon is attached to the ceiling, and the weight of the cover itself or the built-in LED substrate, etc. As a result, even if the central portion of the lighting device is bent slightly downward, substantially no bending occurs, and the problem that the lighting device appears to bend toward the ground can be avoided.

It is a perspective view of the Example apparatus formed by applying this invention. It is a side view of a present Example apparatus. It is the upper side figure and side view of an internal mechanism in a present Example apparatus. FIG. 2 is a cross-sectional view taken along the line A-A ′ of FIG. It is sectional drawing which shows another cylindrical cover shape.

Next, an embodiment to which the present invention is applied will be described in detail. In this embodiment apparatus, a straight tube fluorescent lamp type illumination device equipped with an LED is implemented. However, if the illumination device has a structure in which a semiconductor light emitting element such as an LED is installed and supported at both ends in the longitudinal direction, Other than the tube fluorescent lamp type, for example, an illuminating device having a cylindrical cover with a cross-section of the cross section as shown in FIGS.

FIG. 1 is a perspective view of an illumination device that is the device of this embodiment. In FIG. 1, the apparatus of this embodiment includes a cylindrical main body cover 1 made of, for example, polycarbonate, which incorporates an LED substrate 4 on which a plurality of LEDs are mounted and a heat sink 5 (not shown in FIG. 1), and a main body cover 1. It consists of a terminal cover 2 and terminals 3 formed at both ends.
The user can use the lighting device by inserting the terminal 3 of the lighting device into a socket arranged on the ceiling in the same manner as a normal fluorescent lamp.
FIG. 2 is a side view of the apparatus of this embodiment as viewed from the side. In FIG. 2, the apparatus of this embodiment has a length (a) in the longitudinal direction of about 1198 mm, and the length (b) in the longitudinal direction is about 1212.6 mm when the terminals 3 at both ends are included. The diameter (c) of the terminal cover 2 portion is about 32.5 mm.
3A is a top view of the LED board 4 mounted in the main body cover 1 of the apparatus of the present embodiment, and FIG. 3B is a side view of the LED board 4, the heat sink 5 and the power supply board 6. FIG. . In FIG. 3, an LED substrate 4 on which a plurality of LED chips 7 are mounted is disposed on the upper surface of the heat radiating plate 5, while a power supply substrate 6 is disposed on the back surface of the heat radiating plate 5.
FIG. 4 is a cross-sectional view (a cross-sectional view taken along the line AA ′ in FIG. 1) of the illuminating device which is the apparatus of this embodiment. In FIG. 4, the LED substrate 4 on which a plurality of LED chips 7 are mounted is disposed on the heat radiating plate 5, and both sides of the heat radiating plate 5 (the side in the left-right direction in FIG. 4) are disposed inside the main body cover 1. The two concave portions 8 are fitted. Further, a power supply substrate 6 is disposed on the rear surface side of the heat sink 5 (the surface side opposite to the surface on which the LED substrate 4 is disposed). The recess 8 extends inside the main body cover 1 toward the longitudinal direction of the main body cover 1.
In this embodiment device, when the lighting device is arranged on the ceiling, the central portion in the longitudinal direction of the main body cover 1 is previously warped toward the ceiling so that the lighting device warps toward the ceiling. That is, from the central portion (portion B in FIG. 1) of the main body cover 1 shown in FIG. 1 to the ceiling direction (the direction of the arrow in FIG. 1, ie, the direction in which the LED chip 7 is mounted with reference to the LED substrate 4). Is warped by about 3 mm toward the opposite direction). For this reason, the illumination device has an inclination angle of about 0.5 to 0.6 degrees with respect to a line parallel to the ceiling from the point B toward both ends of the illumination device.
1 and 2, the main body cover 1 has a straight shape. However, since the length of the warp is as small as about 3 mm as described above, the main body cover 1 shown in FIG. The shape is not shown. In other words, since the value of the warp is as small as 3 mm, when the illumination device is viewed from a distant position, it appears as if it is not warped at all.
By warping the main body cover 1 of the lighting device in this way, a force that warps the heat sink 5 and the LED substrate 4 (toward the ceiling) is applied so as to match the warpage of the main body cover 1. Here, the heat radiating plate 5 made of metal is made thin to the extent that heat dissipation is not impaired, thereby contributing to the weight reduction of the entire lighting device. For this reason, the heat sink 5 itself attached in the main body cover 1 does not have a large rigidity, and has a large resistance along the concave portion 8 of the main body cover 1 that is formed by bending in advance when inserted into the main body cover 1. It will warp without.
With the above configuration, even after the lighting device is installed, the lighting device originally warps in the ceiling direction even if the lighting device (particularly the central portion in the longitudinal direction) is applied with a downward force due to its own weight (about 400 grams). Therefore, the lighting device does not have a shape that warps in the direction of the ground.
In the present embodiment, the cylindrical main body cover 1 is warped in the ceiling direction in advance. This is based on the fact that the cylindrical shape is easier to increase the rigidity (without increasing the weight) than the plate shape.
In the present embodiment, the lighting device that is arranged on the ceiling and illuminates the direction of the ground is shown. However, even in the lighting device that is installed on the floor and illuminates the ceiling direction, the warping direction provided in advance may be the ceiling direction (however, the LED substrate) 4 is a direction opposite to that of the present embodiment, that is, the same direction as the direction in which the LED chip 7 is mounted).

Further, when illuminating diagonally downward or diagonally upward, that is, when the plane of the LED board 4 or the heat sink 5 is installed inclined from the vertical direction (gravity direction), the direction of warping due to its own weight is the ground direction. Thus, the direction is perpendicular to the plane of the LED substrate 4 and the heat sink 5. Therefore, the warping direction provided in advance is the ceiling direction, and may be a direction opposite to the warping direction due to its own weight. In addition, since the amount of warpage due to its own weight when illuminating in an oblique direction is small, warpage will remain when installed, but the amount of warpage provided in advance is originally small as described above and is not noticeable visually, so warpage remains. It doesn't matter.

In the present invention, for convenience, the direction in which the weight is applied when the lighting device is installed (that is, the direction of gravity) is expressed as the ground direction, and the opposite direction is expressed as the ceiling direction.

In this embodiment, the length of the warp was 3mm because it was experimentally found that 3 mm was the best mode. However, if the length of the warp is in the range of about 2.0 mm to 4.5 mm, it is installed. It has been experimentally found that even if a deflection due to its own weight occurs later, the deflection as a lighting device is not visually recognized. The amount of warpage provided in advance is less than the amount of warpage when the warp is not provided in advance, about 6 to 10 mm. In addition, even if the amount of warpage remains after installation, the amount of warpage provided in advance Since it is smaller than the amount and only proceeds in a direction that is less noticeable visually, the present invention can be applied even when various installation angles are used as described above.
In the present embodiment, the main body cover 1 is previously deflected in the ceiling direction, but the LED substrate 4 and the heat radiating plate 5 may be previously warped in the ceiling direction.
Further, in the above embodiment, the power supply board 6 is mounted inside the main body cover 1, but the present invention can be similarly applied to a structure in which a power source is mounted outside the main body cover 1.
In the above embodiment, polycarbonate is used as the main body cover 1, but acrylic, ABS resin, or the like may be used.

DESCRIPTION OF SYMBOLS 1 Main body cover 2 Terminal cover 3 Terminal 4 LED board 5 Heat sink 6 Power supply board 7 LED chip 8 Recessed part

Claims (4)

  1. A lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate,
    The lighting device is characterized in that a central portion in the longitudinal direction of the cover of the lighting device is warped in a ceiling direction.
  2. A lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate,
    The illumination device, wherein the cover of the illumination device and a central portion in the longitudinal direction of the substrate are warped in a ceiling direction.
  3. An illumination device including an LED substrate on which a plurality of semiconductor light emitting elements are mounted, a heat dissipation plate connected to the LED substrate, and a cylindrical cover that wraps the substrate and the heat dissipation plate,
    The lighting device, wherein the substrate, the heat radiating plate, and the cover in the longitudinal direction center portion of the lighting device are warped in a ceiling direction.
  4. A lighting device including a substrate on which a plurality of semiconductor light emitting elements are mounted and a cylindrical cover that wraps the substrate,
    The lighting device is characterized in that a central portion in the longitudinal direction of the cover of the lighting device is formed to be warped in a ceiling direction and a direction perpendicular to the substrate.
PCT/JP2010/071440 2009-12-03 2010-12-01 Illumination apparatus WO2011068114A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009-275529 2009-12-03
JP2009275529 2009-12-03

Publications (1)

Publication Number Publication Date
WO2011068114A1 true WO2011068114A1 (en) 2011-06-09

Family

ID=44114960

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/071440 WO2011068114A1 (en) 2009-12-03 2010-12-01 Illumination apparatus

Country Status (1)

Country Link
WO (1) WO2011068114A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD732234S1 (en) 2014-03-26 2015-06-16 Elite Lighting Body for light fixture
US9447949B2 (en) 2014-04-25 2016-09-20 Elite Lighting Light fixture
USD790753S1 (en) 2016-05-17 2017-06-27 Elite Lighting Body for a light fixture
USD797349S1 (en) 2016-05-17 2017-09-12 Elite Lighting Ballast room cover for a light fixture
JP2018107136A (en) * 2018-02-08 2018-07-05 三菱電機株式会社 Illumination lamp and luminaire

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08162677A (en) * 1994-12-05 1996-06-21 Nireco Corp Slender light source using light emitting diode
JP2002141555A (en) * 2000-10-31 2002-05-17 Hitachi Building Systems Co Ltd Led illumination lamp and method for manufacturing led illumination lamp
JP2008282793A (en) * 2007-04-09 2008-11-20 Lead Corporation:Kk Led type fluorescent lamp type illuminating device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08162677A (en) * 1994-12-05 1996-06-21 Nireco Corp Slender light source using light emitting diode
JP2002141555A (en) * 2000-10-31 2002-05-17 Hitachi Building Systems Co Ltd Led illumination lamp and method for manufacturing led illumination lamp
JP2008282793A (en) * 2007-04-09 2008-11-20 Lead Corporation:Kk Led type fluorescent lamp type illuminating device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD732234S1 (en) 2014-03-26 2015-06-16 Elite Lighting Body for light fixture
US9447949B2 (en) 2014-04-25 2016-09-20 Elite Lighting Light fixture
USD790753S1 (en) 2016-05-17 2017-06-27 Elite Lighting Body for a light fixture
USD797349S1 (en) 2016-05-17 2017-09-12 Elite Lighting Ballast room cover for a light fixture
JP2018107136A (en) * 2018-02-08 2018-07-05 三菱電機株式会社 Illumination lamp and luminaire

Similar Documents

Publication Publication Date Title
KR101781424B1 (en) LED Illumination Equipment
US8801224B2 (en) LED illumination device
EP2520854A2 (en) Lighting apparatus
JP6248368B2 (en) lighting equipment
KR20120081019A (en) Illumination device
WO2010095710A1 (en) Led lighting device
US9072171B2 (en) Circuit board mount for LED light
WO2012153788A1 (en) Straight tube lamp
US8052301B2 (en) LED lamp
EP1996856A4 (en) Led module for illumination
JP4879218B2 (en) Lens body, light source unit, and illumination device
US20110248631A1 (en) Led lamp set
US20110002119A1 (en) Led lamp with large light emitting angle
DE102007003256A1 (en) Light source module
JP2008218186A (en) Luminaire
US20110176308A1 (en) Illumination device and light-emitting module thereof
CN101684934B (en) Light-emitting diode lighting device
KR101191218B1 (en) Lighting apparatus
JP2012064391A (en) Lighting fixture
EP2607783B1 (en) Illumination device and connector
CN103270366A (en) Board assemblies, light emitting device assemblies, and methods of making the same
US8888330B2 (en) Omnidirectional LED lighting apparatus
KR101189082B1 (en) Lighting device
EP2280212B1 (en) Lighting device
JP2010062023A (en) Illuminating device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10834564

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase in:

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10834564

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase in:

Ref country code: JP