WO2011038534A1 - 电磁波防护结构 - Google Patents

电磁波防护结构 Download PDF

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Publication number
WO2011038534A1
WO2011038534A1 PCT/CN2009/001115 CN2009001115W WO2011038534A1 WO 2011038534 A1 WO2011038534 A1 WO 2011038534A1 CN 2009001115 W CN2009001115 W CN 2009001115W WO 2011038534 A1 WO2011038534 A1 WO 2011038534A1
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Prior art keywords
electromagnetic wave
protection structure
substrate
wave protection
structure according
Prior art date
Application number
PCT/CN2009/001115
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English (en)
French (fr)
Inventor
林淑清
陈建州
Original Assignee
Lin Shuchling
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Application filed by Lin Shuchling filed Critical Lin Shuchling
Priority to PCT/CN2009/001115 priority Critical patent/WO2011038534A1/zh
Publication of WO2011038534A1 publication Critical patent/WO2011038534A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B2037/0092—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding in which absence of adhesives is explicitly presented as an advantage

Definitions

  • the invention relates to a protective structure, in particular to an electromagnetic wave protection structure. Background technique
  • An existing electromagnetic wave protection structure 1 includes (as shown in FIG. 1). A substrate 11; an adhesive layer 12 is adhered to the substrate 11; and a metal layer 13 is adhered to the adhesive layer 12.
  • the existing electromagnetic wave protection structure requires an adhesive layer to achieve the purpose of bonding the substrate and the metal layer, but the adhesion of the adhesive layer can only be used for the surface of the substrate, and is not suitable for the surface change.
  • the substrate, and the existing electromagnetic wave protection structure may cause denaturation of the adhesive layer due to changes in the temperature of the environment, and easily separate the substrate from the metal layer.
  • Another prior art uses a high-temperature spray method to coat a metal or a metal alloy on a substrate. Since the sprayed metal or metal alloy has a relatively high temperature, the substrate used must have heat resistance, so the base The use of materials will be limited, and high-temperature spraying will produce larger particles of metal or metal alloy, so the metal or metal alloy layer covering the surface of the substrate is less dense, and has less adhesion and larger Porosity.
  • Another prior art method uses an electroplating method to coat a metal or a metal alloy on a substrate. Since some electrolytes cause environmental pollution, and the substrate used must be impregnated into the electrolyte, the use of the substrate is also limited. .
  • the above-mentioned existing electromagnetic wave protection structure obviously has inconveniences and defects in structure and use, and needs to be further improved.
  • the relevant manufacturers do not bother to find a solution, but the design that has not been applied for a long time has been developed, and the general product has no suitable structure to solve the above problem, which is obviously related to the relevant industry.
  • Anxious to solve the problem. Therefore, how to create a new type of electromagnetic wave protection structure is one of the most important research and development topics at present, and it has become a goal that the industry needs to improve. Summary of the invention
  • the object of the present invention is to overcome the defects of the existing electromagnetic wave protection structure and provide a novel electromagnetic wave protection structure.
  • the technical problem to be solved is that it can utilize a normal temperature air pressure welding method to conductive materials (such as metal or The metal alloy is sprayed onto a substrate such that the metal or metal alloy is directly coated on the substrate without using an adhesive layer to avoid denaturation of the adhesive layer due to environmental temperature changes to the substrate and the metal layer. Detachable, very suitable for practical use.
  • Another object of the present invention is to provide a novel electromagnetic wave protection structure, and the technical problem to be solved is to enable a metal or metal alloy to be sprayed on a substrate having a plurality of surfaces by a normal temperature air pressure spraying method, thereby More suitable for practical use.
  • a further object of the present invention is to provide a novel electromagnetic wave protection structure, the technical problem to be solved is to enable a metal or metal alloy to be sprayed onto a substrate by a normal temperature air pressure spraying method.
  • the substrate may be paper, plastic, etc., and the metal or metal alloy layer on the surface of the substrate is denser, and has greater adhesion and less porosity, thereby being more suitable. Practical.
  • Still another object of the present invention is to provide a novel electromagnetic wave protection structure.
  • the technical problem to be solved is to enable a metal or metal alloy to be sprayed onto a substrate by a normal temperature air pressure spraying method, thereby avoiding the use of electroplating.
  • the electrolyte causes environmental pollution problems and avoids the limitation of the use of the substrate, thereby making it more powerful. It is suitable for practical use and has industrial use value.
  • An electromagnetic wave protection structure comprises: a substrate comprising a rough surface disposed on one side of the substrate; and at least one diffusion layer attached to the rough surface, the molten layer and the roughness The interface of the surface does not use an adhesive; wherein the spray layer is a conductive material.
  • the object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.
  • the substrate is one selected from the group consisting of paper, cloth batch, fiber, rubber, resin, plastic, and insulator.
  • the substrate is one selected from the group consisting of acrylonitrile-butadiene-styrene copolymer resin, polyimide film, and polyethylene film.
  • the substrate is one selected from the group consisting of a tile, a stone, a metal, and a metal alloy.
  • the electromagnetic wave protection structure wherein the molten layer is selected from the group consisting of lead, tin, zinc, aluminum, copper, nickel, gold, silver, zinc aluminum alloy, tin zinc alloy, zinc copper alloy and magnesium alloy.
  • the group consisting of lead, tin, zinc, aluminum, copper, nickel, gold, silver, zinc aluminum alloy, tin zinc alloy, zinc copper alloy and magnesium alloy.
  • the upper surface of the adhesion layer is 99. 8 gf / cm 2 - 150 Kgf / cm 2 0
  • the electromagnetic wave protection structure described above, wherein at least one of the spray layers is attached to the rough surface It is realized by a normal temperature air pressure spraying method.
  • the electromagnetic wave protection structure of the present invention has at least the following advantages and beneficial effects:
  • the electromagnetic wave protection structure of the present invention uses a normal temperature air pressure spraying method to spray a molten layer of a metal or a metal alloy onto a substrate, and It is not necessary to use an adhesive layer to bond the substrate and the metal layer to address the denaturation of the adhesive layer due to environmental temperature changes, so that the substrate and the metal layer overcome this disadvantage.
  • Figure 1 is a partial schematic layer view of a prior art electromagnetic wave protection structure.
  • FIG. 2 is a partial schematic view (1) of the electromagnetic wave protection structure of the present invention.
  • Figure 3 is a partial schematic view (2) of the electromagnetic wave protection structure of the present invention.
  • FIG. 4 is a flow chart showing a method of manufacturing the electromagnetic wave protection structure of the present invention.
  • the electromagnetic wave protection structure 2 comprises: a substrate 21; a rough surface 211 is disposed on one side of the substrate 21; and at least one spray layer 22 is attached thereto.
  • the interface of the spray layer 22 and the rough surface 211 does not use an adhesive; wherein the spray layer is a conductive material.
  • the substrate is an arbitrarily shaped substrate, and the substrate is one selected from the group consisting of paper, cloth, fiber, rubber, resin, plastic, and insulator, and the substrate may be acrylonitrile.
  • the substrate may also be selected from the group consisting of tiles, stones, metals, and metal alloys.
  • the molten layer is one selected from the group consisting of a metal and a metal alloy, and the molten layer may be lead, tin, zinc, aluminum, copper, nickel, gold, silver, zinc aluminum alloy, tin zinc alloy.
  • a group consisting of zinc-copper alloy and magnesium-aluminum alloy One of a group consisting of zinc-copper alloy and magnesium-aluminum alloy.
  • the adhesion of the molten layer to the rough surface is from 99. 8 gf/cm 2 to 150 gf/cm 2 , and the porosity of the molten layer is from 1 to 5%.
  • the deposition of the melted layer on the rough surface is achieved by a normal temperature air pressure spray method, and the normal temperature air pressure spray method has a spray temperature of 10 - 60 ° C! .
  • the manufacturing method of the electromagnetic wave protection structure of the present invention comprises the following steps:
  • a conductive material (such as a metal and a metal alloy) is melted by a normal temperature air pressure spraying method, and then the conductive material is sprayed onto the rough surface of the substrate by pressurized air.
  • the roughening treatment in S31 may be a step of sandblasting or plasma roughening.
  • the melting temperature of the conductive material in S32 to the rough surface of the substrate is 10 - 60 °C.
  • the normal temperature air pressure spraying method uses a spray pressure of 3 - 12 Bars; the spray machine used can adjust the melting temperature according to different conductive materials; the voltage used by the spray machine is
  • the electromagnetic wave protection structure of the present invention has the following advantages:
  • the electromagnetic wave protection structure of the present invention uses a normal temperature air pressure spraying method to spray a conductive material (such as a metal or a metal alloy) onto a substrate, so that the metal or metal alloy directly covers the substrate without using Adhesive layer to avoid the deformation of the adhesive layer due to environmental temperature changes to separate the substrate from the metal layer.
  • a conductive material such as a metal or a metal alloy
  • the electromagnetic wave protection structure of the present invention utilizes a normal temperature air pressure spraying method to spray a metal or a metal alloy onto a substrate having a plurality of surfaces.
  • the electromagnetic wave protection structure of the present invention which can spray a metal or a metal alloy onto a substrate by a normal temperature air pressure spraying method
  • the substrate is not limited to a material resistant to high temperature, and the substrate can be paper or plastic.
  • Such materials, and the metal or metal alloy layer on the surface of the substrate is denser, and has greater adhesion and less porosity.
  • the electromagnetic wave protection structure of the invention can spray a metal or a metal alloy onto a substrate by a normal temperature air pressure spraying method, thereby avoiding environmental pollution problems caused by the electrolyte when using the electroplating method and avoiding restrictions on the use of the substrate. .

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Description

电磁波防护结构 技术领域
本发明是有关于一种防护结构， 尤指一种电磁波防护结构。 背景技术
随着 3C产品的普及化， 电磁波干扰已经成为一项新的公害， 不论从电 器正常运作需求或人体健康顾虑考虑， 电磁波干扰问题都已经受到大众的 广泛注意。 此外， 由于各国亦重视此问题， 以电子产品为例， 各国开始针 对各种电子产品制定严格的电磁波千扰管制标准， 这对于电子产业界影响 极大。
针对电子信息产品的防电磁波干扰最直接的方法就是使用一个具有良 好电磁遮蔽效果的外壳， 将电磁线路组件与外界完全阻隔， 现有的一种电 磁波防护结构 1 , 包括（如图 1所示）： 一基材 11; 一黏着层 12是黏附于该基 材 11上； 及一金属层 13是黏附于该黏着层 12上。 该现有的电磁波防护结构 是需要使用一黏着层来达到使基材和金属层接合的目的， 但黏着层的贴合 只能使用于表面平整的基材， 并不适合使用于表面多变化的基材， 且现有' 的电磁波防护结构因环境的温度改变会造成黏着层的变性， 而易使基材和 金属层脱离。
另一种现有技术使用高温熔射法将金属或金属合金覆于一基材上， 因 喷出的金属或金属合金具有较高的温度， 因此使用的基材必须具有耐热性， 因此基材的使用会受到限制， 且高温熔射会产生颗粒较大的金属或金属合 金， 故覆于该基材表面的金属或金属合金层较不致密， 且具有较小的附着 力及较大的孔隙度。
另一种现有技术使用电镀法将金属或金属合金覆于基材上， 因一些电 解液会造成环境污染， 且使用的基材必须含浸于电解液中， 因此基材的使 用也会受到限制。
由此可见， 上述现有的电磁波防护结构在结构与使用上， 显然仍存在 有不便与缺陷， 而亟待加以进一步改进。 为了解决上述存在的问题， 相关 厂商莫不费尽心思来谋求解决之道， 但长久以来一直未见适用的设计被发 展完成， 而一般产品又没有适切结构能够解决上述问题， 此显然是相关业 者急欲解决的问题。 因此如何能创设一种新型的电磁波防护结构，实属当前 重要研发课题之一， 亦成为当前业界极需改进的目标。 发明内容 本发明的目的在于， 克服现有的电磁波防护结构存在的缺陷， 而提供 一种新型的电磁波防护结构 , 所要解决的技术问题是使其能利用一常温气 压熔射法将导电材料 (如金属或金属合金)熔射于一基材上， 使该金属或金 属合金直接覆于该基材上， 而不需使用黏着层， 以避免因环境的温度改变 而造成黏着层变性使基材和金属层脱离， 非常适于实用。
本发明的另一目的在于， 提供一种新型的电磁波防护结构， 所要解决 的技术问题是使其能利用一常温气压熔射法将金属或金属合金熔射于一表 面多变化的基材， 从而更加适于实用。
本发明的再一目的在于， 提供一种新型的电磁波防护结构， 所要解决 的技术问题是使其能利用一常温气压熔射法将金属或金属合金熔射于一基 材上， 该基材不受限于耐高温的材料， 该基材可为纸张、 塑料等材料， 且 该基材表面的金属或金属合金层较致密， 且具有较大的附着力及较小的孔 隙度， 从而更加适于实用。
本发明的还一目的在于， 提供一种新型的电磁波防护结构， 所要解决 的技术问题是使其能利用一常温气压熔射法将金属或金属合金熔射于一基 材上， 可以避免使用电镀法时， 电解液造成环境污染的问题及避免基材使 用的限制， 从而更力。适于实用， 且具有产业上的利用价值。
本发明的目的及解决其技术问题是采用以下技术方案来实现的。 依据 本发明提出的一种电磁波防护结构， 包括： 一基材， 包含一粗糙表面设于 该基材的一侧； 及至少一熔射层附着于该粗糙表面上， 该熔射层与该粗糙 表面的接口未使用黏着剂； 其中该熔射层为一导电性材料。
本发明的目的及解决其技术问题还可采用以下技术措施进一步实现。 前述的电磁波防护结构， 其中所述的基材为一任意形状的基材。
前述的电磁波防护结构， 其中所述的基材是选自纸张、 布批、 纤维、 橡胶、 树脂、 塑料及绝缘体所组成的群组的其中一个。
前述的电磁波防护结构， 其中所述的基材是选自丙烯腈一丁二烯一苯 乙烯共聚物树脂、 聚亚胺膜、 聚乙烯膜所组成的群组的其中一个。
前述的电磁波防护结构， 其中所述的基材是选自磁砖、 石材、 金属及 金属合金所组成的群组的其中一个。
前述的电磁波防护结构， 其中所述的熔射层是选自铅、 锡、 锌、 铝、 铜、 镍、 金、 银、 锌铝合金、 锡锌合金、 锌铜合金及镁铝合金所组成的群 组的其中一个。
前述的电磁波防护结构， 其中所述的熔射层附着于该粗糙表面的附着 力为 99. 8 gf/cm2一 150 Kgf/cm20
前述的电磁波防护结构， 其中所述的熔射层的孔隙率为 1 - 5%。
前述的电磁波防护结构， 其中至少一熔射层附着于该粗糙表面上是通 过一常温气压熔射法实现的。
前述的电磁波防护结构， 其中所述的常温气压熔射法的熔射温度为 10 - 60°C。
本发明与现有技术相比具有明显的优点和有益效果。 借由上述技术方 案， 本发明电磁波防护结构至少具有下列优点及有益效果： 本发明电磁波 防护结构是利用一常温气压熔射法将金属或金属合金的熔射层熔射于一基 材上， 而不需使用黏着层来黏合基材和金属层， 以解决因环境的温度改变 而造成黏着层变性， 使基材和金属层克服该缺点。
上述说明仅是本发明技术方案的概述， 为了能够更清楚了解本发明的 技术手段， 而可依照说明书的内容予以实施， 并且为了让本发明的上述和 其他目的、 特征和优点能够更明显易懂， 以下特举较佳实施例， 并配合附 图，详细说明如下。 基金基熔
附图的筒要说明 射材属材
图 1是现有技术的电磁波防护结构的局部示层层意图。
图 2是本发明电磁波防护结构的局部示意图（一）。
图 3是本发明电磁波防护结构的局部示意图（二）。
图 4是本发明电磁波防护结构的制造方法的流程图。
1： 现有的电磁波防护结构 11
12： 黏着层 13
2: 本发明电磁波防护结构 21
211 : 粗糙表面 11 实现发明的最佳方式
为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功 效，以下结合附图及较佳实施例， 对依据本发明提出的电磁波防护结构其具 体实施方式、 结构、 特征及其功效， 详细说明如后。
有关本发明的前述及其他技术内容、 特点及功效， 在以下配合参考图 式的较佳实施例的详细说明中将可清楚呈现。 通过具体实施方式的说明，当 可对本发明为达成预定目的所采取的技术手段及功效得一更加深入且具体 的了解， 然而所附图式仅是提供参考与说明之用， 并非用来对本发明加以 限制。
如图 2、 图 3所示， 本发明所提供的电磁波防护结构 2 , 包括： 一基材 21; 一粗糙表面 211设于该基材 21的一侧； 及至少一熔射层 22附着于该 粗糙表面 211上， 该熔射层 22与该粗糙表面 211的接口未使用黏着剂； 其 中该熔射层为一导电性材料。 其中该基材为一任意形状的基材， 且该基材是选自纸张、 布批、 纤维、 橡胶、 树脂、 塑料及绝缘体所组成的群组的其中一个， 且该基材可为丙烯 腈一丁二烯一苯乙烯共聚物（Acryloni tr i le butadiene s tyrene, ABS)树 脂、 聚亚胺膜、 聚乙烯膜所组成的群组的其中一个。 该基材也可选自磁砖、 石材、 金属及金属合金所组成的群组的其中一个。
该熔射层是选自金属及金属合金所组成的群组的其中一个， 且该熔射 层可为铅、 锡、 锌、 铝、 铜、 镍、 金、 银、 锌铝合金、 锡锌合金、 锌铜合 金及镁铝合金所组成的群组的其中一个。 该熔射层附着于该粗糙表面的附 着力为 99. 8 gf/cm2 - 150 gf/cm2 , 且该熔射层的孔隙率为 1 - 5%。
该熔射层附着于该粗糙表面上是通过一常温气压熔射法实现的， 且该 常温气压熔射法的熔射温度为 10 - 60°C！。
如图 4所示， 本发明电磁波防护结构的制造方法， 其步骤包括：
S 31: 将一基材表面进行粗糙处理， 得到一粗糙表面； 及
S32: 利用一常温气压熔射法将导电性材料 (如金属及金属合金)熔融 后， 再利用加压空气将该导电性材料熔射至该基材的粗糙表面上。
S31中的粗糙处理可为喷砂或电浆粗糙的步骤。 S32中该导电性材料熔 射至该基材的粗糙表面上的熔射温度为 10 - 60 °C。
S32 中该常温气压熔射法使用的喷涂气压为 3 - 12 Bars; 使用的熔射 机器能依据不同的导电性材料而调整熔融温度； 该熔射机器使用的电压为
20 - 50V, 使用的电流为 185 - 295安培。
综上所述， 本发明电磁波防护结构具有以下的优点：
1、 本发明电磁波防护结构利用一常温气压熔射法将导电材料 (如金属 或金属合金)熔射于一基材上， 使该金属或金属合金直接覆于该基材上， 而 不需使用黏着层， 以避免因环境的温度改变而造成黏着层变性使基材和金 属层脱离。
2、 本发明电磁波防护结构利用一常温气压熔射法可将金属或金属合金 熔射于一表面多变化的基材。
3、 本发明电磁波防护结构， 其能利用一常温气压熔射法将金属或金属 合金熔射于一基材上， 该基材不受限于耐高温的材料， 该基材可为纸张、 塑料等材料， 且该基材表面的金属或金属合金层较致密， 且具有较大的附 着力及较小的孔隙度。
4、 本发明电磁波防护结构， 其能利用一常温气压熔射法将金属或金属 合金熔射于一基材上， 可以避免使用电镀法时， 电解液造成环境污染问题 及避免基材使用的限制。
以上所述， 仅是本发明的较佳实施例而已， 并非对本发明作任何形式 上的限制， 虽然本发明已以较佳实施例揭露如上， 然而并非用以限定本发 明，任何熟悉本专业的技术人员， 在不脱离本发明技术方案范围内，当可利 用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例 ,但 凡是未脱离本发明技术方案内容， 依据本发明的技术实质对以上实施例所 作的任何简单修改、 等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims

权 利 要 求
1.一种电磁波防护结构， 其特征在于其包括：
一基材， 包含一粗糙表面设于该基材的一侧； 以及
至少一熔射层附着于该粗糙表面上， 该熔射层与该粗糙表面的接口未 使用黏着剂；
其中该熔射层为一导电性材料。
2.根据权利要求 1所述的电磁波防护结构， 其特征在于其中所述的基 材为一任意形状的基材。
3.根据权利要求 1所述的电磁波防护结构， 其特征在于其中所述的基 材是选自纸张、 布批、 纤维、 橡胶、 树脂、 塑料及绝缘体所组成的群组的 其中一个。
4.根据权利要求 1所述的电磁波防护结构， 其特征在于其中所述的基 材是选自丙烯腈一丁二烯一苯乙烯共聚物树脂、 聚亚胺膜、 聚乙烯膜所组 成的群组的其中一个。
5.根据权利要求 1所述的电磁波防护结构， 其特征在于其中所述的基 材是选自磁碚、 石材、 金属及金属合金所组成的群组的其中一个。
6.根据权利要求 1所述的电磁波防护结构， 其特征在于其中所述的熔 射层是选自铅、 锡、 锌、 铝、 铜、 镍、 金、 银、 锌铝合金、 锡锌合金、 锌 铜合金及镁铝合金所组成的群组的其中一个。
7.根据权利要求 1所述的电磁波防护结构， 其特征在于其中所述的熔 射层附着于该粗糙表面的附着力为 99. 8 Kgf/cm2 - 150 Kgf/cm2 0
8.根据权利要求 1所述的电磁波防护结构， 其特征在于其中所述的熔 射层的孔隙率为 1 - 5%。
9.根据权利要求 1所述的电磁波防护结构， 其特征在于其中至少一熔 射层附着于该粗糙表面上是通过一常温气压熔射法实现的。
10. 根据权利要求 1所述的电磁波防护结构，其特征在于其中所述的 常温气压熔射法的熔射温度为 10 - 60°C；。
PCT/CN2009/001115 2009-09-30 2009-09-30 电磁波防护结构 WO2011038534A1 (zh)

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CN101538697A (zh) * 2008-03-20 2009-09-23 林淑清 无燃烧熔射的喷覆方法
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