WO2011066696A1 - Gas feeding device and gas feeding method - Google Patents
Gas feeding device and gas feeding method Download PDFInfo
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- WO2011066696A1 WO2011066696A1 PCT/CN2009/076024 CN2009076024W WO2011066696A1 WO 2011066696 A1 WO2011066696 A1 WO 2011066696A1 CN 2009076024 W CN2009076024 W CN 2009076024W WO 2011066696 A1 WO2011066696 A1 WO 2011066696A1
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- pipe
- gas
- air
- air hole
- duct
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
Definitions
- the present invention relates to a gas delivery device and a delivery method, and more particularly to a gas delivery device and a gas delivery method suitable for use in a semiconductor process. Background technique
- the general amorphous silicon solar cell silicon film production includes the following steps: First, the glass substrate is placed in a vacuum chamber, and then enters the amorphous silicon P layer deposition chamber through the transition chamber. Depositing amorphous silicon P layer, depositing amorphous silicon I layer through the transition chamber into the amorphous silicon I layer deposition chamber, and finally depositing amorphous silicon N layer through the transition chamber into the amorphous silicon N layer deposition chamber. Out, the production of amorphous silicon solar cell silicon film has to go through at least three thin film deposition processes.
- a method for fabricating an amorphous silicon thin film solar cell silicon film is mainly a chemical meteorological deposition method, and a chemical vapor deposition method (CVD) is a film forming method for forming a film from a raw material gas by using a chemical reaction. It is widely used for the formation of thin films of micro devices including semiconductor devices. Therefore, the supply of process gas is required during the deposition of the film, but the method and apparatus for supplying the process gas is the key to the process, since uniformity of the process gas will involve overall coating uniformity issues.
- CVD chemical vapor deposition method
- the existing gas delivery device generally comprises a gas supply line, an exhaust pipe and a gas injection device, the gas supply line is directly connected with the exhaust pipe, the exhaust pipe is arranged in the process chamber of the gas injection device, and the process gas is supplied through the gas supply
- the pipe is input to the exhaust pipe, and is output from the exhaust pipe to the gas injection device
- the process chamber is outputted to the glass substrate by a gas injection device, thereby reflecting the formation of the film.
- the technical solution of the present invention is: providing a gas delivery device, which is adapted to communicate with an output tube of a gas supply device, the gas delivery device comprising a box body, a box cover and a pipe group, wherein the box body is a hollow structure, the hollow structure forms an air storage chamber, the cover is sealed on the air storage chamber, and the box cover is hooked with a plurality of vent holes communicating with the air storage chamber, and the pipe group is installed In the gas storage chamber, wherein the pipe group includes a first pipe assembly and a second pipe assembly, and the first pipe assembly and the second pipe assembly are respectively connected to an output pipe of the gas supply device;
- the first pipe assembly includes a plurality of first pipes arranged in parallel with each other, the free ends of the first pipes are sealed, and a plurality of first air holes are formed on both sides;
- the second pipe assembly includes the first pipe a second pipe having the same number and arranged in parallel with each other, the free end of the second pipe is sealed, and a plurality of second air holes
- the adjacent first air holes are opposite to the second air holes; more specifically, the aperture of the first air hole on the first pipe gradually increases along the free end of the first pipe; The aperture of the second air hole on the second duct gradually increases along the free end of the second duct; the first air hole and the second air hole The aperture gradually increases along the free end, which compensates for the disadvantage that the gas output from the first air hole and the second air hole gradually decreases along the free ends of the first pipe and the second pipe, and at the same time, excludes the first air hole and the second air hole.
- the gases compensate each other in the gas storage chamber, which in turn makes the gas in the gas storage chamber more uniform.
- the first air hole and the second air hole have the same aperture, the first air hole and the second air hole are equally spaced; the gas removed from the first air hole and the second air hole is in the air storage cavity To the mutual compensation, the gas in the gas storage chamber is made uniform.
- a gas delivery method for conveying gas in an output pipe of a gas supply device comprising the steps of: providing a plurality of first pipes arranged in parallel with each other, the first pipe being in communication with the output pipe and having a free end sealed a plurality of first air holes are formed on two sides of the first pipe; a second pipe is provided in the same number as the first pipe and arranged in parallel with each other, and the second pipe is connected to the output pipe and has a free end a plurality of second air holes are formed on two sides of the second pipe; the first air hole and the second air hole are adjusted to be in the same plane; and the first pipe and the second pipe are mutually The intersections are equally and equally spaced in the same plane, and the air flow direction of the first duct and the second duct is opposite.
- the first pipe assembly of the gas conveying device of the present invention comprises a plurality of first pipes arranged in parallel with each other, the free ends of the first pipes are sealed, and a plurality of first air holes are formed on both sides;
- the second pipe assembly includes the same number of second pipes arranged in parallel with the first pipe, and the free ends of the second pipe are sealed, and a plurality of second air holes are formed on both sides;
- the first pipe and the second pipe cross each other and Arranged in the same plane at equal intervals, and the airflow direction of the first duct and the second duct are opposite, the axial directions of the first air hole and the second air hole are both perpendicular to the axial direction of the vent hole, and the first air hole and the air vent
- the second air holes are located in the same plane; therefore, when the gas with the opposite air flow direction is output from the first air hole and the second air hole to the air storage chamber, the output gas acts as a mutual compensation, so that the output gas is uniform, thereby improving the quality of the product
- Figure 1 is a schematic view showing the structure of a gas delivery device of the present invention.
- Fig. 2 is a schematic structural view showing the state of use of the gas delivery device of the present invention.
- Figure 3 is a schematic view showing the structure of a first embodiment of the gas delivery device of the present invention.
- Figure 4 is an enlarged schematic view of a portion A of Figure 3.
- Figure 5 is a schematic view showing the structure of a second embodiment of the gas delivery device of the present invention.
- Figure 6 is an enlarged schematic view of a portion B of Figure 5.
- FIG. 7 is a flow chart of the gas delivery method of the present invention. detailed description
- the gas delivery device 10 of the present invention comprises a tank 100, a tank cover 102 and a pipeline group.
- the tank body 100 has a hollow structure, and the hollow structure forms an air storage chamber 101, and the tank cover 102 is sealed and sealed.
- the cover 102 is hooked with a plurality of vent holes 103 communicating with the air storage chamber 101.
- the pipe group is installed in the air storage chamber 101, and the output pipe 400 of the air supply device is installed outside the air storage chamber 101, wherein
- the pipe group includes a first pipe assembly 200 and a second pipe assembly 300.
- the first pipe assembly 200 and the second pipe assembly 300 are mounted on opposite sidewalls of the gas storage chamber 101 and pass through the side wall of the gas storage chamber 101.
- the first pipe assembly 200 and the second pipe assembly 300 are respectively connected to the output pipe 400 of the air supply device;
- the first pipe assembly 200 includes a plurality of first pipes 201 arranged in parallel with each other, and the free end of the first pipe 201 is sealed.
- a plurality of first air holes 202 are defined on both sides of the first pipe 201.
- the second pipe assembly 300 includes the same number of second pipes 301 arranged in parallel with the first pipe 201, and the free ends of the second pipes 301 are a plurality of second air holes 302 are formed on both sides of the second pipe 301; the first pipe 201 and the second pipe 301 are mutually intersected and arranged at equal intervals in the same plane, and the first pipe 201 and the second pipe 301 are The airflow direction is opposite, and the axial directions of the first air hole 202 and the second air hole 302 are both perpendicular to the axial direction of the vent hole 103, and the first air hole 202 and the second air hole 302 are located in the same plane.
- the gas flow direction is indicated by the direction of the arrow in the figure, and the gas is delivered to the first pipe assembly 200 by the output pipe 400 of the air supply device outside the casing 100.
- the gas flows along the free end of each of the first pipes 201 of the first pipe assembly 200. Since the first pipe assembly 200 is provided with a plurality of first air holes 202, the gas will flow from the first process.
- the first air hole 202 on a pipe 201 is output into the air storage chamber 101;
- the gas sent to the second pipe assembly 300 flows along the free end of each of the second pipes 301, it is outputted from the second air holes 302 on the second pipes 301 into the gas storage chamber 101, and the gas passes through the first pipe 201 and
- the air pressure in the first duct 201 and the second duct 301 gradually decreases along the flow direction of the gas, so that the gas that the first air hole 202 and the second air hole 302 output into the air storage chamber 101 will follow.
- the direction of the free end of the first pipe 201 and the second pipe 301 is gradually decreased, but the air flow direction of the first pipe 201 and the second pipe 301 is opposite, so that the gas output from the adjacent first air hole 202 and the second air hole 302 is stored in the gas.
- the cavity 101 is mutually compensated to make the gas outputted into the gas storage chamber 101 as a whole uniform; the gas which is stored in the gas storage chamber 101 is output to the glass substrate through the vent hole 103 which is hooked on the cover 102, so that The film composition and film thickness formed on the glass substrate are uniform.
- a plurality of first air holes 202 are opened on both sides of the first pipe 201, and the aperture of the first air hole 202 is along the first The free end of the pipe 201 is gradually increased; the second pipe 301 is provided with a plurality of second air holes 302, and the aperture of the second air hole 302 is gradually increased along the free end of the second pipe 301, adjacent to the first The first air hole 202 on the pipe 201 and the second pipe 301 is opposite to the second air hole 302; after the gas is sent from the output pipe 400 of the air supply device to the first pipe 201 and the second pipe 301, the gas along the first pipe 201 and The free end of the second pipe 301 flows, and flows through the first air hole 202 and the second air hole 302 on the first pipe 201 and the second pipe 301 to the air storage chamber 101, so that the first pipe 201 and the second pipe are The pressure in the 301 gradually decreases along the direction of the
- the first air hole 202 and the second air hole 302 having the same aperture are respectively disposed on the first pipe 201 and the second pipe 301.
- the first air holes 202 on the adjacent first pipe 201 and the second pipe 301 are arranged at equal intervals with the second air holes 302, so that the gas output from the first air holes 202 and the second air holes 302 is in the air storage chamber 101.
- the mutual compensation acts to keep the gas in the gas storage chamber 101 uniform.
- the gas conveying method of the present invention comprises the following steps: (S01) providing a plurality of first pipes arranged in parallel with each other, the first pipe is in communication with the output pipe and the free end is sealed, and the two sides of the first pipe are a plurality of first air holes are provided in the upper opening; (S02) a second pipe is provided in the same quantity as the first pipe and arranged in parallel with each other, the second pipe is connected to the output pipe and the free end is sealed, the first a plurality of second air holes are formed on two sides of the two pipes; (S03) adjusting the first air holes and the second air holes in the same plane; (S04) crossing the first pipe and the second pipe And arranged at equal intervals in the same plane, and the air flow direction of the first pipe and the second pipe is opposite.
- the first pipe assembly 200 of the gas conveying device 10 of the present invention includes a plurality of first pipes 201 arranged in parallel with each other, the free ends of the first pipes 201 are sealed, and a plurality of first air holes 202 are opened on both sides;
- the second pipe The assembly 300 includes the second pipe 301 of the same number and parallel to the first pipe 201.
- the free ends of the second pipe 301 are sealed, and a plurality of second air holes 302 are defined on both sides.
- the first pipe 201 and the second pipe 201 The ducts 301 are mutually intersected and arranged at equal intervals in the same plane, and the airflow direction of the first duct 201 and the second duct 301 are opposite, and the axial directions of the first air hole 202 and the second air hole 302 are both in the axial direction of the vent hole 103.
- the first air hole 202 and the second air hole 302 are in the same plane; therefore, the gas with the opposite air flow direction is output from the first air hole 202 and the second air hole 302 to the air storage chamber 101, and the output gas is in the air storage chamber.
- the internal compensation function in 101 is such that the gas outputted to the gas storage chamber 101 is hooked to ensure uniform gas output from the vent hole 103 on the tank cover 102 to the glass substrate. Thereby improving the quality of the product; the same time, the gas delivery conduit means 10 and the overall layout of simple structure, low production cost.
- the above description is only for the embodiment in which the pipe group is cylindrical, but is not limited to the above embodiment.
- the gas conveying device 10 of the present invention can also set different types of pipe groups according to actual needs, and can also set the first according to actual needs.
- the gas delivery device 10 of the present invention is also not limited to the semiconductor process, and can be used in similar processes and environments according to actual needs.
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Abstract
A gas feeding device (10) includes a housing (100) with a hollow gas storage chamber (101), a cover (102) and a pipe group. The cover (102) provided uniformly with air holes (103) is positioned on the gas storage chamber (101) in which the pipe group is positioned. The pipe group comprises a first pipe unit (200) and a second pipe unit (300). The first and the second pipe units (200, 300) comprise respectively several first and several second pipes (201,301) arranged in parallel whose free ends are sealed. Several first and second gas apertures (202, 302) are formed on two sides of these pipes (201,301) which are arranged alternately and equidistantly in the same plane and in which the gas flows in opposite directions. Axial directions of the first and the second gas apertures (202, 302) are perpendicular to axial directions of the gas holes (103) and the first and the second gas apertures (202, 302) are arranged in the same plane. A gas feeding method is also disclosed. The gas feeding device and the gas feeding method can provide gas uniformly.
Description
气体输送装置及输送方法 技术领域 Gas delivery device and delivery method
本发明涉及一种气体输送装置及输送方法, 尤其涉及一种适用于半导体工 艺的气体输送装置及气体输送方法。 背景技术 The present invention relates to a gas delivery device and a delivery method, and more particularly to a gas delivery device and a gas delivery method suitable for use in a semiconductor process. Background technique
随着半导体技术的发展, 半导体工艺日趋复杂, 对生产半导体制品的生产 设备和生产工艺也提出了更高的要求, 对于半导体制品, 例如有机发光显示器 件、 液晶显示器件、 非晶硅太阳能电池板等, 其工艺流程中诸多步骤都要使用 到气体, 例如半导体制程中的干蚀刻、 氧化、 离子布植、 薄膜沉积等皆使用到 相当多的气体, 而气体的纯度、 气体的输送装置、 气体的输送方式则对半导体 制品性能、 良品率等有着决定性的影响。 With the development of semiconductor technology, the semiconductor process is becoming more and more complex, and higher requirements are placed on the production equipment and production process for producing semiconductor products, such as organic light-emitting display devices, liquid crystal display devices, and amorphous silicon solar panels. Etc., gas is used in many steps in the process, such as dry etching, oxidation, ion implantation, thin film deposition, etc. in the semiconductor process, using a considerable amount of gas, gas purity, gas delivery device, gas The delivery method has a decisive influence on the performance and yield of semiconductor products.
以非晶硅太阳能电池硅膜的生产为例, 一般的非晶硅太阳能电池硅膜生产 包括如下步骤: 首先将玻璃基片放入真空室, 之后通过过渡室进入到非晶硅 P 层沉积室沉积非晶硅 P层,通过过渡室进入到非晶硅 I层沉积室沉积非晶硅 I层, 最后通过过渡室进入到非晶硅 N层沉积室沉积非晶硅 N层.由此可以看出,非晶 硅太阳能电池硅膜的生产至少要经历 3 个薄膜沉积工序。 目前, 非晶硅薄膜太 阳能电池硅膜的制作方法主要釆用的是化学气象沉积方法, 化学气相沉积法 ( Chemical Vapor Deposition: CVD ) 即利用化学反应由原料气体形成膜的成膜 方法, 在工业上广泛地应用于以半导体装置为首的微细器件的薄膜的形成。 因 此, 在薄膜的沉积过程中需要工艺气体的供给, 但供给工艺气体的方法和装置 是该工艺过程的关键, 因为工艺气体是否均匀将涉及整体的镀膜均匀度问题。 Taking the production of amorphous silicon solar cell silicon film as an example, the general amorphous silicon solar cell silicon film production includes the following steps: First, the glass substrate is placed in a vacuum chamber, and then enters the amorphous silicon P layer deposition chamber through the transition chamber. Depositing amorphous silicon P layer, depositing amorphous silicon I layer through the transition chamber into the amorphous silicon I layer deposition chamber, and finally depositing amorphous silicon N layer through the transition chamber into the amorphous silicon N layer deposition chamber. Out, the production of amorphous silicon solar cell silicon film has to go through at least three thin film deposition processes. At present, a method for fabricating an amorphous silicon thin film solar cell silicon film is mainly a chemical meteorological deposition method, and a chemical vapor deposition method (CVD) is a film forming method for forming a film from a raw material gas by using a chemical reaction. It is widely used for the formation of thin films of micro devices including semiconductor devices. Therefore, the supply of process gas is required during the deposition of the film, but the method and apparatus for supplying the process gas is the key to the process, since uniformity of the process gas will involve overall coating uniformity issues.
对于半导体制品而言, 在其制程中无论是釆用化学气象沉积方法, 还是釆 用常压气相化学沉积技术, 都需要使用工艺气体, 而工艺气体都需要专门的装 置及方法进行供给。 现有的气体输送装置通常包括供气管路、 排气管及气体注 入装置, 供气管路直接与排气管相连接, 排气管设置在气体注入装置的工艺腔 室内, 工艺气体是通过供气管道输入到排气管, 从排气管输出到气体注入装置
的工艺腔室内, 在通过气体注入装置输出到玻璃基板上, 进而反映形成膜。 现 有技术在设计管路时通常没有考虑到气体会随排气管长度的延伸而气压减小, 另外由于气体传输还需要克服管路的阻力 , 使得排气管提供到气体注入装置的 工艺腔室的气体不均勾, 进而使由气体注入装置提供到玻璃基板表面的气体很 难达到一致的均勾性, 导致玻璃基板上薄膜成分及膜厚不均勾, 影响了半导体 制品的质量稳定性和成品率; 另外现有的气体输送装置, 因为供气压力、 供气 方式的问题, 导致了气体输送管道及整体设备的结构复杂, 生产成本高。 For semiconductor products, process gas is required in both the chemical vapor deposition method and the atmospheric pressure vapor deposition technology in the process, and the process gas requires special equipment and methods for supply. The existing gas delivery device generally comprises a gas supply line, an exhaust pipe and a gas injection device, the gas supply line is directly connected with the exhaust pipe, the exhaust pipe is arranged in the process chamber of the gas injection device, and the process gas is supplied through the gas supply The pipe is input to the exhaust pipe, and is output from the exhaust pipe to the gas injection device The process chamber is outputted to the glass substrate by a gas injection device, thereby reflecting the formation of the film. In the prior art, when designing the pipeline, it is generally not considered that the gas will decrease with the extension of the length of the exhaust pipe, and the gas transmission also needs to overcome the resistance of the pipeline, so that the exhaust pipe is provided to the process chamber of the gas injection device. The gas in the chamber is not evenly hooked, so that the gas supplied from the gas injection device to the surface of the glass substrate is difficult to achieve uniform uniformity, resulting in uneven film composition and film thickness on the glass substrate, which affects the quality stability of the semiconductor product. And the yield rate; in addition to the existing gas delivery device, the gas supply pipeline and the overall equipment have complicated structure and high production cost due to the problem of gas supply pressure and gas supply mode.
因此 , 急需一种能提供均匀气体且结构简单的气体输送装置。 发明内容 Therefore, there is an urgent need for a gas delivery device that provides uniform gas and has a simple structure. Summary of the invention
本发明的目的在于提供一种能提供均勾气体且结构简单的气体输送装置。 本发明的另一目的在于提供一种能提供均匀气体的气体输送方法。 It is an object of the present invention to provide a gas delivery device that provides a uniform gas and a simple structure. Another object of the present invention is to provide a gas delivery method capable of providing a uniform gas.
为实现上述目的, 本发明的技术方案为: 提供一种气体输送装置, 适于与 供气装置的输出管连通, 所述气体输送装置包括箱体、 箱盖及管道组, 所述箱 体呈中空结构, 所述中空结构形成储气腔, 所述箱盖密封盖于所述储气腔上, 所述箱盖上均勾开设有若干与储气腔连通的通气孔, 所述管道组安装于所述储 气腔内, 其中, 所述管道组包括第一管道组件及第二管道组件, 所述第一管道 组件及第二管道组件分别与所述供气装置的输出管连通; 所述第一管道组件包 括若干相互平行排列的第一管道, 所述第一管道的自由端呈密封状, 且两侧面 上开设有若干第一气孔; 所述第二管道组件包括与所述第一管道相同数量且相 互平行排列的第二管道, 所述第二管道的自由端呈密封状, 且两侧面上开设有 若干第二气孔; 所述第一管道与所述第二管道相互交叉且等间距地排列在同一 平面, 且所述第一管道与所述第二管道的气流方向相反, 所述第一气孔与所述 第二气孔的轴向均与所述通气孔的轴向垂直, 且所述第一气孔与所述第二气孔 位于同一平面。 In order to achieve the above object, the technical solution of the present invention is: providing a gas delivery device, which is adapted to communicate with an output tube of a gas supply device, the gas delivery device comprising a box body, a box cover and a pipe group, wherein the box body is a hollow structure, the hollow structure forms an air storage chamber, the cover is sealed on the air storage chamber, and the box cover is hooked with a plurality of vent holes communicating with the air storage chamber, and the pipe group is installed In the gas storage chamber, wherein the pipe group includes a first pipe assembly and a second pipe assembly, and the first pipe assembly and the second pipe assembly are respectively connected to an output pipe of the gas supply device; The first pipe assembly includes a plurality of first pipes arranged in parallel with each other, the free ends of the first pipes are sealed, and a plurality of first air holes are formed on both sides; the second pipe assembly includes the first pipe a second pipe having the same number and arranged in parallel with each other, the free end of the second pipe is sealed, and a plurality of second air holes are formed on both sides; the first pipe and the second pipe Arranging in the same plane at equal intervals and at equal intervals, and the air flow direction of the first duct and the second duct is opposite, the axial direction of the first air hole and the second air hole are the axis of the vent hole Vertically, and the first air hole is in the same plane as the second air hole.
较佳地, 相邻的所述第一气孔与所述第二气孔正对; 更具体地, 所述第一 管道上的第一气孔的孔径沿所述第一管道的自由端逐渐增大; 所述第二管道上 的第二气孔的孔径沿所述第二管道的自由端逐渐增大; 第一气孔及第二气孔的
孔径沿自由端逐渐增大, 弥补了从第一气孔及第二气孔输出的气体沿第一管道 及第二管道自由端方向逐渐减少的缺点, 同时, 使从第一气孔及第二气孔排除 的气体在储气腔内相互补偿, 进而使储气腔内的气体更加均匀。 Preferably, the adjacent first air holes are opposite to the second air holes; more specifically, the aperture of the first air hole on the first pipe gradually increases along the free end of the first pipe; The aperture of the second air hole on the second duct gradually increases along the free end of the second duct; the first air hole and the second air hole The aperture gradually increases along the free end, which compensates for the disadvantage that the gas output from the first air hole and the second air hole gradually decreases along the free ends of the first pipe and the second pipe, and at the same time, excludes the first air hole and the second air hole. The gases compensate each other in the gas storage chamber, which in turn makes the gas in the gas storage chamber more uniform.
较佳地, 所述第一气孔与所述第二气孔的孔径相同, 所述第一气孔与第二 气孔等间距地交叉; 从第一气孔及第二气孔排除的气体在储气腔内起到相互补 偿的作用, 使储气腔内的气体均匀。 Preferably, the first air hole and the second air hole have the same aperture, the first air hole and the second air hole are equally spaced; the gas removed from the first air hole and the second air hole is in the air storage cavity To the mutual compensation, the gas in the gas storage chamber is made uniform.
一种气体输送方法, 用于对供气装置的输出管内的气体进行输送, 包括如 下步骤: 提供若干相互平行排列的第一管道, 所述第一管道与所述输出管连通 且自由端呈密封状, 所述第一管道的两侧面上开设有若干第一气孔; 提供与所 述第一管道相同数量且相互平行排列的第二管道, 所述第二管道与所述输出管 连通且自由端呈密封状, 所述第二管道的两侧面上开设有若干第二气孔; 将所 述第一气孔与所述第二气孔调节于同一平面; 将所述第一管道与所述第二管道 相互交叉且等间距地排列在同一平面, 并使所述第一管道与所述第二管道的气 流方向相反。 A gas delivery method for conveying gas in an output pipe of a gas supply device, comprising the steps of: providing a plurality of first pipes arranged in parallel with each other, the first pipe being in communication with the output pipe and having a free end sealed a plurality of first air holes are formed on two sides of the first pipe; a second pipe is provided in the same number as the first pipe and arranged in parallel with each other, and the second pipe is connected to the output pipe and has a free end a plurality of second air holes are formed on two sides of the second pipe; the first air hole and the second air hole are adjusted to be in the same plane; and the first pipe and the second pipe are mutually The intersections are equally and equally spaced in the same plane, and the air flow direction of the first duct and the second duct is opposite.
与现有技术相比, 由于本发明气体输送装置的第一管道组件包括若干相互 平行排列的第一管道, 第一管道的自由端呈密封状, 且两侧面上开设有若干第 一气孔; 第二管道组件包括与第一管道相同数量且相互平行排列的第二管道, 第二管道的自由端呈密封状, 且两侧面上开设有若干第二气孔; 第一管道与第 二管道相互交叉且等间距地排列在同一平面, 且第一管道与第二管道的气流方 向相反, 第一气孔与第二气孔的轴向均与所述通气孔的轴向垂直, 且所述第一 气孔与所述第二气孔位于同一平面; 因此气流方向相反的气体由第一气孔及第 二气孔输出到储气腔时, 输出的气体起到相互补偿的作用, 使输出的气体均匀, 进而提高产品的质量; 同时, 该气体输送装置管道布局及整体结构简单, 生产 成本低。 附图说明 Compared with the prior art, since the first pipe assembly of the gas conveying device of the present invention comprises a plurality of first pipes arranged in parallel with each other, the free ends of the first pipes are sealed, and a plurality of first air holes are formed on both sides; The second pipe assembly includes the same number of second pipes arranged in parallel with the first pipe, and the free ends of the second pipe are sealed, and a plurality of second air holes are formed on both sides; the first pipe and the second pipe cross each other and Arranged in the same plane at equal intervals, and the airflow direction of the first duct and the second duct are opposite, the axial directions of the first air hole and the second air hole are both perpendicular to the axial direction of the vent hole, and the first air hole and the air vent The second air holes are located in the same plane; therefore, when the gas with the opposite air flow direction is output from the first air hole and the second air hole to the air storage chamber, the output gas acts as a mutual compensation, so that the output gas is uniform, thereby improving the quality of the product. At the same time, the gas delivery device has a simple layout and overall structure, and the production cost is low. DRAWINGS
图 1是本发明气体输送装置的结构示意图。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the structure of a gas delivery device of the present invention.
图 2是本发明气体输送装置的使用状态的结构示意图。
图 3是本发明气体输送装置的第一实施例的结构示意图。 Fig. 2 is a schematic structural view showing the state of use of the gas delivery device of the present invention. Figure 3 is a schematic view showing the structure of a first embodiment of the gas delivery device of the present invention.
图 4是图 3中 A部分的放大示意图。 Figure 4 is an enlarged schematic view of a portion A of Figure 3.
图 5是本发明气体输送装置的第二实施例的结构示意图。 Figure 5 is a schematic view showing the structure of a second embodiment of the gas delivery device of the present invention.
图 6是图 5中 B部分的放大示意图。 Figure 6 is an enlarged schematic view of a portion B of Figure 5.
图 7是本发明气体输送方法的流程图。 具体实施方式 Figure 7 is a flow chart of the gas delivery method of the present invention. detailed description
现在参考附图描述本发明的实施例, 附图中类似的元件标号代表类似的元 件。 Embodiments of the present invention will now be described with reference to the drawings, in which like reference numerals represent like elements.
如图 1、 图 2所示, 本发明气体输送装置 10包括箱体 100、 箱盖 102及管 道组, 箱体 100呈中空结构, 中空结构形成储气腔 101 , 箱盖 102密封盖于储气 腔 101上, 箱盖 102上均勾开设有若干与储气腔 101连通的通气孔 103 , 管道组 安装于储气腔 101内, 供气装置的输出管 400安装于储气腔 101外, 其中, 管 道组包括第一管道组件 200及第二管道组件 300,第一管道组件 200及第二管道 组件 300安装于储气腔 101的两相对的侧壁上并穿过储气腔 101的侧壁, 第一 管道组件 200及第二管道组件 300分别与供气装置的输出管 400连通; 第一管 道组件 200包括若干相互平行排列的第一管道 201 ,第一管道 201的自由端呈密 封状, 且第一管道 201的两侧面上开设有若干第一气孔 202; 第二管道组件 300 包括与第一管道 201相同数量且相互平行排列的第二管道 301 ,第二管道 301的 自由端呈密封状, 且第二管道 301的两侧面上开设有若干第二气孔 302; 第一管 道 201与第二管道 301相互交叉且等间距地排列在同一平面, 第一管道 201与 第二管道 301的气流方向相反, 第一气孔 202与第二气孔 302的轴向均与通气 孔 103的轴向垂直, 且第一气孔 202与第二气孔 302位于同一平面。 As shown in FIG. 1 and FIG. 2, the gas delivery device 10 of the present invention comprises a tank 100, a tank cover 102 and a pipeline group. The tank body 100 has a hollow structure, and the hollow structure forms an air storage chamber 101, and the tank cover 102 is sealed and sealed. On the cavity 101, the cover 102 is hooked with a plurality of vent holes 103 communicating with the air storage chamber 101. The pipe group is installed in the air storage chamber 101, and the output pipe 400 of the air supply device is installed outside the air storage chamber 101, wherein The pipe group includes a first pipe assembly 200 and a second pipe assembly 300. The first pipe assembly 200 and the second pipe assembly 300 are mounted on opposite sidewalls of the gas storage chamber 101 and pass through the side wall of the gas storage chamber 101. The first pipe assembly 200 and the second pipe assembly 300 are respectively connected to the output pipe 400 of the air supply device; the first pipe assembly 200 includes a plurality of first pipes 201 arranged in parallel with each other, and the free end of the first pipe 201 is sealed. A plurality of first air holes 202 are defined on both sides of the first pipe 201. The second pipe assembly 300 includes the same number of second pipes 301 arranged in parallel with the first pipe 201, and the free ends of the second pipes 301 are a plurality of second air holes 302 are formed on both sides of the second pipe 301; the first pipe 201 and the second pipe 301 are mutually intersected and arranged at equal intervals in the same plane, and the first pipe 201 and the second pipe 301 are The airflow direction is opposite, and the axial directions of the first air hole 202 and the second air hole 302 are both perpendicular to the axial direction of the vent hole 103, and the first air hole 202 and the second air hole 302 are located in the same plane.
如图 2所示, 本发明气体输送装置 10在使用状态时, 气体流动方向如图中 箭头方向所示, 气体由箱体 100外的供气装置的输出管 400输送到第一管道组 件 200及第二管道组件 300后, 气体沿第一管道组件 200的各第一管道 201的 自由端方向流动, 由于第一管道组件 200上开设有若干第一气孔 202, 气体在流 动过程中, 会从第一管道 201上的第一气孔 202中输出到储气腔 101内; 同样,
输送到第二管道组件 300的气体沿各第二管道 301的自由端方向流动时, 从各 第二管道 301上的第二气孔 302中输出到储气腔 101内, 气体经第一管道 201 及第二管道 301输送时, 第一管道 201及第二管道 301内的气压沿气体的流动 方向逐渐减小, 使第一气孔 202及第二气孔 302输出到储气腔 101内的气体会 沿第一管道 201及第二管道 301的自由端方向逐渐减少, 但第一管道 201与第 二管道 301的气流方向相反, 这样从相邻的第一气孔 202与第二气孔 302输出 的气体在储气腔 101内相互补偿, 使输出到储气腔 101内的气体整体均匀; 存 储于储气腔 101内的均勾气体再通过箱盖 102上均勾开设的通气孔 103输出到 玻璃基板上, 使玻璃基板上形成的薄膜成分及膜厚均匀。 As shown in FIG. 2, when the gas delivery device 10 of the present invention is in use, the gas flow direction is indicated by the direction of the arrow in the figure, and the gas is delivered to the first pipe assembly 200 by the output pipe 400 of the air supply device outside the casing 100. After the second pipe assembly 300, the gas flows along the free end of each of the first pipes 201 of the first pipe assembly 200. Since the first pipe assembly 200 is provided with a plurality of first air holes 202, the gas will flow from the first process. The first air hole 202 on a pipe 201 is output into the air storage chamber 101; When the gas sent to the second pipe assembly 300 flows along the free end of each of the second pipes 301, it is outputted from the second air holes 302 on the second pipes 301 into the gas storage chamber 101, and the gas passes through the first pipe 201 and When the second duct 301 is transported, the air pressure in the first duct 201 and the second duct 301 gradually decreases along the flow direction of the gas, so that the gas that the first air hole 202 and the second air hole 302 output into the air storage chamber 101 will follow. The direction of the free end of the first pipe 201 and the second pipe 301 is gradually decreased, but the air flow direction of the first pipe 201 and the second pipe 301 is opposite, so that the gas output from the adjacent first air hole 202 and the second air hole 302 is stored in the gas. The cavity 101 is mutually compensated to make the gas outputted into the gas storage chamber 101 as a whole uniform; the gas which is stored in the gas storage chamber 101 is output to the glass substrate through the vent hole 103 which is hooked on the cover 102, so that The film composition and film thickness formed on the glass substrate are uniform.
下面参考附图, 详细描述本发明气体输送装置 10的不同实施例。 Different embodiments of the gas delivery device 10 of the present invention are described in detail below with reference to the accompanying drawings.
如图 3、 图 4所示, 本发明气体输送装置 10的第一实施例中, 第一管道 201 的两侧均勾的开设有若干第一气孔 202, 且第一气孔 202的孔径沿第一管道 201 的自由端逐渐增大; 第二管道 301的两侧均勾的开设有若干第二气孔 302, 且第 二气孔 302的孔径沿第二管道 301的自由端逐渐增大, 相邻第一管道 201和第 二管道 301上的第一气孔 202与第二气孔 302正对; 气体由供气装置的输出管 400输送到第一管道 201及第二管道 301后, 气体沿第一管道 201及第二管道 301的自由端流动,流动过程中通过第一管道 201及第二管道 301上的第一气孔 202及第二气孔 302输出到储气腔 101, 这样虽然第一管道 201及第二管道 301 内的压力沿气流方向逐渐减小,但由于第一管道 201及第二管上的第一气孔 202 及第二气孔 302的孔径沿自由端逐渐增大,从而使第一气孔 202及第二气孔 302 输出的气体不会沿第一管道 201及第二管道 301 自由端逐渐较少, 使输出的气 体均匀; 同时, 相邻的第一管道 201及第二管道 301的气流方向相反, 这样, 相邻的第一管道 201及第二管输出的气体在储气腔 101内相互补偿, 进一步使 储气腔 101内的气体更加均匀。 As shown in FIG. 3 and FIG. 4, in the first embodiment of the gas delivery device 10 of the present invention, a plurality of first air holes 202 are opened on both sides of the first pipe 201, and the aperture of the first air hole 202 is along the first The free end of the pipe 201 is gradually increased; the second pipe 301 is provided with a plurality of second air holes 302, and the aperture of the second air hole 302 is gradually increased along the free end of the second pipe 301, adjacent to the first The first air hole 202 on the pipe 201 and the second pipe 301 is opposite to the second air hole 302; after the gas is sent from the output pipe 400 of the air supply device to the first pipe 201 and the second pipe 301, the gas along the first pipe 201 and The free end of the second pipe 301 flows, and flows through the first air hole 202 and the second air hole 302 on the first pipe 201 and the second pipe 301 to the air storage chamber 101, so that the first pipe 201 and the second pipe are The pressure in the 301 gradually decreases along the direction of the airflow, but the apertures of the first air hole 202 and the second air hole 302 on the first pipe 201 and the second pipe gradually increase along the free end, thereby making the first air hole 202 and the second hole 202 Gas output from the air hole 302 The body does not gradually become smaller along the free ends of the first pipe 201 and the second pipe 301, so that the output gas is uniform; meanwhile, the airflow directions of the adjacent first pipe 201 and the second pipe 301 are opposite, thus, adjacent The gas outputted by one of the tubes 201 and the second tube compensates each other in the gas storage chamber 101 to further make the gas in the gas storage chamber 101 more uniform.
如图 5、 图 6所示, 本发明气体输送装置 10的第二实施例中, 第一管道 201 与第二管道 301上都均勾的设置孔径相同的第一气孔 202及第二气孔 302,相邻 的第一管道 201及第二管道 301上的第一气孔 202与第二气孔 302等间距地交 叉排列, 这样从第一气孔 202及第二气孔 302输出的气体在储气腔 101内起到
相互补偿的作用, 进而使储气腔 101内的气体保持均匀。 As shown in FIG. 5 and FIG. 6 , in the second embodiment of the gas delivery device 10 of the present invention, the first air hole 202 and the second air hole 302 having the same aperture are respectively disposed on the first pipe 201 and the second pipe 301. The first air holes 202 on the adjacent first pipe 201 and the second pipe 301 are arranged at equal intervals with the second air holes 302, so that the gas output from the first air holes 202 and the second air holes 302 is in the air storage chamber 101. To The mutual compensation acts to keep the gas in the gas storage chamber 101 uniform.
如图 7所示, 本发明气体输送方法包括如下步骤: (S01 )提供若干相互平 行排列的第一管道, 第一管道与输出管连通且自由端呈密封状, 所述第一管道 的两侧面上开设有若干第一气孔; (S02 )提供与所述第一管道相同数量且相互 平行排列的第二管道, 所述第二管道与所述输出管道连通且自由端呈密封状, 所述第二管道的两侧面上开设有若干第二气孔; (S03 )将所述第一气孔与所述 第二气孔调节于同一平面; (S04 )将所述第一管道与所述第二管道相互交叉且 等间距地排列在同一平面, 并使所述第一管道与所述第二管道的气流方向相反。 As shown in FIG. 7, the gas conveying method of the present invention comprises the following steps: (S01) providing a plurality of first pipes arranged in parallel with each other, the first pipe is in communication with the output pipe and the free end is sealed, and the two sides of the first pipe are a plurality of first air holes are provided in the upper opening; (S02) a second pipe is provided in the same quantity as the first pipe and arranged in parallel with each other, the second pipe is connected to the output pipe and the free end is sealed, the first a plurality of second air holes are formed on two sides of the two pipes; (S03) adjusting the first air holes and the second air holes in the same plane; (S04) crossing the first pipe and the second pipe And arranged at equal intervals in the same plane, and the air flow direction of the first pipe and the second pipe is opposite.
由于本发明气体输送装置 10的第一管道组件 200包括若干相互平行排列的 第一管道 201 , 第一管道 201的自由端呈密封状, 且两侧面上开设有若干第一气 孔 202;第二管道组件 300包括与第一管道 201相同数量且相互平行排列的第二 管道 301 , 第二管道 301 的自由端呈密封状, 且两侧面上开设有若干第二气孔 302; 第一管道 201与第二管道 301相互交叉且等间距地排列在同一平面, 且第 一管道 201与第二管道 301的气流方向相反, 第一气孔 202与第二气孔 302的 轴向均与所述通气孔 103的轴向垂直,且所述第一气孔 202与所述第二气孔 302 位于同一平面; 因此气流方向相反的气体由第一气孔 202及第二气孔 302输出 到储气腔 101 , 输出的气体在储气腔 101内起到相互补偿的作用, 使输出到储气 腔 101的气体均勾, 保证从箱盖 102上的通气孔 103输出到玻璃基板上的气体 均匀, 从而提高产品的质量; 同时, 该气体输送装置 10管道布局及整体结构简 单, 生产成本低。 Since the first pipe assembly 200 of the gas conveying device 10 of the present invention includes a plurality of first pipes 201 arranged in parallel with each other, the free ends of the first pipes 201 are sealed, and a plurality of first air holes 202 are opened on both sides; the second pipe The assembly 300 includes the second pipe 301 of the same number and parallel to the first pipe 201. The free ends of the second pipe 301 are sealed, and a plurality of second air holes 302 are defined on both sides. The first pipe 201 and the second pipe 201 The ducts 301 are mutually intersected and arranged at equal intervals in the same plane, and the airflow direction of the first duct 201 and the second duct 301 are opposite, and the axial directions of the first air hole 202 and the second air hole 302 are both in the axial direction of the vent hole 103. Vertically, the first air hole 202 and the second air hole 302 are in the same plane; therefore, the gas with the opposite air flow direction is output from the first air hole 202 and the second air hole 302 to the air storage chamber 101, and the output gas is in the air storage chamber. The internal compensation function in 101 is such that the gas outputted to the gas storage chamber 101 is hooked to ensure uniform gas output from the vent hole 103 on the tank cover 102 to the glass substrate. Thereby improving the quality of the product; the same time, the gas delivery conduit means 10 and the overall layout of simple structure, low production cost.
以上仅对管道组呈圓柱状的实施例进行了说明, 但不限于上述实施例, 本 发明气体输送装置 10还可根据实际需要, 设置不同形状的管道组, 同时还可以 根据实际需要设置第一气孔 202及第二气孔 302的形状。 The above description is only for the embodiment in which the pipe group is cylindrical, but is not limited to the above embodiment. The gas conveying device 10 of the present invention can also set different types of pipe groups according to actual needs, and can also set the first according to actual needs. The shape of the air hole 202 and the second air hole 302.
本发明气体输送装置 10也不限于半导体制程中, 还可根据实际需要, 用于 相类似制程及环境中。 The gas delivery device 10 of the present invention is also not limited to the semiconductor process, and can be used in similar processes and environments according to actual needs.
以上所揭露的仅为本发明的优选实施例而已, 当然不能以此来限定本发明 之权利范围, 因此依本发明申请专利范围所作的等同变化, 仍属本发明所涵盖 的范围。
The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes made by the scope of the present invention remain within the scope of the present invention.
Claims
1、 一种气体输送装置, 适于与供气装置的输出管连通, 所述气体输送装置 包括箱体、 箱盖及管道组, 所述箱体呈中空结构, 所述中空结构形成储气腔, 所述箱盖密封盖于所述储气腔上, 所述箱盖上均勾开设有若干与储气腔连通的 通气孔, 所述管道组安装于所述储气腔内, 其特征在于: A gas delivery device, adapted to be in communication with an output tube of a gas supply device, the gas delivery device comprising a tank body, a tank cover and a pipe group, the tank body having a hollow structure, the hollow structure forming a gas storage chamber The cover is sealed on the air storage chamber, and the cover is hooked with a plurality of vent holes communicating with the air storage chamber, and the pipe group is installed in the air storage chamber, wherein :
所述管道组包括第一管道组件及第二管道组件, 所述第一管道组件及第二 管道组件分别与所述供气装置的输出管连通; The pipe group includes a first pipe assembly and a second pipe assembly, and the first pipe assembly and the second pipe assembly are respectively connected to an output pipe of the air supply device;
所述第一管道组件包括若干相互平行排列的第一管道, 所述第一管道的自 由端呈密封状, 且两侧面上开设有若干第一气孔; The first pipe assembly includes a plurality of first pipes arranged in parallel with each other, and the free ends of the first pipes are sealed, and a plurality of first air holes are formed on both sides;
所述第二管道组件包括与所述第一管道相同数量且相互平行排列的第二管 道, 所述第二管道的自由端呈密封状, 且两侧面上开设有若干第二气孔; The second pipe assembly includes a second pipe having the same number and parallel to each other as the first pipe, and the free end of the second pipe is sealed, and a plurality of second air holes are formed on both sides;
所述第一管道与所述第二管道相互交叉且等间距地排列在同一平面, 且所 述第一管道与所述第二管道的气流方向相反, 所述第一气孔与所述第二气孔的 轴向均与所述通气孔的轴向垂直, 且所述第一气孔与所述第二气孔位于同一平 面。 The first duct and the second duct cross each other and are arranged at equal intervals in the same plane, and the air flow direction of the first duct and the second duct are opposite, the first air hole and the second air hole The axial direction is perpendicular to the axial direction of the vent hole, and the first air hole and the second air hole are located in the same plane.
2、 如权利要求 1所述的气体输送装置, 其特征在于: 相邻的所述第一气孔 与所述第二气孔正对。 The gas delivery device according to claim 1, wherein the adjacent first air holes are opposite to the second air holes.
3、 如权利要求 2所述的气体输送装置, 其特征在于: 所述第一管道上的第 一气孔的孔径沿所述第一管道的自由端逐渐增大; 所述第二管道上的第二气孔 的孔径沿所述第二管道的自由端逐渐增大。 3. The gas delivery device according to claim 2, wherein: an aperture of the first air hole on the first duct gradually increases along a free end of the first duct; The aperture of the two air holes gradually increases along the free end of the second duct.
4、 如权利要求 1所述的气体输送装置, 其特征在于: 所述第一气孔与所述 第二气孔的孔径相同, 所述第一气孔与第二气孔等间距地交叉。 The gas delivery device according to claim 1, wherein the first air hole has the same aperture as the second air hole, and the first air hole and the second air hole intersect at equal intervals.
5、 一种气体输送方法, 用于对供气装置的输出管内的气体进行输送, 其特 征在于, 包括如下步骤: 提供若干相互平行排列的第一管道, 所述第一管道与所述输出管连通且自 由端呈密封状, 所述第一管道的两侧面上开设有若干第一气孔; 5. A gas transport method for transporting gas in an output pipe of a gas supply device, comprising the steps of: Providing a plurality of first pipes arranged in parallel with each other, the first pipe is in communication with the output pipe and the free end is sealed, and a plurality of first air holes are formed on both sides of the first pipe;
提供与所述第一管道相同数量且相互平行排列的第二管道, 所述第二管道 与所述输出管连通且自由端呈密封状, 所述第二管道的两侧面上开设有若干第 二气孔; Providing a second pipe of the same quantity and parallel to each other as the first pipe, the second pipe is in communication with the output pipe and the free end is sealed, and the second pipe is provided with a plurality of second sides Stomata
将所述第一气孔与所述第二气孔调节于同一平面; Adjusting the first air hole and the second air hole in the same plane;
将所述第一管道与所述第二管道相互交叉且等间距地排列在同一平面, 并 使所述第一管道与所述第二管道的气流方向相反。 The first pipe and the second pipe are mutually intersected and arranged at equal intervals in the same plane, and the airflow direction of the first pipe and the second pipe are opposite.
6、 如权利要求 5所述的气体输送方法, 其特征在于: 将相邻的所述第一气 孔与所述第二气孔调节至正对。 6. The gas delivery method according to claim 5, wherein: the adjacent first pores and the second pores are adjusted to face each other.
7、 如权利要求 6所述的气体输送方法, 其特征在于: 所述第一管道上的第 一气孔的孔径沿所述第一管道的自由端逐渐增大; 所述第二管道上的第二气孔 的孔径沿所述第二管道的自由端逐渐增大。 7. The gas delivery method according to claim 6, wherein: a diameter of the first air hole on the first pipe gradually increases along a free end of the first pipe; The aperture of the two air holes gradually increases along the free end of the second duct.
8、 如权利要求 5所述的气体输送方法, 其特征在于: 所述第一气孔与所述 第二气孔的孔径相同, 所述第一气孔与所述第二气孔等间距地交叉。 The gas delivery method according to claim 5, wherein the first air hole has the same aperture as the second air hole, and the first air hole and the second air hole intersect at equal intervals.
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CN2009102469179A CN101813236B (en) | 2009-12-01 | 2009-12-01 | Gas transmission device and transmission method |
CN200910246917.9 | 2009-12-01 |
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WO2011066696A1 true WO2011066696A1 (en) | 2011-06-09 |
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WO (1) | WO2011066696A1 (en) |
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CN110182952A (en) * | 2019-07-03 | 2019-08-30 | 广州博涛生物技术有限公司 | A kind of compounded carbons dosage automatic feedback and regulating device for municipal sewage plant AAO technique |
Citations (4)
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---|---|---|---|---|
US4096822A (en) * | 1975-09-29 | 1978-06-27 | Nippondenso Co., Ltd. | Gaseous atmosphere control apparatus for a semiconductor manufacturing system |
US5010842A (en) * | 1988-10-25 | 1991-04-30 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for forming thin film |
US5543090A (en) * | 1991-04-18 | 1996-08-06 | Dri Steem Humidifier Company | Rapid absorption steam humidifying system |
US20040216665A1 (en) * | 2003-04-29 | 2004-11-04 | Asm International N.V. | Method and apparatus for depositing thin films on a surface |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CH687258A5 (en) * | 1993-04-22 | 1996-10-31 | Balzers Hochvakuum | Gas inlet arrangement. |
CN201568736U (en) * | 2009-12-01 | 2010-09-01 | 东莞宏威数码机械有限公司 | Gas conveying device |
-
2009
- 2009-12-01 CN CN2009102469179A patent/CN101813236B/en not_active Expired - Fee Related
- 2009-12-25 WO PCT/CN2009/076024 patent/WO2011066696A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4096822A (en) * | 1975-09-29 | 1978-06-27 | Nippondenso Co., Ltd. | Gaseous atmosphere control apparatus for a semiconductor manufacturing system |
US5010842A (en) * | 1988-10-25 | 1991-04-30 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for forming thin film |
US5543090A (en) * | 1991-04-18 | 1996-08-06 | Dri Steem Humidifier Company | Rapid absorption steam humidifying system |
US20040216665A1 (en) * | 2003-04-29 | 2004-11-04 | Asm International N.V. | Method and apparatus for depositing thin films on a surface |
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