.200942151 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種防護結構’尤其係指—種電磁波防護結構，其係利 用-常溫氣壓熔射法製造該電磁波防護結構，該電磁波防護結構係應用於 電子3C產品之電磁波防護或其他電磁波防護材料之領域。 【先前技術】 隨著3C產品的普及化’電磁波干擾已經成為一項新的公害，不論從電 ❹冑正常運作需求或人體健康顧慮考量，電磁波干擾問題都已經受到大幕的 廣泛注意。此外，由於各_重視關題，叫子產品為例，各國開始針 對各種電子產品制定嚴格的電磁波干擾管制標準，這對於電子產業界影響 極大。 針對電子資訊產品的防電磁波干擾最直接的方法就是使用一個具有良 好_遮蔽效果的外殼，將電磁線路元件與外界完全阻隔，f知的一種電 磁波防護結構卜包括(如第一圖所示):一基材in -黏著層12係黏附於 該基材11上；及一金屬層13係黏附於該黏著層12上。此習知的電磁波防 護結構係需要使用-黏著層來達到使基材和金屬層接合之目的，_黏著層 ❹之餘只駿躲表面平整之基材，並科合使將表衫魏之基材， 且習知的電磁波防護結構因環境的溫度改變會造成黏著層的變性而易使 基材和金屬層脱離。 另-種習知技術使用高溫嫁射法將金屬或金屢合金覆於一基材上因 喷出之金屬或金屬合金具有較高之溫度，故·之基材必須具有耐妖性， 因此基材之使用會受到限制，且高射會產生顆粒較大的金屬或:屬么 金’故覆於該基材表_金屬或金屬合金層鮮緻密，且具有較小^ 力及較大的孔隙度。 另-種習知技術使用電鍍法將金屬或金屬合金覆於基材上因一 -解液會造成環境之污染，且使用之基材必須含浸於電解液中，因此^之 5 .200942151 使用也會受到限制。 本發明人鑑於上述之習知技術可改善，故提出一種電磁波防護結 以解決習知技術之缺點。 【發明内容】 本發明之主要目的在於提供一種電磁波防護結構，其係能利用—常溫 氣壓溶射法將導電材料(如金屬歧屬合金)雜於—基材上，使該金屬或 金屬合金直接覆雌基材上，而不需使職著層，⑽免因環境的溫度改 變而造成黏著層變性使基材和金屬層脫離。 © 本發明之次要目的在於提供一種電磁波防護結構，其係能利用一常溫 氣壓熔射法將金屬或金屬合金溶射於一表面多變化之基材。 本發明之另一目的在於提供一種電磁波防護結構，其係能利用一常溫 氣壓熔射法將金屬或金屬合金熔射於一基材上，該基材不受限於耐高溫之 材料，該基材可為紙張、塑膠等材料，且該基材表面的金屬或金屬合金層 較緻密，且具有較大的附著力及較小的孔隙度。 本發明之又一目的在於提供一種電磁波防護結構，其係能利用一常溫 軋塵炼射法將金屬或金屬合金熔射於一基材上，可以避免使用電鑛法時， ^ 電解液造成環境污染之問題及避免基材使用之限制。 本發明提供一種電磁波防護結構’包括•·一基材，係包含一粗糙表面 設於該基材之一侧；及至少一熔射層附著於該粗糙表面上，該熔射層與該 粗糙表面之介面未使用黏著劑；其中該熔射層為一導電释材料。 【實施方式】 茲為使貴審查委員對本發明之特徵及方法步驟有更進一步之瞭解與 認識’現將詳細設計之原理及本發明之較佳實施例說明如後。 本發明電磁波防護結構2 ’包括(如第二圖及第三圖所示）：一基材μ ; 一粗糙表面211設於該基材21之一側；及至少一熔射層22附著於該粗糙 6 200942151 之介面未使用黏著劑；其中該 表面211上，該溶射層22與該粗糙表面211 熔射層為一導電性材料。 其中該基材為-任意形狀之基材’且該基材係選自紙張布批 橡膠、樹脂、塑膠及絕緣體所組成之群組之其中之一者且該其〃难、 稀腈—丁二烯—苯乙烯共聚物(Acryl〇nitrile⑽地咖晰咖可= 樹脂、聚亞胺膜、聚乙烯膜所組成之群組之其中之一者。該基材也可選自 磁碑、石材、金屬及金屬合金所組成之群組之其中之一者。。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The structure is applied to the field of electromagnetic wave protection or other electromagnetic wave protection materials for electronic 3C products. [Prior Art] With the popularization of 3C products, electromagnetic wave interference has become a new public hazard. Regardless of the normal operation requirements of electric power or human health concerns, electromagnetic wave interference has been widely watched by the curtain. In addition, due to the importance of various issues, called sub-products as an example, countries began to set strict electromagnetic interference control standards for various electronic products, which has a great impact on the electronics industry. The most direct method for preventing electromagnetic wave interference of electronic information products is to use a casing with good shielding effect to completely block the electromagnetic circuit components from the outside world. An electromagnetic wave protection structure known to be included (as shown in the first figure): A substrate in-adhesive layer 12 is adhered to the substrate 11; and a metal layer 13 is adhered to the adhesive layer 12. The conventional electromagnetic wave protection structure requires the use of an adhesive layer to achieve the purpose of bonding the substrate and the metal layer, and the adhesive layer is only used to hide the surface of the substrate, and the substrate of the watch is made. Moreover, the known electromagnetic wave protection structure may cause the adhesive layer to be denatured due to changes in the temperature of the environment, and the substrate and the metal layer are easily detached. Another conventional technique uses a high-temperature grafting method to coat a metal or a gold alloy on a substrate. Since the metal or metal alloy to be ejected has a high temperature, the substrate must have a demon resistance. The use of materials will be limited, and high-exposure will produce larger particles of metal or: it belongs to the substrate. Therefore, the metal or metal alloy layer is fresh and dense, and has a small force and a large porosity. . Another conventional technique uses an electroplating method to coat a metal or a metal alloy on a substrate, which causes environmental pollution due to the one-solution solution, and the substrate to be used must be impregnated in the electrolyte, so that the use of the 5.200942151 is also used. Will be restricted. The present inventors have proposed an electromagnetic wave protection junction to solve the disadvantages of the prior art in view of the above-described conventional techniques. SUMMARY OF THE INVENTION The main object of the present invention is to provide an electromagnetic wave protection structure, which can utilize a normal temperature air pressure spraying method to mix a conductive material (such as a metal alloy) on a substrate to directly cover the metal or metal alloy. On the female substrate, without the need for a layer of work, (10) to avoid the deformation of the adhesive layer due to environmental temperature changes to separate the substrate from the metal layer. A secondary object of the present invention is to provide an electromagnetic wave protection structure capable of displacing a metal or a metal alloy on a substrate having a plurality of surfaces by a normal temperature gas pressure spraying method. Another object of the present invention is to provide an electromagnetic wave protection structure capable of spraying a metal or a metal alloy onto a substrate by a normal temperature air pressure spraying method, the substrate being not limited to a material resistant to high temperature, the substrate The material may be paper, plastic or the like, and the metal or metal alloy layer on the surface of the substrate is denser, and has greater adhesion and less porosity. Another object of the present invention is to provide an electromagnetic wave protection structure capable of spraying a metal or a metal alloy onto a substrate by a normal temperature dusting refining method, which can avoid the use of the electro-mine method, and the electrolyte causes the environment. Pollution problems and restrictions on avoiding substrate use. The present invention provides an electromagnetic wave protection structure comprising: a substrate comprising a rough surface disposed on one side of the substrate; and at least one diffusion layer attached to the rough surface, the molten layer and the rough surface No adhesive is used for the interface; wherein the molten layer is a conductive release material. [Embodiment] A more detailed understanding of the present invention and the method of the present invention will be apparent from the following description. The electromagnetic wave protection structure 2' of the present invention comprises (as shown in the second and third figures): a substrate μ; a rough surface 211 is disposed on one side of the substrate 21; and at least one of the spray layers 22 is attached thereto The interface of Rough 6 200942151 does not use an adhesive; wherein on the surface 211, the molten layer 22 and the rough surface 211 are a conductive material. Wherein the substrate is a substrate of any shape and the substrate is selected from the group consisting of paper cloth rubber, resin, plastic and insulator, and the dilute nitrile-butadiene One of the group consisting of a resin, a polyimide film, and a polyethylene film. The substrate may also be selected from the group consisting of a magnetic monument, a stone, and a metal. And one of the group consisting of metal alloys.
該熔射層係選自金屬及金屬合金所組成之群組之其中之一者且該熔 射層可為錯、錫、鋅、銘、銅、錄、金、銀、辞齡金、錫辞合金、辞銅 合金及馳合金所組成之群組之其中之―者。該、騎層附著於該粗链表面 之附著力為99.8 Kgf/cm2〜150 Kgf/cm2，且該熔射層之孔隙率為卜5%。 該熔射層附著於該粗糙表面上係藉由一常溫氣壓熔射法，且該常溫氣 壓熔射法之熔射溫度為10〜6(TC。 本發明電磁波防護結構之製造方法，其步驟包括(如第四圖所示）： S31將一基材表面進行粗链處理，得到一粗链表面；及 S32利用一常溫氣壓熔射法將導電性材料(如金屬及金屬合金)熔融後，再 利用加壓空氣將該導電性材料熔射至該基材之粗糖表面上。 S31中的粗糖處理可為噴砂或電漿粗糙之步驟eS32中該導電性材料溶 射至該基材之粗糙表面上之熔射溫度為1〇〜6〇。匸。 S32中該常溫氣壓溶射法使用之喷塗氣壓為3〜12 Bars ;使用之熔射機 器能依據不同之導電性材料而調整熔融溫度；該疼射機器使甩之電壓為 20〜50V，使用之電流為185〜295安培。 綜上所述’本發明電磁波防護結構具有以下之優點： 1.本發明電磁波防護結構利用一常溫氣壓熔射法將導電材料(如金屬或金 屬合金)熔射於一基材上，使該金屬或金屬合金直接覆於該基材上，而 不需使用黏著層’以避免因環境的溫度改變而造成黏著層變性使基材和 金屬層脫離。 200942151 2·本發明電魏防護結構利用—常溫氣壓熔射法可將金屬或金屬合金溶 射於一表面多變化之基材。 3. 本發明電磁波防護結構，其係能利用一常溫氣壓熔射法將金屬或金属合 金熔射於-基材上’該基材不受限於财高溫之材料，該基材可為紙張、 塑膠等材料’且該基材表面的金屬或金屠合金層較敏密，且具有較大的 附著力及較小的孔隙度。 4. 本發明電磁波防護結構’其係能利用一常溫氣壓熔射法將金屬或金屬合 金熔射於一基材上，可以避免使用電鍍法時，電解液造成環境污染之問 題及避免基材使用之限制。 惟以上所述者’僅為本發明之較佳實施例而已，並非用來限定本發明 實施之範圍，舉凡依本發明申請專利範圍所述之構造、特徵及精神所為之 均等變化與修飾’均應包括於本發明之申請專利範圍内。 【圖式簡單說明】 第一圊為習知電磁波防護結構之局部示意圖。 第二圊為本發明電磁波防護結構之局部示意圖（一）。 第三圖為本發明電磁波防護結構之局部示意圖（二）。 第四圖為本發明電磁波防護結構之製造方法的流程圖。 【主要元件符號說明】 1 習知電磁波防護結構 22溶射層· 11基材 12黏著層 13金屬層 2 本發明電磁波防護結構 21基材 211粗糙表面 8The molten layer is selected from one of a group consisting of a metal and a metal alloy, and the molten layer may be a wrong, tin, zinc, inscription, copper, recorded, gold, silver, gold age, tin Among the groups of alloys, copper alloys and alloys. The adhesion of the riding layer to the surface of the thick chain is 99.8 Kgf/cm2 to 150 Kgf/cm2, and the porosity of the molten layer is 5%. The molten layer is attached to the rough surface by a normal temperature air pressure spraying method, and the normal temperature air pressure spraying method has a spraying temperature of 10 to 6 (TC. The manufacturing method of the electromagnetic wave protection structure of the present invention, the steps of which include (As shown in the fourth figure): S31 performs a thick chain treatment on the surface of a substrate to obtain a thick chain surface; and S32 melts a conductive material (such as a metal and a metal alloy) by a normal temperature gas pressure melting method, and then The conductive material is sprayed onto the surface of the raw sugar of the substrate by pressurized air. The raw sugar treatment in S31 may be blasting or plasma roughening. The conductive material is sprayed onto the rough surface of the substrate in step eS32. The spraying temperature is 1〇~6〇.匸. The spraying pressure of the normal temperature air pressure spraying method in S32 is 3~12 Bars; the spraying machine used can adjust the melting temperature according to different conductive materials; The voltage of the machine is 20~50V, and the current used is 185~295 amps. In summary, the electromagnetic wave protection structure of the invention has the following advantages: 1. The electromagnetic wave protection structure of the invention utilizes a normal temperature air pressure welding method to conduct electricity. material( a metal or metal alloy is sprayed onto a substrate such that the metal or metal alloy is directly applied to the substrate without the use of an adhesive layer to avoid denaturation of the adhesive layer due to environmental temperature changes. The metal layer is detached. 200942151 2. The invention discloses the electric WE protection structure - the normal temperature air pressure spraying method can dissolve the metal or the metal alloy on a substrate having a plurality of changes on the surface. 3. The electromagnetic wave protection structure of the invention can utilize a normal temperature The air pressure spraying method melts a metal or a metal alloy onto a substrate. The substrate is not limited to a material having a high temperature, and the substrate may be a material such as paper, plastic, etc. and the surface of the substrate is metal or gold. The alloy layer is relatively dense and has a large adhesion and a small porosity. 4. The electromagnetic wave protection structure of the invention can fuse a metal or a metal alloy onto a substrate by a normal temperature air pressure spraying method. It is possible to avoid the problem of environmental pollution caused by the use of the electroplating method and the limitation of avoiding the use of the substrate. However, the above description is only a preferred embodiment of the present invention and is not intended to limit the practice of the present invention. The scope and the spirit of the invention are all included in the scope of the present invention. The first one is a conventional electromagnetic wave. The second schematic diagram is a partial schematic view of the electromagnetic wave protection structure of the present invention (1). The third diagram is a partial schematic diagram of the electromagnetic wave protection structure of the present invention (2). The fourth diagram is a manufacturing method of the electromagnetic wave protection structure of the present invention. [Main element symbol description] 1 conventional electromagnetic wave protection structure 22 spray layer · 11 substrate 12 adhesive layer 13 metal layer 2 electromagnetic wave protection structure 21 of the present invention substrate 211 rough surface 8