WO2020085703A1 - Module d'éclairage et dispositif d'éclairage le comprenant - Google Patents

Module d'éclairage et dispositif d'éclairage le comprenant Download PDF

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Publication number
WO2020085703A1
WO2020085703A1 PCT/KR2019/013471 KR2019013471W WO2020085703A1 WO 2020085703 A1 WO2020085703 A1 WO 2020085703A1 KR 2019013471 W KR2019013471 W KR 2019013471W WO 2020085703 A1 WO2020085703 A1 WO 2020085703A1
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WO
WIPO (PCT)
Prior art keywords
light
light emitting
area
resin layer
substrate
Prior art date
Application number
PCT/KR2019/013471
Other languages
English (en)
Korean (ko)
Inventor
이동현
이정호
Original Assignee
엘지이노텍 주식회사
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Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to EP19877506.6A priority Critical patent/EP3872391B1/fr
Priority to CN201980070215.1A priority patent/CN113167443B/zh
Priority to US17/284,512 priority patent/US11353193B2/en
Publication of WO2020085703A1 publication Critical patent/WO2020085703A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V11/00—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00
    • F21V11/08—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using diaphragms containing one or more apertures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
    • F21S43/235—Light guides
    • F21S43/236—Light guides characterised by the shape of the light guide
    • F21S43/239—Light guides characterised by the shape of the light guide plate-shaped
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
    • F21S43/235—Light guides
    • F21S43/242—Light guides characterised by the emission area
    • F21S43/245—Light guides characterised by the emission area emitting light from one or more of its major surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
    • F21S43/235—Light guides
    • F21S43/249—Light guides with two or more light sources being coupled into the light guide
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
    • F21S43/26—Refractors, transparent cover plates, light guides or filters not provided in groups F21S43/235 - F21S43/255
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0091—Reflectors for light sources using total internal reflection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/05—Optical design plane
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0036—2-D arrangement of prisms, protrusions, indentations or roughened surfaces
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0038—Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0051—Diffusing sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133611—Direct backlight including means for improving the brightness uniformity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
    • G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
    • G—PHYSICS
    • G02—OPTICS
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    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
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    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Definitions

  • An embodiment of the invention relates to an illumination module having a light emitting element and providing a surface light source.
  • An embodiment of the invention relates to a lighting device having a lighting module, a light unit, a liquid crystal display device, or a vehicle lamp.
  • Typical lighting applications include backlights for displays and signs as well as vehicle lights.
  • the light emitting device for example, a light emitting diode (LED)
  • LED light emitting diode
  • the light emitting diode is applied to various display devices, various lighting devices such as indoor or outdoor lights.
  • a lamp employing a light emitting diode has been proposed. Compared to incandescent lamps, light emitting diodes are advantageous in that they consume less power.
  • the emission angle of the light emitted from the light emitting diode is small, when using the light emitting diode as a vehicle lamp, there is a need to increase the light emitting area of the lamp using the light emitting diode. Since the light emitting diode is small, it can increase the freedom of design of the lamp and is economical due to its semi-permanent life.
  • An embodiment of the present invention provides an illumination module in which a light blocking portion is disposed on a resin layer covering a light emitting element.
  • An embodiment of the invention provides an illumination module having a light-shielding portion made of an air gap in a region lower than an upper surface of the resin layer.
  • An embodiment of the present invention provides an illumination module in which a light-shielding portion disposed in a recess of a negative shape is disposed between a resin layer and a diffusion layer on a light emitting device.
  • An embodiment of the present invention provides an illumination module including a light blocking portion having an area in contact with the diffusion layer between the diffusion layer and the bonded area on the upper surface of the resin layer.
  • An embodiment of the invention provides an illumination module in which a reflective member is disposed between the resin layer and the substrate.
  • An embodiment of the invention provides an illumination module for irradiating a surface light source and an illumination device having the same.
  • An embodiment of the invention may provide a backlight unit having a lighting module, a liquid crystal display device, or a vehicle lamp.
  • Lighting module according to an embodiment of the invention the substrate; A reflective member disposed on the substrate; A plurality of light emitting elements disposed on the substrate; A resin layer disposed on the reflective member and the light emitting element; And a diffusion layer disposed on the resin layer, wherein the resin layer includes a light-shielding portion that is a recessed area recessed from the upper surface of the resin layer, and the light emitting device emits light in a first direction, and the light-shielding The part may overlap from the first region overlapping the light emitting element, the second region extending in the first direction from the first region, the third region extending from the second region in the first side direction of the substrate, and the second region.
  • a fourth area extending in the second side direction of the substrate may be included, and the area of the second area may be larger than the area of the third area or the area of the fourth area, and the light blocking portion may be formed as an air gap. .
  • the second area, the third area, and the fourth area of the light blocking portion may include curved surfaces that are convex outward.
  • the area of the first region is 1/2 or more of the area of the top surface of the light emitting device, and the light emitting device includes an emission surface that emits light in the first direction, and the emission surface is perpendicular to the upper surface of the substrate. Can be placed.
  • a plurality of light emitting elements are disposed in the first direction on the substrate, and a plurality of light blocking units are disposed in the first direction on the resin layer, and a maximum length of the light blocking unit in the first direction is equal to the first direction. It may be smaller than the maximum width in the orthogonal second direction.
  • the inner surface of the resin layer forming the light blocking portion is overlapped and flat in the vertical direction with the light emitting element, and the width in the second direction of the inner surface of the flat resin layer is greater than the width in the second direction of the light emitting element. You can.
  • the bottom surface of the resin layer forming the light blocking portion is flat, and the depth of the light blocking portion may range from 0.05 to 0.1 times the thickness of the resin layer.
  • the light blocking portion is disposed on a region of the resin layer that is outside a predetermined angle from a straight line horizontal to the upper surface of the light emitting device, and the angle may be less than 10 degrees.
  • the bottom surface of the resin layer forming the light shielding portion may have a lower adhesive strength than the adhesive strength of the surface in contact with the diffusion layer and the resin layer.
  • the reflective member includes a plurality of first open regions disposed adjacent to the first side of the substrate, and a plurality of second open regions disposed adjacent to the second side of the substrate, , Each of the plurality of first open areas and the second open areas may be arranged in a first direction, and the resin layer may include protrusions disposed in each of the first open area and the second open area.
  • the gap between the first and second open regions is smaller than the maximum width in the second direction of the light blocking portion, and the first and second open regions do not overlap the light emitting elements in the first and second directions.
  • the light blocking portion may overlap with any one of the first open region or any one of the second open region in the vertical direction.
  • the lighting module it is possible to improve the light intensity and uniformity of the surface light source.
  • a light-shielding portion made of an air gap in the resin layer disposed on the light emitting device, it is possible to prevent hot spots and reduce light loss.
  • a diffusion layer using the adhesive strength of the top surface of the resin layer, a light-shielding portion or a total reflection surface can be provided through etching the top surface of the resin layer, and hot spots can be prevented and uniformity of light can be improved.
  • a reflective member between the resin layer and the substrate light reflection efficiency may be improved.
  • a vehicle lighting device having a lighting module according to an embodiment of the invention, a backlight unit, various display devices, a surface light source lighting device, or a vehicle lamp.
  • FIG. 1 is a plan view showing a lighting module according to an embodiment.
  • FIG. 2 is a partially enlarged view of the lighting module of FIG. 1.
  • FIG. 3 is a cross-sectional view of the lighting module A-A of FIG. 1.
  • FIG. 4 is a partially enlarged view of the lighting module of FIG. 3.
  • FIG. 5 is an enlarged view of a reflective member in the lighting module of FIG. 3.
  • FIG. 6 is a sectional view taken along line B-B of the lighting module of FIG. 1.
  • FIG. 7 to 10 are views illustrating a manufacturing process of the lighting module of FIG. 1.
  • FIG. 11 is an example of a lighting device having the lighting module of FIG. 3.
  • FIG. 12 is a front view of a light emitting device on a substrate in the lighting module of FIG. 6.
  • FIG. 13 is a side view of a light emitting device on a substrate in the lighting module of FIG. 3.
  • FIG. 14 is a view showing a lamp having a lighting module or a lighting device according to an embodiment.
  • FIG. 15 is a plan view of a vehicle to which the vehicle lamp of FIG. 14 is applied.
  • a singular form may also include a plural form unless specifically stated in the phrase, and is combined as A, B, C when described as "at least one (or more than one) of A and B, C". It can contain one or more of all possible combinations.
  • terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the component from other components, and the term does not determine the essence, order, or order of the component.
  • the component when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also to the component It may also include a case of 'connected', 'coupled' or 'connected' due to another component between the other components.
  • the top (top) or bottom (bottom) when described as being formed or disposed in the "top (top) or bottom (bottom)" of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other It also includes a case in which another component described above is formed or disposed between two components.
  • up (up) or down (down) it may include the meaning of the downward direction as well as the upward direction based on one component.
  • the lighting device according to the invention can be applied to various lamp devices that require lighting, such as vehicle lamps, home lighting devices, and industrial lighting devices.
  • vehicle lamps head lamps, side mirror lights, side maker lights, fog lights, tail lamps, brake lights, daytime running lights, vehicle interior lights, door scars, rear
  • the lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various electric vehicle fields.
  • it can be applied to all lighting-related fields or advertising-related fields that are currently developed and commercialized or can be implemented according to future technological development.
  • FIG. 1 is a plan view showing a lighting module according to an embodiment
  • FIG. 2 is a partially enlarged view of the lighting module of FIG. 1
  • FIG. 3 is a cross-sectional view along the AA side of the lighting module of FIG. 1
  • FIG. 4 is the lighting module of FIG. Is a partially enlarged view
  • FIG. 5 is an enlarged view of a reflective member in the lighting module of FIG. 3
  • FIG. 6 is a cross-sectional view of the lighting module of FIG.
  • the lighting module 400 includes a substrate 401, a light emitting device 100 disposed on the substrate 401, the substrate 401 and the light emitting device A resin layer 420 covering the (100), and a diffusion layer 430 may be included on the resin layer 420.
  • the lighting module 400 may include a reflective member 410 disposed on the substrate 401.
  • the lighting module 400 according to an embodiment of the present invention may emit light emitted from the light emitting device 100 as a surface light source.
  • the lighting module 400 may be defined as a light emitting cell or a light source module.
  • the lighting module 400 may include one light emitting cell or a plurality of light emitting cells on the substrate 401.
  • the substrate 401 may include a printed circuit board (PCB).
  • the substrate 401 may include, for example, at least one of a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 substrate. .
  • PCB resin-based printed circuit board
  • the substrate 401 may be electrically connected to the light emitting device 100.
  • the substrate 401 includes a wiring layer (not shown) on the top, and the wiring layer may be electrically connected to the light emitting device 100.
  • the plurality of light emitting devices 100 may be connected in series, parallel, or in series-parallel by the wiring layer.
  • the substrate 401 may function as a base member or a support member disposed under the light emitting device 100 and the resin layer 420.
  • the upper surface of the substrate 401 may include an X-Y plane.
  • the upper surface of the substrate 401 may be a flat or curved surface.
  • the thickness of the substrate 401 may be a vertical direction or a height in the Z direction.
  • the X direction may be the first direction
  • the Y direction may be the second direction.
  • the Z direction may be a direction orthogonal to the first and second directions.
  • the length of the first direction of the substrate 401 may be greater than the width of the second direction.
  • the length of the first direction of the substrate 401 may be two times or more, for example, four times or more, than the width Y1 in the second direction.
  • the plurality of light emitting devices 100 may be arranged on the substrate 401 at a predetermined interval in a first direction.
  • the substrate 401 may include a transmissive material through which light is transmitted through the upper and lower surfaces.
  • the translucent material may include at least one of PET (Polyethylene terephthalate), PS (Polysty
  • the light emitting device 100 is disposed on the substrate 401 and emits light in a first direction.
  • the light emitting device 100 emits light having the highest intensity in the first direction.
  • the light emitting device 100 includes an emission surface 81 through which light is emitted, and the emission surface 81 may be disposed in a third direction or a vertical direction with respect to a horizontal upper surface of the substrate 401. .
  • the exit surface 81 may be a vertical plane, or may include a concave surface or a convex surface with respect to the vertical surface.
  • the light emitting device 100 is disposed on the substrate 401 and may be electrically connected to pads 403 and 405 of the substrate 401 by conductive bonding members 203 and 205.
  • the conductive bonding members 203 and 205 may be a solder material or a metal material.
  • the light emitting device 100 may be arranged in at least one column in the second direction on the substrate 401, or may be arranged in two or more columns, and the light emitting devices 100 in one or more columns ) May be disposed in the first direction of the substrate 401 or may be disposed in different directions.
  • the light emitting device 100 may be arranged as a first light emitting device from one end of the substrate 401 and a second light emitting device in the emission direction of the first light emitting device.
  • the first light emitting element and the second light emitting element are irradiated with light in the other end direction or the first direction of the substrate 401. That is, the first light emitting element emits light in the direction of the second light emitting element, and the second light emitting element emits light in the other end direction of the substrate 401 or in the opposite direction in which the first light emitting element is disposed.
  • the light emitting device 100 is a device having a light emitting diode (LED), and may include a package in which an LED chip is packaged.
  • the light emitting chip 71 may emit at least one of blue, red, green, ultraviolet (UV), and infrared rays.
  • the light emitting device 100 may emit at least one of white, blue, red, green, and infrared rays.
  • the light emitting device 100 may be a side view type in which a bottom portion is electrically connected to the substrate 401.
  • the light emitting device 100 may be an LED chip, and may emit light in each side direction of the LED chip.
  • the emission surface 81 of the light emitting device 100 may be disposed on at least one side surface, not the top surface of the light emitting device 100.
  • the exit surface 81 may be a side adjacent to the substrate 401 among the side surfaces of the light emitting device 100, for example, a side adjacent to the top surface of the substrate 401.
  • the emission surface 81 is disposed on a side surface between the bottom surface and the top surface of the light emitting device 100 and emits light having the highest intensity in the first direction.
  • the emission surface 81 of the light emitting device 100 may be a surface adjacent to the reflective member 410 or a surface perpendicular to the upper surface of the substrate 401 and the upper surface of the reflective member 410.
  • the light emitted through the emission surface 81 of the light emitting device 100 proceeds in a direction parallel to the upper surface of the substrate 401, or is reflected by the reflective member 410, or of the resin layer 420. It can proceed in the upward direction.
  • the thickness of the light emitting device 100 may be, for example, 3 mm or less, for example, in the range of 0.8 mm to 2 mm.
  • the length in the second direction of the light emitting device 100 (D1 in FIG. 2) may be 1.5 times or more the thickness of the light emitting device 100.
  • the light emitting device 100 may have a light directing angle in the ⁇ Y direction wider than a light directing angle in the ⁇ Z direction.
  • the light directing angle in the second direction of the light emitting device 100 may be 110 degrees or more, for example, 120 degrees to 160 degrees or 140 degrees or more.
  • the light directing angle in the third direction of the light emitting device 100 may have a range of 110 degrees or more, for example, 120 degrees to 140 degrees.
  • the reflective member 410 may be disposed between the substrate 401 and the resin layer 420.
  • the reflective member 410 may be adhered to the upper surface of the substrate 401.
  • the reflective member 410 may have an area smaller than the top surface area of the substrate 401.
  • the reflective member 410 may be provided in the form of a film having a metallic material or a non-metallic material.
  • the reflective member 410 may be spaced apart from the edge of the substrate 401, and a portion of the resin layer 420 may be attached to the substrate 401 in an area spaced apart from the edge of the reflective member 410. Can be. Since the edge portion of the reflective member 410 contacts the resin layer 420, it is possible to prevent the edge portion of the resin layer 420 from peeling off.
  • the reflective member 410 may include an opening 417 in which the lower portion of the light emitting device 100 is disposed. In the opening 417 of the reflective member 410, an upper surface of the substrate 401 is exposed and a portion to which the lower portion of the light emitting device 100 is bonded may be disposed. The opening 417 may have a size equal to or larger than the size of the light emitting device 100.
  • the reflective member 410 may be in contact with an upper surface of the substrate 401 or may be adhered between the resin layer 420 and the substrate 401. Here, the reflective member 410 may be removed when a high reflective material is coated on the upper surface of the substrate 401.
  • the reflective member 410 may be formed to a thickness thinner than the thickness of the light emitting device 100.
  • the thickness of the reflective member 410 may include a range of 0.2mm ⁇ 0.02mm.
  • the lower portion of the light emitting device 100 may penetrate through the opening 417 of the reflective member 410, and the upper part of the light emitting device 100 may protrude.
  • the emitting surface 81 of the light emitting device 100 may be provided in a direction perpendicular to the upper surface of the reflective member 410.
  • the reflective member 410 may include a metallic material or a non-metallic material.
  • the metallic material may include metals such as aluminum, silver, and gold.
  • the non-metallic material may include a plastic material or a resin material.
  • the plastic material is polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyphenyl bichloride, polyethylene terephthalate, polyvinyl alcohol, polycarbonate, polybutylene terephthalate, polyethylene naphthalate, polyamide, polyacetal, polyphenylene Ether, polyamideimide, polyetherimide, polyetheretherketone, polyimide, polytetrafluoroethylene, liquid crystal polymer, fluororesin, copolymers thereof, and mixtures thereof.
  • a metal oxide such as TiO 2 , Al 2 O 3 or SiO 2 may be added to silicon or epoxy.
  • the reflective member 410 may be implemented in a single layer or multiple layers, and the light reflection efficiency may be improved by the layer structure.
  • the reflective member 410 according to an exemplary embodiment of the present invention reflects incident light, thereby increasing the amount of light so that light is emitted uniformly.
  • the reflective member 410 may be arranged in a multi-layer structure.
  • the reflective member 410 may include an adhesive layer L1, a reflective layer L2, and a dot layer L3.
  • the adhesive layer L1 may attach the reflective member 410 to the upper surface of the substrate 401.
  • the adhesive layer (L1) is a transparent material, and may be an adhesive such as UV adhesive, silicone or epoxy.
  • the reflective layer L2 may include a plurality of reflectors La inside the resin material.
  • the reflector La may be a bubble such as air, or a medium having a refractive index of the same medium as air.
  • the resin material of the reflective layer L2 is a material such as silicone or epoxy, and the reflector La may be formed by injecting air bubbles into the resin material.
  • the reflective layer L2 may reflect light incident by the plurality of reflectors La or refract it in different directions.
  • the thickness of the reflective layer L2 may be 80% or more of the thickness of the reflective member 410.
  • the reflective layer L2 may include a dot layer L3 in which a plurality of dots are arranged.
  • the dot layer L3 may be formed on the reflective layer L2 through printing.
  • the dot layer L3 may include reflective ink.
  • the dot layer (L3) may be printed with a material including any one of TiO 2 , CaCO 3 , BaSO 4 , Al 2 O 3 , Silicon, and PS. Each dot of the dot layer (L3) may have a lateral cross-section or a polygonal shape.
  • the density of the dot pattern of the dot layer L3 may be higher as it is further away from the emission surface 81 of the light emitting device 100.
  • the material of the dot layer L3 may be white.
  • the dot layer L3 on the upper surface of the reflective member 410 is disposed in the emission direction of the light emitting device 100, thereby improving light reflectance, reducing light loss, and improving brightness of a surface light source.
  • the reflective member 410 may include a plurality of open areas 411 and 413.
  • the plurality of open areas 411 and 413 includes a plurality of first and second open areas 411 and 413 spaced apart from each other.
  • the plurality of first open areas 411 may be arranged in a first direction
  • the plurality of second open areas 413 may be arranged in a first direction.
  • the first and second open areas 411 and 413 may be spaced apart in the second direction.
  • the first open area 411 may be adjacent to the first side S1 of the substrate 401
  • the second open area 413 may be adjacent to the second side S2 of the substrate 401.
  • the first open area 411 is arranged along the first side S1 of the substrate 401
  • the second open area 413 is arranged along the second side S2 of the substrate 401. Can be.
  • Each of the first open areas 411 may overlap each of the second open areas 413 in a second direction.
  • the first and second open areas 411 and 413 may not overlap the light emitting device 100 in the second direction with the light emitting device 100.
  • the first and second open areas 411 and 413 may not overlap the light emitting device 100 in the first and second directions.
  • the first and second open regions 411 and 413 and the opening 417 may not overlap in the second direction. Accordingly, since the first and second open regions 411 and 413 are not disposed on both sides of the reflective member 410 in the second direction of the opening 417, in the second direction region where the opening 417 is disposed. A drop in adhesive strength can be prevented.
  • At least one or a portion of the first and second open areas 411 and 413 may overlap with at least one of the light emitting devices 100 in a second direction.
  • the distance between the plurality of first and second open areas 411 and 413 may be greater than the length of the first direction X of the light emitting device 100.
  • Each of the first and second open regions 411 and 413 may be an elliptical shape having a long shape in a first direction, or a circular shape or a polygonal shape.
  • Each of the first and second open areas 411 and 413 may have a distance B4 in the first direction smaller than a length B5 in the first direction of the first and second open areas 411 and 413.
  • B5> B4 has a relationship, and the difference between the distance B4 and the length B5 may range from 0.1 mm to 1 mm. Since the length B5 of each of the first and second open regions 411 and 413 of the reflective member 410 is arranged to be long in the first direction, it is possible to prevent a decrease in adhesive strength in a region adjacent to the long side edge of the substrate 401. You can. That is, reflection disposed between the first side S1 of the substrate 401 and the first open area 411 and between the second side S2 of the substrate 401 and the second open area 413. A decrease in the adhesive force of the member 410 can be prevented.
  • the distance C2 between the first and second open areas 411 and 413 may be greater than the second direction length D1 of the light emitting device 100 and the length D1 ).
  • Each of the first and second open areas 411 and 413 may have a width B6 in the second direction of 1/5 or less, for example, 1/5 to 1/10 of the length B5.
  • the width B6 may range from 1.2 mm or less, for example, from 0.8 mm to 1.2 mm.
  • Each of the first and second open areas 411 and 413 may prevent a decrease in adhesive force in the second direction rather than a decrease in adhesive force in the first direction.
  • the first open area 411 is spaced apart from the first side S1 of the substrate 401 at a predetermined distance B2, and the second open area 413 is the second side of the substrate 401. It can be spaced from (S2) at a predetermined interval (B2).
  • the gap B2 may be in the range of 1.2 mm or less, for example, 0.5 mm to 1.2 mm. If the gap B2 is smaller than the above range, the adhesive strength of the reflective member 410 disposed outside the first and second open areas 411 and 413 may be reduced, and if it is larger than the above range, the reflective area may be reduced.
  • the reflective member 410 is disposed outside the first and second open regions 411 and 413 and may be exposed on the first and second side surfaces S1 and S2 of the substrate 401.
  • the resin layer 420 may be disposed on the first and second open regions 411 and 413 and the reflective member 410.
  • the resin layer 420 may be adhered to the upper surface of the substrate 401 through the first and second open regions 411 and 413 to fix the outer portion of the reflective member 410.
  • the resin layer 420 may be disposed on the substrate 401.
  • the resin layer 420 may face the substrate 401.
  • the resin layer 420 may be disposed on all or part of the upper surface of the substrate 401.
  • the area of the lower surface of the resin layer 420 may be equal to or smaller than the area of the upper surface of the substrate 401.
  • the resin layer 420 may be formed of a transparent material.
  • the resin layer 420 may include a resin material such as silicone or epoxy.
  • the resin layer 420 may include a thermosetting resin material, and may optionally include PC, OPS, PMMA, PVC, and the like.
  • the resin layer 420 may be formed of glass, but is not limited thereto.
  • a resin material using a urethane acrylate oligomer as a main material may be used as the main material of the resin layer 420.
  • a synthetic oligomer, a urethane acrylate oligomer, and a polyacrylic polymer type may be used.
  • a low-boiling dilution type reactive monomer such as IBOA (isobornyl acrylate), HPA (Hydroxylpropyl acrylate, 2-HEA (2-hydroxyethyl acrylate)
  • the resin layer 420 is provided as a layer that guides light to the resin, it may be provided in a thinner thickness than in the case of glass and may be provided as a flexible plate.
  • the resin layer 420 may emit the point light emitted from the light emitting device 100 in the form of a line light source or a surface light source.
  • a bead (not shown) may be included in the resin layer 420, and the bead may diffuse and reflect incident light, thereby increasing the amount of light.
  • the beads may be disposed in a range of 0.01 to 0.3% by weight of the resin layer 420.
  • the beads are composed of any one selected from silicon, silica, glass bubble, polymethyl methacrylate (PMMA), urethane, Zn, Zr, Al 2 O 3 , and acryl. It may be, the particle diameter of the bead may be in the range of about 1 ⁇ m to about 20 ⁇ m, but is not limited thereto.
  • the resin layer 420 is disposed on the light emitting device 100, the light emitting device 100 can be protected and loss of light emitted from the light emitting device 100 can be reduced.
  • the light emitting device 100 may be buried under the resin layer 420.
  • the resin layer 420 may contact the surface of the light emitting device 100 and may contact the exit surface 81 of the light emitting device 100.
  • a portion of the resin layer 420 may be disposed in the opening 417 of the reflective member 410.
  • a portion of the resin layer 420 may contact the upper surface of the substrate 401 through the opening 417 of the reflective member 410. Accordingly, a portion of the resin layer 420 is in contact with the substrate 401, thereby fixing the reflective member 410 between the resin layer 420 and the substrate 401.
  • the resin layer 420 may include a first protrusion 421 disposed in the first open area 411 and a second protrusion 423 disposed in the second open area 413.
  • the first protrusion 421 may be attached to the upper surface of the substrate 401 along the first open area 411.
  • the first protrusion 421 is disposed in the first open area 411 to prevent deterioration of adhesion in the outer region of the reflective member 410 adjacent to the first side S1 of the substrate 401.
  • the second protrusion 423 may be attached to the upper surface of the substrate 401 along the second open area 413.
  • the second protrusion 423 is disposed in the second open region 413 of the reflective member 410, in the outer region of the reflective member 410 adjacent to the second side S2 of the substrate 401. A drop in adhesive strength can be prevented.
  • the first protrusions 421 are arranged in the first direction
  • the second protrusions 423 are arranged in the first direction
  • the first and second protrusions 421 and 423 are spaced apart from each other with respect to the second direction. have.
  • the first protrusion 421 and the second protrusion 423 may protrude lower than the upper surface of the reflective member 410.
  • the first protrusion 421 and the second protrusion 423 may protrude in a lower surface direction of the substrate 401.
  • the first protruding portion 421 and the second protruding portion 423 may prevent the edge region of the reflective member 410 from being lifted, and may be disposed in the bezel region of the housing to which the lighting module is coupled.
  • the thickness Z1 of the resin layer 420 may be 1.8 mm or more, for example, 1.8 to 2.5 mm.
  • the thickness Z1 of the resin layer 420 is thicker than the above range, the luminosity may deteriorate and it may be difficult to provide a flexible module due to an increase in module thickness.
  • the thickness Z1 of the resin layer 420 is smaller than the above range, it is difficult to provide a surface light source of uniform light intensity.
  • the length of the resin layer 420 in the first direction may be the same as the length of the substrate 401 in the first direction
  • the width of the resin layer 420 in the second direction may be the second direction of the substrate 401. It may be the same as the width Y1.
  • each side of the resin layer 420 may be disposed on the same plane as each side of the substrate 401.
  • the first and second side surfaces S1 and S2 of the substrate 401 may be disposed on vertical surfaces such as both side surfaces of the resin layer 420.
  • the resin layer 420 may be provided in a size that covers the plurality of light emitting devices 100 or may be connected to each other.
  • the resin layer 420 may be separated to a size that covers each light emitting device 100, and may be separated into light emitting cells having each light emitting device 100 / each resin layer 420.
  • the upper surface of the resin layer 420 may have a first adhesive force.
  • the upper surface of the resin layer 420 may have a first adhesive force and may be adhered to the diffusion layer 430.
  • the resin layer 420 may have a recessed upper surface than the upper surface of the resin layer 420, or may include a stepped structure or a recessed recessed area on the upper surface.
  • the stepped structure or the recessed recess region of the resin layer 420 may function as a light blocking portion 425.
  • the resin layer 420 may include the light blocking portion 425.
  • the light blocking portion 425 may be the same as the number of the light emitting elements 100.
  • the light blocking unit 425 may be provided on a size or area sufficient to prevent hot spots caused by light emitted in the emission direction of the light emitting device 100 on each light emitting device 100.
  • the light blocking unit 425 increases the light blocking efficiency due to light distribution angle distribution and light reflection characteristics of the light emitting device 100 because the light emitting device 100 sends light in a side direction, that is, in a first direction. It covers the area that can.
  • the light blocking portion 425 may face the upper surface of the substrate 401.
  • the light blocking unit 425 may overlap the light emitting device 100 in a vertical direction.
  • Each of the plurality of light blocking units 425 may overlap each of the plurality of light emitting elements 100 in a vertical direction.
  • the distance B1 between the light blocking units 425 may be smaller than the distance X1 between the light emitting devices 100.
  • the light blocking portion 425 may be spaced apart from the side surface of the resin layer 420.
  • a plurality of light blocking units 425 may be arranged in a first direction.
  • the plurality of light blocking portions 425 may have the same shape.
  • the light blocking portion may be divided into a first light blocking portion on a first light emitting element and a second light blocking portion on a second light emitting element.
  • the first and second light blocking units may be disposed above the emission direction of each of the first and second light emitting elements. 2 to 4, the light blocking portion 425 may be disposed lower than the upper surface S11 of the resin layer 420.
  • the bottom surface S12 of the light blocking portion 425 may be disposed closer to the light emitting device 100 than the top surface S11 of the resin layer 420.
  • the light blocking portion 425 may be an air gap.
  • the light blocking portion 425 may be a material having a refractive index equal to that of air, or a material having a refractive index lower than that of the resin layer 420.
  • the light blocking portion 425 is a recessed area recessed from the upper surface of the resin layer 420, and the bottom surface S12 of the light blocking portion 425 is the resin forming the light blocking portion 425
  • the upper surface is recessed lower than the upper surface of the layer 420 and may be disposed at a lower position than the surface where the diffusion layer 430 and the resin layer 420 are in contact, and may have lower adhesion.
  • the bottom surface S12 of the light blocking portion 425 may have a second adhesive force lower than the first adhesive force of the resin layer 420.
  • the upper surface S11 of the resin layer 420 may have fine cilia and be adhered to the diffusion layer 430, and the bottom of the light blocking portion 425 may be completely removed by fine cilia by an etching process. have.
  • the fine cilia is the same material as the material of the resin layer 420, and may be a surface material of the resin layer 420.
  • the surface roughness value of the bottom surface S12 of the light blocking portion 425 may be lower than the surface roughness value of the top surface S11 of the resin layer 420.
  • the light blocking portion 425 may be formed to a depth lower than the upper surface S11 of the resin layer 420 by an etching process, so that the first adhesive force formed on the upper surface S11 of the resin layer 420 may be removed. have. Accordingly, the bottom surface S12 of the light blocking portion 425 may be provided as a surface having little adhesion. Accordingly, the light incident on the bottom surface S12 of the light blocking portion 425 may increase reflection efficiency by a surface having no adhesive force. That is, since the light blocking portion 425 has a surface etched by a dry etching process, the inherent first adhesive force of the resin layer 420 may be removed.
  • the bottom surface S12 of the light blocking portion 425 may be provided as a flat plane, and may be provided as a full reflection surface, and when the bottom surface S12 is not flat, incident light leaks light out of a critical angle. Problems may arise.
  • the light blocking unit 425 may be disposed in a hemispherical shape, an elliptical shape, or a circular shape based on the light emitting device 100.
  • the width C1 in the second direction of the region adjacent to the light emitting device 100 in the light blocking portion 425 is small and gradually increases toward the center of the light blocking portion 425, and the second direction from the center portion
  • the width (eg C3) can be as large as possible.
  • the width of the second direction may gradually decrease as the distance from the center of the light blocking unit 425 moves away from the light emitting device 100.
  • the maximum width (C3) in the second direction from the center of the light blocking portion 425 is the largest, and the width in the second direction may be gradually narrowed toward the first direction from the center of the light blocking portion 425.
  • An area overlapped with the light emitting device 100 in the light blocking element 425 in a vertical direction has a flat inner surface, and a second direction width may be greater than a second direction length D1 of the light emitting device 100. have.
  • the second direction width D1 of the flat inner side surface of the light blocking portion 425 is disposed at least 0.8 mm larger than the length D1 to cover both sides of the light emitting device 100 and emit from the light emitting device 100 It is possible to prevent the hot spot caused by the light.
  • the light blocking unit 425 includes a first area g1 overlapping the light emitting device 100 in a vertical direction, a second area g2 extending in a first direction based on the light emitting device 100, and the first The substrate extends from the second region g2 to the first side S1 of the substrate 401 or the third region g3 extending toward the first side of the resin layer 420, and the second region g2 to the substrate
  • the second side surface S2 of 401 or the fourth area g4 extending toward the second side surface of the resin layer 420 may be included.
  • the third and fourth regions g3 and g4 may be regions on both sides of the first and second regions g1 and g2.
  • the first and second regions g1 and g2 may be disposed between the third and fourth regions g3 and g4.
  • the third and fourth regions g3 and g4 may extend from the first region g1 to the first side S1 and the second side S2 of the substrate 401.
  • one end of the light blocking portion 425 may be disposed in the first direction
  • the second region g2 may be disposed at the other end.
  • a third region g3 may be disposed at one end of the light blocking unit 425 in a second direction
  • a fourth region g4 may be disposed at the other end.
  • the second area (g2) to the fourth area (g4) may be disposed in an upper peripheral area of the light emitting device 100.
  • the second region g2 to the fourth region g4 may not overlap the light emitting device 100 in a vertical direction.
  • the area of the first area g1 may be 50% or more of the area of the top surface of the light emitting device 100. When the area of the first area g1 is smaller than the area, light may leak through the first area g1 or its surroundings and hot spots may be generated.
  • the first region g1 may be disposed with a flat inner surface or a convex curved surface.
  • the light blocking portion 425 of the resin layer 420 is disposed on the region of each light emitting device 100 and on the emission region thereof, thereby reducing a hot spot of incident light.
  • the second area g2 may be spaced at a maximum distance based on the light emitting device 100.
  • the sum of the areas of the first and second areas g1 and g2 may be larger than the area of the third area g3 or the area of the fourth area g4.
  • the area of the second area g2 may be larger than the area of the third area g3 or the area of the fourth area g4. Accordingly, the light blocking area in the second area g2 is the largest and may be larger than the light blocking area of the third and fourth areas g3 and g4.
  • the outer portion of the second region g2 may include a convex curved surface.
  • the outer portion of the second region g2 may be formed as a convex curved surface in the exit direction of the light emitting device 100 from the center of the light blocking portion 425.
  • the distance between the outer portion of the second region g2 and the first region g1 may be narrower as the center side is the farthest and goes to the side.
  • the distance between the center of the light blocking portion 425 and the outer portion of the second region g2 may be the center side being largest and the side side being the smallest.
  • the center side may be arranged on the same straight line as the center of the light blocking portion 425.
  • the side side may be an area bordered with the outer portions of the third area g3 and the fourth area g4.
  • the outer portion of the third region g3 may include the convex curved surface.
  • the outer portion of the third region g3 may include a curved surface convex in the lateral direction of the resin layer 420 adjacent to the first side S1 of the substrate 401 from the center of the light blocking portion 425.
  • the outer portion of the fourth region g4 may include the convex curved surface.
  • the outer portion of the fourth region g4 may include a convex curved surface in the lateral direction of the resin layer 420 adjacent to the second side S2 of the substrate 401 from the center of the light blocking portion 425.
  • the outer portion of the third region (g3) is the most convex on the center side, and can be connected to the outer portion of the first region (g1) with a convex curved surface, and to the outer portion of the second region (g2) with a convex curved surface.
  • the outer portion of the fourth region (g4) is the most convex on the center side, and may be connected to the outer portion of the first region (g1) with a convex curved surface, and to the outer portion of the second region (g2) with a convex curved surface.
  • the distance between the outer portion of the third area (g3) and the outer portion of the fourth area (g4) has the largest distance between the centers passing through the center of the light blocking portion 425, and the distance may gradually decrease toward the side. have.
  • the third area g3 of the light blocking part 425 may overlap with any one of the first open areas 411 in a vertical direction.
  • the fourth area g4 of the light blocking part 425 may overlap with any one of the second open areas 413 in the vertical direction.
  • the third region g3 of the light blocking portion 425 may overlap with any one of the first protrusions 421 in a vertical direction.
  • the fourth region g4 of the light blocking portion 425 may overlap with any one of the second protrusions 423 in the vertical direction.
  • protrusions overlapped with the light blocking portion 425 in a vertical direction may be adjacent to both sides of the emission surface 81 of the light emitting device 100.
  • the light blocking portion 425 may have a maximum length B3 in the first direction equal to or smaller than the maximum width C3 in the second direction.
  • the maximum width C3 may be 13 mm or more, for example, in the range of 13 mm to 17 mm.
  • the maximum width C3 of the light blocking unit 425 in the second direction may vary according to the length of the second direction of the light emitting device 100.
  • the maximum width C3 of the light blocking portion 425 in the second direction may be 50% or more, for example, 50% to 90% of the length Y1 of the second direction of the substrate 401.
  • the maximum length B3 in the first direction of the light blocking unit 425 may be 0.3 times or more, for example, 0.3 times to 0.52 times the interval (X1 in FIG. 1) between the light emitting devices 100.
  • the maximum length B3 in the first direction of the light blocking unit 425 may be arranged in a range of 6 times to 10 times, for example, 6 times to 10 times the first direction width D2 of the light emitting device 100.
  • the distance X1 between the light emitting devices 100 may be 25 mm or more, for example, in a range of 25 mm to 30 mm, and may vary according to the characteristics of the light emitting devices 100.
  • the light blocking unit 425 provides the maximum length (B3) in the first direction and the maximum width (C3) in the second direction, passing through the center of the light blocking unit 425, in the above range, so that the light emitting device 100 ) Can reduce hot spots and improve light uniformity.
  • the central portion of the light blocking portion 425 may be disposed in a range of 4.5 mm or more, for example, 4.5 mm to 6.5 mm on a flat plane of the first area g1 overlapping the light emitting device 100.
  • the depth Z3 of the light blocking part 425 may be 0.1 times or less, for example, 0.05 times to 0.1 times the thickness Z1 of the resin layer 420.
  • the depth Z3 of the light blocking portion 425 may be 100 micrometers or more, for example, 100 to 200 micrometers.
  • the distance Z4 between the upper surface of the light emitting device 100 and the lower surface of the light blocking unit 425 may be 0.4 mm or more, for example, in a range of 0.4 mm to 0.6 mm.
  • the distance Z0 between the top surface of the light emitting device 100 and the top surface of the reflective member 410 may be 0.8 mm or more, for example, in the range of 0.8 mm to 1.4 mm.
  • one end of the light blocking unit 425 overlaps the light emitting device 100 in a vertical direction, and the other end of the light blocking unit 425 in a first direction is a straight line horizontal to the top surface of the light emitting device 100. It may be disposed in an area outside the predetermined angle R1.
  • the angle R1 may be less than 10 degrees, for example, in the range of 1 degree to 9 degrees or in the range of 1 degree to 3 degrees.
  • the light blocking unit 425 may be disposed in a range of 80 degrees or more, for example, 80 degrees to 88 degrees or 86 degrees to 88 degrees, from a straight line perpendicular to the light emitting device 100.
  • the distance C4 between a straight line perpendicular to the surface opposite to the exit surface 81 of the light emitting device 100 from the light blocking unit 425 is 1 of the width D2 in the first direction of the light emitting device 100. / 2 or less. When the distance C4 is larger than the above range, light leakage may occur.
  • the light blocking unit 425 may be a maximum distance from a point spaced apart in the first direction based on a first point perpendicular to the center of the light emitting device 100, and a minimum distance from a point spaced apart in the second direction. have.
  • the outer shape of the straight line connecting the point of the minimum distance from the point of the maximum distance may be a hemispherical shape.
  • the maximum distance in the first direction orthogonal to the center of the light blocking portion 425 may be smaller than the maximum distance in the second direction.
  • the light blocking unit 425 When viewed from the top view, the light blocking unit 425 may have a circular shape except for a region overlapped with the light emitting device 100 in a vertical direction.
  • the diffusion layer 430 may be disposed on the resin layer 420.
  • the diffusion layer 430 may include an adhesive region adhered to an upper surface of the resin layer 420 and a non-adhesive region A11 on the light blocking portion 425.
  • the diffusion layer 430 may be adhered to the upper surface S11 of the resin layer 420 with a first adhesive force.
  • the upper surface S11 of the resin layer 420 may be adhered to the diffusion layer 430 by a first adhesive force having fine cilia.
  • the diffusion layer 430 may be attached on the resin layer 420 by applying a predetermined pressure or pressure / heat.
  • the diffusion layer 430 is adhered to the resin layer 420 with a self-adhesive property without a separate adhesive, the process of attaching the adhesive separately can be reduced, and an adhesive harmful to the human body may not be used. Can be reduced.
  • the diffusion layer 430 is adhered to the entire upper surface of the resin layer 420, and the non-adhesive region A11 faces the bottom of the light blocking portion 425 and may be disposed on the light blocking portion 425. .
  • the diffusion layer 430 diffuses the light emitted through the resin layer 420.
  • the diffusion layer 430 may be mixed by diffusing the light because a specific color may not be mixed when the light intensity is high.
  • the material of the diffusion layer 430 may be a light-transmitting material.
  • the diffusion layer 430 may include at least one of a polyester (PET) film, a PMMA (Poly Methyl Methacrylate) material, or a PC (Poly Carbonate).
  • the diffusion layer 430 may be provided as a film made of a resin material such as silicone or epoxy.
  • the diffusion layer 430 may include a single layer or multiple layers.
  • the thickness Z2 of the diffusion layer 430 is 25 micrometers or more, and may be, for example, 25 to 250 micrometers or 100 to 250 micrometers.
  • the diffusion layer 430 has a range of the thickness and may provide incident light as a uniform surface light source.
  • the diffusion layer 430 may include at least one or more of a diffusion agent such as a bead, phosphor, and ink particles.
  • the phosphor may include, for example, at least one of a red phosphor, an amber phosphor, an yellow phosphor, a green phosphor, or a white phosphor.
  • the ink particles may include at least one of metal ink, UV ink, or curing ink. The size of the ink particles may be smaller than the size of the phosphor.
  • the surface color of the ink particles may be any one of green, red, yellow, and blue.
  • the ink types are PVC (Poly vinyl chloride) ink, PC (Polycarbonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink, UV resin ink, epoxy ink, silicone ink, PP (polypropylene) ink, water-based ink, plastic ink, PMMA (poly methyl methacrylate) ink or PS (Polystyrene) ink.
  • the ink particles may include at least one of metal ink, UV ink, or curing ink.
  • a light blocking unit 425 having a predetermined depth is provided on the resin layer 420 on the light emitting device 100, and the diffusion layer 430 is adhered to the resin layer 420 without a separate adhesive.
  • zooming the process can be simplified and the shading effect can be maximized.
  • by providing a light-blocking portion 425 having a predetermined depth in the resin layer 420 as an air gap a process of forming a light-shielding pattern or material consumption can be reduced, and light is reflected through full reflection using the air gap. It can improve the uniformity.
  • the surface adhesion of the resin layer 420 is used and the surface reflectivity of the light-shielding portion 425 Through this, it is possible to give a shading effect.
  • FIG. 7 to 10 are views for explaining a manufacturing process of a lighting module according to an embodiment of the invention.
  • a reflective member 410 having an opening 417 and an open area is attached to the substrate 401.
  • the light emitting device 100 is adhered to the conductive adhesive member through the opening 417 of the substrate 401.
  • the reflective member 410 may include an adhesive layer L1, a reflective layer L2 having bubbles, and a dot layer L3.
  • the resin layer 420 is dispensed on the substrate 401 and the light emitting device 100.
  • the resin layer 420 may include a transparent material such as silicon or epoxy.
  • the resin layer 420 may protrude through the opening 417 and the open area of the substrate 401.
  • an etching device for example, a laser 471 is irradiated from the upper surface of the resin layer 420.
  • the laser is irradiated to the light blocking portion 425 on the resin layer 420, and is formed to a predetermined depth.
  • the upper surface of the resin layer 420 is a surface on which the light blocking portion 425 is not formed, and has a self-adhesive property, and the bottom of the light blocking portion 425 is etched by etching by the laser 471.
  • the adhesive properties can be removed.
  • the surface adhesion of the resin layer 420 is used and through the surface reflectance of the light-shielding portion 425 It can give a shading effect.
  • the diffusion layer 430 is pressed and attached to the upper surface of the resin layer 420 using a crimping device, for example, a roller 473. At this time, the diffusion layer 430 may be closely adhered to the upper surface of the resin layer 420 by adhesive properties of the upper surface of the resin layer 420.
  • an illumination module may be provided. The lighting module may be provided in the size of the unit module. In addition, by cutting the back side of the light emitting device, it is possible to separate a plurality of light emitting cells having a resin layer / diffusion layer in each light emitting device.
  • the light blocking unit 425 may not use a separate material, and the diffusion layer 430 may be bonded to the resin layer 420 due to the unique surface adhesion property, so that a separate adhesive is not used. You can. Therefore, since the light blocking portion 425 and the adhesive are not used, the manufacturing process and material can be reduced. For example, the upper surface S11 of the resin layer 420 may be adhered to the diffusion layer 430, and the bottom of the light blocking portion 425 may have adhesive properties completely removed by an etching process.
  • FIG. 11 is a view showing a lighting device having a lighting module according to an embodiment.
  • the lighting module in the lighting device according to the embodiment will be referred to the above description.
  • the lighting module 400 includes a module disclosed in an embodiment, for example, a substrate 401, a plurality of light emitting devices 100, a resin layer 420, and reflection on the substrate 401
  • a member 410 and a diffusion layer 430 may be included.
  • An optical member 230 may be disposed on the illumination module 400, and the optical member 230 may diffuse and transmit incident light.
  • the optical member 230 uniformly diffuses the surface light source emitted through the diffusion layer 430 to emit light.
  • the optical member 230 may include an optical lens or an inner lens, and the optical lens may condense light in a target direction or change a path of light.
  • the optical member 230 includes a plurality of lens units 231 on at least one of an upper surface and a lower surface, and the lens unit 231 is a shape protruding downward from the optical member 230 or in an upward direction It may be a protruding shape.
  • the optical member 230 may adjust the light distribution characteristics of the lighting device.
  • the optical member 230 may include a material having a refractive index of 2.0 or less, for example, a material of 1.7 or less.
  • the material of the optical member 230 may be formed of a transparent resin material of acrylic, polymethyl methacrylate (PMMA), polycarbonate (PC), or epoxy resin (EP) or transparent glass (Glass).
  • the optical member 230 may have a distance of 10 mm or more, for example, 15 mm to 100 mm, from the illumination module 400, for example, the substrate 401, and may degrade light intensity when the gap is outside the range. , When it is smaller than the above range, uniformity of light may be reduced.
  • the lighting module 400 may include a heat dissipation heat dissipation plate (not shown) on the bottom surface.
  • the heat dissipation plate may include a plurality of heat dissipation fins, and heat dissipation to the substrate 401 may be dissipated.
  • the heat dissipation plate may include at least one of metals such as aluminum, copper, magnesium, and nickel, or an optional alloy thereof.
  • the lighting device includes a housing 300 having a storage space 305, a lighting module according to an embodiment disposed on the bottom of the storage space of the housing 300, and an optical member 230 disposed on the lighting module do.
  • the housing 300, the outer side of the storage space 305 may be provided as an inclined surface with respect to the bottom surface of the housing 300, such inclined surface can improve the extraction efficiency of light .
  • a metal material made of a reflective material may be formed on the surface of the storage space 305 of the housing 300, and the light extraction efficiency in the storage space 305 may be improved by the metal material.
  • the storage space 305 may have a depth greater than that of the resin layer 420, and may emit light emitted through the resin layer 420.
  • the housing 300 includes a bottom portion 301 and a reflection portion 302, the bottom portion 301 is disposed under the substrate 401, and the reflection portion 302 is the bottom portion 301 It protrudes upward from the outer circumference of the and may be disposed around the resin layer 420.
  • the housing 300 may include a metal or plastic material, but is not limited thereto.
  • An opening (not shown) through which a cable connected to the substrate 401 may be formed may be formed on the bottom portion 301 or the reflection portion 302 of the housing 300, but is not limited thereto.
  • the substrate 401 may be attached to a bottom portion 301 of the housing 300 by a fastening means such as a screw or an adhesive member, or may be combined in a structure such as a hook.
  • the substrate 401 may be fixed to the bottom of the housing 300.
  • the reflection part 302 may be a side part of the housing 300.
  • the lighting device according to the embodiment may be applied to various vehicle lighting devices such as head lamps, vehicle lights, side mirror lights, fog lights, tail lamps, stop lamps, daytime running lights, display devices, and traffic lights You can.
  • FIG. 12 is a front view showing a light emitting device on a substrate in a lighting module according to an embodiment
  • FIG. 13 is a side view of the light emitting device of FIG. 12.
  • the light emitting device 100 includes a body 10 having a cavity 20, a plurality of lead frames 30 and 40 in the cavity 20, and the plurality of lead frames 30 , 40) the light emitting chip 71 disposed on at least one of the above.
  • the light emitting device 100 may be implemented as a side light emitting package.
  • the body 10 may include a cavity 20 with lead frames 30 and 40 exposed on the floor.
  • the plurality of lead frames 30 and 40 are separated into, for example, a first lead frame 30 and a second lead frame 40 and coupled to the body 10.
  • the body 10 may be formed of an insulating material.
  • the body 10 may be formed of a reflective material.
  • the body 10 may be formed of a material having a reflectance higher than the transmittance, for example, a material having a reflectance of 70% or more, for a wavelength emitted from the light emitting chip. When the reflectance is 70% or more, the body 10 may be defined as a non-transmissive material or a reflective material.
  • the body 10 may be formed of a resin-based insulating material, for example, a resin material such as polyphthalamide (PPA).
  • PPA polyphthalamide
  • the body 10 may be formed of a silicone-based, epoxy-based, or heat-curable resin comprising a plastic material, or a high heat-resistant, high-light-resistant material.
  • the body 10 includes a white-based resin.
  • an acid anhydride, an antioxidant, a release material, a light reflecting material, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide may be selectively added. It contains.
  • the body 10 may be molded by at least one member selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylic resin, and urethane resin.
  • an epoxy resin composed of triglycidyl isocyanurate, hydrogenated bisphenol A diglycidyl ether, and the like, and an acid composed of hexahydro phthalic anhydride, 3-methylhexahydro phthalic anhydride, 4-methylhexahydro phthalic anhydride, and the like.
  • Anhydride is added to the epoxy resin as a curing accelerator, DBU (1,8-Diazabicyclo (5,4,0) undecene-7), ethylene glycol, titanium oxide pigment, and glass fiber are added as a cocatalyst, and partially heated.
  • a solid epoxy resin composition B-staged by curing reaction may be used, but is not limited thereto.
  • the body 10 may suitably mix at least one member selected from the group consisting of a diffusion agent, a pigment, a fluorescent material, a reflective material, a light-shielding material, a light stabilizer, and a lubricant, in a thermosetting resin.
  • the body 10 may include a reflective material, for example, a resin material to which metal oxide is added, and the metal oxide may include at least one of TiO 2 , SiO 2 , and Al 2 O 3 .
  • the body 10 can effectively reflect the incident light.
  • the body 10 may be formed of a translucent resin material or a resin material having a phosphor that converts the wavelength of incident light.
  • the bottom of the body 10 may be a side corresponding to the substrate 401.
  • the first lead frame 30 includes a first lead portion 31 disposed on the bottom of the cavity 20, a first bonding portion 32 and a first heat radiating portion extending outside the body 10 ( 33).
  • the first bonding portion 32 is bent from the first lead portion 31 in the body 10 and protrudes outside the body, and the first heat dissipation portion 33 is the first bonding portion 32 ).
  • the second lead frame 40 includes a second lead portion 41 disposed on the bottom of the cavity 20, a second bonding portion 42 and a second heat dissipation portion disposed in an outer region of the body 10. (43).
  • the second bonding portion 42 is bent from the second lead portion 41 in the body 10, and the second heat dissipation portion 43 can be bent from the second bonding portion 42. .
  • the light emitting chip 71 may be disposed on the first lead portion 31 of the first lead frame 30, for example, or connected to the first and second lead portions 31 and 41 by wire, The first lead portion 31 may be connected with an adhesive and may be connected to the second lead portion 41 with a wire.
  • the light emitting chip 71 may be a horizontal chip, a vertical chip, or a chip having a via structure.
  • the light emitting chip 71 may be mounted in a flip chip method.
  • the light emitting chip 71 may selectively emit light within a wavelength range of ultraviolet light to visible light.
  • the light-emitting chip 71 may emit ultraviolet or blue peak wavelengths, for example.
  • the light emitting chip 71 may include at least one of a II-VI compound and a III-V compound.
  • the light emitting chip 71 may be formed of, for example, a compound selected from the group consisting of GaN, AlGaN, InGaN, AlInGaN, GaP, AlN, GaAs, AlGaAs, InP and mixtures thereof.
  • the light emitting chip 71 may be disposed in the cavity 20 in plural or one, and emit light having the greatest intensity in the direction of the central axis Y0.
  • the light emitting chip disposed in the cavity 20 of the light emitting device 100 according to the embodiment may be arranged in one or a plurality.
  • the light emitting chip may be selected from, for example, a red LED chip, a blue LED chip, a green LED chip, and a yellow green LED chip.
  • a molding member 80 is disposed in the cavity 20 of the body 11, and the molding member 80 includes a light-transmitting resin such as silicone or epoxy, and may be formed in a single layer or multiple layers.
  • the molding member 80 or the light emitting chip 71 may include a phosphor for changing the wavelength of the light emitted, the phosphor excites a part of the light emitted from the light emitting chip 71 to a different wavelength It emits light.
  • the phosphor may be selectively formed from quantum dots, YAG, TAG, Silicate, Nitride, and Oxy-nitride-based materials.
  • the phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but is not limited thereto.
  • the exit surface 81 of the molding member 80 may be formed in a flat shape, a concave shape, a convex shape, etc., but is not limited thereto.
  • a light-transmitting film having a phosphor may be disposed on the cavity 20, but is not limited thereto.
  • a lens may be further formed on the upper portion of the body 10, and the lens may include a concave or convex lens structure, and control light distribution of light emitted by the light emitting device 100.
  • a semiconductor element such as a light receiving element or a protection element may be mounted on the body 10 or any one lead frame, and the protection element may be implemented by a thyristor, a zener diode, or a transient voltage suppression (TVS), The Zener diode protects the light emitting chip from electrostatic discharge (ESD).
  • ESD electrostatic discharge
  • At least one or a plurality of light emitting elements 100 are disposed on the substrate 401, and a reflective member 410 is disposed around a lower portion of the light emitting element 100.
  • the first and second lead portions 33 and 43 of the light emitting device 100 are bonded to the pads 403 and 405 of the substrate 401 with solder or conductive tape, which is a conductive adhesive member 203 or 205.
  • FIG. 14 is a view showing a vehicle lamp having a lighting module or a lighting device according to an embodiment
  • FIG. 15 is a plan view of a vehicle to which the vehicle lamp of FIG. 14 is applied.
  • the tail light 800 in the vehicle 900 includes a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810 can do.
  • the first lamp unit 812 may be a light source for the role of a turn indicator
  • the second lamp unit 814 may be a light source for the role of a vehicle lamp
  • the third lamp unit 816 serves as a brake light. It can be a light source for.
  • the housing 810 accommodates the first to third lamp units 812, 814, 816, and may be made of a light-transmitting material.
  • the housing 810 may have a bend according to the design of the vehicle body, and the first to third lamp units 812,814,816 may implement a surface light source having a curved surface, depending on the shape of the housing 810. .
  • the lamp unit when the lamp unit is applied to a tail light, a brake light, or a turn signal lamp of a vehicle, it may be applied to a turn signal lamp of a vehicle.
  • the tail light when measuring based on front light, the tail light has a light distribution standard of 4 to 5 cantela (cd), and the brake light has a light distribution standard of 60 to 80 cantela (cd). Range.
  • the lighting module according to the embodiment is distributed with a light intensity having more than 50 cantels, thereby providing light intensity within a vehicle safety standard of a lamp such as the brake light or tail light.

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Abstract

Selon un mode de réalisation, la présente invention concerne un module d'éclairage pouvant comprendre : un substrat ; un élément réfléchissant disposé sur le substrat ; une pluralité d'éléments électroluminescents disposés sur le substrat ; une couche de résine disposée sur l'élément réfléchissant et sur les éléments électroluminescents ; et une couche de diffusion disposée sur la couche de résine. La couche de résine comprend une partie de blocage de lumière qui est une zone évidée formée de façon à être concave sur la surface supérieure de la couche de résine, et les éléments électroluminescents émettent de la lumière dans une première direction, la partie de blocage de lumière pouvant comprendre : une première zone chevauchant les éléments électroluminescents ; une deuxième zone s'étendant dans la première direction à partir de la première zone ; une troisième zone s'étendant à partir de la deuxième zone dans la direction d'un premier côté du substrat ; et une quatrième zone s'étendant à partir de la deuxième zone dans la direction d'un second côté du substrat. La surface de la deuxième zone peut être supérieure à celle de la troisième ou de la quatrième zone, et la partie de blocage de lumière peut être formée comme un entrefer.
PCT/KR2019/013471 2018-10-24 2019-10-15 Module d'éclairage et dispositif d'éclairage le comprenant WO2020085703A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP19877506.6A EP3872391B1 (fr) 2018-10-24 2019-10-15 Module d'éclairage et dispositif d'éclairage le comprenant
CN201980070215.1A CN113167443B (zh) 2018-10-24 2019-10-15 照明模块及包括其的照明装置
US17/284,512 US11353193B2 (en) 2018-10-24 2019-10-15 Lighting module and lighting device comprising same

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KR10-2018-0127686 2018-10-24
KR1020180127686A KR20200046478A (ko) 2018-10-24 2018-10-24 조명 모듈 및 이를 구비한 조명 장치

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EP (1) EP3872391B1 (fr)
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CN214041938U (zh) * 2020-11-04 2021-08-24 中强光电股份有限公司 光源模块及显示装置
KR20220114910A (ko) * 2021-02-09 2022-08-17 엘지이노텍 주식회사 발광소자 패키지 및 이를 구비한 조명 장치

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EP3872391B1 (fr) 2023-05-17
US11353193B2 (en) 2022-06-07
US20210372594A1 (en) 2021-12-02

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