WO2011044606A1 - Élément de carte de circuits imprimés et procédé de fabrication d'une telle carte de circuits imprimés - Google Patents

Élément de carte de circuits imprimés et procédé de fabrication d'une telle carte de circuits imprimés Download PDF

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Publication number
WO2011044606A1
WO2011044606A1 PCT/AT2010/000389 AT2010000389W WO2011044606A1 WO 2011044606 A1 WO2011044606 A1 WO 2011044606A1 AT 2010000389 W AT2010000389 W AT 2010000389W WO 2011044606 A1 WO2011044606 A1 WO 2011044606A1
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WO
WIPO (PCT)
Prior art keywords
optical
waveguide
component
circuit board
printed circuit
Prior art date
Application number
PCT/AT2010/000389
Other languages
German (de)
English (en)
Inventor
Gregor Langer
Original Assignee
At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & S Austria Technologie & Systemtechnik Aktiengesellschaft filed Critical At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Publication of WO2011044606A1 publication Critical patent/WO2011044606A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means

Definitions

  • the invention relates to a printed circuit board element having a substrate, on which at least one optical component is mounted and connected to the at least one waveguide component.
  • the invention relates to a method for producing such a printed circuit board element.
  • optical component is both a purely optical component, such as a mirror, a grating (grating), an optical connector, etc., as well as an opto-electronic component, such as a light-emitting diode or a laser diode or As a receiver, a photodiode or a phototransistor understood, the waveguide component can
  • the optical components are mechanically aligned with the waveguide components or, conversely, the waveguide components are mechanically aligned with the optical components to achieve proper light conduction between the optical components and the waveguide components.
  • This alignment process is laborious, expensive, and nonetheless less effective, and accordingly there is a need for a technique that can easily ensure efficient light coupling between said components.
  • Printed circuit boards with integrated optical signal connections are being used more and more frequently, in particular for the realization of highly complex applications, whereby a further miniaturization and an increase in the integration density and thus a higher product value creation is made possible.
  • Printed circuit boards with Connections are used where applications require the highest data flows between components or components, modules and functional units (eg high-end computer applications) where interference immunity to electromagnetic fields is desired (eg in automotive and aeronautical applications) - or in general, where a space-saving design of connections (eg mobile applications) is needed.
  • waveguide components are traditionally eg glass fibers or polymer fibers used as optical light guides, but also planar polymer waveguide, which can not achieve the properties of glass ⁇ fibers in terms of attenuation, but less for short connections Meaning, but in terms of production,
  • the invention provides a printed circuit board element as in claim 1 and a method as defined in claim 11 before.
  • waveguide components are conventional optical fibers as well as previously produced planar
  • the assembly of the components is first carried out for the realization of optical waveguides, and these components are then embedded in an optical material. Thereafter, the structuring of the optical waveguide between the components by means of irradiation, in particular with a laser.
  • a chemical reaction namely polymerization, activated by simultaneous absorption of several - usually two - photons in the optical material.
  • the material itself is transparent to the irradiated laser wavelength (eg 800 nm). This results in the material initially no absorption and no single-photon process. In the focal region of the light beam or laser beam, however, the intensity is so high that the optical material absorbs two (or more) photons simultaneously, whereby the said chemical reaction is triggered.
  • Transparency of the optical material for the excitation wavelength reaches all the points in the optical layer and thus can be written without problems three-dimensional structures in the optical layer.
  • three-dimensional is to be understood that the optical waveguide not only in one plane (the xy plane) - possibly reciprocating - run, but also in height, in the z-direction, can vary, the optical waveguide can In other words, the optical waveguide can also change its (cross-sectional) shape over its longitudinal extension in the x, y and z directions, for example by making the cross section smaller or larger, from circular to flat elliptical, and then again to circular, to elliptical, etc.
  • the said multiphoton absorption process is further a one-step structuring process in which no multiple exposures and no wet-chemical development ⁇ steps are required.
  • the aforementioned three-dimensional optical waveguide structuring is particularly advantageous in providing an optical connection between a waveguide component and an optical (optoelectronic) component, with previous rather coarse positioning, the interface optical waveguide in particular directly to the waveguide structure of the waveguide component connects and can lead to the optical component, optionally to a deflection mirror at this.
  • the present invention can be used in opto-electronic circuit boards with multimode or singlemode waveguides for high data transfer rates and more design freedom. It can be used with Rigid-Flex and Rigid-Flex-Rigid PCBs and is mainly used for the production of high-volume products.
  • An interface between a conventional optical fiber technology and a planar waveguide technology based on plastics and an optical component is made possible, which has significant advantages, as mentioned, in the connection to the optical or opto-electronic components.
  • a particularly advantageous application is, for example, that of the optical connection of an active one
  • Optical cable for optical connection of a high-end computer Optical cable for optical connection of a high-end computer.
  • the components are mounted in advance, and prior to structuring the interface optical waveguide between them, their positions are measured by means of an optical system (called a "vision" system) the components, in particular the waveguide component in its end region, at least one - preferably formed of a reflective material - mark
  • a “vision” system the components, in particular the waveguide component in its end region, at least one - preferably formed of a reflective material - mark
  • the optical material has a similar refractive index as the waveguide component, so that the latter would be difficult to detect by the optical system within the optical layer for example, colored or wi e mentioned may be formed of a reflective material, in particular a metallic material, however, the detection can be accomplished easily.
  • the mark can be made by printing a paint or by sputtering a metal.
  • the components can be measured precisely with regard to their position, and also their rotation or tilt, so that data for the control of the laser beam during structuring of the interface optical waveguide are obtained, thus the course, in exact alignment of its ends to the mentioned Components to be able to determine.
  • the waveguide component can have a planar waveguide structure with at least one waveguide core, preferably with a plurality of waveguide cores (similar to a ribbon line), or else an optical fiber.
  • These waveguide components usually consist of a cladding layer (called cladding layer) and a core, whose refractive index is higher than that of the cladding layer, so that a total reflection at the boundary layer can take place.
  • the waveguide component is also advantageous if it is attached with its end on a separate substrate ⁇ part, which is provided with at least one mark;
  • This substrate portion may further preferably at the same time a spacer element, a spacer for adjusting the height "waveguide component form relative to the optical component, that is selected a substrate portion having an appropriate thickness, the waveguide component is connected to the with their end region, for example by adhesive bonding, is, after which the substrate part mounted on the PCB element substrate, for example glued, is.
  • the interface optical waveguide can also be designed, for example, as a waveguide splitter, as a waveguide crossing or similar optical component.
  • the Wel ⁇ lenleiter component may be a waveguide array having a plurality
  • Waveguide cores included In this case, if all the waveguide cores are to be used, a corresponding number and arrangement of Inter.face optical waveguides can be provided.
  • the optical component can be a light-emitting component, for example a laser diode, or a light-receiving component, such as a photodiode or a phototransistor, in a manner known per se.
  • a light-emitting component for example a laser diode
  • a light-receiving component such as a photodiode or a phototransistor
  • These components can also like also already known per se deflecting mirrors, in order to direct the light respectively out of the component or into the component. It is also conceivable, however, if the optical component is a (standardized) optical plug.
  • the positions of the components can be measured prior to attaching the optical layer or even after its attachment.
  • FIG. 1A and 1B schematically show a printed circuit board element with an optical coupling of a waveguide component with an opto-electronic component in a longitudinal section (Fig. 1A) and in plan view (Fig. 1B); 2A and 2B in a longitudinal section (along the line AA in Fig. 2B) and cross-section (along the line BB in Fig. 2A) as a waveguide component usable, per se conventional optical fiber; 3A, 3B and 3C in a longitudinal section, in a plan view and in a cross-section along the line CC in Figure 3B, a planar waveguide component, for example with an array of four optical fiber cores.
  • FIGS. 4A and 4B in a schematic longitudinal section and in a plan view of the construction of a rigid-flex-rigid printed circuit board element in an intermediate stage of production, prior to attachment of the optical material and the structuring of the interface optical waveguide for the purpose of optical coupling between the individual components; 5A and 5B of this printed circuit board element according to FIGS. 4A and 4B, but now in a state after the application of the optical material in the form of a layer, FIG. 5A again showing a schematic longitudinal section and FIG. 5B a schematic top view of FIG. see shows; 6A and 6B turn, in a schematic longitudinal section and a schematic plan view of the printed circuit board element according to FIG. 4A, 4B and 5A, 5B, now after completion, after structuring of the interface optical waveguide.
  • FIG. 7 shows a schematic longitudinal section of a multilayer structure of a printed circuit board element with interface optical waveguides between waveguide components and optoelectronic components
  • Figure 8 is a schematic longitudinal section through a PCB ⁇ element with a three-dimensional (3D) -Wellenleiterarray as a waveguide component.
  • FIGS. 11 and 12 two examples of circuit board elements similarity ⁇ Lich Fig. 1A, in corresponding schematic longitudinal sections, wherein, compared to Fig.
  • FIG. 1A an interface optical fiber with changing in the direction of extension cross-section, namely on the one hand with one of the waveguide component to the optoelectronic component increasing cross-section (Figure 11) and the other with an increasing from the opto-electronic component to the waveguide component cross-section (Figure 12), is shown;
  • Figures 13A and 13B are a schematic plan view and in a schematic longitudinal section of embodiments of the printed circuit board element according to the invention with different struc tured ⁇ interface optical waveguides.
  • 14 shows a further embodiment of a printed circuit board element with an optical connector (optical coupler) as optical component in conjunction with a waveguide component via a slanted interface optical waveguide.
  • each printed ⁇ tenelement 1 further comprises a substrate 5, 5, 5 on '.
  • optical component or “optical component” is to be understood quite generally as a component which can have both a purely optical function and an opto-electronic function, such as, for example, a mirror, a grating, an optocoupler (optical plug) , or transmission components such as LEDs, Laserdi ⁇ oden, or receiver components such as photodiodes or phototransistors.
  • optical components 3 may also be directed by folding mirror alone or by an opto-electronic component with a reflecting mirror ge ⁇ forms.
  • a waveguide component 2 is attached in the region of its end 6 to the upper side of the substrate 5 of the printed circuit board element 1, for example with the aid of an adhesive layer 7.
  • the deflection mirror 8 as a light input or light output of the optical component 3 is located at a distance from the end 6 of the 'waveguide component 2.
  • the optical coupling of these two components 2, 3 is a bridging or interface optical fiber 4 in a layer 9 of an optical, polymerizable material, as known per se (cf., for example, AT 413 891 B).
  • An edge or boundary layer 10 limited the optical layer 9.
  • a per se known optical fiber as shown in Figures 2A and 2B, be provided;
  • Such an optical fiber has a core 11, also called a core, within a cladding or cladding layer 12.
  • a planar waveguide component 13 as can be seen in FIGS. 3A, 3B and 3C, is provided as the waveguide component, whereby this waveguide component 13 according to FIG. 3C exemplarily has an array with four optical waveguides Cores 14 has.
  • These optical waveguide cores 14 are located within a cladding, similar to the cladding layer 12 according to FIGS. 2A and 2B, wherein usually in a planar structure on a lower cladding layer 15 after structuring or attachment of the optical waveguide cores 14 an upper cladding Layer 16 is attached.
  • the entire structure 14, 15, 16 takes place according to FIGS. 3A-3C as well as according to FIG. 1A on a flexible substrate 17, e.g. a polyimide film.
  • the components to be optically coupled that is to say 3 and 2 according to FIG. 1A, are fastened to the substrate 5 of the printed circuit board element 1 without special alignment measures; in other words, with this assembly, unlike previous techniques, there is no (or no exact) mechanical alignment of components 2 and 3 relative to each other.
  • this interfacial optical fiber 4 is known per se in the optical material of layer 9 by multiphoton absorption, in particular two photon absorption (TPA) Structured by a laser beam focused on the particular desired location within the layer 9 and in the focus area through the high intensity material polymerization is caused by the absorption of several, mostly two, photons.
  • TPA photon absorption
  • FIGS. 4A-6B show a printed circuit board element 1 in the form of a so-called rigid-flex-rigid-board, wherein a waveguide component 2, for example in the form of a planar waveguide component 13 according to FIGS. 3A, 3B and 3C, with a flexible own substrate part 17, which is provided in its two end regions 6, 6 'on substrates 5 and 5' of rigid material, eg Epoxy resin, for example by gluing, is attached.
  • a waveguide component 2 for example in the form of a planar waveguide component 13 according to FIGS. 3A, 3B and 3C
  • a flexible own substrate part 17 which is provided in its two end regions 6, 6 'on substrates 5 and 5' of rigid material, eg Epoxy resin, for example by gluing
  • the space between the parts of the delimiting layers 10 and 10 ' which are likewise provided here, similar to FIGS. 1A and 1B, is provided with an optical, photopolymerizable material in the form of a layer 9 or 9 'filled, wherein the optical components 3 and 3' and the
  • End regions 6 and 6 'of the waveguide component 2 are embedded in the optical material of these layers 9, 9', as can be seen best from FIG. 5A.
  • the components 2, 3 or 3 ' are measured with respect to their positions with the aid of an optical system, a vision system 18, so as to control signals for the structuring of the interface optical waveguides 4 and 4' according to FIG. 6A 6B, as is also known per se.
  • a vision system 18 so as to control signals for the structuring of the interface optical waveguides 4 and 4' according to FIG. 6A 6B, as is also known per se.
  • the xyz positions of the components 2, 3, 3 'as well as any twists or tilts of these components can be detected, so that the interface optical waveguides 4 and 4' optimally in alignment with each other the components 2, 3, 3 'structured can be.
  • AT 503 585 B reference may also be made to AT 503 585 B.
  • the waveguide component 2 which usually has a similar refractive index as the optical material of the layer 9 or 9 ', is poorly visible in this optical system 18.
  • markings are applied in the end regions 6, 6 'of the waveguide component 2, for example in the form of a reflective material on the upper surface of the upper cladding layer 16, e.g. by sputtering of metals, or in the form of a colored imprint.
  • markings- which, of course, can also be provided on the component 3 or 3 ', as is known per se-are not apparent;
  • markings 19 - there on a separate substrate part 20 of the waveguide component 2 - are shown. Similar markings as the markings 19 may, in the exemplary embodiment according to FIGS. 4A-6B, be mounted on the upper side of the upper cladding layer 16 (and on the components 3, 3 ') as mentioned.
  • the interface optical waveguides 4, 4 ' After receiving the position data, including alignment data, the components 2, 3, 3 '(as far as the waveguide component 2 is concerned, more precisely its end regions 6, 6'), the interface optical waveguides 4, 4 'are "written in", as mentioned Placement inaccuracies can be compensated because the interface optical waveguide 4 or 4 'quite an oblique or arcuate course between the respective core 14 of the waveguide component 2 and, for example, the respective deflection mirror 8 of the optical component 3 can be obtained.
  • the aforementioned rigid-flex-rigid printed circuit board 1 will have two rigid regions (substrates 5, 5') and one therebetween
  • the assembly of the optical components 3, 3 ' can be carried out both before and after the waveguide assembly.
  • an optical fiber as shown in FIGS. 2A and 2B may also be used.
  • Such an optical fiber or a fiber optic cable may be made of glass or polymer (POF), for example.
  • planar polymer waveguide component having the lower cladding layer 15, the core layer 14, and the upper cladding layer 16 may be made of a polymer such as
  • planar waveguide components 2 can be made by a variety of known technologies, such as by
  • optical components 3 or 3 'with order ⁇ directing optics mirrors 8 and 8'
  • they can, of course, optical components 3, 3 'with no such reflecting mirror 8, 8' also be provided.
  • the optical material of the layer 9, 9', so ei ⁇ should here the index of refraction in order to minimize reflections, preferably between the refractive indexes of the to be coupled to components 3 and 3 'ne réelle and 2, on the other hand.
  • a printed circuit board element 1 is shown with a multi-layer structure, wherein on a lower element similar to the printed circuit board element 1 shown in FIG. 6A via a substrate intermediate layer 5A, 5A 'another waveguide component 2', for example of the same type "planar waveguide component "as the lower waveguide component 2 (see Figures 3A-3C.), for example as ⁇ derum 'is attached stacked; on the interlayer substrates 5A, 5A' through adhesive layers 7, in turn, are optical components 3, 'attached 3
  • interface optical waveguides 4 and 4 ' are provided for the purpose of optical coupling, and a cover layer 22, for example a standard solder resist, for protecting the multilayer structure shown is provided as the upper terminus Begren ⁇ wetting layer 10A protected.
  • a waveguide- Kom ⁇ component 2 is provided with a three-dimensional array of optical waveguide cores 14, wherein the three-dimensional array for example, four optical waveguide cores adjacent to each other (see Fig. 3C) and adjacent arrays three times one above the other (see Fig. 8), so that a 3D arrangement of 3x4 waveguide cores 14 is given.
  • a corresponding array of optical waveguides interface 4 is then in the respective op ⁇ tables layer 9 'is patterned in the optical layer 9 for the optical coupling of the waveguide Comp ⁇ component 2 with the respective optical component 3 and 3 respectively.
  • Fig. 9 is the end portion and the end 6 of a waveguide component 2 with its own substrate part 20, wherein the already mentioned markings 19 for measuring the end region 6 of the waveguide component 2 are mounted on this own substrate part 20 instead of on the waveguide component 2 itself.
  • the waveguide component 2 is attached by means of this own sub ⁇ stratteils 20 on the substrate 5 of the printed circuit board element. 1
  • the substrate part 20 (from an assortment with several thicknesses) with such a thickness, ie height, can be selected such that the waveguide component 2 with its
  • Fiber optic core 11 and 14 in height already the height of the optical component 3 and the deflection mirror 8 of the optical component 3 is approximately adjusted.
  • the substrate part 20 thus also has the function of a spacer or spacer element here.
  • FIGS. 11 and 12 show modifications of the embodiment according to FIG. 1A, the interface optical waveguide 4 having a varying cross-section, for example being conical, being designed; it increases according to FIG. 11 from the waveguide component 2 to the optical component 3, which is of particular advantage when the optical component is a photodiode; 12, the cross-section of the in ⁇ terface optical waveguide 4, starting from the optical Kompo ⁇ component 3 'to the waveguide component 2 towards, for example, in turn tapered, which is advantageous if it is in the optical component 3' is a laser diode or the like.
  • the light Kopp ⁇ development efficiency can be increased through the tapered design of the interface waveguide 4 and 4 '.
  • the respective interface optical waveguide 4 or 4 ' can undergo an adaptation change not only in the diameter size but also in the cross-sectional shape, for example from round to elliptical or from round to more or less rectangular, to improve the light coupling between the components 2 and 3 or 3 '.
  • the light emitting field of a laser diode is round, but the waveguide cross section of a planar waveguide 13 is rectangular (see Fig. 3C); a "sliding" transition from the round cross-section to the rectangular cross-section is more favorable for light coupling than an abrupt transition.
  • the light is transmitted between the waveguide component 2, e.g. in the form of an optical fiber or in turn in the form of a planar waveguide component, and an optical component 3 coupled via a TPA-structured interface optical waveguide 4; this optical waveguide 4 can also have various other forms depending on the need and objectives than a simple waveguide configuration.
  • various configurations are apparent from FIG. 13A, such as a waveguide splitter 4A and a waveguide crossing 4B.
  • the optical waveguides 4 are in Fig. 13A only very schematically, with dashed lines, indicated, as well as the components 2, 3, wherein for the sake of simplicity, a waveguide component 2 with a plurality of optical waveguide cores 14 and an optical component 3 with multiple receiving areas 24 are schematically illustrated.
  • the two optical waveguides can be arranged one above the other in height, but it is quite conceivable that the two optical waveguides form a mutual (possibly partial) penetration, provided that the angle is chosen such that a crosstalk of the light signal of a waveguide channel is minimized in the other waveguide channel.
  • an interface optical waveguide 4 that splits in a vertical plane that is to say with a waveguide splitter 4A in the z direction, is located between a waveguide component 2 with at least one waveguide core 14 and an optical component 3 with a plurality of reception regions 24 provided.
  • FIG. 14 an embodiment with a standardized optical connector (coupler) finally is illustrated 23 as an optical component 3, the optical fiber 23 'as ⁇ derum a within an optical layer 9 TPA-structured Interface optical waveguide 4 - here
  • the modified printed circuit board element 1 formed in this way again has a substrate 5, so that the printed circuit board element 1 is stiff in this area, and that a flexible area with the waveguide component 2 adjoins this rigid area.
  • optical component 3 also more active or carried ⁇ ve optical components come into question, such as, more generally, to understand a VCSEL component or a lens, a grating (grating), etc., and thus the term "optical component" ,

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un élément de carte de circuits imprimés (1) comprenant un substrat (5, 5') sur lequel au moins un composant optique (3, 31) est appliqué et auquel au moins un composant de guide d'ondes (2) est relié, au moins un guide d'ondes optiques d'interface (4, 4') structuré par absorption multiphotonique dans une couche (9, 9') en matériau optique étant prévu entre l'extrémité (6) du composant de guide d'ondes (2) et le composant optique (3, 3'), ainsi qu'un procédé de fabrication d'un tel élément de carte de circuits imprimés.
PCT/AT2010/000389 2009-10-16 2010-10-13 Élément de carte de circuits imprimés et procédé de fabrication d'une telle carte de circuits imprimés WO2011044606A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0064909U AT12314U1 (de) 2009-10-16 2009-10-16 Leiterplattenelement und verfahren zur herstellung eines solchen leiterplattenelements
ATGM649/2009 2009-10-16

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Publication Number Publication Date
WO2011044606A1 true WO2011044606A1 (fr) 2011-04-21

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WO (1) WO2011044606A1 (fr)

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