WO2011043400A1 - Polycarboxylic acid composition, process for preparation thereof, and curable resin compositions containing the polycarboxylic acid composition - Google Patents
Polycarboxylic acid composition, process for preparation thereof, and curable resin compositions containing the polycarboxylic acid composition Download PDFInfo
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- WO2011043400A1 WO2011043400A1 PCT/JP2010/067594 JP2010067594W WO2011043400A1 WO 2011043400 A1 WO2011043400 A1 WO 2011043400A1 JP 2010067594 W JP2010067594 W JP 2010067594W WO 2011043400 A1 WO2011043400 A1 WO 2011043400A1
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- carboxylic acid
- compound
- anhydride
- polyvalent carboxylic
- acid composition
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- 0 CCC(CC)(CN(C)*(C)N)*(C)* Chemical compound CCC(CC)(CN(C)*(C)N)*(C)* 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/445—Block-or graft-polymers containing polysiloxane sequences containing polyester sequences
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
Definitions
- the present invention relates to a polyvalent carboxylic acid composition suitable for use in electrical and electronic materials and a method for producing the same. Furthermore, the present invention relates to a curable resin composition containing the polyvalent carboxylic acid composition as a curable component.
- Polyvalent carboxylic acid has excellent performance as a crosslinking agent, condensing agent, etc., such as high thermal stability, good electrical properties, chemical resistance, etc., as well as formation of condensates and good reactivity. As a molecular manufacturing raw material, it has attracted much attention and is widely used. It is also known that polyvalent carboxylic acids can be used as curing agents for epoxy resins.
- a curable resin composition containing an epoxy resin is used as a resin having excellent heat resistance in the fields of architecture, civil engineering, automobiles, aircraft, and the like.
- electronic devices such as mobile phones with cameras, ultra-thin liquid crystals, plasma TVs, and light-weight notebook computers have become key to light, thin, short, and small.
- Very high characteristics have been demanded for packaging materials represented by resins.
- the use in the optoelectronics related field has attracted attention.
- a technique utilizing an optical signal has been developed instead of the conventional signal transmission using electric wiring. Accordingly, in the field of optical components such as optical waveguides, blue LEDs, and optical semiconductors, development of a resin composition that gives a cured product having excellent transparency is desired.
- the epoxy resin curing agent used in such a field includes acid anhydride compounds.
- acid anhydrides formed with saturated hydrocarbons are often used because cured products have excellent light resistance (see, for example, Patent Documents 1 and 2).
- these acid anhydrides alicyclic acid anhydrides such as methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, and tetrahydrophthalic anhydride are generally used. Hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, etc. are mainly used.
- these curing agents have a high vapor pressure and tend to partially evaporate during curing.
- the effect of the above volatilization on the cured product is prominent when an LED, particularly an LED used for a SMD (Surface Mount Device) is sealed with a cured product using a conventional acid anhydride as a curing agent. Since LED sealing uses a small amount of resin, there is a problem that dents are generated when acid anhydrides volatilize, and in severe cases, the wires are exposed. Furthermore, since cracks and peeling occur during solder reflow, or curing becomes insufficient, the obtained cured product has a problem that it is difficult to withstand long-term lighting.
- a method using polyvalent carboxylic acid as a curing agent can be considered.
- ordinary polyvalent carboxylic acids are often solidified, particularly crystallized due to their hydrogen bonds, and are very difficult to use as a liquid composition.
- the inventors of the present invention have studied using a silicone-based polyvalent carboxylic acid as a curing agent.
- desired properties were not obtained in terms of adhesion and corrosion gas permeability, and it was difficult to use as a cured product such as a sealing material.
- the resulting cured product tends to be brittle, and there is a problem in toughness.
- the present invention provides a polyvalent carboxylic acid composition that suppresses volatilization of a curing agent during curing, and further provides a cured product excellent in heat resistance, light resistance, corrosion resistance gas permeability, adhesion, toughness, and the like. It aims at providing the manufacturing method. Another object of the present invention is to provide a curable resin composition containing the polyvalent carboxylic acid composition.
- R 1 represents an alkylene group having 1 to 10 carbon atoms that may be bonded via an ether bond
- R 2 represents a methyl group or a phenyl group
- n represents a repeating unit
- the weight average molecular weight of the compound represented by) is 500 to 5,000.
- a carboxylic acid compound (J) obtained by subjecting a silicone oil (a) represented by the formula (b) to a compound (b) having one or more carboxylic anhydride groups in the molecule; Polyvalent carboxylic acid obtained by addition reaction of saturated aliphatic polyhydric alcohol (c) having a bifunctional or higher alcoholic hydroxyl group and compound (d) having one or more carboxylic anhydride groups in the molecule
- Compound (K) Containing a polyvalent carboxylic acid composition
- (2) The polyvalent carboxylic acid composition according to item (1), wherein the compounds (b) and (d) are acid anhydrides having a cyclic saturated hydrocarbon as a mother skeleton, (3)
- the polyvalent carboxylic acid composition as described, (6) A method for producing the polyvalent carboxylic acid composition according to any one of (1) to (5) above, Compounds (b) and (d) having one or more carboxylic anhydride groups in the molecule are added to a mixture containing silicone oil (a) and a saturated aliphatic polyhydric alcohol (c) having a bifunctional or higher functional alcoholic hydroxyl group. And the addition reaction between the silicone oil (a) and the compound (b) and the addition reaction between the compound (c) and the compound (d) are performed simultaneously.
- Method for producing polyvalent carboxylic acid composition (9) A curable resin composition comprising the polyvalent carboxylic acid composition according to any one of (1) to (5) above and an epoxy resin; (10) The curable resin composition as described in (9) above, wherein the epoxy resin is an alicyclic epoxy resin and / or an epoxy group-containing silicone resin, (11) The curable resin composition as described in (9) above, wherein the epoxy resin is an epoxy group-containing silicone resin, (12) A cured product obtained by curing the curable resin composition according to any one of (9) to (11), About.
- the polyvalent carboxylic acid composition of the present invention is useful as a curing agent for an epoxy resin.
- the curable resin composition of the present invention is used as a curing agent in a temperature range usually employed for curing an epoxy resin.
- it is excellent in heat resistance, light resistance, adhesion, corrosion resistance gas permeability, toughness and the like.
- the polyvalent carboxylic acid composition of the present invention includes paints, adhesives, molded articles, semiconductors, optical semiconductor encapsulant resins, optical semiconductor die bond material resins, polyimide resins and other raw materials and modifiers, plasticizers, It is useful as a raw material for lubricating oils, intermediates for pharmaceuticals and agricultural chemicals, resin for paints, and resin for toners. Especially, it has excellent curing ability for epoxy resins and transparency of cured products obtained from it. It is extremely useful as a curing agent for an epoxy resin for sealing a representative optical semiconductor.
- the polyvalent carboxylic acid composition of the present invention has the following formula (1)
- R 1 represents an alkylene group having 1 to 10 carbon atoms that may be bonded via an ether bond
- R 2 represents a methyl group or a phenyl group
- n represents a repeating unit
- the weight average molecular weight of the compound represented by is 500 to 5,000.
- a carboxylic acid compound (J) obtained by subjecting a silicone oil (a) represented by the formula (b) to a compound (b) having one or more carboxylic anhydride groups in the molecule; Polyvalent carboxylic acid obtained by addition reaction of saturated aliphatic polyhydric alcohol (c) having a bifunctional or higher alcoholic hydroxyl group and compound (d) having one or more carboxylic anhydride groups in the molecule And a compound (K).
- the polyvalent carboxylic acid (J) and the polyvalent carboxylic acid (K) used in the production of the polyvalent carboxylic acid composition of the present invention are prepared in accordance with the following, and each raw material is allowed to react sequentially even if they are individually adjusted and mixed. May be.
- the silicone oil (a) is represented by the formula (1).
- R 1 specific examples of R 1 include alkylene groups having 1 to 10 carbon atoms and no ether bond, such as methylene, ethylene, propylene, butylene, pentylene, hexylene, heptylene, and octylene; 3 H 6 —O—C 2 H 4 —, —C 2 H 4 —O—C 2 H 4 —, —C 3 H 6 —O—C 3 H 6 — etc. 10 alkylene groups are mentioned. Of these, a propylene group or —C 3 H 6 —O—C 2 H 4 — is preferable because of easy availability in the market.
- a commercially available product includes a polyethylene oxide adduct, but this is not preferable in terms of heat resistance and light resistance.
- the preferred molecular weight range of the silicone oil (a) is 500 to 5000, more preferably 600 to 4000, and particularly preferably 600 to 2500 in terms of weight average molecular weight. The most preferable range is 600 to 1500.
- the molecular weight is less than 500, the intermolecular force of the obtained product is increased and the viscosity is likely to increase.
- the molecular weight is greater than 5000, the compatibility with other components is poor and the system often becomes cloudy. That is not preferable.
- Such a carbinol-modified silicone compound can be synthesized, for example, using a technique described in Japanese Patent Application Laid-Open No. 2007-508424.
- the commercially available compounds include Dow Corning 5562 (manufactured by Dow Corning Toray), X22-160-AS, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical), XF42-B0970 (manufactured by Momentive ), Silaplane FM-4411, FM-4421, FM-4425 (manufactured by Chisso) and the like.
- saturated aliphatic polyhydric alcohol (c) having a bifunctional or higher alcoholic hydroxyl group examples include conventionally known alcohols, and from the viewpoint of a balance between heat resistance, light resistance and toughness, particularly preferred is a functional group. It is preferably a polyhydric alcohol having 2 to 6 groups, and the total number of carbon atoms in one molecule is 5 to 20. More preferred are chain alkylene diols having a branched structure, diols having a cyclic structure, triols, tetraols, hexaols and the like.
- chain alkylene diol having a branched structure examples include neopentyl glycol, 2-ethyl-2-butylpropylene-1,3-diol, 2,4-diethylpentane-1,5-diol and the like.
- diol having a cyclic structure examples include tricyclodecane diol, pentacyclopentadecane diol, 1,4-cyclohexane diol, norbornane diol, dioxane glycol, spiro glycol and the like.
- triol examples include glycerin and trimethylolpropane
- examples of the tetraol include pentaerythritol and ditrimethylolpropane
- examples of the hexaol include dipentaerythritol.
- 2,4-diethylpentane-1,5-diol, tricyclodecanediol, or pentaerythritol it is not limited to these specific examples, Furthermore, you may use 1 type or in mixture of 2 or more types.
- phthalic anhydride trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, hexahydrophthalic anhydride, methyl hexahydro Phthalic anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1] heptane-2,3-dicarboxylic anhydride, methylbicyclo [2,2,1] heptane-2,3-dicarboxylic anhydride, Examples include cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride, cyclobutanetetracarboxylic acid dihydrate, butanetetracarboxylic dianhydride, and the like.
- a compound having a saturated hydrocarbon structure is particularly preferable.
- those having a cyclic saturated hydrocarbon structure as a mother skeleton are particularly preferable.
- methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, cyclohexane-1,2,4- Tricarboxylic acid-1,2-anhydride and bicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride are particularly preferred.
- methylhexahydrophthalic anhydride or cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride is particularly preferable from the viewpoint of optical properties.
- the reaction for adding an alcohol and an acid anhydride is generally an addition reaction using an acid or a base as a catalyst.
- a catalyst-free reaction is preferred.
- hydrochloric acid sulfuric acid, methanesulfonic acid, trifluoromethanesulfonic acid, paratoluenesulfonic acid, nitric acid, trifluoroacetic acid, trichloroacetic acid and other acidic compounds
- sodium hydroxide potassium hydroxide
- calcium hydroxide water
- Metal hydroxides such as magnesium oxide, amine compounds such as triethylamine, tripropylamine, tributylamine, pyridine, dimethylaminopyridine, 1,8-diazabicyclo [5.4.0] undec-7-ene, imidazole, triazole, Heterocyclic compounds such as tetrazole, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, trimethylethylammonium hydroxide Trimethyl
- catalysts may be used alone or in combination of two or more. Of these, triethylamine, pyridine, and dimethylaminopyridine are preferred.
- the amount of the catalyst used is not particularly limited, but is usually 0.001 to 5 parts by weight with respect to 100 parts by weight of the total weight of the raw materials.
- a reaction without a solvent is preferable, but an organic solvent may be used.
- the organic solvent is used in a weight ratio of 0.005 to 1, preferably 0.005 to 0.7, more preferably 0.005 to 0.5 (that is, outside) with respect to a total amount of reaction substrate of 1. 50% by weight or less). When the weight ratio exceeds 1, the progress of the reaction is extremely slow, which is not preferable.
- organic solvents that can be used include alkanes such as hexane, cyclohexane and heptane, aromatic hydrocarbon compounds such as toluene and xylene, ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone and anone, diethyl ether , Ethers such as tetrahydrofuran and dioxane, and ester compounds such as ethyl acetate, butyl acetate and methyl formate.
- alkanes such as hexane, cyclohexane and heptane
- aromatic hydrocarbon compounds such as toluene and xylene
- ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone and anone
- diethyl ether Ethers such as tetrahydrofuran and dioxane
- the reaction temperature is preferably 40 to 200 ° C, particularly preferably 40 to 150 ° C.
- the reaction at 100 ° C. or lower is preferred, and a reaction at 40 to 100 ° C., particularly 40 to 80 ° C. is preferred because of the volatilization of acid anhydride.
- a compound having high crystallinity at room temperature such as cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride
- the reaction is performed at 100 to 150 ° C. in order to sufficiently dissolve the crystal. It is preferable.
- the acid anhydride which is easy to volatilize, and the acid anhydride with high crystallinity it is also possible to prevent volatilization of an acid anhydride by raising temperature in steps.
- the reaction ratio of the compounds (a) and (b), (c) and (d) in the reaction for obtaining the polyvalent carboxylic acid (J) and the polyvalent carboxylic acid (K) is theoretically equivalent. Is preferable, but can be changed as necessary. That is, as will be described later, in the curing agent composition of the present invention, when the acid anhydride used in combination with the acid anhydride used here is the same as necessary, the reaction is carried out in an excess of acid anhydride at the time of production. When the reaction for obtaining the polyvalent carboxylic acid (J) and the polyvalent carboxylic acid (K) is completed, a mixture of the acid anhydride and the polyvalent carboxylic acid composition of the present invention can be used.
- the functional group equivalent is compared.
- the molar ratio (a) (or (c)) is 0.001 to 1. 0, more preferably 0.01 to 1.0, still more preferably 0.1 to 1.0.
- the ratio is preferably in the range of 0.01 to 0.7, preferably 0.01 to 0.4. .
- reaction time depends on the reaction temperature, the amount of catalyst, etc., from the viewpoint of industrial production, a long reaction time is not preferable because it consumes a great deal of energy.
- An excessively short reaction time means that the reaction is abrupt and is not preferable from the viewpoint of safety.
- a preferred range is 1 to 48 hours, preferably 1 to 36 hours, and more preferably 1 to 24 hours.
- the desired polycarboxylic acid (J) or (K) is obtained by removing the catalyst by neutralization, washing with water, adsorption, etc., and distilling off the solvent. .
- the solvent is distilled off, and in the case of no solvent and without a catalyst, the polycarboxylic acid (J) or the polyvalent carboxylic acid (K) can be obtained by taking it out as it is. .
- the most preferred production method is a method of reacting at 40 to 150 ° C. under the conditions of no catalyst and no solvent, and taking it out as it is after the reaction is completed.
- the target polyvalent carboxylic acid composition can be obtained by mixing the polyvalent carboxylic acid (J) and the polyvalent carboxylic acid (K) thus obtained.
- the ratio of (J) / (K) is particularly preferably 99/1 to 80/20, and more preferably 99/1 to 85/15.
- the polyvalent carboxylic acid (J) and the polyvalent carboxylic acid (K) can also be produced simultaneously.
- Specific methods include (i) Compounds (b) and (d) having one or more carboxylic acid anhydride groups in the molecule are charged into a mixture of silicone oil (a) and polyhydric alcohol (c) and reacted simultaneously. (Ii) The following steps (A) and (B) are sequentially reacted in one pot.
- the compounds to be used in step (B) (or step (A)) are sequentially added, and reaction and mixing are performed in the system.
- the polycarboxylic acid composition of the present invention thus obtained is usually a colorless liquid to semi-solid substance.
- the polyvalent carboxylic acid composition of the present invention has excellent transparency, a curing agent for a curable resin such as an epoxy resin, a paint, an adhesive, a molded product, a semiconductor, a resin for an optical semiconductor encapsulant, and an optical semiconductor die bond material
- a curing agent for a curable resin such as an epoxy resin, a paint, an adhesive, a molded product, a semiconductor, a resin for an optical semiconductor encapsulant, and an optical semiconductor die bond material
- the polyvalent carboxylic acid composition of the present invention When used as a curing agent for an epoxy resin, the polyvalent carboxylic acid composition of the present invention exhibits excellent curability and the transparency of the cured product is excellent. It is extremely useful as a curing agent for epoxy resins used for sealing of other white semiconductor LEDs and other optical semiconductors.
- the polyvalent carboxylic acid composition of the present invention is used as a curing agent for a curable resin such as an epoxy resin, particularly as a liquid composition
- the polyvalent carboxylic acid composition of the present invention and another acid anhydride are mixed. It is preferably used in the form of a curing agent composition.
- the acid anhydride that can be used a compound (e) having one or more carboxylic acid anhydride groups in the molecule is preferable, and an acid anhydride having no aromatic ring in its structure is particularly preferable.
- the compound (e) having one or more carboxylic anhydride groups in the molecule include hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1 ] Heptane-2,3-dicarboxylic acid anhydride, methylbicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride, etc. Is mentioned.
- the proportion of the polyvalent carboxylic acid composition of the present invention is the total weight of the other acid anhydride and the polyvalent carboxylic acid composition of the present invention. On the other hand, it is 0.1 to 50% by weight, preferably 0.1 to 30% by weight. By using together in such a range, there is an effect in terms of fluidity of the composition and heat resistant mechanical strength of the cured product.
- the curable resin composition of the present invention including the polyvalent carboxylic acid composition of the present invention will be described.
- the curable resin composition of the present invention contains an epoxy resin as an essential component.
- Examples of the epoxy resin that can be used in the curable resin composition of the present invention include novolac type epoxy resins, bisphenol A type epoxy resins, biphenyl type epoxy resins, triphenylmethane type epoxy resins, and phenol aralkyl type epoxy resins.
- bisphenol A bisphenol S, thiodiphenol, fluorene bisphenol, terpene diphenol, 4,4′-biphenol, 2,2′-biphenol, 3,3 ′, 5,5′-tetramethyl- [ 1,1′-biphenyl] -4,4′-diol, hydroquinone, resorcin, naphthalenediol, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenol (Phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc.) and formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, o-hydroxybenzaldehyde, p-hydroxyacetofu Non, o-hydroxy
- an alicyclic epoxy resin and / or an epoxy-group containing silicone resin are preferable, and the epoxy resin of a silsesquioxane structure is more preferable.
- an alicyclic epoxy resin a compound having an epoxycyclohexane structure in the skeleton is preferable, and an epoxy resin obtained by an oxidation reaction of a compound having a cyclohexene structure is more preferable.
- These alicyclic epoxy resins include esterification reaction of cyclohexene carboxylic acid with alcohols or esterification reaction of cyclohexene methanol with carboxylic acids (Tetrahedron vol.36 p.2409 (1980), Tetrahedron Letter p.4475 (1980) ), Or Tyschenco reaction of cyclohexene aldehyde (method described in Japanese Patent Application Laid-Open No. 2003-170059, Japanese Patent Application Laid-Open No. 2004-262871, etc.), and transesterification of cyclohexene carboxylic acid ester Examples thereof include an oxidized product of a compound that can be produced by a reaction (a method described in Japanese Patent Application Laid-Open No.
- the alcohol is not particularly limited as long as it is a compound having an alcoholic hydroxyl group, but ethylene glycol, propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,4-butanediol, 1,5-pentane.
- carboxylic acids include, but are not limited to, oxalic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, adipic acid, and cyclohexanedicarboxylic acid.
- an acetal compound obtained by an acetal reaction between a cyclohexene aldehyde derivative and an alcohol is exemplified.
- a reaction method it can be produced by applying a general acetalization reaction.
- a method of carrying out a reaction while azeotropically dehydrating using a solvent such as toluene or xylene as a reaction medium US Pat. No. 2,945,008
- concentrated hydrochloric acid A method in which polyhydric alcohol is dissolved in the mixture and then the reaction is carried out while gradually adding aldehydes (Japanese Patent Laid-Open No.
- epoxy resins include ERL-4221, UVR-6105, ERL-4299 (all trade names, all manufactured by Dow Chemical), Celoxide 2021P, Epolide GT401, EHPE3150, EHPE3150CE (all trade names, all Daicel) (Chemical Industry) and dicyclopentadiene diepoxide, and the like, but are not limited thereto (Reference: Review Epoxy Resin Basic Edition I p76-85). These may be used alone or in combination of two or more.
- the polyvalent carboxylic acid composition (or the curing agent composition) of the present invention may be used in combination with other curing agents.
- the proportion of the polyvalent carboxylic acid of the present invention in the total curing agent is preferably 20% by weight or more, and particularly preferably 30% by weight or more.
- other curing agents that can be used in combination include amine compounds, acid anhydride compounds, amide compounds, phenol compounds, and carboxylic acid compounds.
- the curing agent that can be used include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, dicyandiamide, polyamide resin synthesized from linolenic acid and ethylenediamine, phthalic anhydride, trimellitic anhydride Acid, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, Bicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, methylbicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, cyclo
- the ratio of the total curing agent to the epoxy resin is 0.5 to 1.5 equivalents per 1 equivalent of epoxy groups of the epoxy resin (note that acid anhydride groups are considered to be monofunctional).
- the amount is particularly preferably 0.5 to 1.2 equivalents. When less than 0.5 equivalent or more than 1.5 equivalent with respect to 1 equivalent of epoxy group, curing may be incomplete and good cured properties may not be obtained.
- a curing accelerator may be used in combination with a curing agent.
- the curing accelerator that can be used include 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, and 1-benzyl-2-phenylimidazole.
- the zinc salt and / or the zinc complex contributes as a curing accelerator between the epoxy resin and the curing agent.
- the zinc salt and / or zinc complex is a salt and / or complex having a zinc ion as a central element, preferably a carboxylic acid having an alkyl group having 1 to 30 carbon atoms as a counter ion and / or a ligand. , Phosphoric acid ester, and phosphoric acid.
- alkyl group having 1 to 30 carbon atoms examples include methyl group, isopropyl group, butyl group, 2-ethylhexyl group, octyl group, isodecyl group, isostearyl group, decanyl group, cetyl group and the like.
- a zinc carboxylate and a zinc phosphate ester are particularly preferable. By using a zinc carboxylate body or a zinc phosphate ester body, corrosion resistance and gas permeability can be improved.
- the particularly preferred zinc carboxylate in the present invention preferably has an alkyl group having a chain-branched structure or an alkyl group having a functional group such as an olefin in the compound, and among them, those having 3 to 30 carbon atoms are preferred. In particular, those having 5 to 20 carbon atoms are preferred. These are preferable in terms of compatibility, and when the number of carbon atoms is too large (when the number of carbon atoms exceeds 30), or when they do not have a structure such as a branched structure or a functional group, the compatibility with the resin is poor, which is not preferable. Specific examples include zinc 2-ethylhexylate, zinc isostearate and zinc undecylenate.
- a zinc salt and / or a zinc complex of phosphoric acid, phosphoric acid ester (monoalkyl ester body, dialkyl ester body, trialkyl ester body, or a mixture thereof) is preferable.
- the amount of the monoalkyl ester compound is 50 area% or more at the stage of the trimethylsilylation treatment.
- Such zinc salt and / or zinc complex of zinc phosphate ester can be obtained, for example, by reacting a phosphate ester with, for example, zinc carbonate, zinc hydroxide, etc. (Patent Document EP 699708).
- the ratio of phosphorus atom to zinc atom is preferably 1.2 to 2.3, more preferably 1.3 to 2.0. . Particularly preferred is 1.4 to 1.9. That is, in a particularly preferred form, the amount of phosphate ester (or phosphate derived from phosphate ester) is 2.0 mol or less per mol of zinc ion, and not a simple ionic structure, some molecules are ion-bonded (or arranged). Those having a structure related by coordinate bond) are preferred.
- Such a zinc salt and / or zinc complex can also be obtained, for example, by the technique described in Japanese Patent Publication No. 2003-51495.
- Examples of the phosphate ester and / or zinc phosphate include LBT-2000B (manufactured by SC Organic Chemical) and XC-9206 (manufactured by King Industry).
- the curing accelerator is usually used in an amount of 0.001 to 15 parts by weight, more preferably 0.01 to 5 parts by weight, and particularly preferably 0.01 to 3 parts by weight with respect to 100 parts by weight of the epoxy resin.
- curing is possible without using a curing accelerator, but from the viewpoint of coloring during curing, addition of a curing accelerator is preferred.
- the use of zinc salts and / or zinc complexes is preferred in order to prevent coloring and to obtain corrosion-resistant gas permeability characteristics.
- the curable resin composition of the present invention may contain a phosphorus-containing compound as a flame retardant component.
- the phosphorus-containing compound may be a reactive type or an additive type.
- Specific examples of phosphorus-containing compounds include trimethyl phosphate, triethyl phosphate, tricresyl phosphate, trixylylenyl phosphate, cresyl diphenyl phosphate, cresyl-2,6-dixylylenyl phosphate, 1,3-phenylenebis ( Phosphoric esters such as dixylylenyl phosphate), 1,4-phenylenebis (dixylylenyl phosphate), 4,4′-biphenyl (dixylylenyl phosphate); 9,10-dihydro-9-oxa Phosphanes such as -10-phosphaphenanthrene-10-oxide, 10 (2,5-dihydroxyphenyl) -10H-9-oxa-10-pho
- Phosphate esters, phosphanes or phosphorus-containing epoxy compounds are preferable, and 1,3-phenylenebis (dixylylenyl phosphate), 1,4-phenylenebis (dixylylene). Nyl phosphate), 4,4′-biphenyl (dixylylenyl phosphate) or phosphorus-containing epoxy compounds are particularly preferred.
- antioxidant to the curable resin composition of this invention as needed.
- Antioxidants that can be used include phenol-based, sulfur-based, and phosphorus-based antioxidants. Antioxidants can be used alone or in combination of two or more.
- the amount of the antioxidant used is usually 0.008 to 1 part by weight, preferably 0.01 to 0.5 part by weight, based on 100 parts by weight of the resin component in the curable resin composition of the present invention. It is.
- antioxidants examples include a phenol-based antioxidant, a sulfur-based antioxidant, and a phosphorus-based antioxidant.
- phenolic antioxidants include 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-t-butyl-p-ethylphenol, stearyl- ⁇ - (3 , 5-di-t-butyl-4-hydroxyphenyl) propionate, isooctyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate, 2,4-bis- (n-octylthio)- Monophenols such as 6- (4-hydroxy-3,5-di-t-butylanilino) -1,3,5-triazine, 2,4-bis [(octylthio) methyl] -o-cresol; 2'-methylenebis (4-methyl-6-t-butylphenol), 2,2'-methylenebis (4-ethyl
- sulfur antioxidant examples include dilauryl-3,3′-thiodipropionate, dimyristyl-3,3′-thiodipropionate, distearyll-3,3′-thiodipropionate, and the like. .
- phosphorus antioxidants include 1,1,3-tris (2-methyl-4-ditridecyl phosphite-5-tert-butylphenyl) butane, distearyl pentaerythritol diphosphite, bis (2 , 4-Di-tert-butylphenyl) pentaerythritol diphosphite, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite, dicyclohexylpenta Erythritol diphosphite, tris (diethylphenyl) phosphite, tris (di-isopropylphenyl) phosphite, tris (di-n-butylphenyl) phosphite, tris (2,4-di-tert
- a commercial item can also be used for the said phosphorus compound.
- the amount of the phosphorus compound used is 0.005 to 5% by weight, more preferably 0.01 to 4% by weight, and 0.1 to 2% by weight with respect to the epoxy resin.
- antioxidants can be used alone, but two or more kinds may be used in combination.
- a phosphorus-based antioxidant is particularly preferable.
- a light stabilizer it is preferable to contain a hindered amine compound especially, and it is preferable to contain a phosphorus compound as needed.
- the amine compound that is the light stabilizer can be used as the amine compound that is the light stabilizer.
- the light stabilizer is used in an amount of 0.005 to 5% by weight, more preferably 0.01 to 4% by weight, and 0.1 to 2% by weight with respect to the epoxy resin.
- the amount is less than 0.005% by weight, the effect is insufficient, and when the amount exceeds 5% by weight, an influence on the heat-resistant coloring property appears, which is not preferable.
- a binder resin can be blended with the curable resin composition of the present invention as required.
- the binder resin include butyral resins, acetal resins, acrylic resins, epoxy-nylon resins, NBR-phenol resins, epoxy-NBR resins, polyamide resins, polyimide resins, and silicone resins.
- the blending amount of the binder resin is preferably within a range that does not impair the flame retardancy and heat resistance of the cured product, and is usually 0.05 to 50 parts by weight, preferably 0.05 to 20 parts per 100 parts by weight of the resin component. Part by weight is used as needed.
- An inorganic filler can be added to the curable resin composition of the present invention as necessary.
- inorganic fillers include crystalline silica, fused silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, silicon nitride, boron nitride, zirconia, fosterite, steatite, spinel, titania, talc, and the like.
- the present invention is not limited to these. These may be used alone or in combination of two or more.
- the content of these inorganic fillers is used in an amount of 0 to 95% by weight in the curable resin composition of the present invention.
- the curable resin composition of the present invention includes various agents such as silane coupling agents, mold release agents such as stearic acid, palmitic acid, zinc stearate, and calcium stearate, surfactants, dyes, pigments, and ultraviolet absorbers.
- agents such as silane coupling agents, mold release agents such as stearic acid, palmitic acid, zinc stearate, and calcium stearate, surfactants, dyes, pigments, and ultraviolet absorbers.
- a compounding agent and various thermosetting resins can be added.
- a fluorescent substance can be added as needed.
- the phosphor has a function of forming white light by absorbing part of blue light emitted from a blue LED element and emitting wavelength-converted yellow light. After the phosphor is dispersed in advance in the curable resin composition, the optical semiconductor is sealed.
- fluorescent substance A conventionally well-known fluorescent substance can be used, For example, rare earth element aluminate, thio gallate, orthosilicate, etc. are illustrated.
- phosphors such as a YAG phosphor, a TAG phosphor, an orthosilicate phosphor, a thiogallate phosphor, and a sulfide phosphor can be mentioned, and YAlO 3 : Ce, Y 3 Al 5 O 12 : Ce, Y 4 Al 2 O 9 : Ce, Y 2 O 2 S: Eu, Sr 5 (PO 4 ) 3 Cl: Eu, (SrEu) O.Al 2 O 3 and the like are exemplified.
- the particle size of the phosphor those having a particle size known in this field are used, and the average particle size is preferably 1 to 250 ⁇ m, particularly preferably 2 to 50 ⁇ m. When these phosphors are used, the addition amount thereof is 1 to 80 parts by weight, preferably 5 to 60 parts by weight, based on 100 parts by weight of the resin component.
- silica fine powder also called Aerosil or Aerosol
- a thixotropic agent can be added.
- silica fine powder include Aerosil 50, Aerosil 90, Aerosil 130, Aerosil 200, Aerosil 300, Aerosil 380, Aerosil OX50, Aerosil TT600, Aerosil R972, Aerosil R974, AerosilR202, AerosilR202, AerosilR202 Aerosil R805, RY200, RX200 (made by Nippon Aerosil Co., Ltd.), etc. are mentioned.
- the curable resin composition of the present invention can be obtained by uniformly mixing each component.
- the curable resin composition of the present invention can be easily made into a cured product by a method similar to a conventionally known method. For example, an epoxy resin, a curing agent and, if necessary, a curing accelerator, a phosphorus-containing compound, a binder resin, an inorganic filler, and a compounding agent are thoroughly mixed using an extruder, kneader, roll, etc. as necessary until uniform.
- the curable resin composition is in liquid form, potting or casting, impregnating the base material, pouring the curable resin composition into a mold, casting, curing by heating, or solid
- the curing temperature and time are 80 to 200 ° C. and 2 to 10 hours.
- a curing method it can be hardened at a high temperature at a stretch, but it is preferable to increase the temperature stepwise to advance the curing reaction. Specifically, initial curing is performed at 80 to 150 ° C., and post-curing is performed at 100 to 200 ° C.
- the temperature is preferably increased in 2 to 8 stages, more preferably 2 to 4 stages.
- the curable resin composition of the present invention is dissolved in a solvent such as toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, etc. to obtain a curable resin composition varnish, glass fiber,
- a prepreg obtained by impregnating a base material such as carbon fiber, polyester fiber, polyamide fiber, alumina fiber, paper, etc. and heat-dried is subjected to hot press molding to obtain a cured product of the curable resin composition of the present invention. can do.
- the solvent is used in an amount usually accounting for 10 to 70% by weight, preferably 15 to 70% by weight in the mixture of the curable resin composition of the present invention and the solvent.
- cured material containing a carbon fiber can also be obtained with a RTM (Resin * Transfer * Molding) system with a liquid composition.
- the curable resin composition of the present invention can also be used as a modifier for a film-type composition. Specifically, it can be used to improve flexibility in the B-stage.
- a method for obtaining such a film-type resin composition first, the curable resin composition of the present invention is used as the curable resin composition varnish as described above, and this is applied onto a release film and heated under a solvent.
- a method of forming a B-stage after removing the film is mentioned, whereby a film-type sealing composition can be obtained as a sheet-like adhesive.
- This sheet-like adhesive can be used as an interlayer insulating layer in a multilayer substrate or the like.
- curable resin composition of the present invention is used as an optical semiconductor sealing material or die bond material.
- a curing agent (curing agent composition) containing the polyvalent carboxylic acid of the present invention
- a curable resin composition is prepared by sufficiently mixing additives such as a curing accelerator, a coupling material, an antioxidant, and a light stabilizer.
- a mixing method a kneader, a three-roll, a universal mixer, a planetary mixer, a homomixer, a homodisper, a bead mill, or the like may be used at room temperature or with heating.
- the obtained curable resin composition can be used for a sealing material, or both a die-bonding material and a sealing material.
- Optical semiconductor elements such as high-intensity white LEDs are generally GaAs, GaP, GaAlAs, GaAsP, AlGa, InP, GaN, InN, AlN, InGaN laminated on a substrate of sapphire, spinel, SiC, Si, ZnO or the like.
- Such a semiconductor chip is bonded to a lead frame, a heat sink, or a package using an adhesive (die bond material).
- a wire such as a gold wire is connected to pass an electric current.
- the periphery of such a semiconductor chip is sealed with a sealing material such as an epoxy resin.
- the sealing material is used to protect the semiconductor chip from heat and moisture and to play a role of a lens function.
- the curable resin composition of the present invention can be used as this sealing material or die bond material. From the viewpoint of the process, it is advantageous to use the curable resin composition of the present invention for both the die bond material and the sealing material.
- the curable resin composition of the present invention is applied on the substrate by dispenser, potting or screen printing, and then the curable resin is used.
- a semiconductor chip is placed on the composition and heat-cured.
- the semiconductor chip can be bonded to the substrate.
- methods such as hot air circulation, infrared rays and high frequency can be used.
- the heating conditions are preferably 80 to 230 ° C. for about 1 minute to 24 hours.
- post-curing is performed at 120 to 180 ° C. for 30 minutes to 10 hours. it can.
- an injection method in which the sealing material is injected into the mold frame in which the substrate on which the semiconductor chip is fixed is inserted and then heat-cured and then molded, and the sealing material on the mold A compression molding method is used in which a semiconductor chip fixed on a substrate is immersed therein and heat-cured and then released from the mold.
- the injection method include dispenser, transfer molding, injection molding and the like.
- methods such as hot air circulation, infrared rays and high frequency can be used.
- the heating conditions are preferably 80 to 230 ° C. for about 1 minute to 24 hours.
- post-curing is performed at 120 to 180 ° C. for 30 minutes to 10 hours. it can.
- the application of the curable resin composition of the present invention is not limited to the above application, and can be applied to general applications in which a thermosetting resin such as an epoxy resin is used.
- a thermosetting resin such as an epoxy resin
- cyanate resin composition for resist and additives for other resins such as an acrylic ester resin as a curing agent for resist.
- adhesives examples include civil engineering, architectural, automotive, general office, and medical adhesives, as well as electronic material adhesives.
- adhesives for electronic materials include interlayer adhesives for multilayer substrates such as build-up substrates, die bonding agents, semiconductor adhesives such as underfills, BGA reinforcing underfills, anisotropic conductive films ( ACF) and an adhesive for mounting such as anisotropic conductive paste (ACP).
- sealing materials potting, dipping and transfer mold sealing used for capacitors, transistors, diodes, light emitting diodes, ICs, LSIs, potting sealings used for COB, COF, TAB, etc. of ICs and LSIs, flip Examples include underfill used for chips and the like, and sealing (including reinforcing underfill) when mounting IC packages such as QFP, BGA, and CSP.
- the cured product of the present invention obtained by curing the curable resin composition of the present invention can be used for various applications including optical component materials.
- the optical material refers to general materials used for applications that allow light such as visible light, infrared light, ultraviolet light, X-rays, and lasers to pass through the material. More specifically, in addition to LED sealing materials such as lamp type and SMD type, the following may be mentioned. It is a peripheral material for liquid crystal display devices such as a substrate material, a light guide plate, a prism sheet, a polarizing plate, a retardation plate, a viewing angle correction film, an adhesive, and a film for a liquid crystal such as a polarizer protective film in the liquid crystal display field.
- color PDP plasma display
- antireflection films antireflection films
- optical correction films housing materials
- front glass protective films front glass replacement materials
- adhesives and LED displays that are expected as next-generation flat panel displays
- LED molding materials LED sealing materials, front glass protective films, front glass substitute materials, adhesives, and substrate materials for plasma addressed liquid crystal (PALC) displays, light guide plates, prism sheets, deflection plates , Phase difference plate, viewing angle correction film, adhesive, polarizer protective film, front glass protective film in organic EL (electroluminescence) display, front glass substitute material, adhesive, and various in field emission display (FED) Film substrate
- PLC plasma addressed liquid crystal
- VD video disc
- CD / CD-ROM CD-R / RW
- DVD-R / DVD-RAM MO / MD
- PD phase change disc
- disc substrate materials for optical cards Pickup lenses, protective films, sealing materials, adhesives and the like.
- optical equipment field they are still camera lens materials, finder prisms, target prisms, finder covers, and light receiving sensor parts. It is also a photographic lens and viewfinder for video cameras.
- optical components they are fiber materials, lenses, waveguides, element sealing materials, adhesives and the like around optical switches in optical communication systems.
- optical passive components and optical circuit components there are lenses, waveguides, LED sealing materials, CCD sealing materials, adhesives, and the like.
- OEIC optoelectronic integrated circuit
- automotive lamp reflectors In the field of automobiles and transport equipment, automotive lamp reflectors, bearing retainers, gear parts, anti-corrosion coatings, switch parts, headlamps, engine internal parts, electrical parts, various interior and exterior parts, drive engines, brake oil tanks, and automotive defenses Rusted steel plate, interior panel, interior material, wire harness for protection / bundling, fuel hose, automobile lamp, glass substitute.
- it is a multilayer glass for railway vehicles.
- they are toughness imparting agents for aircraft structural materials, engine peripheral members, protective / bundling wire harnesses, and corrosion-resistant coatings.
- it In the construction field, it is interior / processing materials, electrical covers, sheets, glass interlayers, glass substitutes, and solar cell peripheral materials. For agriculture, it is a house covering film.
- optical / electronic functional organic materials include organic EL element peripheral materials, organic photorefractive elements, optical amplification elements that are light-to-light conversion devices, optical arithmetic elements, substrate materials around organic solar cells, fiber materials, elements Sealing material, adhesive and the like.
- Synthesis example 2 A flask equipped with a stirrer, reflux condenser, and stirrer was charged with 98 parts of tricyclodecanediol, HTMan (1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride, Mitsubishi Gas Chemical ( 99 parts), MH-700 (mixture of hexahydrophthalic anhydride and 4-methylhexahydrophthalic anhydride, manufactured by Nippon Nippon Chemical Co., Ltd.), 84 parts, and 10 parts of toluene were charged in a reaction vessel at 100 ° C. for 1 hour. The reaction was carried out at 2 ° C. for 2 hours. After completion of the reaction, the solvent was removed under reduced pressure to obtain 280 parts of a colorless solid resin carboxylic acid compound (K-1).
- K-1 colorless solid resin carboxylic acid compound
- Example 1 A flask equipped with a stirrer, a reflux condenser, and a stirrer was charged with 68.3 parts of the carboxylic acid compound (J-1) while purging with nitrogen, and the mixture was stirred at 100 ° C., and the carboxylic acid compound (K -1) 28.1 parts were added, and the mixture was stirred as it was for 1 hour to be compatible with each other to obtain a polyvalent carboxylic acid composition (MA-1) of the present invention as a colorless transparent liquid.
- Example 2 and Comparative Example 1 The polyvalent carboxylic acid composition (MA-1) of the present invention obtained in Example 1 and, as a comparative example, MH-700 (a mixture of hexahydrophthalic anhydride and 4-methylhexahydrophthalic anhydride, manufactured by Shin Nippon Rika Co., Ltd.) (Hereinafter referred to as H1) as a curing agent, and 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate as epoxy resin (UVR-6105 manufactured by Dow Chemical) (hereinafter referred to as epoxy resin (EP1)), curing Hexadecyltrimethylammonium hydroxide (manufactured by Tokyo Chemical Industry Co., Ltd., 25% methanol solution, hereinafter referred to as C1) is used as an accelerator, blended at the blending ratio (parts by weight) shown in Table 1 below, and desorbed for 20 minutes. Foaming was performed to obtain a curable resin composition of the present
- LED sealing test Surface mount type (SMD) in which the curable resin compositions obtained in the examples and comparative examples were vacuum degassed for 20 minutes, filled in a syringe and mounted with a light emitting element having an emission wavelength of 465 nm using a precision discharge device.
- Evaluation item Volatility The presence or absence of dents on the surface of the cured product after sealing was visually evaluated. In the table, ⁇ : no dent is observed, ⁇ : some dent is observed, x: many dents are observed (there is an exposed wire).
- Example 2 shows that the curable resin composition of the present invention has a small amount of volatilization and does not cause problems such as wire exposure even when the LED is sealed. Furthermore, it can be seen that there is a tendency to reduce cracks during reflow. From the above results, it can be seen that the polyvalent carboxylic acid of the present invention and the curing agent composition containing the polyvalent carboxylic acid can give a curable resin composition effective for volatility.
- Synthesis example 4 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane (59.1 parts), polydimethyldiphenylsiloxane having a silanol group having a molecular weight of 1700 (measured by GPC) 130.6 parts, 0.5 wt% KOH methanol solution 10.0 The portion was charged into a reaction vessel and heated to 75 ° C. After raising the temperature, the mixture was reacted at 75 ° C. under reflux for 8 hours. After the reaction, 135 parts of methanol was added, 25.9 parts of 50% distilled water methanol solution was added dropwise over 60 minutes, and the mixture was further reacted at 75 ° C. for 8 hours under reflux.
- reaction mixture was neutralized with a 5 wt% aqueous sodium hydrogen phosphate solution, and methanol was recovered by distillation at 80 ° C. Thereafter, 170 parts of methyl isobutyl ketone (MIBK) was added for washing, and washing with water was repeated three times. Subsequently, 162 parts of epoxy resins (EP2) were obtained by removing a solvent at 100 degreeC under pressure reduction of an organic layer.
- the epoxy equivalent of the obtained compound was 707 g / eq, the weight average molecular weight was 2680, and the appearance was colorless and transparent.
- Example 3 A flask equipped with a stirrer, a reflux condenser, and a stirrer was charged with 500 parts of both ends carbinol-modified silicone X22-160AS (manufactured by Shin-Etsu Chemical Co., Ltd.) while purging with nitrogen, MH (methylhexahydrophthalic anhydride, 168 parts (manufactured by Nippon Nippon Chemical Co., Ltd.) and reacted at 70 ° C.
- carbinol-modified silicone X22-160AS manufactured by Shin-Etsu Chemical Co., Ltd.
- MH methylhexahydrophthalic anhydride
- polycarboxylic acid (J) derived from carbinol-modified silicone at both ends is about 70% by weight
- polycarboxylic acid derived from 2,4-diethylpentane-1,5-diol (K) is about 30% by weight
- Example 4 A flask equipped with a stirrer, a reflux condenser, and a stirrer was purged with nitrogen while carrying both ends of the carbinol-modified silicone X22-160AS (manufactured by Shin-Etsu Chemical Co., Ltd.) 500 parts, MH (methylcyclohexanedicarboxylic anhydride, 168 parts by Nippon Nippon Chemical Co., Ltd., 80 parts by Kyowadiol PD9 (2,4-diethylpentane-1,5-diol manufactured by Kyowa Hakko Chemical), HTAn (1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride) 198 parts by Mitsubishi Gas Chemical Co., Ltd.), reacted at 70 ° C.
- MH methylcyclohexanedicarboxylic anhydride, 168 parts by Nippon Nippon Chemical Co., Ltd., 80 parts by Kyowadiol
- polyvalent carboxylic acid composition (MA-3) of the present invention.
- the obtained polyvalent carboxylic acid composition was a colorless and transparent liquid.
- polycarboxylic acid (J) derived from carbinol-modified silicone at both ends is about 70% by weight
- polycarboxylic acid derived from 2,4-diethylpentane-1,5-diol (K) About 27% by weight and about 3% by weight of acid anhydride
- Corrosion gas 20% by weight aqueous solution of ammonium sulfide (turns black when sulfur component reacts with silver)
- Contact method A container of an ammonium sulfide aqueous solution and the LED package were mixed in a wide-mouth glass bottle, and the wide-mouth glass bottle was covered to bring the volatilized ammonium sulfide gas into contact with the LED package in a sealed state.
- Judgment of corrosion The time when the lead frame inside the LED package was discolored black (referred to as blackening) was observed, and the longer the discoloration time, the better the corrosion resistance gas permeability.
- the epoxy resin composition of the present invention has a dent and is excellent not only in reflow resistance but also in a cured product excellent in corrosion resistance and gas permeability.
- SI-1 Chisso FM-4411
- SI-2 Shin-Etsu Chemical X22-160AS
- AL-1 Kyowa Hakko Chemical Kyowajiru PD-9
- AL-2 OXEA TCDAlchol-DM
- H1 Rikacid MH-700, manufactured by Shin Nippon Rika
- H2 Rikacid MH, manufactured by Shin Nippon Rika
- H3 H-TMAn, manufactured by Mitsubishi Gas Chemical.
- Synthesis example 8 A flask equipped with a stirrer, a reflux condenser, and a stirrer was charged with 100 parts of acid anhydride (H2) and saturated aliphatic polyhydric alcohol (AL-1) while purging with nitrogen, and at 70 ° C. for 3 hours. Stirring at 30 ° C. for 30 minutes gave 120 parts of a mixture of a colorless and transparent carboxylic acid compound and an acid anhydride. The ratio of the obtained carboxylic acid to acid anhydride was approximately 52:48 as a result of measurement by gel permeation chromatography.
- Synthesis Example 10 375 parts of ⁇ - (3,4 epoxycyclohexyl) ethyltrimethoxysilane, 475 parts of silanol-terminated methylphenyl silicone oil having a weight average molecular weight of 1900 (measured by GPC) (silanol equivalent 950, half of the weight average molecular weight measured using GPC) 40 parts of 0.5% potassium hydroxide (KOH) methanol solution was charged into a reaction vessel, the bath temperature was set to 75 ° C., and the temperature was raised. After raising the temperature, the reaction was carried out under reflux for 8 hours.
- Examples 16 to 19 and Comparative Example 4 The polyvalent carboxylic acid composition of the present invention (MA-4, MA-5, MA-6, MA-10), as a comparative example, a polyvalent carboxylic acid resin (J-3) is used as a curing agent, and an epoxy resin Using the epoxy resin (EP-4) obtained in Synthesis Example 10, zinc octylate (18% Octopus Zn, hereinafter referred to as C2) manufactured by Hope Pharmaceutical, and light stabilizer (LA-81 or less, manufactured by ADEKA) were added as a curing accelerator. And an antioxidant (made by ADEKA, ADEKA 260, called additive AD-2)), and blended at the blending ratio (parts by weight) shown in Table 4 below, and removed for 20 minutes.
- an antioxidant made by ADEKA, ADEKA 260, called additive AD-2
- Foaming was performed to obtain a curable resin composition of the present invention and a comparative curable resin composition. Using the obtained curable resin composition, a test was conducted in the following manner, and the results are shown in Table 4. The curing conditions are 150 ° C. ⁇ 5 hours after preliminary curing at 120 ° C. ⁇ 2 hours, unless otherwise specified.
- Examples 20-22, Comparative Example 5 The polyvalent carboxylic acid composition of the present invention (MA-7, MA-8, MA-9), as a comparative example, the polyvalent carboxylic acid resin (J-3) was used as a curing agent, and the epoxy resin was synthesized in Synthesis Example 9, 10 using the epoxy resins (EP-3, EP-4) obtained in No. 10, using the curing accelerator (C2) and additives (AD-1, AD-2), and the mixing ratios (weights) shown in Table 5 below. Part) and defoaming for 20 minutes to obtain a curable resin composition of the present invention and a comparative curable resin composition. Using the obtained curable resin composition, a test was conducted in the following manner, and the results are shown in Table 5. The curing conditions are 150 ° C.
- the curable resin composition of the present invention is excellent in adhesion, toughness, and heat durability.
- Corrosive gas 20% aqueous solution of ammonium sulfide (discolors black when sulfur component reacts with silver)
- Contact method A container of an ammonium sulfide aqueous solution and the LED package were mixed in a wide-mouth glass bottle, and the wide-mouth glass bottle was covered to bring the volatilized ammonium sulfide gas into contact with the LED package in a sealed state.
- Judgment of corrosion The time when the lead frame inside the LED package was blackened (referred to as blackening) was observed every hour, and it was judged that the longer the color changing time, the better the corrosion resistance gas resistance.
- Example 26 Comparative Example 7
- the polyvalent carboxylic acid composition (MA-13) of the present invention as a comparative example, the polycarboxylic acid resin (J-3) was used as a curing agent, and the epoxy resin obtained in Synthesis Examples 9 and 10 as an epoxy resin ( EP-3, EP-4), using curing accelerator (C2) and additives (AD-1, AD-2), and blending ratios (parts by weight) shown in Table 7 below, for 20 minutes Defoaming was performed to obtain a curable resin composition of the present invention and a comparative curable resin composition. Using the obtained curable resin composition, a test was conducted in the following manner, and the results are shown in Table 7. The curing conditions are 150 ° C. ⁇ 5 hours after preliminary curing at 120 ° C.
- LED for lighting test is obtained by making it harden
- the lighting test was performed at 210 mA, which is 7 times the specified current, for the acceleration test. Detailed conditions are shown below.
- the illuminance before and after lighting for 40 hours was measured using an integrating sphere, and the illuminance retention rate of the test LED was calculated.
- Light emission wavelength 465nm Drive method: constant current method, 210 mA (light emitting element specified current is 30 mA)
- Driving environment 25 ° C, 65% RH (4) Gas permeation resistance test (corrosion gas permeability test); The package of the LED prepared with the obtained curable resin composition was left in a corrosive gas under the following conditions, and the change in the color of the silver-plated lead frame inside the seal was observed.
- Corrosive gas 20% aqueous solution of ammonium sulfide (discolors black when sulfur component reacts with silver)
- Contact method A container of an ammonium sulfide aqueous solution and the LED package were mixed in a wide-mouth glass bottle, and the wide-mouth glass bottle was covered to bring the volatilized ammonium sulfide gas into contact with the LED package in a sealed state.
- Judgment of corrosion The time during which the lead frame inside the LED package was blackened (referred to as blackening) was observed every hour, and it was judged that the longer the color changing time, the better the corrosion resistance.
- the epoxy resin composition of the present invention is not only excellent in heat resistance and light resistance, but also in a cured product excellent in adhesion, toughness, and corrosion resistance gas permeability. I know you give it.
Abstract
Description
また多価カルボン酸はエポキシ樹脂の硬化剤としても使用できることが知られている。 Polyvalent carboxylic acid has excellent performance as a crosslinking agent, condensing agent, etc., such as high thermal stability, good electrical properties, chemical resistance, etc., as well as formation of condensates and good reactivity. As a molecular manufacturing raw material, it has attracted much attention and is widely used.
It is also known that polyvalent carboxylic acids can be used as curing agents for epoxy resins.
さらに、近年オプトエレクトロニクス関連分野における利用が注目されている。特に近年の高度情報化に伴い、膨大な情報を円滑に伝送および処理するために、従来の電気配線による信号伝送に替わり、光信号を生かした技術が開発されている。そしてこれに伴って、光導波路、青色LEDおよび光半導体等の光学部品の分野においては透明性に優れた硬化物を与える樹脂組成物の開発が望まれている。 A curable resin composition containing an epoxy resin is used as a resin having excellent heat resistance in the fields of architecture, civil engineering, automobiles, aircraft, and the like. In recent years, especially in the field of semiconductor-related materials, electronic devices such as mobile phones with cameras, ultra-thin liquid crystals, plasma TVs, and light-weight notebook computers have become key to light, thin, short, and small. Very high characteristics have been demanded for packaging materials represented by resins.
Further, in recent years, the use in the optoelectronics related field has attracted attention. In particular, with the advancement of advanced information technology in recent years, in order to smoothly transmit and process a huge amount of information, a technique utilizing an optical signal has been developed instead of the conventional signal transmission using electric wiring. Accordingly, in the field of optical components such as optical waveguides, blue LEDs, and optical semiconductors, development of a resin composition that gives a cured product having excellent transparency is desired.
しかしながら上記の脂環式酸無水物を硬化剤とした場合、これらの硬化剤は蒸気圧が高く、硬化時に一部が蒸発する傾向がある。このため、これらの脂環式酸無水物をエポキシ樹脂の硬化剤として用いて開放系で熱硬化させる際には、この脂環式酸無水物が大気中に揮発し、大気への有害物質の放出による環境汚染、人体への悪影響を引き起こす懸念がある。また、それ以外にも、生産ラインの汚染、硬化物中に所定量のカルボン酸無水物(硬化剤)が存在しないことに起因するエポキシ樹脂組成物の硬化不良が起こるという問題があるばかりか、硬化条件によってその特性が大幅に変わってしまい、安定して目的とした性能を有する硬化物を得ることが困難である。 In general, the epoxy resin curing agent used in such a field includes acid anhydride compounds. In particular, acid anhydrides formed with saturated hydrocarbons are often used because cured products have excellent light resistance (see, for example, Patent Documents 1 and 2). As these acid anhydrides, alicyclic acid anhydrides such as methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, and tetrahydrophthalic anhydride are generally used. Hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, etc. are mainly used.
However, when the above alicyclic acid anhydride is used as a curing agent, these curing agents have a high vapor pressure and tend to partially evaporate during curing. For this reason, when these alicyclic acid anhydrides are used as a curing agent for epoxy resins and thermally cured in an open system, the alicyclic acid anhydrides volatilize in the atmosphere, causing harmful substances to the atmosphere. There are concerns about environmental pollution and harmful effects on humans. In addition, there is a problem that the epoxy resin composition is poorly cured due to contamination of the production line and the absence of a predetermined amount of carboxylic acid anhydride (curing agent) in the cured product. The characteristics vary greatly depending on the curing conditions, and it is difficult to stably obtain a cured product having the intended performance.
さらに、オルガノシロキサンタイプのエポキシ樹脂との硬化においては得られる硬化物がもろくなりやすく、強靭性に課題があった。 For such a problem, a method using polyvalent carboxylic acid as a curing agent can be considered. However, ordinary polyvalent carboxylic acids are often solidified, particularly crystallized due to their hydrogen bonds, and are very difficult to use as a liquid composition. In order to solve such problems, the inventors of the present invention have studied using a silicone-based polyvalent carboxylic acid as a curing agent. Although the above problem was solved, desired properties were not obtained in terms of adhesion and corrosion gas permeability, and it was difficult to use as a cured product such as a sealing material.
Furthermore, in the curing with an organosiloxane type epoxy resin, the resulting cured product tends to be brittle, and there is a problem in toughness.
すなわち本発明は、
(1)下記式(1) As a result of intensive studies in view of the actual situation as described above, the present inventors have completed the present invention.
That is, the present invention
(1) The following formula (1)
で表されるシリコーンオイル(a)と分子内に1個以上のカルボン酸無水物基をもつ化合物(b)とを付加反応させることにより得られるカルボン酸化合物(J)と、
2官能以上のアルコール性水酸基を有する飽和脂肪族多価アルコール(c)と分子内に1個以上のカルボン酸無水物基をもつ化合物(d)とを付加反応させることにより得られる多価カルボン酸化合物(K)と、
を含有することを特徴とする多価カルボン酸組成物、
(2)
前記化合物(b)および(d)が環状の飽和炭化水素を母骨格とする酸無水物であることを特徴とする前項(1)記載の多価カルボン酸組成物、
(3)
前記化合物(b)および(d)がメチルヘキサヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、シクロヘキサン-1,2,4-トリカルボン酸-1,2-無水物およびビシクロ[2,2,1]ヘプタン-2,3-ジカルボン酸無水物からなる群より選ばれる少なくとも1種の酸無水物であることを特徴とする前項(1)または(2)記載の多価カルボン酸組成物、
(4)
前記化合物(b)および(d)がメチルヘキサヒドロ無水フタル酸を必須とすることを特徴とする前項(3)記載の多価カルボン酸組成物、
(5)
前記化合物(c)が官能基数2~6の多価アルコールであって1分子中の総炭素数が5~20であることを特徴とする前項(1)~(4)のいずれか一項に記載の多価カルボン酸組成物、
(6)
前項(1)~(5)のいずれか一項に記載の多価カルボン酸組成物の製造方法であって、
シリコーンオイル(a)と2官能以上のアルコール性水酸基を有する飽和脂肪族多価アルコール(c)を含む混合物に、分子内に1個以上のカルボン酸無水物基をもつ化合物(b)および(d)を加え、前記シリコーンオイル(a)と前記化合物(b)の付加反応と、前記化合物(c)と前記化合物(d)の付加反応を同時に行なうことを特徴とする多価カルボン酸組成物の製造方法、
(7)
前項(1)~(5)のいずれか一項に記載の多価カルボン酸組成物の製造方法であって、
以下の工程(A)、工程(B)を逐次的に1ポットで反応させることを特徴とする多価カルボン酸組成物の製造方法、
工程(A):シリコーンオイル(a)と分子内に1個以上のカルボン酸無水物基をもつ化合物(b)を付加反応させる工程
工程(B):2官能以上のアルコール性水酸基を有する飽和脂肪族多価アルコール(c)と分子内に1個以上のカルボン酸無水物基をもつ化合物(d)を付加反応させる工程
(8)
前記付加反応を、無溶剤、もしくは使用する原料における反応基質の総量に対して50重量%以下の有機溶剤中、40~150℃で行なうことを特徴とする前項(6)または(7)記載の多価カルボン酸組成物の製造方法、
(9)
前項(1)~(5)のいずれか一項に記載の多価カルボン酸組成物とエポキシ樹脂とを含有する硬化性樹脂組成物、
(10)
前記エポキシ樹脂が脂環式エポキシ樹脂および/またはエポキシ基含有シリコーン樹脂であることを特徴とする前項(9)記載の硬化性樹脂組成物、
(11)
前記エポキシ樹脂がエポキシ基含有シリコーン樹脂であることを特徴とする前項(9)記載の硬化性樹脂組成物、
(12)
前項(9)~(11)のいずれか一項に記載の硬化性樹脂組成物を硬化してなる硬化物、
に関する。 (In Formula (1), R 1 represents an alkylene group having 1 to 10 carbon atoms that may be bonded via an ether bond, R 2 represents a methyl group or a phenyl group, n represents a repeating unit, and Formula (1) The weight average molecular weight of the compound represented by) is 500 to 5,000.)
A carboxylic acid compound (J) obtained by subjecting a silicone oil (a) represented by the formula (b) to a compound (b) having one or more carboxylic anhydride groups in the molecule;
Polyvalent carboxylic acid obtained by addition reaction of saturated aliphatic polyhydric alcohol (c) having a bifunctional or higher alcoholic hydroxyl group and compound (d) having one or more carboxylic anhydride groups in the molecule Compound (K),
Containing a polyvalent carboxylic acid composition,
(2)
The polyvalent carboxylic acid composition according to item (1), wherein the compounds (b) and (d) are acid anhydrides having a cyclic saturated hydrocarbon as a mother skeleton,
(3)
The compounds (b) and (d) are methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride and bicyclo [2,2,1] heptane- The polyvalent carboxylic acid composition as described in (1) or (2) above, which is at least one acid anhydride selected from the group consisting of 2,3-dicarboxylic acid anhydrides,
(4)
The polyvalent carboxylic acid composition according to item (3), wherein the compounds (b) and (d) essentially comprise methylhexahydrophthalic anhydride,
(5)
Any one of (1) to (4) above, wherein the compound (c) is a polyhydric alcohol having 2 to 6 functional groups, and the total number of carbon atoms in one molecule is 5 to 20. The polyvalent carboxylic acid composition as described,
(6)
A method for producing the polyvalent carboxylic acid composition according to any one of (1) to (5) above,
Compounds (b) and (d) having one or more carboxylic anhydride groups in the molecule are added to a mixture containing silicone oil (a) and a saturated aliphatic polyhydric alcohol (c) having a bifunctional or higher functional alcoholic hydroxyl group. And the addition reaction between the silicone oil (a) and the compound (b) and the addition reaction between the compound (c) and the compound (d) are performed simultaneously. Production method,
(7)
A method for producing the polyvalent carboxylic acid composition according to any one of (1) to (5) above,
A method for producing a polyvalent carboxylic acid composition, wherein the following step (A) and step (B) are sequentially reacted in one pot,
Step (A): Step of addition reaction of silicone oil (a) and compound (b) having one or more carboxylic anhydride groups in the molecule Step (B): Saturated fat having a bifunctional or higher functional alcoholic hydroxyl group Step (8) of reacting an aromatic polyhydric alcohol (c) with a compound (d) having one or more carboxylic anhydride groups in the molecule
(6) or (7) above, wherein the addition reaction is carried out at 40 to 150 ° C. in an organic solvent of 50% by weight or less based on the total amount of reaction substrate in the raw material to be used without solvent. Method for producing polyvalent carboxylic acid composition,
(9)
A curable resin composition comprising the polyvalent carboxylic acid composition according to any one of (1) to (5) above and an epoxy resin;
(10)
The curable resin composition as described in (9) above, wherein the epoxy resin is an alicyclic epoxy resin and / or an epoxy group-containing silicone resin,
(11)
The curable resin composition as described in (9) above, wherein the epoxy resin is an epoxy group-containing silicone resin,
(12)
A cured product obtained by curing the curable resin composition according to any one of (9) to (11),
About.
で表されるシリコーンオイル(a)と分子内に1個以上のカルボン酸無水物基をもつ化合物(b)とを付加反応させることにより得られるカルボン酸化合物(J)と、
2官能以上のアルコール性水酸基を有する飽和脂肪族多価アルコール(c)と分子内に1個以上のカルボン酸無水物基をもつ化合物(d)とを付加反応させることにより得られる多価カルボン酸化合物(K)と、を含有することを特徴とする。
本発明の多価カルボン酸組成物を製造する際の多価カルボン酸(J)と多価カルボン酸(K)は下記に従い、それぞれ単独で調整して混合しても、各原料を逐次反応させてもよい。 (In Formula (1), R 1 represents an alkylene group having 1 to 10 carbon atoms that may be bonded via an ether bond, R 2 represents a methyl group or a phenyl group, n represents a repeating unit, and Formula (1) The weight average molecular weight of the compound represented by) is 500 to 5,000.)
A carboxylic acid compound (J) obtained by subjecting a silicone oil (a) represented by the formula (b) to a compound (b) having one or more carboxylic anhydride groups in the molecule;
Polyvalent carboxylic acid obtained by addition reaction of saturated aliphatic polyhydric alcohol (c) having a bifunctional or higher alcoholic hydroxyl group and compound (d) having one or more carboxylic anhydride groups in the molecule And a compound (K).
The polyvalent carboxylic acid (J) and the polyvalent carboxylic acid (K) used in the production of the polyvalent carboxylic acid composition of the present invention are prepared in accordance with the following, and each raw material is allowed to react sequentially even if they are individually adjusted and mixed. May be.
前記式(1)において、R1の具体例としては、メチレン、エチレン、プロピレン、ブチレン、ペンチレン、へキシレン、ヘプチレン、オクチレン等のエーテル結合を有しない総炭素数1~10のアルキレン基;-C3H6-O-C2H4-、-C2H4-O-C2H4-、-C3H6-O-C3H6-等のエーテル結合を有する総炭素数1~10のアルキレン基が挙げられる。これらのうち市場での入手のし易さからプロピレン基または-C3H6-O-C2H4-が好ましい。
R1の鎖が総炭素数10を越える場合、例えば市販品であればポリエチレンオキサイド付加体等が存在するが、耐熱・耐光性の面で好ましくない。
シリコーンオイル(a)の好ましい分子量範囲としては、重量平均分子量で500~5000、より好ましくは600~4000、特に好ましくは600~2500である。また最も好ましい範囲としては600~1500である。分子量が500より小さい場合、得られた生成物の分子間力が高くなり粘度が上昇しやすくなる、また5000より大きい場合、他の成分との相溶性が悪く、系が濁ってしまう場合が多いことから好ましくない。
このようなカルビノール変性シリコーン化合物としては、例えば日本国特開2007-508424号公報等に記載の手法を用いて合成できる。市場から入手可能な化合物としてはDow Corning5562(東レ・ダウコーニング製)、X22-160-AS、KF-6001、KF-6002、KF-6003(いずれも信越化学工業製)、XF42-B0970(モメンティブ製)、サイラプレーンFM-4411、FM-4421、FM-4425(チッソ製)などが挙げられる。 The silicone oil (a) is represented by the formula (1).
In the formula (1), specific examples of R 1 include alkylene groups having 1 to 10 carbon atoms and no ether bond, such as methylene, ethylene, propylene, butylene, pentylene, hexylene, heptylene, and octylene; 3 H 6 —O—C 2 H 4 —, —C 2 H 4 —O—C 2 H 4 —, —C 3 H 6 —O—C 3 H 6 — etc. 10 alkylene groups are mentioned. Of these, a propylene group or —C 3 H 6 —O—C 2 H 4 — is preferable because of easy availability in the market.
In the case where the chain of R 1 exceeds 10 carbon atoms, for example, a commercially available product includes a polyethylene oxide adduct, but this is not preferable in terms of heat resistance and light resistance.
The preferred molecular weight range of the silicone oil (a) is 500 to 5000, more preferably 600 to 4000, and particularly preferably 600 to 2500 in terms of weight average molecular weight. The most preferable range is 600 to 1500. When the molecular weight is less than 500, the intermolecular force of the obtained product is increased and the viscosity is likely to increase. When the molecular weight is greater than 5000, the compatibility with other components is poor and the system often becomes cloudy. That is not preferable.
Such a carbinol-modified silicone compound can be synthesized, for example, using a technique described in Japanese Patent Application Laid-Open No. 2007-508424. The commercially available compounds include Dow Corning 5562 (manufactured by Dow Corning Toray), X22-160-AS, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical), XF42-B0970 (manufactured by Momentive ), Silaplane FM-4411, FM-4421, FM-4425 (manufactured by Chisso) and the like.
分岐構造を有する鎖状アルキレンジオールとしては具体的にはネオペンチルグリコール、2-エチル-2-ブチルプロピレン-1,3-ジオール、2,4-ジエチルペンタン-1,5-ジオールなどが挙げられる。
環状構造を有するジオールとしては、トリシクロデカンジオール、ペンタシクロペンタデカンジオール、1,4-シクロヘキサンジオール、ノルボルナンジオール、ジオキサングリコール、スピログリコール等が挙げられる。
トリオールとしてはグリセリン、トリメチロールプロパン等が、テトラオールとしてはペンタエリスリトール、ジトリメチロールプロパン等が、さらにヘキサオールとしてはジペンタエリスリトール等が挙げられる。
光学特性、耐熱着色性、耐光着色性に優れる点から、2,4-ジエチルペンタン-1,5-ジオール、トリシクロデカンジオール、ペンタエリスリトールの使用が好ましい。
本発明においてはこれらの具体例に限定されず、さらに1種又は2種以上を混合して用いても良い。 Examples of the saturated aliphatic polyhydric alcohol (c) having a bifunctional or higher alcoholic hydroxyl group include conventionally known alcohols, and from the viewpoint of a balance between heat resistance, light resistance and toughness, particularly preferred is a functional group. It is preferably a polyhydric alcohol having 2 to 6 groups, and the total number of carbon atoms in one molecule is 5 to 20. More preferred are chain alkylene diols having a branched structure, diols having a cyclic structure, triols, tetraols, hexaols and the like.
Specific examples of the chain alkylene diol having a branched structure include neopentyl glycol, 2-ethyl-2-butylpropylene-1,3-diol, 2,4-diethylpentane-1,5-diol and the like.
Examples of the diol having a cyclic structure include tricyclodecane diol, pentacyclopentadecane diol, 1,4-cyclohexane diol, norbornane diol, dioxane glycol, spiro glycol and the like.
Examples of the triol include glycerin and trimethylolpropane, examples of the tetraol include pentaerythritol and ditrimethylolpropane, and examples of the hexaol include dipentaerythritol.
From the viewpoint of excellent optical properties, heat-resistant coloring properties, and light-resistant coloring properties, it is preferable to use 2,4-diethylpentane-1,5-diol, tricyclodecanediol, or pentaerythritol.
In this invention, it is not limited to these specific examples, Furthermore, you may use 1 type or in mixture of 2 or more types.
これらのうち、光学特性の観点から、特に飽和炭化水素構造を有する化合物が好ましい。さらに、耐熱性と強靭性のバランスの観点から、環状の飽和炭化水素構造を母骨格として有するものが特に好ましく、具体的にはメチルヘキサヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、シクロヘキサン-1,2,4-トリカルボン酸-1,2-無水物、ビシクロ[2,2,1]ヘプタン-2,3-ジカルボン酸無水物、シクロブタンテトラカルボン酸二水和物、ブタンテトラカルボン酸二無水物等が挙げられるがこれらに限定されず、1種又は2種以上を混合して用いても良い。
本発明においては、取り扱いのしやすさの観点から、特にカルボン酸無水物基を1個有する物が特に好ましく、中でもメチルヘキサヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、シクロヘキサン-1,2,4-トリカルボン酸-1,2-無水物、ビシクロ[2,2,1]ヘプタン-2,3-ジカルボン酸無水物が好ましい。特に、光学的な特性から、メチルヘキサヒドロ無水フタル酸またはシクロヘキサン-1,2,4-トリカルボン酸-1,2-無水物が特に好ましい。 Compounds (b) and (d) having one or more carboxylic acid anhydride groups in the molecule (compounds (b) and (d) may be the same or different) may be used as molecules Those having one or two carboxylic anhydride groups therein are preferred. Specifically, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, hexahydrophthalic anhydride, methyl hexahydro Phthalic anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1] heptane-2,3-dicarboxylic anhydride, methylbicyclo [2,2,1] heptane-2,3-dicarboxylic anhydride, Examples include cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride, cyclobutanetetracarboxylic acid dihydrate, butanetetracarboxylic dianhydride, and the like.
Among these, from the viewpoint of optical properties, a compound having a saturated hydrocarbon structure is particularly preferable. Further, from the viewpoint of a balance between heat resistance and toughness, those having a cyclic saturated hydrocarbon structure as a mother skeleton are particularly preferable. Specifically, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, cyclohexane-1,2 , 4-tricarboxylic acid-1,2-anhydride, bicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, cyclobutanetetracarboxylic acid dihydrate, butanetetracarboxylic acid dianhydride, etc. Although not limited to these, you may use 1 type or in mixture of 2 or more types.
In the present invention, from the viewpoint of ease of handling, those having one carboxylic anhydride group are particularly preferred, and among them, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, cyclohexane-1,2,4- Tricarboxylic acid-1,2-anhydride and bicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride are preferred. In particular, methylhexahydrophthalic anhydride or cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride is particularly preferable from the viewpoint of optical properties.
触媒を用いる場合、例えば塩酸、硫酸、メタンスルホン酸、トリフルオロメタンスルホン酸、パラトルエンスルホン酸、硝酸、トリフルオロ酢酸、トリクロロ酢酸等の酸性化合物、水酸化ナトリウム、水酸化カリウム、水酸化カルシウム、水酸化マグネシウム等の金属水酸化物、トリエチルアミン、トリプロピルアミン、トリブチルアミン等のアミン化合物、ピリジン、ジメチルアミノピリジン、1,8-ジアザビシクロ[5.4.0]ウンデカ-7-エン、イミダゾール、トリアゾール、テトラゾール等の複素環式化合物、テトラメチルアンモニウムヒドロキシド、テトラエチルアンモニウムヒドロキシド、テトラプロピルアンモニウムヒドロキシド、テトラブチルアンモニウムヒドロキシド、トリメチルエチルアンモニウムヒドロキシド、トリメチルプロピルアンモニウムヒドロキシド、トリメチルブチルアンモニウムヒドロキシド、トリメチルセチルアンモニウムヒドロキシド、トリオクチルメチルアンモニウムヒドロキシド、テトラメチルアンモニウムクロリド、テトラメチルアンモニウムブロミド、テトラメチルアンモニウムヨージド、テトラメチルアンモニウムアセテート、トリオクチルメチルアンモニウムアセテート等の4級アンモニウム塩等が挙げられる。これらの触媒は1種又は2種以上を混合して用いても良い。これらの中で、トリエチルアミン、ピリジン、ジメチルアミノピリジンが好ましい。
触媒の使用量には、特に制限はないが、原料の総重量100重量部に対して、通常0.001~5重量部である。 Such as addition reaction between silicone oil (a) and compound (b) having a carboxylic acid anhydride group, or addition reaction between polyhydric alcohol (c) and compound (d) having a carboxylic acid anhydride group, The reaction for adding an alcohol and an acid anhydride is generally an addition reaction using an acid or a base as a catalyst. However, in the present invention, from the viewpoint of simplicity of post-treatment and removal of adverse effects due to residual catalyst on the product. In particular, a catalyst-free reaction is preferred. Further, since removal is a problem, it is preferable to use one or more selected from among accelerators and additives used in the curable resin composition described below, since subsequent purification is not necessary.
When using a catalyst, for example, hydrochloric acid, sulfuric acid, methanesulfonic acid, trifluoromethanesulfonic acid, paratoluenesulfonic acid, nitric acid, trifluoroacetic acid, trichloroacetic acid and other acidic compounds, sodium hydroxide, potassium hydroxide, calcium hydroxide, water Metal hydroxides such as magnesium oxide, amine compounds such as triethylamine, tripropylamine, tributylamine, pyridine, dimethylaminopyridine, 1,8-diazabicyclo [5.4.0] undec-7-ene, imidazole, triazole, Heterocyclic compounds such as tetrazole, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, trimethylethylammonium hydroxide Trimethylpropylammonium hydroxide, trimethylbutylammonium hydroxide, trimethylcetylammonium hydroxide, trioctylmethylammonium hydroxide, tetramethylammonium chloride, tetramethylammonium bromide, tetramethylammonium iodide, tetramethylammonium acetate, trioctylmethylammonium Examples include quaternary ammonium salts such as acetate. These catalysts may be used alone or in combination of two or more. Of these, triethylamine, pyridine, and dimethylaminopyridine are preferred.
The amount of the catalyst used is not particularly limited, but is usually 0.001 to 5 parts by weight with respect to 100 parts by weight of the total weight of the raw materials.
また室温での結晶性の高い化合物、例えばシクロヘキサン-1,2,4-トリカルボン酸-1,2-無水物等を用いる場合はその結晶を十分に溶解させるため100~150℃での反応を行うことが好ましい。
また、揮発しやすい酸無水物と、結晶性の高い酸無水物を併用する場合は、段階的に温度を上昇させることで酸無水物の揮発を防ぐということも可能である。 The reaction temperature is preferably 40 to 200 ° C, particularly preferably 40 to 150 ° C. In particular, when this reaction is carried out in the absence of a solvent, the reaction at 100 ° C. or lower is preferred, and a reaction at 40 to 100 ° C., particularly 40 to 80 ° C. is preferred because of the volatilization of acid anhydride.
When a compound having high crystallinity at room temperature, such as cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride, is used, the reaction is performed at 100 to 150 ° C. in order to sufficiently dissolve the crystal. It is preferable.
Moreover, when using the acid anhydride which is easy to volatilize, and the acid anhydride with high crystallinity, it is also possible to prevent volatilization of an acid anhydride by raising temperature in steps.
具体的な反応比率としてはその官能基当量で比較し、(b)(もしくは(d))を1とした場合、そのモル比で(a)(もしくは(c))が0.001~1.0、より好ましくは0.01~1.0、さらに好ましくは0.1~1.0である。前述のように本発明の多価カルボン酸組成物と他の酸無水物の混合物を製造する場合、前記割合が0.01~0.7、好ましくは0.01~0.4の範囲が好ましい。 The reaction ratio of the compounds (a) and (b), (c) and (d) in the reaction for obtaining the polyvalent carboxylic acid (J) and the polyvalent carboxylic acid (K) is theoretically equivalent. Is preferable, but can be changed as necessary. That is, as will be described later, in the curing agent composition of the present invention, when the acid anhydride used in combination with the acid anhydride used here is the same as necessary, the reaction is carried out in an excess of acid anhydride at the time of production. When the reaction for obtaining the polyvalent carboxylic acid (J) and the polyvalent carboxylic acid (K) is completed, a mixture of the acid anhydride and the polyvalent carboxylic acid composition of the present invention can be used.
As a specific reaction ratio, the functional group equivalent is compared. When (b) (or (d)) is 1, the molar ratio (a) (or (c)) is 0.001 to 1. 0, more preferably 0.01 to 1.0, still more preferably 0.1 to 1.0. As mentioned above, when producing the mixture of the polyvalent carboxylic acid composition of the present invention and other acid anhydrides, the ratio is preferably in the range of 0.01 to 0.7, preferably 0.01 to 0.4. .
また無触媒での反応においては必要に応じて溶剤を留去、さらに無溶剤、無触媒の場合はそのまま取り出すことで多価カルボン酸(J)または多価カルボン酸(K)を得ることができる。 When the catalyst is used after completion of the reaction, the desired polycarboxylic acid (J) or (K) is obtained by removing the catalyst by neutralization, washing with water, adsorption, etc., and distilling off the solvent. .
In the reaction without a catalyst, if necessary, the solvent is distilled off, and in the case of no solvent and without a catalyst, the polycarboxylic acid (J) or the polyvalent carboxylic acid (K) can be obtained by taking it out as it is. .
ここで、特に(J)/(K)の比率は99/1~80/20が好ましく、99/1~85/15がより好ましい。(K)を重量比で1以上混合させることで、耐腐食ガス透過性の性能が特に改善され、さらに(J)を重量比で80以上混合させることで、耐光性に優れ、基材からの剥離やクラックが生じ難く、LEDの封止材として用いた場合における照度劣化も起こり難い性能を実現できるためである。特に(J)を重量比で85以上混合させることで、上記特性をバランス良く両立させることができる。 The target polyvalent carboxylic acid composition can be obtained by mixing the polyvalent carboxylic acid (J) and the polyvalent carboxylic acid (K) thus obtained. The ratio by weight is (J) / (K) = 99.7 / 0.3 to 50/50, more preferably 99.7 / 0.3 to 40/40. If the amount of the polyvalent carboxylic acid (J) is too large, there will be a problem in the corrosion gas permeability and reflow resistance of the cured product. If the amount of the polyvalent carboxylic acid (K) is too large, it will be solidified and difficult to handle. Become.
Here, the ratio of (J) / (K) is particularly preferably 99/1 to 80/20, and more preferably 99/1 to 85/15. By mixing one or more (K) by weight ratio, the performance of corrosion-resistant gas permeability is particularly improved, and by mixing (J) by 80 or more by weight ratio, the light resistance is excellent, and This is because peeling and cracking are unlikely to occur, and it is possible to realize performance that hardly causes deterioration of illuminance when used as an LED sealing material. In particular, by mixing (J) in a weight ratio of 85 or more, the above characteristics can be balanced.
(i)
シリコーンオイル(a)と多価アルコール(c)の混合物に、分子内に1個以上のカルボン酸無水物基をもつ化合物(b)および(d)を仕込み、同時に反応させる。
(ii)
以下の工程(A)、工程(B)を逐次的に1ポットで反応させる。
工程(A):シリコーンオイル(a)と分子内に1個以上のカルボン酸無水物基をもつ化合物(b)を反応させる工程
工程(B):2官能以上のアルコール性水酸基を有する飽和脂肪族多価アルコール(c)と分子内に1個以上のカルボン酸無水物基をもつ化合物(d)を反応させる工程
即ち、上記(ii)の手法は、工程(A)(あるいは工程(B))を行った後に、逐次的に工程(B)(あるいは工程(A))に使用する化合物を投入し、系中で反応および混合を行うものである。
(iii)
分子内に1個以上のカルボン酸無水物基をもつ化合物(b)、(d)が同一である場合、シリコーンオイル(a)(あるいは多価アルコール(c))と、分子内に1個以上のカルボン酸無水物基をもつ化合物(b)(=(d))を仕込み、反応を行った後、多価アルコール(c)(あるいはシリコーンオイル(a))を仕込み、反応を行う。 In the present invention, the polyvalent carboxylic acid (J) and the polyvalent carboxylic acid (K) can also be produced simultaneously. Specific methods include (i)
Compounds (b) and (d) having one or more carboxylic acid anhydride groups in the molecule are charged into a mixture of silicone oil (a) and polyhydric alcohol (c) and reacted simultaneously.
(Ii)
The following steps (A) and (B) are sequentially reacted in one pot.
Step (A): Step of reacting silicone oil (a) with compound (b) having one or more carboxylic acid anhydride groups in the molecule Step (B): Saturated aliphatic having bifunctional or higher alcoholic hydroxyl group The step of reacting the polyhydric alcohol (c) with the compound (d) having one or more carboxylic acid anhydride groups in the molecule. That is, the method of (ii) is the step (A) (or step (B)). After performing, the compounds to be used in step (B) (or step (A)) are sequentially added, and reaction and mixing are performed in the system.
(Iii)
When compounds (b) and (d) having one or more carboxylic acid anhydride groups in the molecule are the same, silicone oil (a) (or polyhydric alcohol (c)) and one or more in the molecule The compound (b) (= (d)) having a carboxylic acid anhydride group is charged and reacted, and then the polyhydric alcohol (c) (or silicone oil (a)) is charged and reacted.
本発明の多価カルボン酸組成物は透明性に優れ、エポキシ樹脂等の硬化性樹脂の硬化剤、塗料、接着剤、成形品、半導体、光半導体の封止材用樹脂、光半導体のダイボンド材用樹脂、ポリアミド樹脂、ポリイミド樹脂などの原料や改質剤、可塑剤や潤滑油原料、医農薬中間体、塗料用樹脂の原料、トナー用樹脂として有用であり、とりわけエポキシ樹脂の硬化剤として有用である。
本発明の多価カルボン酸組成物をエポキシ樹脂の硬化剤として用いた場合、本発明の多価カルボン酸組成物は優れた硬化能を示し、またその硬化物の透明度が優れるので、特に高輝度の白色LED他の光半導体封止に用いられるエポキシ樹脂用硬化剤として極めて有用である。 The polycarboxylic acid composition of the present invention thus obtained is usually a colorless liquid to semi-solid substance.
The polyvalent carboxylic acid composition of the present invention has excellent transparency, a curing agent for a curable resin such as an epoxy resin, a paint, an adhesive, a molded product, a semiconductor, a resin for an optical semiconductor encapsulant, and an optical semiconductor die bond material Useful as raw materials and modifiers for resins, polyamide resins, polyimide resins, plasticizers and lubricating oil raw materials, intermediates for pharmaceuticals and agricultural chemicals, raw materials for paint resins, and resin for toners, especially useful as a curing agent for epoxy resins It is.
When the polyvalent carboxylic acid composition of the present invention is used as a curing agent for an epoxy resin, the polyvalent carboxylic acid composition of the present invention exhibits excellent curability and the transparency of the cured product is excellent. It is extremely useful as a curing agent for epoxy resins used for sealing of other white semiconductor LEDs and other optical semiconductors.
使用できる酸無水物としては、分子内に1個以上のカルボン酸無水物基をもつ化合物(e)が好ましく、特にその構造に芳香環を有しない酸無水物が好ましい。分子内に1個以上のカルボン酸無水物基をもつ化合物(e)として具体的には、ヘキサヒドロ無水フタル酸、メチルヘキサヒドロ無水フタル酸、ブタンテトラカルボン酸無水物、ビシクロ[2,2,1]ヘプタン-2,3-ジカルボン酸無水物、メチルビシクロ[2,2,1]ヘプタン-2,3-ジカルボン酸無水物、シクロヘキサン-1,2,4-トリカルボン酸-1,2-無水物などが挙げられる。
硬化剤組成物として酸無水物との混合で使用する場合、本発明の多価カルボン酸組成物の占める割合は、前記他の酸無水物と本発明の多価カルボン酸組成物の合計重量に対し、0.1~50重量%、好ましくは0.1~30重量%である。かかる範囲で併用することで、組成物の流動性、硬化物の耐熱性機械的強度の面で効果を奏する。
以下、本発明の多価カルボン酸組成物を含む本発明の硬化性樹脂組成物について記載する。
本発明の硬化性樹脂組成物はエポキシ樹脂を必須成分として含有する。 When the polyvalent carboxylic acid composition of the present invention is used as a curing agent for a curable resin such as an epoxy resin, particularly as a liquid composition, the polyvalent carboxylic acid composition of the present invention and another acid anhydride are mixed. It is preferably used in the form of a curing agent composition.
As the acid anhydride that can be used, a compound (e) having one or more carboxylic acid anhydride groups in the molecule is preferable, and an acid anhydride having no aromatic ring in its structure is particularly preferable. Specific examples of the compound (e) having one or more carboxylic anhydride groups in the molecule include hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1 ] Heptane-2,3-dicarboxylic acid anhydride, methylbicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride, etc. Is mentioned.
When used as a curing agent composition in a mixture with an acid anhydride, the proportion of the polyvalent carboxylic acid composition of the present invention is the total weight of the other acid anhydride and the polyvalent carboxylic acid composition of the present invention. On the other hand, it is 0.1 to 50% by weight, preferably 0.1 to 30% by weight. By using together in such a range, there is an effect in terms of fluidity of the composition and heat resistant mechanical strength of the cured product.
Hereinafter, the curable resin composition of the present invention including the polyvalent carboxylic acid composition of the present invention will be described.
The curable resin composition of the present invention contains an epoxy resin as an essential component.
これら脂環式エポキシ樹脂としては、シクロヘキセンカルボン酸とアルコール類とのエステル化反応あるいはシクロヘキセンメタノールとカルボン酸類とのエステル化反応(Tetrahedron vol.36 p.2409 (1980)、Tetrahedron Letter p.4475 (1980)等に記載の手法)、あるいはシクロヘキセンアルデヒドのティシェンコ反応(日本国特開2003-170059号公報、日本国特開2004-262871号公報等に記載の手法)、さらにはシクロヘキセンカルボン酸エステルのエステル交換反応(日本国特開2006-052187号公報等に記載の手法)によって製造できる化合物を酸化した物などが挙げられる。
アルコール類としては、アルコール性水酸基を有する化合物であれば特に限定されないがエチレングリコール、プロピレングリコール、1,3-プロパンジオール、1,2-ブタンジオール、1,4-ブタンジオール、1,5-ペンタンジオール、1,6-ヘキサンジオール、シクロヘキサンジメタノールなどのジオール類、グリセリン、トリメチロールエタン、トリメチロールプロパン、トリメチロールブタン、2-ヒドロキシメチル-1,4-ブタンジオールなどのトリオール類、ペンタエリスリトールなどのテトラオール類などが挙げられる。またカルボン酸類としてはシュウ酸、マレイン酸、フマル酸、フタル酸、イソフタル酸、アジピン酸、シクロヘキサンジカルボン酸などが挙げられるがこれに限らない。 When using especially the curable resin composition of this invention for an optical use, an alicyclic epoxy resin and / or an epoxy-group containing silicone resin are preferable, and the epoxy resin of a silsesquioxane structure is more preferable. Particularly in the case of an alicyclic epoxy resin, a compound having an epoxycyclohexane structure in the skeleton is preferable, and an epoxy resin obtained by an oxidation reaction of a compound having a cyclohexene structure is more preferable.
These alicyclic epoxy resins include esterification reaction of cyclohexene carboxylic acid with alcohols or esterification reaction of cyclohexene methanol with carboxylic acids (Tetrahedron vol.36 p.2409 (1980), Tetrahedron Letter p.4475 (1980) ), Or Tyschenco reaction of cyclohexene aldehyde (method described in Japanese Patent Application Laid-Open No. 2003-170059, Japanese Patent Application Laid-Open No. 2004-262871, etc.), and transesterification of cyclohexene carboxylic acid ester Examples thereof include an oxidized product of a compound that can be produced by a reaction (a method described in Japanese Patent Application Laid-Open No. 2006-052187).
The alcohol is not particularly limited as long as it is a compound having an alcoholic hydroxyl group, but ethylene glycol, propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,4-butanediol, 1,5-pentane. Diols, diols such as 1,6-hexanediol and cyclohexanedimethanol, triols such as glycerin, trimethylolethane, trimethylolpropane, trimethylolbutane, 2-hydroxymethyl-1,4-butanediol, pentaerythritol, etc. And tetraols. Examples of carboxylic acids include, but are not limited to, oxalic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, adipic acid, and cyclohexanedicarboxylic acid.
これらエポキシ樹脂の具体例としては、ERL-4221、UVR-6105、ERL-4299(全て商品名、いずれもダウ・ケミカル製)、セロキサイド2021P、エポリードGT401、EHPE3150、EHPE3150CE(全て商品名、いずれもダイセル化学工業製)及びジシクロペンタジエンジエポキシドなどが挙げられるがこれらに限定されるものではない(参考文献:総説エポキシ樹脂 基礎編I p76-85)。
これらは単独で用いてもよく、2種以上併用してもよい。 Furthermore, as an alicyclic epoxy resin other than the above, an acetal compound obtained by an acetal reaction between a cyclohexene aldehyde derivative and an alcohol is exemplified. As a reaction method, it can be produced by applying a general acetalization reaction. For example, a method of carrying out a reaction while azeotropically dehydrating using a solvent such as toluene or xylene as a reaction medium (US Pat. No. 2,945,008), concentrated hydrochloric acid A method in which polyhydric alcohol is dissolved in the mixture and then the reaction is carried out while gradually adding aldehydes (Japanese Patent Laid-Open No. 48-96590), a method using water as a reaction medium (US Pat. No. 3,092,640), reaction A method using an organic solvent as a medium (Japanese Patent Laid-open No. 7-215979), a method using a solid acid catalyst (Japanese Patent Laid-Open No. 2007-230992), and the like are disclosed. A cyclic acetal structure is preferable from the viewpoint of structural stability.
Specific examples of these epoxy resins include ERL-4221, UVR-6105, ERL-4299 (all trade names, all manufactured by Dow Chemical), Celoxide 2021P, Epolide GT401, EHPE3150, EHPE3150CE (all trade names, all Daicel) (Chemical Industry) and dicyclopentadiene diepoxide, and the like, but are not limited thereto (Reference: Review Epoxy Resin Basic Edition I p76-85).
These may be used alone or in combination of two or more.
併用できる他の硬化剤としては、例えばアミン系化合物、酸無水物系化合物、アミド系化合物、フェノール系化合物、カルボン酸系化合物などが挙げられる。使用できる硬化剤の具体例としては、ジアミノジフェニルメタン、ジエチレントリアミン、トリエチレンテトラミン、ジアミノジフェニルスルホン、イソホロンジアミン、ジシアンジアミド、リノレン酸の2量体とエチレンジアミンより合成されるポリアミド樹脂、無水フタル酸、無水トリメリット酸、無水ピロメリット酸、無水マレイン酸、テトラヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、無水メチルナジック酸、無水ナジック酸、ヘキサヒドロ無水フタル酸、メチルヘキサヒドロ無水フタル酸、ブタンテトラカルボン酸無水物、ビシクロ[2,2,1]ヘプタン-2,3-ジカルボン酸無水物、メチルビシクロ[2,2,1]ヘプタン-2,3-ジカルボン酸無水物、シクロヘキサン-1,3,4-トリカルボン酸-3,4-無水物、ビスフェノールA、ビスフェノールF、ビスフェノールS、フルオレンビスフェノール、テルペンジフェノール、4,4’-ビフェノール、2,2’-ビフェノール、3,3’,5,5’-テトラメチル-[1,1’-ビフェニル]-4,4’-ジオール、ハイドロキノン、レゾルシン、ナフタレンジオール、トリス-(4-ヒドロキシフェニル)メタン、1,1,2,2-テトラキス(4-ヒドロキシフェニル)エタン、フェノール類(フェノール、アルキル置換フェノール、ナフトール、アルキル置換ナフトール、ジヒドロキシベンゼン、ジヒドロキシナフタレン等)とホルムアルデヒド、アセトアルデヒド、ベンズアルデヒド、p-ヒドロキシベンズアルデヒド、o-ヒドロキシベンズアルデヒド、p-ヒドロキシアセトフェノン、o-ヒドロキシアセトフェノン、ジシクロペンタジエン、フルフラール、4,4’-ビス(クロロメチル)-1,1’-ビフェニル、4,4’-ビス(メトキシメチル)-1,1’-ビフェニル、1,4’-ビス(クロロメチル)ベンゼン、1,4’-ビス(メトキシメチル)ベンゼン等との重縮合物及びこれらの変性物、テトラブロモビスフェノールA等のハロゲン化ビスフェノール類、イミダゾール、トリフルオロボラン-アミン錯体、グアニジン誘導体、テルペンとフェノール類の縮合物などが挙げられるが、これらに限定されるものではない。これらは単独で用いてもよく、2種以上を用いてもよい。 In the curable resin composition of the present invention, the polyvalent carboxylic acid composition (or the curing agent composition) of the present invention may be used in combination with other curing agents. When used in combination, the proportion of the polyvalent carboxylic acid of the present invention in the total curing agent is preferably 20% by weight or more, and particularly preferably 30% by weight or more.
Examples of other curing agents that can be used in combination include amine compounds, acid anhydride compounds, amide compounds, phenol compounds, and carboxylic acid compounds. Specific examples of the curing agent that can be used include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, dicyandiamide, polyamide resin synthesized from linolenic acid and ethylenediamine, phthalic anhydride, trimellitic anhydride Acid, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, Bicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, methylbicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, cyclohexane-1,3,4-tricarboxylic acid 3, -Anhydride, bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, terpene diphenol, 4,4'-biphenol, 2,2'-biphenol, 3,3 ', 5,5'-tetramethyl- [1, 1′-biphenyl] -4,4′-diol, hydroquinone, resorcin, naphthalenediol, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenols ( Phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc.) and formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, o-hydroxybenzaldehyde, p-hydroxyacetophenone o-hydroxyacetophenone, dicyclopentadiene, furfural, 4,4′-bis (chloromethyl) -1,1′-biphenyl, 4,4′-bis (methoxymethyl) -1,1′-biphenyl, 1,4 Polycondensates with '-bis (chloromethyl) benzene, 1,4'-bis (methoxymethyl) benzene and their modified products, halogenated bisphenols such as tetrabromobisphenol A, imidazole, trifluoroborane-amine Examples include, but are not limited to, complexes, guanidine derivatives, and condensates of terpenes and phenols. These may be used alone or in combination of two or more.
亜鉛塩および/または亜鉛錯体としては、亜鉛イオンを中心元素とした塩および/または錯体であって、好ましくは、カウンターイオンおよび/または配位子として炭素数1~30のアルキル基を有するカルボン酸、燐酸エステル、燐酸から選ばれる少なくとも1種を有する。炭素数1~30のアルキル基としてはメチル基、イソプロピル基、ブチル基、2-エチルヘキシル基、オクチル基、イソデシル基、イソステアリル基、デカニル基、セチル基などが挙げられる。
本発明においては特にカルボン酸亜鉛体、燐酸エステル亜鉛体が好ましい。カルボン酸亜鉛体、燐酸エステル亜鉛体を使用することによって、耐腐食性ガス透過性を向上させることができる。 In the present invention, it is preferable to contain a zinc salt and / or a zinc complex. In the curable resin composition of the present invention, the zinc salt and / or the zinc complex contributes as a curing accelerator between the epoxy resin and the curing agent.
The zinc salt and / or zinc complex is a salt and / or complex having a zinc ion as a central element, preferably a carboxylic acid having an alkyl group having 1 to 30 carbon atoms as a counter ion and / or a ligand. , Phosphoric acid ester, and phosphoric acid. Examples of the alkyl group having 1 to 30 carbon atoms include methyl group, isopropyl group, butyl group, 2-ethylhexyl group, octyl group, isodecyl group, isostearyl group, decanyl group, cetyl group and the like.
In the present invention, a zinc carboxylate and a zinc phosphate ester are particularly preferable. By using a zinc carboxylate body or a zinc phosphate ester body, corrosion resistance and gas permeability can be improved.
具体的には2-エチルヘキシル酸亜鉛、イソステアリン酸亜鉛、ウンデシレン酸亜鉛などが挙げられる。 The particularly preferred zinc carboxylate in the present invention preferably has an alkyl group having a chain-branched structure or an alkyl group having a functional group such as an olefin in the compound, and among them, those having 3 to 30 carbon atoms are preferred. In particular, those having 5 to 20 carbon atoms are preferred. These are preferable in terms of compatibility, and when the number of carbon atoms is too large (when the number of carbon atoms exceeds 30), or when they do not have a structure such as a branched structure or a functional group, the compatibility with the resin is poor, which is not preferable.
Specific examples include zinc 2-ethylhexylate, zinc isostearate and zinc undecylenate.
このような燐酸エステル亜鉛の亜鉛塩および/または亜鉛錯体は、例えば燐酸エステルを例えば炭酸亜鉛、水酸化亜鉛などと反応させることで得られる(特許文献 EP699708号公報)。 As a preferable phosphoric acid ester body to be obtained in the present invention, a zinc salt and / or a zinc complex of phosphoric acid, phosphoric acid ester (monoalkyl ester body, dialkyl ester body, trialkyl ester body, or a mixture thereof) is preferable. You may contain an ester body. Specifically, the molar ratio of monoalkyl ester, dialkyl ester, and trialkyl ester in the phosphoric acid ester contained (substitute with the purity of gas chromatography. However, since trimethylsilylation is required, there is a difference in sensitivity. In this case, it is preferable that the amount of the monoalkyl ester compound is 50 area% or more at the stage of the trimethylsilylation treatment.
Such zinc salt and / or zinc complex of zinc phosphate ester can be obtained, for example, by reacting a phosphate ester with, for example, zinc carbonate, zinc hydroxide, etc. (Patent Document EP 699708).
上記リン系化合物は、市販品を用いることもできる。
例えば、アデカ製として、アデカスタブPEP-4C、アデカスタブPEP-8、アデカスタブPEP-24G、アデカスタブPEP-36、アデカスタブHP-10、アデカスタブ2112、アデカスタブ260、アデカスタブ522A、アデカスタブ1178、アデカスタブ1500、アデカスタブC、アデカスタブ135A、アデカスタブ3010、アデカスタブTPPが挙げられる。
本発明において、リン系化合物の使用量は、エポキシ樹脂に対し、重量比で0.005~5重量%、より好ましくは0.01~4重量%、0.1~2重量%である。 Specific examples of phosphorus antioxidants include 1,1,3-tris (2-methyl-4-ditridecyl phosphite-5-tert-butylphenyl) butane, distearyl pentaerythritol diphosphite, bis (2 , 4-Di-tert-butylphenyl) pentaerythritol diphosphite, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite, dicyclohexylpenta Erythritol diphosphite, tris (diethylphenyl) phosphite, tris (di-isopropylphenyl) phosphite, tris (di-n-butylphenyl) phosphite, tris (2,4-di-tert-butylphenyl) phosphite , Tris 2,6-di-tert-butylphenyl) phosphite, tris (2,6-di-tert-butylphenyl) phosphite, 2,2′-methylenebis (4,6-di-tert-butylphenyl) (2 , 4-Di-tert-butylphenyl) phosphite, 2,2′-methylenebis (4,6-di-tert-butylphenyl) (2-tert-butyl-4-methylphenyl) phosphite, 2,2 ′ -Methylenebis (4-methyl-6-tert-butylphenyl) (2-tert-butyl-4-methylphenyl) phosphite, 2,2'-ethylidenebis (4-methyl-6-tert-butylphenyl) (2 -Tert-butyl-4-methylphenyl) phosphite, tetrakis (2,4-di-tert-butylphenyl) -4,4'-biphenylene Diphosphonite, tetrakis (2,4-di-tert-butylphenyl) -4,3′-biphenylenediphosphonite, tetrakis (2,4-di-tert-butylphenyl) -3,3′-biphenylenediphosphonite, Tetrakis (2,6-di-tert-butylphenyl) -4,4′-biphenylenediphosphonite, tetrakis (2,6-di-tert-butylphenyl) -4,3′-biphenylenediphosphonite, tetrakis ( 2,6-di-tert-butylphenyl) -3,3′-biphenylenediphosphonite, bis (2,4-di-tert-butylphenyl) -4-phenyl-phenylphosphonite, bis (2,4- Di-tert-butylphenyl) -3-phenyl-phenylphosphonite, bis (2,6-di-n-butylphenyl) -3 Phenyl-phenylphosphonite, bis (2,6-di-tert-butylphenyl) -4-phenyl-phenylphosphonite, bis (2,6-di-tert-butylphenyl) -3-phenyl-phenylphosphonite, Tetrakis (2,4-di-tert-butyl-5-methylphenyl) -4,4′-biphenylenediphosphonite, tributyl phosphate, trimethyl phosphate, tricresyl phosphate, triphenyl phosphate, trichlorophenyl phosphate, triethyl phosphate, Examples include diphenyl cresyl phosphate, diphenyl monoorthoxenyl phosphate, tributoxyethyl phosphate, dibutyl phosphate, dioctyl phosphate, diisopropyl phosphate and the like.
A commercial item can also be used for the said phosphorus compound.
For example, ADK STAB PEP-4C, ADK STAB PEP-8, ADK STAB PEP-24G, ADK STAB PEP-36, ADK STAB HP-10, ADK STAB 2112, ADK STAB 260, ADK STAB 522A, ADK STAB 1178, ADK STAB 1500, ADK STAB C, and ADK STAB C 135A, ADK STAB 3010, and ADK STAB TPP.
In the present invention, the amount of the phosphorus compound used is 0.005 to 5% by weight, more preferably 0.01 to 4% by weight, and 0.1 to 2% by weight with respect to the epoxy resin.
光安定剤としては、特にヒンダートアミン化合物を含有することが好ましく、必要に応じてリン系化合物を含有することが好ましい。前記アミン化合物としては、例えば、テトラキス(1,2,2,6,6-ペンタメチル-4-ピペリジル)=1,2,3,4-ブタンテトラカルボキシラート、テトラキス(2,2,6,6-トトラメチル-4-ピペリジル)=1,2,3,4-ブタンテトラカルボキシラート、1,2,3,4-ブタンテトラカルボン酸と1,2,2,6,6-ペンタメチル-4-ピペリジノールおよび3,9-ビス(2-ヒドロキシ-1,1-ジメチルエチル)-2,4,8,10-テトラオキサスピロ[5.5]ウンデカンとの混合エステル化物、デカン二酸ビス(2,2,6,6-テトラメチル-4-ピペリジル)セバケート、ビス(1-ウンデカンオキシ-2,2,6,6-テトラメチルピペリジン-4-イル)カーボネート、2,2,6,6,-テトラメチル-4-ピペリジルメタクリレート、ビス(2,2,6,6-テトラメチル-4-ピペリジル)セバケート、ビス(1,2,2,6,6-ペンタメチル-4-ピペリジル)セバケート、4-ベンゾイルオキシ-2,2,6,6-テトラメチルピペリジン、1-〔2-〔3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオニルオキシ〕エチル〕-4-〔3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオニルオキシ〕-2,2,6,6-テトラメチルピペリジン、1,2,2,6,6-ペンタメチル-4-ピペリジニル-メタアクリレート、ビス(1,2,2,6,6-ペンタメチル-4-ピペリジニル)〔〔3,5-ビス(1,1-ジメチルエチル)-4-ヒドロキシフェニル〕メチル〕ブチルマロネート、デカン二酸ビス(2,2,6,6-テトラメチル-1(オクチルオキシ)-4-ピペリジニル)エステル,1,1-ジメチルエチルヒドロペルオキシドとオクタンの反応生成物、N,N′,N″,N″′-テトラキス-(4,6-ビス-(ブチル-(N-メチル-2,2,6,6-テトラメチルピペリジン-4-イル)アミノ)-トリアジン-2-イル)-4,7-ジアザデカン-1,10-ジアミン、ジブチルアミン・1,3,5-トリアジン・N,N′-ビス(2,2,6,6-テトラメチル-4-ピペリジル-1,6-ヘキサメチレンジアミンとN-(2,2,6,6-テトラメチル-4-ピペリジル)ブチルアミンの重縮合物、ポリ〔〔6-(1,1,3,3-テトラメチルブチル)アミノ-1,3,5-トリアジン-2,4-ジイル〕〔(2,2,6,6-テトラメチル-4-ピペリジル)イミノ〕ヘキサメチレン〔(2,2,6,6-テトラメチル-4-ピペリジル)イミノ〕〕、コハク酸ジメチルと4-ヒドロキシ-2,2,6,6-テトラメチル-1-ピペリジンエタノールの重合物、2,2,4,4-テトラメチル-20-(β-ラウリルオキシカルボニル)エチル-7-オキサ-3,20-ジアザジスピロ〔5・1・11・2〕ヘネイコサン-21-オン、β-アラニン,N,-(2,2,6,6-テトラメチル-4-ピペリジニル)-ドデシルエステル/テトラデシルエステル、N-アセチル-3-ドデシル-1-(2,2,6,6-テトラメチル-4-ピペリジニル)ピロリジン-2,5-ジオン、2,2,4,4-テトラメチル-7-オキサ-3,20-ジアザジスピロ〔5,1,11,2〕ヘネイコサン-21-オン、2,2,4,4-テトラメチル-21-オキサ-3,20-ジアザジシクロ-〔5,1,11,2〕-ヘネイコサン-20-プロパン酸ドデシルエステル/テトラデシルエステル、プロパンジオイックアシッド,〔(4-メトキシフェニル)-メチレン〕-ビス(1,2,2,6,6-ペンタメチル-4-ピペリジニル)エステル、2,2,6,6-テトラメチル-4-ピペリジノールの高級脂肪酸エステル、1,3-ベンゼンジカルボキシアミド,N,N′-ビス(2,2,6,6-テトラメチル-4-ピペリジニル)等のヒンダートアミン系化合物等が挙げられる。
前記光安定材であるアミン化合物として、次に示す市販品を使用することができる。
例えば、チバスペシャリティケミカルズ製として、TINUVIN765、TINUVIN770DF、TINUVIN144、TINUVIN123、TINUVIN622LD、TINUVIN152、CHIMASSORB944、アデカ製として、LA-52、LA-57、LA-62、LA-63P、LA-77Y、LA-81、LA-82、LA-87などが挙げられる。
本発明において、光安定剤の使用量は、エポキシ樹脂に対し、重量比で0.005~5重量%、より好ましくは0.01~4重量%、0.1~2重量%である。
0.005重量%よりも少ない場合、効果が足りず、5重量%を超えるような過剰の場合、耐熱着色性への影響が現れてしまうことから好ましくない。 Furthermore, you may add a light stabilizer to the curable resin composition of this invention as needed.
As a light stabilizer, it is preferable to contain a hindered amine compound especially, and it is preferable to contain a phosphorus compound as needed. Examples of the amine compound include tetrakis (1,2,2,6,6-pentamethyl-4-piperidyl) = 1,2,3,4-butanetetracarboxylate, tetrakis (2,2,6,6- Totramethyl-4-piperidyl) = 1,2,3,4-butanetetracarboxylate, 1,2,3,4-butanetetracarboxylic acid and 1,2,2,6,6-pentamethyl-4-piperidinol and 3 , 9-bis (2-hydroxy-1,1-dimethylethyl) -2,4,8,10-tetraoxaspiro [5.5] undecane mixed ester, decanedioic acid bis (2,2,6 , 6-Tetramethyl-4-piperidyl) sebacate, bis (1-undecanoxy-2,2,6,6-tetramethylpiperidin-4-yl) carbonate, 2,2,6,6, -tetrame Ru-4-piperidyl methacrylate, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, 4-benzoyloxy -2,2,6,6-tetramethylpiperidine, 1- [2- [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] ethyl] -4- [3- (3 , 5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] -2,2,6,6-tetramethylpiperidine, 1,2,2,6,6-pentamethyl-4-piperidinyl-methacrylate, bis (1,2,2,6,6-pentamethyl-4-piperidinyl) [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] bu Lumalonate, bis (2,2,6,6-tetramethyl-1 (octyloxy) -4-piperidinyl) ester decanedioate, reaction product of 1,1-dimethylethyl hydroperoxide and octane, N, N ′, N ″, N ″ ′-tetrakis- (4,6-bis- (butyl- (N-methyl-2,2,6,6-tetramethylpiperidin-4-yl) amino) -triazin-2-yl)- 4,7-diazadecane-1,10-diamine, dibutylamine, 1,3,5-triazine, N, N'-bis (2,2,6,6-tetramethyl-4-piperidyl-1,6-hexa Polycondensate of methylenediamine and N- (2,2,6,6-tetramethyl-4-piperidyl) butylamine, poly [[6- (1,1,3,3-tetramethylbutyl) amino-1,3 , 5-Triazine -2,4-diyl] [(2,2,6,6-tetramethyl-4-piperidyl) imino] hexamethylene [(2,2,6,6-tetramethyl-4-piperidyl) imino]], Polymer of dimethyl acid and 4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol, 2,2,4,4-tetramethyl-20- (β-lauryloxycarbonyl) ethyl-7- Oxa-3,20-diazadispiro [5,1,11,2] heneicosan-21-one, β-alanine, N,-(2,2,6,6-tetramethyl-4-piperidinyl) -dodecyl ester / tetra Decyl ester, N-acetyl-3-dodecyl-1- (2,2,6,6-tetramethyl-4-piperidinyl) pyrrolidine-2,5-dione, 2,2,4,4-tetramethyl-7- Oki -3,20-diazadispiro [5,1,11,2] heneicosan-21-one, 2,2,4,4-tetramethyl-21-oxa-3,20-diazadicyclo- [5,1,11, 2] -Heneicosane-20-propanoic acid dodecyl ester / tetradecyl ester, propanedioic acid, [(4-methoxyphenyl) -methylene] -bis (1,2,2,6,6-pentamethyl-4-piperidinyl) Ester, higher fatty acid ester of 2,2,6,6-tetramethyl-4-piperidinol, 1,3-benzenedicarboxamide, N, N′-bis (2,2,6,6-tetramethyl-4- And hindered amine compounds such as piperidinyl).
The following commercially available products can be used as the amine compound that is the light stabilizer.
For example, as manufactured by Ciba Specialty Chemicals, TINUVIN 765, TINUVIN 770DF, TINUVIN 144, TINUVIN 123, TINUVIN 622LD, TINUVIN 152, CHIMASSORB 944, manufactured by ADEKA, LA-52, LA-57, LA-62, LA-63P, LA-77Y, LA-81, LA-82, LA-87 and the like can be mentioned.
In the present invention, the light stabilizer is used in an amount of 0.005 to 5% by weight, more preferably 0.01 to 4% by weight, and 0.1 to 2% by weight with respect to the epoxy resin.
When the amount is less than 0.005% by weight, the effect is insufficient, and when the amount exceeds 5% by weight, an influence on the heat-resistant coloring property appears, which is not preferable.
加熱条件は例えば80~230℃で1分~24時間程度が好ましい。加熱硬化の際に発生する内部応力を低減する目的で、例えば80~120℃、30分~5時間予備硬化させた後に、120~180℃、30分~10時間の条件で後硬化させることができる。 As a method for adhering a semiconductor chip to a substrate using the curable resin composition of the present invention, the curable resin composition of the present invention is applied on the substrate by dispenser, potting or screen printing, and then the curable resin is used. There is a method in which a semiconductor chip is placed on the composition and heat-cured. By this method, the semiconductor chip can be bonded to the substrate. For the heating, methods such as hot air circulation, infrared rays and high frequency can be used.
For example, the heating conditions are preferably 80 to 230 ° C. for about 1 minute to 24 hours. For the purpose of reducing internal stress generated during heat-curing, for example, after pre-curing at 80 to 120 ° C. for 30 minutes to 5 hours, post-curing is performed at 120 to 180 ° C. for 30 minutes to 10 hours. it can.
注入方法としては、ディスペンサー、トランスファー成形、射出成形等が挙げられる。
加熱は、熱風循環式、赤外線、高周波等の方法が使用できる。
加熱条件は例えば80~230℃で1分~24時間程度が好ましい。加熱硬化の際に発生する内部応力を低減する目的で、例えば80~120℃、30分~5時間予備硬化させた後に、120~180℃、30分~10時間の条件で後硬化させることができる。 As a molding method of the sealing material, as described above, an injection method in which the sealing material is injected into the mold frame in which the substrate on which the semiconductor chip is fixed is inserted and then heat-cured and then molded, and the sealing material on the mold A compression molding method is used in which a semiconductor chip fixed on a substrate is immersed therein and heat-cured and then released from the mold.
Examples of the injection method include dispenser, transfer molding, injection molding and the like.
For the heating, methods such as hot air circulation, infrared rays and high frequency can be used.
For example, the heating conditions are preferably 80 to 230 ° C. for about 1 minute to 24 hours. For the purpose of reducing internal stress generated during heat-curing, for example, after pre-curing at 80 to 120 ° C. for 30 minutes to 5 hours, post-curing is performed at 120 to 180 ° C. for 30 minutes to 10 hours. it can.
カラム:Shodex SYSTEM-21カラム(KF-803L、KF-802.5(×2本)、KF-802)
連結溶離液:テトラヒドロフラン、流速は1ml/min.
カラム温度:40℃、また検出はRI(Reflective index)
検量線:Shodex製標準ポリスチレン EXAMPLES Next, the present invention will be described more specifically with reference to examples. In the following, parts are parts by weight unless otherwise specified. The present invention is not limited to these examples. In the examples, gel permeation chromatography (hereinafter referred to as “GPC”) was measured under the following conditions.
Column: Shodex SYSTEM-21 column (KF-803L, KF-802.5 (× 2), KF-802)
Linked eluent: tetrahydrofuran, flow rate 1 ml / min.
Column temperature: 40 ° C, detection is RI (Reflective index)
Calibration curve: Standard polystyrene manufactured by Shodex
撹拌機、還流冷却管、撹拌装置を備えたフラスコに、窒素パージを施しながら両末端カルビノール変性シリコーンX22-160AS(信越化学工業(株)製 式(1)において、R1=-C3H6-O-C2H4-、R2=CH3、重量平均分子量は約1000)500部、HTMAn(1,2,4-シクロヘキサントリカルボン酸-1,2-無水物、三菱ガス化学(株)製)99部、MH-700(ヘキサヒドロ無水フタル酸と4-メチルヘキサヒドロ無水フタル酸の混合物、新日本理化製)84部、トルエン50部を反応容器に仕込み、90℃で2時間反応後、130℃に昇温し、3時間後にGPCを測定したところ酸無水物のピークが消失していた。その後さらに2時間反応させた。反応終了後、減圧下で溶媒を除去することにより無色~淡黄色液体のカルボン酸化合物(J-1)681部を得た。 Synthesis example 1
Both ends carbinol-modified silicone X22-160AS (in Shin-Etsu Chemical Co., Ltd., formula (1), R 1 = −C 3 H) while purging nitrogen with a stirrer, a reflux condenser, and a stirrer. 6- O—C 2 H 4 —, R 2 ═CH 3 , weight average molecular weight is about 1000) 500 parts, HTAn (1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride, Mitsubishi Gas Chemical Co., Ltd. )) 99 parts, MH-700 (a mixture of hexahydrophthalic anhydride and 4-methylhexahydrophthalic anhydride, manufactured by Shin Nippon Chemical Co., Ltd.), 84 parts, and 50 parts of toluene were charged in a reaction vessel and reacted at 90 ° C. for 2 hours. When the temperature was raised to 130 ° C. and GPC was measured 3 hours later, the acid anhydride peak disappeared. Thereafter, the reaction was further continued for 2 hours. After completion of the reaction, the solvent was removed under reduced pressure to obtain 681 parts of a colorless to pale yellow liquid carboxylic acid compound (J-1).
撹拌機、還流冷却管、撹拌装置を備えたフラスコに、窒素パージを施しながらトリシクロデカンジオール98部、HTMAn(1,2,4-シクロヘキサントリカルボン酸-1,2-無水物、三菱ガス化学(株)製)99部、MH-700(ヘキサヒドロ無水フタル酸と4-メチルヘキサヒドロ無水フタル酸の混合物、新日本理化製)84部、トルエン10部を反応容器に仕込み、60℃で1時間100℃で2時間反応を行った。反応終了後、減圧下で溶媒を除去することにより、無色の固形樹脂のカルボン酸化合物(K-1)280部を得た。 Synthesis example 2
A flask equipped with a stirrer, reflux condenser, and stirrer was charged with 98 parts of tricyclodecanediol, HTMan (1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride, Mitsubishi Gas Chemical ( 99 parts), MH-700 (mixture of hexahydrophthalic anhydride and 4-methylhexahydrophthalic anhydride, manufactured by Nippon Nippon Chemical Co., Ltd.), 84 parts, and 10 parts of toluene were charged in a reaction vessel at 100 ° C. for 1 hour. The reaction was carried out at 2 ° C. for 2 hours. After completion of the reaction, the solvent was removed under reduced pressure to obtain 280 parts of a colorless solid resin carboxylic acid compound (K-1).
撹拌機、還流冷却管、撹拌装置を備えたフラスコに、窒素パージを施しながらカルボン酸化合物(J-1)68.3部を仕込み、100℃で撹拌しているところに、カルボン酸化合物(K-1)28.1部を加え、そのまま1時間撹拌し、相溶させることで無色透明液体として本発明の多価カルボン酸組成物(MA-1)を得た。 Example 1
A flask equipped with a stirrer, a reflux condenser, and a stirrer was charged with 68.3 parts of the carboxylic acid compound (J-1) while purging with nitrogen, and the mixture was stirred at 100 ° C., and the carboxylic acid compound (K -1) 28.1 parts were added, and the mixture was stirred as it was for 1 hour to be compatible with each other to obtain a polyvalent carboxylic acid composition (MA-1) of the present invention as a colorless transparent liquid.
実施例1で得られた本発明の多価カルボン酸組成物(MA-1)、比較例として、MH-700(ヘキサヒドロ無水フタル酸と4-メチルヘキサヒドロ無水フタル酸の混合物、新日本理化製 以下、H1と称す)を硬化剤として用い、エポキシ樹脂として3,4-エポキシシクロヘキシルメチル-3,4-エポキシシクロヘキシルカルボキシレート(ダウ・ケミカル製 UVR-6105 以下エポキシ樹脂(EP1)と称す)、硬化促進剤としてヘキサデシルトリメチルアンモニウムヒドロキシド(東京化成工業(株)製 25%メタノール溶液、以下C1と称す。)を使用し、下記表1に示す配合比(重量部)で配合し、20分間脱泡を行い、本発明の硬化性樹脂組成物を得た。 Example 2 and Comparative Example 1
The polyvalent carboxylic acid composition (MA-1) of the present invention obtained in Example 1 and, as a comparative example, MH-700 (a mixture of hexahydrophthalic anhydride and 4-methylhexahydrophthalic anhydride, manufactured by Shin Nippon Rika Co., Ltd.) (Hereinafter referred to as H1) as a curing agent, and 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate as epoxy resin (UVR-6105 manufactured by Dow Chemical) (hereinafter referred to as epoxy resin (EP1)), curing Hexadecyltrimethylammonium hydroxide (manufactured by Tokyo Chemical Industry Co., Ltd., 25% methanol solution, hereinafter referred to as C1) is used as an accelerator, blended at the blending ratio (parts by weight) shown in Table 1 below, and desorbed for 20 minutes. Foaming was performed to obtain a curable resin composition of the present invention.
実施例及び比較例で得られた硬化性樹脂組成物を真空脱泡20分間実施後、シリンジに充填し精密吐出装置を使用して、発光波長465nmを持つ発光素子を搭載した表面実装型(SMD型 外径5mm角表面実装型LEDパッケージ 内径4.4mm、外壁高さ1.25mm)LEDに注型した。その後、所定の硬化条件で硬化させることで、試験用LEDを得た。
評価項目
揮発性:封止した後の硬化物表面の凹みの有無を目視で評価した。表中、○;凹みが認められない、△;凹みが多少認められる、×;凹みが多く認められる(ワイヤーの露出がある)。 (LED sealing test)
Surface mount type (SMD) in which the curable resin compositions obtained in the examples and comparative examples were vacuum degassed for 20 minutes, filled in a syringe and mounted with a light emitting element having an emission wavelength of 465 nm using a precision discharge device. Type outer diameter 5 mm square surface-mount type LED package inner diameter 4.4 mm, outer wall height 1.25 mm) was cast into LED. Thereafter, a test LED was obtained by curing under predetermined curing conditions.
Evaluation item Volatility: The presence or absence of dents on the surface of the cured product after sealing was visually evaluated. In the table, ◯: no dent is observed, Δ: some dent is observed, x: many dents are observed (there is an exposed wire).
2-(3,4エポキシシクロヘキシル)エチルトリメトキシシラン59.1部、分子量1700(GPC測定値)のシラノール基をもつポリジメチルジフェニルシロキサン130.6部、0.5重量%KOHメタノール溶液10.0部を反応容器に仕込み、75℃に昇温した。昇温後、還流下75℃にて8時間反応させた。反応後、メタノールを135部追加後、50%蒸留水メタノール溶液25.9部を60分かけて滴下し、還流下75℃にてさらに8時間反応させた。反応終了後、5重量%第1水素ナトリウムリン酸水溶液で中和後、80℃でメタノールの蒸留回収を行った。その後、洗浄のために、メチルイソブチルケトン(MIBK)170部を添加後、水洗を3回繰り返した。次いで有機層を減圧下、100℃で溶媒を除去することによりエポキシ樹脂(EP2)162部を得た。得られた化合物のエポキシ当量は707g/eq、重量平均分子量は2680、外観は無色透明であった。 Synthesis example 4
2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane (59.1 parts), polydimethyldiphenylsiloxane having a silanol group having a molecular weight of 1700 (measured by GPC) 130.6 parts, 0.5 wt% KOH methanol solution 10.0 The portion was charged into a reaction vessel and heated to 75 ° C. After raising the temperature, the mixture was reacted at 75 ° C. under reflux for 8 hours. After the reaction, 135 parts of methanol was added, 25.9 parts of 50% distilled water methanol solution was added dropwise over 60 minutes, and the mixture was further reacted at 75 ° C. for 8 hours under reflux. After completion of the reaction, the reaction mixture was neutralized with a 5 wt% aqueous sodium hydrogen phosphate solution, and methanol was recovered by distillation at 80 ° C. Thereafter, 170 parts of methyl isobutyl ketone (MIBK) was added for washing, and washing with water was repeated three times. Subsequently, 162 parts of epoxy resins (EP2) were obtained by removing a solvent at 100 degreeC under pressure reduction of an organic layer. The epoxy equivalent of the obtained compound was 707 g / eq, the weight average molecular weight was 2680, and the appearance was colorless and transparent.
撹拌機、還流冷却管、撹拌装置を備えたフラスコに、窒素パージを施しながら両末端カルビノール変性シリコーンX22-160AS(信越化学工業(株)製)500部、MH(メチルヘキサヒドロ無水フタル酸、新日本理化製)168部を加え、70℃で2時間反応後、キョウワジオールPD9(2,4-ジエチルペンタン-1,5-ジオール 協和発酵ケミカル製)80部、HTMAn(1,2,4-シクロヘキサントリカルボン酸-1,2-無水物、三菱ガス化学(株)製)198部を添加し、70℃で1時間、130℃で5時間反応を行うことで本発明の多価カルボン酸組成物(MA-2)を得た。得られた多価カルボン酸組成物は、無色透明の液体(半固形に近いが室温にて流動性はある)であった。(正確には算出できないが、両末端カルビノール変性シリコーン由来の多価カルボン酸(J)が約70重量%、2,4-ジエチルペンタン-1,5-ジオール由来の多価カルボン酸(K)が約30重量%含まれる) Example 3
A flask equipped with a stirrer, a reflux condenser, and a stirrer was charged with 500 parts of both ends carbinol-modified silicone X22-160AS (manufactured by Shin-Etsu Chemical Co., Ltd.) while purging with nitrogen, MH (methylhexahydrophthalic anhydride, 168 parts (manufactured by Nippon Nippon Chemical Co., Ltd.) and reacted at 70 ° C. for 2 hours, 80 parts of Kyowadiol PD9 (2,4-diethylpentane-1,5-diol, manufactured by Kyowa Hakko Chemical), HTAn (1,2,4- 198 parts of cyclohexanetricarboxylic acid-1,2-anhydride (manufactured by Mitsubishi Gas Chemical Co., Inc.) are added, and the reaction is carried out at 70 ° C. for 1 hour and at 130 ° C. for 5 hours, thereby producing the polyvalent carboxylic acid composition of the present invention. (MA-2) was obtained. The polyvalent carboxylic acid composition obtained was a colorless and transparent liquid (semi-solid but fluid at room temperature). (Although it cannot be calculated accurately, polycarboxylic acid (J) derived from carbinol-modified silicone at both ends is about 70% by weight, polycarboxylic acid derived from 2,4-diethylpentane-1,5-diol (K) About 30% by weight)
撹拌機、還流冷却管、撹拌装置を備えたフラスコに、窒素パージを施しながら両末端カルビノール変性シリコーンX22-160AS(信越化学工業(株)製)500部、MH(メチルシクロヘキサンジカルボン酸無水物、新日本理化製)168部、キョウワジオールPD9(2,4-ジエチルペンタン-1,5-ジオール 協和発酵ケミカル製)80部、HTMAn(1,2,4-シクロヘキサントリカルボン酸-1,2-無水物、三菱ガス化学(株)製)198部を添加し、70℃で2時間、130℃で5時間反応を行った後、50℃に冷却後、MH(メチルヘキサヒドロ無水フタル酸、新日本理化製)33.6部添加し、完全に相溶させることで本発明の多価カルボン酸組成物(MA-3)を得た。得られた多価カルボン酸組成物は、無色透明の液体であった。(正確には算出できないが、両末端カルビノール変性シリコーン由来の多価カルボン酸(J)が約70重量%、2,4-ジエチルペンタン-1,5-ジオール由来の多価カルボン酸(K)が約27重量%、酸無水物が約3重量%含まれる) Example 4
A flask equipped with a stirrer, a reflux condenser, and a stirrer was purged with nitrogen while carrying both ends of the carbinol-modified silicone X22-160AS (manufactured by Shin-Etsu Chemical Co., Ltd.) 500 parts, MH (methylcyclohexanedicarboxylic anhydride, 168 parts by Nippon Nippon Chemical Co., Ltd., 80 parts by Kyowadiol PD9 (2,4-diethylpentane-1,5-diol manufactured by Kyowa Hakko Chemical), HTAn (1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride) 198 parts by Mitsubishi Gas Chemical Co., Ltd.), reacted at 70 ° C. for 2 hours and 130 ° C. for 5 hours, cooled to 50 ° C., and then MH (methylhexahydrophthalic anhydride, Shin Nippon Rika) Product) 33.6 parts was added and completely mixed to obtain the polyvalent carboxylic acid composition (MA-3) of the present invention. The obtained polyvalent carboxylic acid composition was a colorless and transparent liquid. (Although it cannot be calculated accurately, polycarboxylic acid (J) derived from carbinol-modified silicone at both ends is about 70% by weight, polycarboxylic acid derived from 2,4-diethylpentane-1,5-diol (K) About 27% by weight and about 3% by weight of acid anhydride)
実施例3、4で得られた本発明の多価カルボン酸組成物(MA-2、MA-3)、比較例として、合成例1で製造したカルボン酸(J-1)、酸無水物(H1)をそれぞれ硬化剤として用い、エポキシ樹脂として合成例4で得られたエポキシ樹脂(EP2)を用い、硬化促進剤としてヘキサデシルトリメチルアンモニウムヒドロキシド(東京化成工業(株)製 25%メタノール溶液、以下C1と称す。)を使用し、下記表2に示す配合比(重量部)で配合し、20分間脱泡を行い、本発明または比較用の硬化性樹脂組成物を得た。
得られた硬化性樹脂組成物を用い、以下に示す要領で各種試験を行った。結果を表2に合わせて示す。 Examples 5 and 6, Comparative Examples 2 and 3
The polyvalent carboxylic acid composition of the present invention (MA-2, MA-3) obtained in Examples 3 and 4, as a comparative example, the carboxylic acid (J-1) prepared in Synthesis Example 1, an acid anhydride ( H1) is used as a curing agent, the epoxy resin (EP2) obtained in Synthesis Example 4 is used as an epoxy resin, and hexadecyltrimethylammonium hydroxide (manufactured by Tokyo Chemical Industry Co., Ltd., 25% methanol solution, (Hereinafter referred to as “C1”), and blended at a blending ratio (parts by weight) shown in Table 2 below, followed by defoaming for 20 minutes to obtain a curable resin composition for the present invention or for comparison.
Using the obtained curable resin composition, various tests were performed in the following manner. The results are shown in Table 2.
実施例5、6、比較例2、3で得られた硬化性樹脂組成物を真空脱泡20分間実施後、シリンジに充填し精密吐出装置を使用して、発光波長465nmを持つ発光素子を搭載した表面実装型LEDに開口部が平面になるように注型した。120℃×3時間の予備硬化の後、150℃×1時間で硬化し、表面実装型LEDを封止した。このように封止した後の硬化剤の揮発に伴う樹脂表面の凹みの有無を目視で評価した。表中、○;凹みが認められない、△;凹みが多少認められる、×;凹みが多く認められる(ワイヤーの露出)
(2)リフロー試験;
実施例5、6、比較例2、3で得られた硬化性樹脂組成物を真空脱泡20分間実施後、シリンジに充填し精密吐出装置を使用して、発光波長465nmを持つ発光素子を搭載した表面実装型LEDに開口部が平面になるように注型した。120℃×3時間の予備硬化の後、150℃×1時間で硬化し、表面実装型LEDを封止した。得られた試験用LEDを30℃70%×72Hr吸湿後、高温観察装置(SMT Scope SK-5000 山陽精工株式会社製)を用い、以下のリフロー条件下での、試験用LEDへのクラックの発生を目視で観察した。n=3でテストを行い、(OK数)/(テスト数)で評価する。
条件は25℃より2℃/秒で150℃まで昇温、その後、2分150℃で保持し、さらに2℃/秒で260℃まで昇温し、10秒の温度保持後、1.3℃/秒で室温まで冷却する、というものである。
(3)耐ガス透過性試験(腐食ガス透過性試験);
実施例5、6、比較例2、3で得られた硬化性樹脂組成物を真空脱泡20分間実施後、シリンジに充填し精密吐出装置を用いて、中心発光波465nmのチップを搭載した外径5mm角表面実装型LEDパッケージ(内径4.4mm、外壁高さ1.25mm)に注型した。その注型物を加熱炉に投入して、120℃、1時間さらに150℃、3時間の硬化処理をしてLEDパッケージを作成した。下記条件でLEDパッケージを腐食性ガス中に放置し、封止内部の銀メッキされたリードフレーム部の色の変化を観察した。
<測定条件>
腐食ガス:硫化アンモニウム20重量%水溶液(硫黄成分が銀と反応した場合に黒く変色する)
接触方法:広口ガラス瓶の中に、硫化アンモニウム水溶液の容器と前記LEDパッケージを混在させ、広口ガラス瓶の蓋をして密閉状況下、揮発した硫化アンモニウムガスとLEDパッケージを接触させた。
腐食の判定:LEDパッケージ内部のリードフレームが黒く変色(黒化という)した時間を観察し、その変色時間が長い物ほど、耐腐食性ガス透過性にすぐれていると判断した。 (1) dent test;
The curable resin compositions obtained in Examples 5 and 6 and Comparative Examples 2 and 3 were vacuum degassed for 20 minutes, then filled into a syringe and mounted with a light emitting element having an emission wavelength of 465 nm using a precision discharge device. The surface mounted LED was cast so that the opening was flat. After pre-curing at 120 ° C. for 3 hours, curing was performed at 150 ° C. for 1 hour to seal the surface-mounted LED. The presence or absence of dents on the resin surface accompanying the volatilization of the curing agent after sealing in this way was visually evaluated. In the table, ○: No dent is observed, △: Some dent is observed, ×: Many dents are observed (exposure of wire)
(2) Reflow test;
The curable resin compositions obtained in Examples 5 and 6 and Comparative Examples 2 and 3 were vacuum degassed for 20 minutes, then filled into a syringe and mounted with a light emitting element having an emission wavelength of 465 nm using a precision discharge device. The surface mounted LED was cast so that the opening was flat. After pre-curing at 120 ° C. for 3 hours, curing was performed at 150 ° C. for 1 hour to seal the surface-mounted LED. After the obtained test LED absorbs moisture at 30 ° C. and 70% × 72 hours, generation of cracks in the test LED under the following reflow conditions using a high-temperature observation device (SMT Scope SK-5000 manufactured by Sanyo Seiko Co., Ltd.) Was visually observed. The test is performed with n = 3, and the evaluation is made with (OK number) / (test number).
The temperature was raised from 25 ° C. to 150 ° C. at 2 ° C./second, then held at 150 ° C. for 2 minutes, further heated to 260 ° C. at 2 ° C./second, and maintained at 10 ° C., then 1.3 ° C. It cools to room temperature at / second.
(3) Gas permeation resistance test (corrosion gas permeability test);
The curable resin compositions obtained in Examples 5 and 6 and Comparative Examples 2 and 3 were vacuum degassed for 20 minutes, filled in a syringe, and mounted with a chip having a central emission wave of 465 nm using a precision discharge device. A 5 mm-diameter surface-mount LED package (inner diameter: 4.4 mm, outer wall height: 1.25 mm) was cast. The cast product was put into a heating furnace and cured at 120 ° C. for 1 hour, further at 150 ° C. for 3 hours, and an LED package was prepared. The LED package was left in a corrosive gas under the following conditions, and the color change of the silver-plated lead frame part inside the seal was observed.
<Measurement conditions>
Corrosion gas: 20% by weight aqueous solution of ammonium sulfide (turns black when sulfur component reacts with silver)
Contact method: A container of an ammonium sulfide aqueous solution and the LED package were mixed in a wide-mouth glass bottle, and the wide-mouth glass bottle was covered to bring the volatilized ammonium sulfide gas into contact with the LED package in a sealed state.
Judgment of corrosion: The time when the lead frame inside the LED package was discolored black (referred to as blackening) was observed, and the longer the discoloration time, the better the corrosion resistance gas permeability.
撹拌機、還流冷却管、撹拌装置を備えたフラスコに、窒素パージを施しながら両末端カルビノール変性シリコーン化合物(SI-1、SI-2から選ばれる1種)、飽和脂肪族多価アルコール(AL-1、AL-2から選ばれる1種)、酸無水物(H1,H2、H3から選ばれる少なくとも1種)を下記表3に記載の配合量で仕込み、70℃で5時間、90℃で3時間反応させることで、無色透明液体として多価カルボン酸組成物(MA-4~MA10)およびカルボン酸樹脂(J-2、J-3)を得た。
なお、それぞれSI-1:チッソ製 FM-4411、SI-2:信越化学工業製 X22-160AS、AL-1:協和発酵ケミカル製 キョーワジールPD-9、AL-2:OXEA製 TCDAlchol-DM、H1:新日本理化製 リカシッドMH-700、H2:新日本理化製 リカシッドMH、H3:三菱瓦斯化学製 H-TMAnである。 Examples 7 to 13, Synthesis Examples 6 and 7
A flask equipped with a stirrer, a reflux condenser, and a stirrer is purged with nitrogen while both ends carbinol-modified silicone compound (one selected from SI-1 and SI-2), saturated aliphatic polyhydric alcohol (AL -1 and AL-2) and an acid anhydride (at least one selected from H1, H2, and H3) in the amounts shown in Table 3 below, at 70 ° C for 5 hours, at 90 ° C By reacting for 3 hours, polyvalent carboxylic acid compositions (MA-4 to MA10) and carboxylic acid resins (J-2, J-3) were obtained as colorless and transparent liquids.
In addition, SI-1: Chisso FM-4411, SI-2: Shin-Etsu Chemical X22-160AS, AL-1: Kyowa Hakko Chemical Kyowajiru PD-9, AL-2: OXEA TCDAlchol-DM, H1 : Rikacid MH-700, manufactured by Shin Nippon Rika, H2: Rikacid MH, manufactured by Shin Nippon Rika, H3: H-TMAn, manufactured by Mitsubishi Gas Chemical.
撹拌機、還流冷却管、撹拌装置を備えたフラスコに、窒素パージを施しながら酸無水物(H2)100部、飽和脂肪族多価アルコール(AL-1)を仕込み、50℃で3時間、70℃で30分撹拌することで、無色透明のカルボン酸化合物と酸無水物の混合物120部を得た。得られたカルボン酸と酸無水物の比はゲルパーミエーションクロマトグラフィーにより測定した結果、約52:48であった。 Synthesis example 8
A flask equipped with a stirrer, a reflux condenser, and a stirrer was charged with 100 parts of acid anhydride (H2) and saturated aliphatic polyhydric alcohol (AL-1) while purging with nitrogen, and at 70 ° C. for 3 hours. Stirring at 30 ° C. for 30 minutes gave 120 parts of a mixture of a colorless and transparent carboxylic acid compound and an acid anhydride. The ratio of the obtained carboxylic acid to acid anhydride was approximately 52:48 as a result of measurement by gel permeation chromatography.
合成例8で得られた無色透明のカルボン酸化合物と酸無水物の混合物1部(実施例14)、2部(実施例15)に対し、合成例6で得られた多価カルボン酸化合物(J-2)100部を加え均一に溶解した。これによりそれぞれ無色の多価カルボン酸組成物MA-11、MA-12を得た。 Examples 14 and 15
With respect to 1 part (Example 14) and 2 parts (Example 15) of the mixture of the colorless and transparent carboxylic acid compound and acid anhydride obtained in Synthesis Example 8, the polyvalent carboxylic acid compound obtained in Synthesis Example 6 ( J-2) 100 parts were added and dissolved uniformly. As a result, colorless polyvalent carboxylic acid compositions MA-11 and MA-12 were obtained.
β-(3,4エポキシシクロヘキシル)エチルトリメトキシシラン39.4部、重量平均分子量1900(GPC測定値)のシラノール末端メチルフェニルシリコーンオイル137部(シラノール当量950、GPCを用いて測定した重量平均分子量の半分として算出した。)、0.5%水酸化カリウム(KOH)メタノール溶液10部を反応容器に仕込み、バス温度を75℃に設定し、昇温した。昇温後、還流下にて10時間反応させた。製造工程(ii)として、メタノールを140部追加後、50%蒸留水メタノール溶液17.3部を60分かけて滴下し、還流下75℃にて8時間反応させた。反応終了後、5%リン酸2水素ナトリウム水溶液で中和後、80℃でメタノールの約90%を蒸留回収した。次いで、メチルイソブチルケトン(MIBK)200部を添加し、水洗を3回繰り返した。得られた有機層を減圧下、100℃で溶媒を除去することによりエポキシシクロヘキシル基含有オルガノポリシロキサン(EP-3)152部を得た。得られた化合物(EP-3)のエポキシ当量は1040g/eq.、重量平均分子量は2290、外観は無色透明の液状樹脂であった。 Synthesis Example 9
β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane 39.4 parts, weight average molecular weight 1900 (GPC measured value) silanol-terminated methylphenyl silicone oil 137 parts (silanol equivalent 950, weight average molecular weight measured using GPC) 10 parts of 0.5% potassium hydroxide (KOH) methanol solution was charged into the reaction vessel, the bath temperature was set to 75 ° C., and the temperature was raised. After raising the temperature, the reaction was carried out under reflux for 10 hours. As a manufacturing process (ii), after adding 140 parts of methanol, 17.3 parts of 50% distilled water methanol solution was added dropwise over 60 minutes, and reacted at 75 ° C. for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with 5% aqueous sodium dihydrogen phosphate solution, and about 90% of methanol was recovered by distillation at 80 ° C. Subsequently, 200 parts of methyl isobutyl ketone (MIBK) was added, and washing with water was repeated three times. By removing the solvent from the obtained organic layer at 100 ° C. under reduced pressure, 152 parts of an epoxycyclohexyl group-containing organopolysiloxane (EP-3) was obtained. The epoxy equivalent of the obtained compound (EP-3) was 1040 g / eq. The weight average molecular weight was 2290, and the appearance was a colorless and transparent liquid resin.
β-(3,4エポキシシクロヘキシル)エチルトリメトキシシラン375部、重量平均分子量1900(GPC測定値)のシラノール末端メチルフェニルシリコーンオイル475部(シラノール当量950、GPCを用いて測定した重量平均分子量の半分として算出した。)、0.5%水酸化カリウム(KOH)メタノール溶液40部を反応容器に仕込み、バス温度を75℃に設定し、昇温した。昇温後、還流下にて8時間反応させた。メタノールを655部追加後、50%蒸留水メタノール溶液144部を60分かけて滴下し、還流下75℃にて8時間反応させた。反応終了後、5%リン酸2水素ナトリウム水溶液で中和後、80℃でメタノールの約90%を蒸留回収した。次いで、メチルイソブチルケトン(MIBK)750部を添加し、水洗を3回繰り返した。得られた有機層を減圧下、100℃で溶媒を除去することによりエポキシシクロヘキシル基含有オルガノポリシロキサン(EP-4)647部を得た。得られた化合物(EP-4)のエポキシ当量は541g/eq.、重量平均分子量は2100、外観は無色透明の液状樹脂であった。 Synthesis Example 10
375 parts of β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, 475 parts of silanol-terminated methylphenyl silicone oil having a weight average molecular weight of 1900 (measured by GPC) (silanol equivalent 950, half of the weight average molecular weight measured using GPC) 40 parts of 0.5% potassium hydroxide (KOH) methanol solution was charged into a reaction vessel, the bath temperature was set to 75 ° C., and the temperature was raised. After raising the temperature, the reaction was carried out under reflux for 8 hours. After adding 655 parts of methanol, 144 parts of a 50% distilled water methanol solution was added dropwise over 60 minutes and reacted at 75 ° C. for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with 5% aqueous sodium dihydrogen phosphate solution, and about 90% of methanol was recovered by distillation at 80 ° C. Next, 750 parts of methyl isobutyl ketone (MIBK) was added, and washing with water was repeated three times. The solvent was removed from the obtained organic layer at 100 ° C. under reduced pressure to obtain 647 parts of an epoxycyclohexyl group-containing organopolysiloxane (EP-4). The epoxy equivalent of the obtained compound (EP-4) was 541 g / eq. The weight average molecular weight was 2,100, and the appearance was a colorless and transparent liquid resin.
本発明の多価カルボン酸組成物(MA-4、MA-5、MA-6、MA-10)、比較例として、多価カルボン酸樹脂(J-3)を硬化剤として用い、エポキシ樹脂として合成例10で得られたエポキシ樹脂(EP-4)を用い、硬化促進剤としてオクチル酸亜鉛(ホープ製薬製 18% オクトープ Zn 以下C2と称す。)、光安定剤(ADEKA製 LA-81 以下 添加剤AD-1と称す)、酸化防止剤(ADEKA製、アデカ260、添加剤AD-2と称す))、を使用し、下記表4に示す配合比(重量部)で配合し、20分間脱泡を行い、本発明の硬化性樹脂組成物、および比較用の硬化性樹脂組成物を得た。
得られた硬化性樹脂組成物を用い、以下に示す要領で、試験をおこない、結果を表4に合わせて示す。なお、硬化条件は、特に断りの無い場合は、120℃×2時間の予備硬化の後150℃×5時間である。
(1)引っ張り試験 JIS K 6911に準拠
サンプル 厚み0.9±0.05mm 断面積4.5±0.2mm2
速度 5mm/min、チャック間距離 15mm
(2)熱耐久性透過率試験
得られた硬化性樹脂組成物を、30mm×20mm×高さ1mmになるように耐熱テープでダムを作成したガラス基板上に静かに注型した。その注型物を、120℃×3時間の予備硬化の後150℃×1時間で硬化させ、厚さ1mmの透過率用試験片を得た。
これらの試験片を用い、150℃オーブン中72hr放置前後における透過率(測定波長:400nm)を分光光度計により測定し、その変化率を算出した。
評価:透過率低下が5%未満の場合○、5%以上10%未満の場合△、10%以上の場合×とする。 Examples 16 to 19 and Comparative Example 4
The polyvalent carboxylic acid composition of the present invention (MA-4, MA-5, MA-6, MA-10), as a comparative example, a polyvalent carboxylic acid resin (J-3) is used as a curing agent, and an epoxy resin Using the epoxy resin (EP-4) obtained in Synthesis Example 10, zinc octylate (18% Octopus Zn, hereinafter referred to as C2) manufactured by Hope Pharmaceutical, and light stabilizer (LA-81 or less, manufactured by ADEKA) were added as a curing accelerator. And an antioxidant (made by ADEKA, ADEKA 260, called additive AD-2)), and blended at the blending ratio (parts by weight) shown in Table 4 below, and removed for 20 minutes. Foaming was performed to obtain a curable resin composition of the present invention and a comparative curable resin composition.
Using the obtained curable resin composition, a test was conducted in the following manner, and the results are shown in Table 4. The curing conditions are 150 ° C. × 5 hours after preliminary curing at 120 ° C. × 2 hours, unless otherwise specified.
(1) Tensile test Conforms to JIS K 6911 Sample Thickness 0.9 ± 0.05 mm Cross-sectional area 4.5 ± 0.2 mm 2
Speed 5mm / min, Chuck distance 15mm
(2) Thermal durability transmittance test The obtained curable resin composition was gently cast on a glass substrate on which a dam was formed with a heat-resistant tape so as to be 30 mm × 20 mm × height 1 mm. The cast was cured at 120 ° C. for 1 hour after pre-curing at 120 ° C. for 3 hours to obtain a test piece for transmittance having a thickness of 1 mm.
Using these test pieces, the transmittance (measurement wavelength: 400 nm) before and after being left for 72 hours in a 150 ° C. oven was measured with a spectrophotometer, and the rate of change was calculated.
Evaluation: When the transmittance decrease is less than 5%, ○, when 5% or more and less than 10%, Δ when 10% or more, and x.
本発明の多価カルボン酸組成物(MA-7、MA-8、MA-9)、比較例として、多価カルボン酸樹脂(J-3)を硬化剤として用い、エポキシ樹脂として合成例9、10で得られたエポキシ樹脂(EP-3、EP-4)を用い、硬化促進剤(C2)、添加剤(AD-1、AD-2)を使用し、下記表5に示す配合比(重量部)で配合し、20分間脱泡を行い、本発明の硬化性樹脂組成物、および比較用の硬化性樹脂組成物を得た。
得られた硬化性樹脂組成物を用い、以下に示す要領で、試験をおこない、結果を表5に合わせて示す。なお、硬化条件は120℃×2時間の予備硬化の後150℃×5時間である。
(1)ピール試験 JIS K 6911 に準拠
支持体:銅箔粗面使用、サンプル幅:10mm、剥離スピード:3mm/分
(2)引っ張り試験 JIS K 6911に準拠
サンプル 厚み0.9±0.05mm 断面積4.5±0.2mm2
速度 5mm/min、チャック間距離 15mm Examples 20-22, Comparative Example 5
The polyvalent carboxylic acid composition of the present invention (MA-7, MA-8, MA-9), as a comparative example, the polyvalent carboxylic acid resin (J-3) was used as a curing agent, and the epoxy resin was synthesized in Synthesis Example 9, 10 using the epoxy resins (EP-3, EP-4) obtained in No. 10, using the curing accelerator (C2) and additives (AD-1, AD-2), and the mixing ratios (weights) shown in Table 5 below. Part) and defoaming for 20 minutes to obtain a curable resin composition of the present invention and a comparative curable resin composition.
Using the obtained curable resin composition, a test was conducted in the following manner, and the results are shown in Table 5. The curing conditions are 150 ° C. × 5 hours after preliminary curing at 120 ° C. × 2 hours.
(1) Peel test Conforms to JIS K 6911 Support: Use of copper foil rough surface, Sample width: 10 mm, Peeling speed: 3 mm / min
(2) Tensile test Conforms to JIS K 6911 Sample Thickness 0.9 ± 0.05 mm Cross-sectional area 4.5 ± 0.2 mm 2
Speed 5mm / min, Chuck distance 15mm
本発明の多価カルボン酸組成物(MA-11,MA-12)、比較例として、多価カルボン酸樹脂(J-2)を硬化剤として用い、エポキシ樹脂として合成例10で得られたエポキシ樹脂(EP-4)を用い、硬化促進剤(C2)、添加剤(AD-1、AD-2)を使用し、下記表6に示す配合比(重量部)で配合し、20分間脱泡を行い、本発明の硬化性樹脂組成物、および比較用の硬化性樹脂組成物を得た。
得られた硬化性樹脂組成物を用い、以下に示す要領で、試験をおこない、結果を表6に合わせて示す。なお、硬化条件は120℃×2時間の予備硬化の後150℃×5時間である。
(1)引っ張り試験 JIS K 6911に準拠
サンプル 厚み0.9±0.05mm 断面積4.5±0.2mm2
速度 5mm/min、チャック間距離 15mm
(2)LED点灯試験
実施例及び比較例で得られた硬化性樹脂組成物を真空脱泡20分間実施後、シリンジに充填し精密吐出装置を使用して、発光波長465nmを持つ発光素子を搭載した表面実装型LED(Φ5mm)に注型した。その後、所定の硬化条件で硬化させることで、点灯試験用LEDを得る。点灯試験は、加速試験のため、規定電流の7倍である210mAでの点灯試験を行った。詳細な条件は下記に示した。測定項目としては、20時間点灯前後の照度を積分球を使用して測定し、試験用LEDの照度の保持率を算出した。
点灯詳細条件
発光波長:465nm
駆動方式:定電流方式、210mA(発光素子規定電流は30mA)
駆動環境:25℃、65%RH
(3)耐ガス透過性試験(腐食ガス透過性試験);
得られた硬化性樹脂組成物で作成した、LEDをパッケージを下記条件で腐食性ガス中に放置し、封止内部の銀メッキされたリードフレーム部の色の変化を観察した。
<測定条件>
腐食ガス:硫化アンモニウム20%水溶液(硫黄成分が銀と反応した場合に黒く変色する)
接触方法:広口ガラス瓶の中に、硫化アンモニウム水溶液の容器と前記LEDパッケージを混在させ、広口ガラス瓶の蓋をして密閉状況下、揮発した硫化アンモニウムガスとLEDパッケージを接触させた。
腐食の判定:LEDパッケージ内部のリードフレームが黒く変色(黒化という)した時間を1時間毎に観察し、その変色時間が長い物ほど、耐腐食性ガス性に優れていると判断した。 Examples 23 and 24, Comparative Example 6
The polyhydric carboxylic acid composition (MA-11, MA-12) of the present invention and, as a comparative example, the polycarboxylic acid resin (J-2) as a curing agent and the epoxy obtained in Synthesis Example 10 as an epoxy resin Using resin (EP-4), using curing accelerator (C2) and additives (AD-1, AD-2), blending ratios (parts by weight) shown in Table 6 below, and defoaming for 20 minutes The curable resin composition of the present invention and a comparative curable resin composition were obtained.
Using the obtained curable resin composition, a test was conducted in the following manner, and the results are shown in Table 6. The curing conditions are 150 ° C. × 5 hours after preliminary curing at 120 ° C. × 2 hours.
(1) Tensile test Conforms to JIS K 6911 Sample Thickness 0.9 ± 0.05 mm Cross-sectional area 4.5 ± 0.2 mm 2
Speed 5mm / min, Chuck distance 15mm
(2) LED lighting test After carrying out vacuum defoaming for 20 minutes with the curable resin compositions obtained in Examples and Comparative Examples, a syringe is filled and a light emitting element having an emission wavelength of 465 nm is mounted using a precision discharge device. Was cast into a surface-mounted LED (Φ5 mm). Then, LED for lighting test is obtained by making it harden | cure on predetermined hardening conditions. The lighting test was performed at 210 mA, which is 7 times the specified current, for the acceleration test. Detailed conditions are shown below. As a measurement item, the illuminance before and after lighting for 20 hours was measured using an integrating sphere, and the illuminance retention rate of the test LED was calculated.
Detailed lighting conditions Light emission wavelength: 465nm
Drive method: constant current method, 210 mA (light emitting element specified current is 30 mA)
Driving environment: 25 ° C, 65% RH
(3) Gas permeation resistance test (corrosion gas permeability test);
The package of the LED prepared with the obtained curable resin composition was left in a corrosive gas under the following conditions, and the change in the color of the silver-plated lead frame inside the seal was observed.
<Measurement conditions>
Corrosive gas: 20% aqueous solution of ammonium sulfide (discolors black when sulfur component reacts with silver)
Contact method: A container of an ammonium sulfide aqueous solution and the LED package were mixed in a wide-mouth glass bottle, and the wide-mouth glass bottle was covered to bring the volatilized ammonium sulfide gas into contact with the LED package in a sealed state.
Judgment of corrosion: The time when the lead frame inside the LED package was blackened (referred to as blackening) was observed every hour, and it was judged that the longer the color changing time, the better the corrosion resistance gas resistance.
撹拌機、還流冷却管、撹拌装置を備えたフラスコに、窒素パージを施しながら両末端カルビノール変性シリコーン化合物(SI-2)365部、ペンタエリスリトール(以下、飽和脂肪族多価アルコールAL-3と称す)9部、酸無水物(H2)168部を仕込み、90℃で2時間、110℃で3時間反応させることで、無色透明液体として多価カルボン酸組成物(MA-13)542部を得た。(SI-2由来の多価カルボン酸の重量(J)/AL-3由来の多価カルボン酸の重量(K)=90/10) Example 25
A flask equipped with a stirrer, a reflux condenser, and a stirrer was charged with 365 parts of both ends carbinol-modified silicone compound (SI-2), pentaerythritol (hereinafter referred to as saturated aliphatic polyhydric alcohol AL-3) while purging with nitrogen. 9 parts) and 168 parts of acid anhydride (H2) were charged and reacted at 90 ° C. for 2 hours and at 110 ° C. for 3 hours to obtain 542 parts of a polyvalent carboxylic acid composition (MA-13) as a colorless transparent liquid. Obtained. (Weight of polycarboxylic acid derived from SI-2 (J) / weight of polycarboxylic acid derived from AL-3 (K) = 90/10)
本発明の多価カルボン酸組成物(MA-13)、比較例として、多価カルボン酸樹脂(J-3)を硬化剤として用い、エポキシ樹脂として合成例9、10で得られたエポキシ樹脂(EP-3、EP-4)を用い、硬化促進剤(C2)、添加剤(AD-1、AD-2)を使用し、下記表7に示す配合比(重量部)で配合し、20分間脱泡を行い、本発明の硬化性樹脂組成物、および比較用の硬化性樹脂組成物を得た。
得られた硬化性樹脂組成物を用い、以下に示す要領で、試験をおこない、結果を表7に合わせて示す。なお、硬化条件は120℃×2時間の予備硬化の後150℃×5時間である。
(1)ピール試験 JIS K 6911 に準拠
支持体:銅箔粗面使用、サンプル幅:10mm、剥離スピード:3mm/分
(2)引っ張り試験 JIS K 6911に準拠
サンプル 厚み0.9±0.05mm 断面積4.5±0.2mm2
速度 5mm/min、チャック間距離 15mm
(3)LED点灯試験
実施例及び比較例で得られた硬化性樹脂組成物を真空脱泡20分間実施後、シリンジに充填し精密吐出装置を使用して、発光波長465nmを持つ発光素子を搭載した表面実装型LED(Φ5mm)に注型した。その後、所定の硬化条件で硬化させることで、点灯試験用LEDを得る。点灯試験は、加速試験のため、規定電流の7倍である210mAでの点灯試験を行った。詳細な条件は下記に示した。測定項目としては、40時間点灯前後の照度を積分球を使用して測定し、試験用LEDの照度の保持率を算出した。
点灯詳細条件
発光波長:465nm
駆動方式:定電流方式、210mA(発光素子規定電流は30mA)
駆動環境:25℃、65%RH
(4)耐ガス透過性試験(腐食ガス透過性試験);
得られた硬化性樹脂組成物で作成した、LEDをパッケージを下記条件で腐食性ガス中に放置し、封止内部の銀メッキされたリードフレーム部の色の変化を観察した。
<測定条件>
腐食ガス:硫化アンモニウム20%水溶液(硫黄成分が銀と反応した場合に黒く変色する)
接触方法:広口ガラス瓶の中に、硫化アンモニウム水溶液の容器と前記LEDパッケージを混在させ、広口ガラス瓶の蓋をして密閉状況下、揮発した硫化アンモニウムガスとLEDパッケージを接触させた。
腐食の判定:LEDパッケージ内部のリードフレームが黒く変色(黒化という)した時間を1時間毎に観察し、その変色時間が長い物ほど、耐腐食性ガス性にすぐれていると判断した。 Example 26, Comparative Example 7
The polyvalent carboxylic acid composition (MA-13) of the present invention, as a comparative example, the polycarboxylic acid resin (J-3) was used as a curing agent, and the epoxy resin obtained in Synthesis Examples 9 and 10 as an epoxy resin ( EP-3, EP-4), using curing accelerator (C2) and additives (AD-1, AD-2), and blending ratios (parts by weight) shown in Table 7 below, for 20 minutes Defoaming was performed to obtain a curable resin composition of the present invention and a comparative curable resin composition.
Using the obtained curable resin composition, a test was conducted in the following manner, and the results are shown in Table 7. The curing conditions are 150 ° C. × 5 hours after preliminary curing at 120 ° C. × 2 hours.
(1) Peel test Conforms to JIS K 6911 Support: Use of copper foil rough surface, Sample width: 10 mm, Peeling speed: 3 mm / min
(2) Tensile test Conforms to JIS K 6911 Sample Thickness 0.9 ± 0.05 mm Cross-sectional area 4.5 ± 0.2 mm 2
Speed 5mm / min, Chuck distance 15mm
(3) LED lighting test After carrying out vacuum defoaming for 20 minutes with the curable resin compositions obtained in Examples and Comparative Examples, a syringe is filled and a light emitting element having an emission wavelength of 465 nm is mounted using a precision discharge device. Was cast into a surface-mounted LED (Φ5 mm). Then, LED for lighting test is obtained by making it harden | cure on predetermined hardening conditions. The lighting test was performed at 210 mA, which is 7 times the specified current, for the acceleration test. Detailed conditions are shown below. As a measurement item, the illuminance before and after lighting for 40 hours was measured using an integrating sphere, and the illuminance retention rate of the test LED was calculated.
Detailed lighting conditions Light emission wavelength: 465nm
Drive method: constant current method, 210 mA (light emitting element specified current is 30 mA)
Driving environment: 25 ° C, 65% RH
(4) Gas permeation resistance test (corrosion gas permeability test);
The package of the LED prepared with the obtained curable resin composition was left in a corrosive gas under the following conditions, and the change in the color of the silver-plated lead frame inside the seal was observed.
<Measurement conditions>
Corrosive gas: 20% aqueous solution of ammonium sulfide (discolors black when sulfur component reacts with silver)
Contact method: A container of an ammonium sulfide aqueous solution and the LED package were mixed in a wide-mouth glass bottle, and the wide-mouth glass bottle was covered to bring the volatilized ammonium sulfide gas into contact with the LED package in a sealed state.
Judgment of corrosion: The time during which the lead frame inside the LED package was blackened (referred to as blackening) was observed every hour, and it was judged that the longer the color changing time, the better the corrosion resistance.
なお、本出願は、2009年10月6日付で出願された日本特許出願(特願2009-232113)に基づいており、その全体が引用により援用される。また、ここに引用されるすべての参照は全体として取り込まれる。 Although the invention has been described in detail with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is based on a Japanese patent application filed on October 6, 2009 (Japanese Patent Application No. 2009-232113), which is incorporated by reference in its entirety. Also, all references cited herein are incorporated as a whole.
Claims (12)
- 下記式(1)
(式(1)において、R1はエーテル結合を介しても良い炭素総数1~10アルキレン基を表し、R2はメチル基又はフェニル基を表す。また、nは繰り返し単位を表し、式(1)で表される化合物の重量平均分子量は500~5000である。)で表されるシリコーンオイル(a)と分子内に1個以上のカルボン酸無水物基をもつ化合物(b)とを付加反応させることにより得られるカルボン酸化合物(J)と、
2官能以上のアルコール性水酸基を有する飽和脂肪族多価アルコール(c)と分子内に1個以上のカルボン酸無水物基をもつ化合物(d)とを付加反応させることにより得られる多価カルボン酸化合物(K)と、
を含有することを特徴とする多価カルボン酸組成物。 Following formula (1)
(In Formula (1), R 1 represents an alkylene group having 1 to 10 carbon atoms that may be bonded via an ether bond, R 2 represents a methyl group or a phenyl group, n represents a repeating unit, and Formula (1) The weight average molecular weight of the compound represented by) is 500 to 5000. The addition reaction of the silicone oil (a) represented by) and the compound (b) having one or more carboxylic anhydride groups in the molecule. A carboxylic acid compound (J) obtained by
Polyvalent carboxylic acid obtained by addition reaction of saturated aliphatic polyhydric alcohol (c) having a bifunctional or higher alcoholic hydroxyl group and compound (d) having one or more carboxylic anhydride groups in the molecule Compound (K),
Containing a polyvalent carboxylic acid composition. - 前記化合物(b)および(d)が環状の飽和炭化水素を母骨格とする酸無水物であることを特徴とする請求項1記載の多価カルボン酸組成物。 The polyvalent carboxylic acid composition according to claim 1, wherein the compounds (b) and (d) are acid anhydrides having a cyclic saturated hydrocarbon as a mother skeleton.
- 前記化合物(b)および(d)がメチルヘキサヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、シクロヘキサン-1,2,4-トリカルボン酸-1,2-無水物およびビシクロ[2,2,1]ヘプタン-2,3-ジカルボン酸無水物からなる群より選ばれる少なくとも1種の酸無水物であることを特徴とする請求項1または2記載の多価カルボン酸組成物。 The compounds (b) and (d) are methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride and bicyclo [2,2,1] heptane- 3. The polyvalent carboxylic acid composition according to claim 1, wherein the polycarboxylic acid composition is at least one acid anhydride selected from the group consisting of 2,3-dicarboxylic acid anhydrides.
- 前記化合物(b)および(d)がメチルヘキサヒドロ無水フタル酸を必須とすることを特徴とする請求項3記載の多価カルボン酸組成物。 The polyvalent carboxylic acid composition according to claim 3, wherein the compounds (b) and (d) essentially comprise methylhexahydrophthalic anhydride.
- 前記化合物(c)が官能基数2~6の多価アルコールであって1分子中の総炭素数が5~20であることを特徴とする請求項1~4のいずれか一項に記載の多価カルボン酸組成物。 5. The polyhydric alcohol according to claim 1, wherein the compound (c) is a polyhydric alcohol having 2 to 6 functional groups, and the total number of carbon atoms in one molecule is 5 to 20. Carboxylic acid composition.
- 請求項1~5のいずれか一項に記載の多価カルボン酸組成物の製造方法であって、
シリコーンオイル(a)と2官能以上のアルコール性水酸基を有する飽和脂肪族多価アルコール(c)を含む混合物に、分子内に1個以上のカルボン酸無水物基をもつ化合物(b)および(d)を加え、前記シリコーンオイル(a)と前記化合物(b)の付加反応と、前記化合物(c)と前記化合物(d)の付加反応を同時に行なうことを特徴とする多価カルボン酸組成物の製造方法。 A method for producing a polyvalent carboxylic acid composition according to any one of claims 1 to 5,
Compounds (b) and (d) having one or more carboxylic anhydride groups in the molecule are added to a mixture containing silicone oil (a) and a saturated aliphatic polyhydric alcohol (c) having a bifunctional or higher functional alcoholic hydroxyl group. And the addition reaction between the silicone oil (a) and the compound (b) and the addition reaction between the compound (c) and the compound (d) are performed simultaneously. Production method. - 請求項1~5のいずれか一項に記載の多価カルボン酸組成物の製造方法であって、
以下の工程(A)、工程(B)を逐次的に1ポットで反応させることを特徴とする多価カルボン酸組成物の製造方法。
工程(A):シリコーンオイル(a)と分子内に1個以上のカルボン酸無水物基をもつ化合物(b)を付加反応させる工程
工程(B):2官能以上のアルコール性水酸基を有する飽和脂肪族多価アルコール(c)と分子内に1個以上のカルボン酸無水物基をもつ化合物(d)を付加反応させる工程 A method for producing a polyvalent carboxylic acid composition according to any one of claims 1 to 5,
A method for producing a polyvalent carboxylic acid composition, wherein the following step (A) and step (B) are sequentially reacted in one pot.
Step (A): Addition reaction of silicone oil (a) and compound (b) having one or more carboxylic anhydride groups in the molecule Step (B): Saturated fat having a bifunctional or higher functional alcoholic hydroxyl group A step of addition reaction of an aromatic polyhydric alcohol (c) and a compound (d) having one or more carboxylic anhydride groups in the molecule - 前記付加反応を、無溶剤、もしくは使用する原料における反応基質の総量に対して50重量%以下の有機溶剤中、40~150℃で行うことを特徴とする請求項6または7記載の多価カルボン酸組成物の製造方法。 8. The polyvalent carboxylic acid according to claim 6, wherein the addition reaction is carried out at 40 to 150 ° C. in an organic solvent in an amount of 50% by weight or less based on the total amount of the reaction substrate in the raw material to be used without solvent. A method for producing an acid composition.
- 請求項1~5のいずれか一項に記載の多価カルボン酸組成物とエポキシ樹脂とを含有する硬化性樹脂組成物。 A curable resin composition comprising the polyvalent carboxylic acid composition according to any one of claims 1 to 5 and an epoxy resin.
- 前記エポキシ樹脂が脂環式エポキシ樹脂および/またはエポキシ基含有シリコーン樹脂であることを特徴とする請求項9記載の硬化性樹脂組成物。 10. The curable resin composition according to claim 9, wherein the epoxy resin is an alicyclic epoxy resin and / or an epoxy group-containing silicone resin.
- 前記エポキシ樹脂がエポキシ基含有シリコーン樹脂であることを特徴とする請求項9記載の硬化性樹脂組成物。 10. The curable resin composition according to claim 9, wherein the epoxy resin is an epoxy group-containing silicone resin.
- 請求項9~11のいずれか一項に記載の硬化性樹脂組成物を硬化してなる硬化物。 A cured product obtained by curing the curable resin composition according to any one of claims 9 to 11.
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JPWO2011043400A1 (en) | 2013-03-04 |
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