WO2011049373A2 - Boîtier de dispositif émetteur de lumière et système d'éclairage l'incluant - Google Patents

Boîtier de dispositif émetteur de lumière et système d'éclairage l'incluant Download PDF

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Publication number
WO2011049373A2
WO2011049373A2 PCT/KR2010/007203 KR2010007203W WO2011049373A2 WO 2011049373 A2 WO2011049373 A2 WO 2011049373A2 KR 2010007203 W KR2010007203 W KR 2010007203W WO 2011049373 A2 WO2011049373 A2 WO 2011049373A2
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
lens unit
package
protrusions
Prior art date
Application number
PCT/KR2010/007203
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English (en)
Korean (ko)
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WO2011049373A3 (fr
Inventor
장지원
Original Assignee
엘지이노텍주식회사
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Publication of WO2011049373A2 publication Critical patent/WO2011049373A2/fr
Publication of WO2011049373A3 publication Critical patent/WO2011049373A3/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • Embodiments relate to a light emitting device package and a lighting system having the same.
  • III-V nitride semiconductors are spotlighted as core materials of light emitting devices such as light emitting diodes (LEDs) or laser diodes (LDs) due to their physical and chemical properties.
  • the III-V nitride semiconductor is usually made of a semiconductor material having a composition formula of In x Al y Ga 1-xy N (0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ x + y ⁇ 1).
  • a light emitting diode is a kind of semiconductor device that transmits and receives a signal by converting electricity into infrared light or light using characteristics of a compound semiconductor.
  • LEDs or LDs using such nitride semiconductor materials are widely used in light emitting devices for obtaining light, and have been applied to light sources of various products such as keypad light emitting units, electronic displays, and lighting devices of mobile phones.
  • the embodiment provides a light emitting device package having a new structure.
  • the embodiment provides a light emitting device package that can improve color deviation.
  • the embodiment provides a light emitting device package having a concentric pattern.
  • the light emitting device package includes a package body having a cavity open at the top; A plurality of lead frames disposed in the cavity of the package body; A light emitting device disposed on at least one lead frame of the plurality of lead frames; Resin in the cavity; And a lens unit disposed on the package body and the resin material and including a central concave in the direction of the light emitting element and circular protrusions having different radii around the central portion.
  • the embodiment can provide a light emitting device package having a new structure.
  • the embodiment can provide a light emitting device package that can improve color deviation.
  • the embodiment can improve the thickness of the light emitting device package.
  • FIG. 1 is a perspective view of a light emitting device package according to a first embodiment.
  • FIG. 2 is a cross-sectional view taken along the line A-A of FIG.
  • FIG. 3 is a view illustrating some patterns of the lens unit of FIG. 2.
  • FIG. 4 is a side cross-sectional view of a light emitting device package according to the second embodiment.
  • FIG. 5 is a side cross-sectional view of a light emitting device package according to a third embodiment.
  • FIG. 6 is a view illustrating some patterns of the lens unit of FIG. 5.
  • FIGS. 7 to 10 are diagrams illustrating an example of a pattern of a lens unit according to an exemplary embodiment.
  • FIG 11 is a side cross-sectional view of a light emitting device package according to the fourth embodiment.
  • FIG. 12 and 13 are diagrams illustrating a light distribution of FIG. 1.
  • FIG. 14 is a perspective view illustrating an example of a display device according to an exemplary embodiment.
  • FIG. 15 is a perspective view illustrating another example of a display device according to an exemplary embodiment.
  • 16 is a view showing a lighting apparatus according to an embodiment.
  • each layer, region, pattern or structure may be “under” or “under” the substrate, each layer, region, pad or pattern.
  • “up” and “under” include both “directly” or “indirectly” formed through another layer. do.
  • the criteria for up / down or down / down each layer will be described with reference to the drawings.
  • each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description.
  • the size of each component does not necessarily reflect the actual size.
  • FIG. 1 is a perspective view illustrating a light emitting device package according to a first embodiment
  • FIG. 2 is a cross-sectional view taken along the line A-A of FIG.
  • the light emitting device package 100 may include a first lead frame 121, a second lead frame 123, a package body 110, a light emitting device 125, The resin material 130 and the lens unit 140 is included.
  • the package body 110 may be formed using a polymer-based resin that is easy to inject, and as the polymer-based resin, for example, PPA (Polyphthal amide), LCP (Liquid Crystal Polymer), PPS (Poly) Materials such as phenylene sulfide) or polyetheretherketone (PEEK) may be used.
  • PPA Polyphthal amide
  • LCP Liquid Crystal Polymer
  • PPS Poly
  • the material of the package body 110 is not limited to such a resin material, and various resin materials may be used as the material.
  • the package body 110 may be implemented as a wafer level package (WLP) using a silicon-based material, but is not limited thereto.
  • WLP wafer level package
  • the outer shape of the package body 110 may be formed in a circular columnar shape, a polyhedral shape, and the like, and the shape may be changed by an injection molding or / and etching process of the body material.
  • the package body 110 is illustrated that the cavity 115 of at least one structure is formed.
  • the package body 110 may be formed in a disc shape, and the first and second lead frames 121 and 123 may be coupled in the package body 110 and disposed in a semi-circle shape.
  • the first lead frame 121 and the second lead frame 123 are electrically separated from each other, one side is disposed in the cavity 115 and the other side is exposed to the bottom surface of the package body 110.
  • each of the first lead frame 121 and the second lead frame 123 may be exposed to one or more branches on the outer side surface of the package body 110.
  • the first lead frame 121 and the second lead frame 123 may be selectively formed using a metal plating layer, a via structure, and the like, and a lead frame type will be described as an example for convenience of description.
  • the first lead frame 121 and the second lead frame 123 may be disposed under the package body 110.
  • At least a portion of the first lead frame 121 and the second lead frame 123 may be exposed to the bottom surface of the package body 110 or may extend in the same plane as the bottom surface of the package body 110.
  • first lead frame 121 and the second lead frame 123 may be disposed in the cavity 115 of the package body 110, and the circumference thereof is perpendicular to the bottom surface of the cavity 115. Or inclined.
  • the light emitting device 125 is disposed in the cavity 115, and the light emitting device 125 may be disposed on at least one lead frame 121, and the first lead frame 121 and the second lead frame 123 may be disposed on the cavity 115. ) Is electrically connected.
  • the first lead frame 121 and the second lead frame 123 may be separated by the separating unit 112.
  • the separating part 112 may be a material of the package body 110 or another material, but is not limited thereto.
  • the outer portion 111 of the package body 110 is disposed inside the lead frames 121 and 123, and the accommodating portion 117 is formed therein.
  • An inner side surface of the outer portion 111 may be formed as an inclined surface, and the inclined surface effectively reflects the light reflected from the upper surface of the package body 110 or the light reflected from the lens unit 140.
  • the lens unit 140 is accommodated in the accommodating part 117 of the package body 110, and the outer part 111 guides the outer region of the lens part 140.
  • the first lead frame 121 and the second lead frame 123 not only provide power to the light emitting device 125, but also emit heat generated by the light emitting device 125 and the light emitting device 125. It can serve to reflect the light generated from).
  • the light emitting device 125 may include a wire bonding method using one or more wires 127, or a flip or die bonding method, according to a chip type, and the first lead frame 121 and the second lead frame ( 123).
  • the light emitting device 125 is an LED chip, and includes a LED chip that emits light in a visible light band such as a blue light emitting diode (LED) chip, a green LED chip, and a red LED chip, or a band such as UV (Ultraviolet). It may include an LED chip that emits light.
  • a visible light band such as a blue light emitting diode (LED) chip, a green LED chip, and a red LED chip, or a band such as UV (Ultraviolet). It may include an LED chip that emits light.
  • a visible light band such as a blue light emitting diode (LED) chip, a green LED chip, and a red LED chip, or a band such as UV (Ultraviolet). It may include an LED chip that emits light.
  • the embodiment will be described with the blue LED chip as an example.
  • the accommodating part 117 of the package body 110 may be formed on the cavity 115.
  • An upper diameter of the cavity 115 may be smaller than an upper diameter of the accommodating part 117.
  • the accommodating part 117 is disposed above the package body 110, and the cavity 115 is disposed under the center of the accommodating part 117.
  • the space of the cavity 115 and / or the receiving portion 117 may be formed by the package body 110 or / and at least one lead frame 121, 123, which cavity space is within the technical scope of the embodiment. It can be changed in various ways.
  • At least one light emitting device 125 may be disposed in the cavity 115, and patterns of the lead frames 121 and 123 may be changed when a plurality of LED chips are mounted.
  • the resin material 130 is formed in the cavity 115.
  • the resin material 130 may include a silicon or epoxy material, and at least one phosphor or / and a diffusing agent may be added to the resin material 130, but is not limited thereto.
  • the phosphor may include a yellow phosphor, a green phosphor, a red phosphor, and a blue phosphor.
  • the type of the LED chip and the phosphor in the cavity 115 may be changed according to the target light of the package, but is not limited thereto.
  • the surface of the resin material 130 may be formed in a concave shape, convex shape, or a flat shape, the pattern may be formed on the surface.
  • the cavity 115 and the housing 117 in the package body 110 may be formed in a groove shape having a circular shape or a polygonal shape on a flat surface, and light emitted from the light emitting device 125 may be easily formed.
  • Peripheral surface may be formed as an inclined surface or a multi-stage inclined surface so as to be discharged to the outside.
  • a reflective layer may be formed on the circumferential surface of the cavity 115 and / or the storage unit 117.
  • the package body 110 may be implemented in a glass material, it may be released through the body of the glass material in the cavity.
  • the width of the lens unit 140 may be formed to have a width smaller than the width of the package body 110 and larger than the width of the upper surface of the resin material 130.
  • Between the resin material 130 and the lens unit 140 may include another light-transmissive resin layer or a light-transmitting phosphor layer, but is not limited thereto.
  • the lens unit 140 is disposed on the light emitting device 125 and is emitted from the light emitting device 125 or emitted from the light emitting device 125 to be reflected in the cavity 115 and the receiving unit 117. It acts as a lens to change the directing angle of the advancing light.
  • the lens unit 140 may include a resin material such as silicon or epoxy, a polymer material, or a glass material on the accommodating part 117.
  • the lens unit 140 may include at least a portion of a phosphor or a color conversion material.
  • the lens unit 140 may be accommodated in the accommodating unit 117, and an upper portion thereof may have a convex lens shape.
  • the lens unit 140 may be formed of a resin material in the accommodating unit 117 or by attaching a separate lens.
  • the edge of the lens unit 140 may be formed in a circular shape and may correspond to the outer shape of the package body 110 in a circular shape.
  • the outer shape of the package body 110 and the lens unit 140 may be formed in a polygonal shape, not a circular shape, but is not limited thereto.
  • One of the cavity 115 and the housing 117 may not be formed, and the position of the light emitting device 125 may also be changed.
  • the lens unit 140 may be disposed in direct contact with or spaced apart from the light emitting device 125, and a part of the lens unit 140 may be disposed in an area of the cavity 115, but is not limited thereto.
  • a plurality of protrusions 142 having circular shapes having different sizes are formed on an upper surface of the lens unit 140, and the plurality of protrusions 142 are alternately arranged with concentric grooves and arranged in concentric circles.
  • the concentric protrusion 142 may be formed on the entire upper surface of the lens unit 140, or may be formed on at least one of an upper surface center portion, an upper surface circumference portion, or an area between the upper surface center portion and the upper surface circumference portion.
  • the embodiment will be described as an example that the concentric protrusions 142 are disposed on the entire upper surface of the lens unit 140, but is not limited thereto.
  • the concentric protrusion 142 of the lens unit 140 may have a circular shape having a different radius with respect to the central portion P0, and as another example, at least one of an elliptic shape, an aspherical shape, and a polygonal shape. Can protrude with.
  • the concentric protrusions 142 may be disposed on different planes or on the same plane according to the surface shape of the lens unit 140.
  • the shape of each protrusion 142 may be formed in a polygonal horn shape or a prism pattern of symmetry or asymmetry.
  • the concentric protrusions 142 are formed along the shape of the top surface of the lens unit 140, and the size of each protrusion 142 gradually decreases toward the outside from the central portion P0 of the lens unit 140. Can be formed.
  • the height of each protrusion 142 may be formed to be gradually lowered toward the outside as a distance from the lower surface of the package body 110.
  • the lens unit 140 has the largest height and size of the protrusion 142 adjacent to the central portion P0 corresponding to the light emitting element 125, and a protrusion adjacent to the outer side 111 of the package body 110. 142 has the smallest height and size.
  • the concentric protrusions 142 may include a prism pattern or a Fresnel pattern, and the intervals between the protrusions 142 may be arranged at equal intervals, irregular intervals, or random intervals.
  • the concentric protrusion 142 of the lens unit 140 refracts or disperses when the light emitted from the light emitting device 125 is transmitted or reflected, so that light of the center and side portions of the lens unit 140 is reduced. It may have a uniform distribution of luminosity. In addition, there is almost no color deviation between the center portion and the side portion of the lens unit 140, the degree of the color deviation may be changed by the concentric projections 142.
  • the size of the protrusions 142 gradually decreases toward the outside from the central portion P0 of the lens unit 140, and the ratio of the size of the protrusions 142 is inversely proportional to the distance from the light emitting device 125. Done. Accordingly, the color deviation of the light passing through the lens unit 140 hardly occurs.
  • a concave region may be disposed in the central portion P0 of the protrusions 142, and the concave regions are disposed to overlap each other at a position corresponding to the light emitting device 125.
  • the region may be formed in a horn shape, for example a circular horn.
  • the concave region may include a concave lens shape.
  • the maximum width of the concave region may be formed at least larger than the size of the light emitting device, which may effectively reflect or refract light incident from the light emitting device 125.
  • the central portion P0 of the lens unit 140 is formed to have the highest height from the bottom surface of the accommodating portion 117 or the bottom surface of the package body 110 among the concave regions of the lens unit 140.
  • the edge region of the lens unit 140 may be formed at the lowest height from the bottom surface of the package body 110.
  • Line segments connecting the vertices of the protrusions 142 of the lens unit 140 may be formed in a spherical shape, the spherical shape is the shape of the highest central portion (P0) and the lowest edge region of the lens portion 140 Has
  • the first protrusion P1 and the second protrusion P2 of the lens unit 140 are adjacent to each other, and two side surfaces S1 and S2 may be formed in a triangular prism shape.
  • the angle ⁇ 2: 30 to 60 ° of the second side surface S2 of the first protrusion P1 may be greater than the angle ⁇ 3 of the second side surface S2 of the second protrusion P2 adjacent in the outward direction.
  • the inclined second side surface S2 of each of the protrusions may be formed such that its inclination angle gradually decreases toward the outer direction X.
  • FIG. The ⁇ 2 is about 30 to 80 °, the ⁇ 3 is less than ⁇ 2 may be formed of 20 ⁇ 70 °. Accordingly, the inclined direction of each of the protrusions is formed to be inclined outward from the protrusion center.
  • Heights H1 and H2 of the adjacent first protrusion P1 and the second protrusion P2 may be the same or different from each other, and may be gradually lowered toward the outer direction X in other cases.
  • the inclination angles of the protrusions P1 and P2 of the lens unit 140 may be the same, and in this case, the heights H1 and H2 of the protrusions may be gradually reduced.
  • the inclined side surface may be formed in a concave or convex curved shape having a flat or predetermined curvature.
  • the gap G between the protrusions P1 and P2 of the lens unit 140 and the bottom surface 118 of the accommodating part may be gradually lowered toward the outer direction X from the protrusion center P0, for example, each protrusion (
  • the gap G between the bottoms RO, R1, and R2 of the P1 and P2 and the bottom surface of the accommodating part may be gradually lowered. This may vary depending on the surface shape of the lens unit 140.
  • the intervals of the protrusions P1 and P2 may be arranged to be gradually narrowed toward the outside.
  • FIG. 4 is a side cross-sectional view illustrating a light emitting device package according to a second embodiment and an enlarged view of protrusions thereof.
  • the same parts as the first embodiment will be denoted by the same reference numerals, and redundant description thereof will be omitted.
  • the light emitting device package 100A includes concentric protrusions 142A of the lens unit 140, and the concentric protrusions 142A may not be inclined in an outward direction. It is formed in the form inclined in the inward direction.
  • the concentric protrusion 142A of the lens unit 140 is inclined in a direction opposite to the inclined direction of the protrusion structure of FIG. 2, and the inclined direction of the protrusion may be variously changed within the technical scope of the embodiment.
  • Each inclined surface may be flat, or may be formed as a concave curved surface or a convex curved surface having a predetermined curvature.
  • the concentric protrusions 142A of the lens unit 140 may have protrusions disposed at the centers of the protrusions, and the protrusions 142A may be formed such that at least one of the protrusion size, the protrusion interval, and the protrusion height gradually decreases from the protrusion center toward the outside. Can be.
  • the size and height of the concentric protrusions 142A may be adjusted to become smaller or larger at an angle of the inclined side, and the inclined side may be formed to have a flat or curvature.
  • the light emitting device package 100A may widen the light distribution and the directing angle by the lens unit 140, and color deviation between the center part and the side part in the light distribution area is hardly generated. That is, by adjusting the concentric protrusions 142A of the lens unit 140, the lens unit 140 may have the same color distribution at any angle when viewed from the package top side.
  • the thickness of the light emitting device package 100A may be thinner than a package thickness having a convex lens shape. In this case, the thickness of the light emitting module and the light unit applied to the display device, the indicator device, or the lighting device may be reduced.
  • FIG. 5 is a side cross-sectional view illustrating a light emitting device package according to a third embodiment
  • FIG. 6 is a partially enlarged view of the protrusion of FIG. 5.
  • the same parts as the first embodiment will be denoted by the same reference numerals, and redundant descriptions thereof will be omitted.
  • concentric protrusions 142B of the lens unit 140 are formed, and the concentric protrusions 142B are formed between the protrusions P8 and P9.
  • the intervals may be equally spaced or the inner angles ⁇ 4 of each protrusion may be formed at the same angle.
  • the shape of the protrusion 142B of the lens unit 140 may be formed of an equilateral triangular prism.
  • the protrusion 142B of the lens unit 140 may be formed to have a positive triangle vertex and one side or both sides thereof have a predetermined curvature.
  • FIGS. 7 to 10 are diagrams showing examples of protrusions of a lens unit according to an exemplary embodiment.
  • the lens unit may be formed such that a distance T1 between the protrusions 143 gradually decreases from the center portion O toward the outer direction X, and the size (or height) of the protrusions 143 may be the center portion. It may be formed to gradually become smaller in the outer direction (X) in (O).
  • the lens unit may be formed such that a distance T2 between the protrusions 144 gradually increases from the center portion O toward the outside direction X, and the size of each of the lens portions may extend from the center portion O to the outside direction ( It can be formed to gradually increase toward X).
  • the lens unit may have the same spacing T3 and size between the protrusions 145, and the upper portion of the lens unit may be formed in the shape of a convex lens as shown in FIG. 2, or may be formed flat. have.
  • the lens units may have different intervals T4, T5, T6 and sizes between the protrusions 146 for each of the regions A1, A2, and A3.
  • the interval T4 of the protrusions of the first region A1 adjacent to the center portion O is equally spaced, and the interval T5 of the protrusions of the second region A2 adjacent to the outside of the first region A1.
  • the size of the protrusions of the second region A2 is smaller than the size of the protrusions of the first region.
  • the interval T6 and the size of the protrusions of the third region A3 adjacent to the outer side of the second region A2 may be formed to have the same size and interval as the first region A1.
  • Such an embodiment may control the color deviation of the lens center and the lens side by varying the light distribution of the first area A1, the second area A2, and the third area A3.
  • the light emitting device package of the embodiment is formed in the convex projection of the lens portion formed on the upper portion, the inclination angle of each concentric projection, the curvature of the inclined surface (one side or both sides), the interval between the projections, the size of the projections, the projections According to the direction of the array of the desired light distribution can be implemented without generating color deviation.
  • FIG 11 is a cross-sectional view illustrating a light emitting device package according to a fourth embodiment.
  • the same parts as the above-described embodiments refer to the above-described embodiment, and the concentric protrusions disclosed above may be selectively applied.
  • the light emitting device package 100C includes a package body 110, first and second lead frames 121A and 123A, a light emitting device 125, a resin material 130, and a lens unit 140. It includes.
  • the package body 110 may be disposed as an upper portion 110A and a lower portion 110B, and the first and second lead frames 121A and 123A penetrate between the upper portion 110A and the lower portion 110B. Structure.
  • One end of the first lead frame 121A is disposed in the cavity 115 of the package body 110, and the other end penetrates through the package body 110 and is exposed to the other side of the package body 110 and the package. It extends to the lower surface of the body (110).
  • the other end of the second lead frame 123A is disposed in the cavity 115 of the package body 110, and one end of the second lead frame 123A is exposed to one side of the package body 110 through the package body 110. It extends to one side of the body 110.
  • the other end of the first lead frame 121A and one end of the second lead frame 123A may be trimmed or / and formed after being exposed to the outside of the package body 110.
  • the trimming and forming process can be changed.
  • the package body 110 may include at least one heat dissipation via, and the heat dissipation via may extend from the first lead frame 121A to the bottom surface of the package body 110.
  • the central portion P0 of the lens unit 140 is a concave region, and a reflective layer may be formed.
  • the reflective layer may be formed of a material having a refractive index higher than that of the lens unit 140.
  • the reflective layer may be formed of a compound of oxygen and a metal such as TiO 2 , for example, and the reflectance may be at least 30% or more.
  • the hot spot in the upper direction of a light emitting element can be prevented.
  • the center light distribution and the side light distribution may be uniformly distributed.
  • FIGS. 12 and 13 are diagrams illustrating a light distribution distribution according to the first embodiment.
  • the measurement was performed under the conditions of providing a resin to which a light emitting element and a yellow phosphor of a blue LED chip were added.
  • FIG. 12 is a light distribution distribution of blue light emitted from the light emitting device package of FIG. 1 and has a peak-to-peak directivity angle of 90 to 120 °, Color deviation does not occur.
  • FIG. 13 is a light distribution distribution of yellow light emitted from the light emitting device package of FIG. 1 and has a peak-to-peak directivity angle of 70 to 120 °. Color deviation does not occur.
  • the light distribution distribution of light has a distribution that is shorter between the center and the center side of the light emitting device and is wider on both side sides.
  • the light distribution on both sides is shifted by 30 degrees or more.
  • the orientation angle distribution and the color deviation are examples, and the color deviation distribution and the orientation angle may be changed according to the protrusion shape according to the embodiment disclosed above, but are not limited thereto.
  • the light emitting device package may be implemented as a light emitting module through an array structure using at least one or a plurality of light emitting devices, and may be used as a light source for an illumination device, an indicator device, and a display device, which may be implemented within the technical scope of the embodiment. .
  • the light emitting device may be applied to the light unit.
  • the light unit includes a structure in which a plurality of light emitting elements are arranged, and includes a display device as shown in FIGS. 14 and 15 and a lighting device as shown in FIG. 16, and may include a light, a traffic light, a vehicle headlight, an electric sign, and the like. have.
  • FIG. 14 is an exploded perspective view of a display device according to an exemplary embodiment.
  • the display device 1000 includes a light guide plate 1041, a light emitting module 1031 that provides light to the light guide plate 1041, and a reflective member 1022 under the light guide plate 1041. ), An optical sheet 1051 on the light guide plate 1041, a display panel 1061, a light guide plate 1041, a light emitting module 1031, and a reflective member 1022 on the optical sheet 1051.
  • the bottom cover 1011 may be included, but is not limited thereto.
  • the bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 may be defined as a light unit 1050.
  • the light guide plate 1041 diffuses light to serve as a surface light source.
  • the light guide plate 1041 is made of a transparent material, for example, acrylic resin-based, such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate (PEN) It may include one of the resins.
  • PMMA polymethyl metaacrylate
  • PET polyethylene terephthlate
  • PC polycarbonate
  • COC cycloolefin copolymer
  • PEN polyethylene naphthalate
  • the light emitting module 1031 provides light to at least one side of the light guide plate 1041, and ultimately serves as a light source of the display device.
  • the light emitting module 1031 may include at least one, and may provide light directly or indirectly at one side of the light guide plate 1041.
  • the light emitting module 1031 may include a substrate 1033 and a light emitting device 100 according to the exemplary embodiment disclosed above, and the light emitting device 100 may be arranged on the substrate 1033 at predetermined intervals.
  • the substrate 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown).
  • the substrate 1033 may include not only a general PCB but also a metal core PCB (MCPCB, Metal Core PCB), a flexible PCB (FPCB, Flexible PCB) and the like, but is not limited thereto.
  • MCPCB Metal Core PCB
  • FPCB Flexible PCB
  • the substrate 1033 may be removed.
  • a part of the heat dissipation plate may contact the upper surface of the bottom cover 1011.
  • the plurality of light emitting devices 100 may be mounted on the substrate 1033 such that an emission surface from which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto.
  • the light emitting device 100 may directly or indirectly provide light to a light incident portion, which is one side of the light guide plate 1041, but is not limited thereto.
  • the reflective member 1022 may be disposed under the light guide plate 1041.
  • the reflective member 1022 may improve the luminance of the light unit 1050 by reflecting light incident to the lower surface of the light guide plate 1041 and pointing upward.
  • the reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto.
  • the reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.
  • the bottom cover 1011 may accommodate the light guide plate 1041, the light emitting module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with an accommodating part 1012 having a box shape having an upper surface opened thereto, but is not limited thereto. The bottom cover 1011 may be combined with the top cover, but is not limited thereto.
  • the bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding.
  • the bottom cover 1011 may include a metal or non-metal material having good thermal conductivity, but is not limited thereto.
  • the display panel 1061 is, for example, an LCD panel, and includes a first and second substrates of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates.
  • a polarizer may be attached to at least one surface of the display panel 1061, but the polarizer is not limited thereto.
  • the display panel 1061 displays information by light passing through the optical sheet 1051.
  • the display device 1000 may be applied to various portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.
  • the optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light transmissive sheet.
  • the optical sheet 1051 may include at least one of a sheet such as, for example, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet.
  • the diffusion sheet diffuses the incident light
  • the horizontal and / or vertical prism sheet focuses the incident light into the display area
  • the brightness enhancement sheet reuses the lost light to improve the brightness.
  • a protective sheet may be disposed on the display panel 1061, but is not limited thereto.
  • the light guide plate 1041 and the optical sheet 1051 may be included as an optical member on the optical path of the light emitting module 1031, but are not limited thereto.
  • 15 is a diagram illustrating a display device according to an exemplary embodiment.
  • the display device 1100 includes a bottom cover 1152, a substrate 1120 on which the light emitting device 100 disclosed above is arranged, an optical member 1154, and a display panel 1155.
  • the substrate 1120 and the light emitting device 100 may be defined as a light emitting module 1060.
  • the bottom cover 1152, at least one light emitting module 1060, and the optical member 1154 may be defined as a light unit.
  • the bottom cover 1152 may include an accommodating part 1153, but is not limited thereto.
  • the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, horizontal and vertical prism sheets, and a brightness enhancement sheet.
  • the light guide plate may be made of a PC material or a poly methy methacrylate (PMMA) material, and the light guide plate may be removed.
  • the diffusion sheet diffuses the incident light
  • the horizontal and vertical prism sheets focus the incident light onto the display area
  • the brightness enhancement sheet reuses the lost light to improve the brightness.
  • the optical member 1154 is disposed on the light emitting module 1060, and performs surface light source, diffusion, condensing, etc. of the light emitted from the light emitting module 1060.
  • 16 is a perspective view of a lighting apparatus according to an embodiment.
  • the lighting device 1500 may include a case 1510, a light emitting module 1530 installed in the case 1510, and a connection terminal installed in the case 1510 and receiving power from an external power source. 1520).
  • the case 1510 may be formed of a material having good heat dissipation, for example, may be formed of a metal material or a resin material.
  • the light emitting module 1530 may include a substrate 1532 and a light emitting device 100 according to an embodiment mounted on the substrate 1532.
  • the plurality of light emitting devices 100 may be arranged in a matrix form or spaced apart at predetermined intervals.
  • the substrate 1532 may be a circuit pattern printed on an insulator.
  • a general printed circuit board PCB
  • a metal core PCB PCB
  • a flexible PCB PCB
  • a ceramic PCB FR-4 substrates and the like.
  • the substrate 1532 may be formed of a material that reflects light efficiently, or a surface may be coated with a color, for example, white or silver, in which the light is efficiently reflected.
  • At least one light emitting device 100 may be mounted on the substrate 1532.
  • Each of the light emitting devices 100 may include at least one light emitting diode (LED) chip.
  • the LED chip may include a colored light emitting diode emitting red, green, blue or white colored light, and a UV emitting diode emitting ultraviolet (UV) light.
  • UV ultraviolet
  • the light emitting module 1530 may be disposed to have a combination of various light emitting devices 100 to obtain color and luminance. For example, a white light emitting diode, a red light emitting diode, and a green light emitting diode may be combined to secure high color rendering (CRI).
  • CRI color rendering
  • connection terminal 1520 may be electrically connected to the light emitting module 1530 to supply power.
  • the connection terminal 1520 is inserted into and coupled to an external power source in a socket manner, but is not limited thereto.
  • the connection terminal 1520 may be formed in a pin shape and inserted into an external power source, or may be connected to the external power source by a wire.
  • the light emitting device 100 may be mounted on the substrate to be implemented as a light emitting module, or may be mounted and packaged as an LED chip to be implemented as a light emitting module.
  • the embodiment provides a light emitting device package applied to a lamp, an indicator lamp, a headlamp, a street lamp, an indoor lamp, and the like.
  • the embodiment provides a light unit having a light emitting device package.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne, entre autres modes de réalisation, un boîtier de dispositif émetteur de lumière et un système d'éclairage. Le boîtier de dispositif émetteur de lumière selon un mode de réalisation comporte : un corps de boîtier doté d'une cavité comprenant une partie supérieure ouverte ; une pluralité de grilles de connexion disposées dans la cavité du corps de boîtier ; un dispositif émetteur de lumière disposé sur au moins une grille de connexion parmi lesdites grilles de connexion ; un matériau en résine à l'intérieur de la cavité ; et une partie de lentille disposée sur le corps de boîtier et le matériau en résine et comprenant une partie centrale enfoncée en direction du dispositif émetteur de lumière et des protubérances circulaires de rayons différents autour de la partie centrale.
PCT/KR2010/007203 2009-10-20 2010-10-20 Boîtier de dispositif émetteur de lumière et système d'éclairage l'incluant WO2011049373A2 (fr)

Applications Claiming Priority (2)

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KR10-2009-0099926 2009-10-20
KR1020090099926A KR101103908B1 (ko) 2009-10-20 2009-10-20 발광소자 패키지

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WO2011049373A3 WO2011049373A3 (fr) 2011-07-14

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WO2017191954A1 (fr) * 2016-05-04 2017-11-09 엘지이노텍 주식회사 Module d'éclairage et appareil d'éclairage comportant celui-ci

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KR101515439B1 (ko) * 2013-12-26 2015-05-04 (주)한성스마트엘이디 렌즈형 커버를 포함하는 led 조명장치
US9285098B2 (en) * 2014-07-21 2016-03-15 CoreLed Systems, LLC LED luminaire
JP2017098414A (ja) * 2015-11-24 2017-06-01 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光装置
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KR20110043015A (ko) 2011-04-27
WO2011049373A3 (fr) 2011-07-14

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