WO2011038242A3 - Injecteur de gaz hybride - Google Patents
Injecteur de gaz hybride Download PDFInfo
- Publication number
- WO2011038242A3 WO2011038242A3 PCT/US2010/050217 US2010050217W WO2011038242A3 WO 2011038242 A3 WO2011038242 A3 WO 2011038242A3 US 2010050217 W US2010050217 W US 2010050217W WO 2011038242 A3 WO2011038242 A3 WO 2011038242A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- axis
- gas injector
- distal end
- extending along
- bore extending
- Prior art date
Links
- 239000000463 material Substances 0.000 abstract 3
- 239000010902 straw Substances 0.000 abstract 2
- 239000012530 fluid Substances 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract 1
- 229910010271 silicon carbide Inorganic materials 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45578—Elongated nozzles, tubes with holes
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Silicon Compounds (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10819542.1A EP2481082B1 (fr) | 2009-09-25 | 2010-09-24 | Injecteur de gaz hybride |
JP2012531072A JP5802672B2 (ja) | 2009-09-25 | 2010-09-24 | ハイブリッドガスインジェクタ |
KR1020127006659A KR20120085745A (ko) | 2009-09-25 | 2010-09-24 | 하이브리드 가스 인젝터 |
CN201080042558.6A CN102656666B (zh) | 2009-09-25 | 2010-09-24 | 混合气体注射器 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27736109P | 2009-09-25 | 2009-09-25 | |
US61/277,361 | 2009-09-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011038242A2 WO2011038242A2 (fr) | 2011-03-31 |
WO2011038242A3 true WO2011038242A3 (fr) | 2011-06-16 |
Family
ID=43796508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/050217 WO2011038242A2 (fr) | 2009-09-25 | 2010-09-24 | Injecteur de gaz hybride |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110232568A1 (fr) |
EP (1) | EP2481082B1 (fr) |
JP (1) | JP5802672B2 (fr) |
KR (1) | KR20120085745A (fr) |
CN (1) | CN102656666B (fr) |
WO (1) | WO2011038242A2 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2705031T3 (es) * | 2012-04-27 | 2019-03-21 | Arkema Inc | Campana para recubrir recipientes de vidrio con vapor de óxido metálico |
JP6176732B2 (ja) * | 2014-03-20 | 2017-08-09 | 株式会社日立国際電気 | ガス供給部、基板処理装置及び半導体装置の製造方法 |
US20170167023A1 (en) * | 2015-12-09 | 2017-06-15 | Lam Research Corporation | Silicon or silicon carbide gas injector for substrate processing systems |
AT518081B1 (de) * | 2015-12-22 | 2017-07-15 | Sico Tech Gmbh | Injektor aus Silizium für die Halbleiterindustrie |
US11993847B2 (en) * | 2020-01-08 | 2024-05-28 | Asm Ip Holding B.V. | Injector |
CN115386861B (zh) * | 2022-10-27 | 2023-04-07 | 盛吉盛(宁波)半导体科技有限公司 | 一种化学气相沉积设备的导气管及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10284426A (ja) * | 1997-04-10 | 1998-10-23 | Kokusai Electric Co Ltd | ノズル |
JP2001351871A (ja) * | 2000-06-09 | 2001-12-21 | Asm Japan Kk | 半導体製造装置 |
WO2006030857A1 (fr) * | 2004-09-16 | 2006-03-23 | Hitachi Kokusai Electric Inc. | Appareil de traitement thermique et procede de fabrication de substrat |
US20060211218A1 (en) * | 2005-03-03 | 2006-09-21 | Boyle James E | Baffle wafers and randomly oriented polycrystalline silicon used therefor |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3761114A (en) * | 1971-08-30 | 1973-09-25 | Victaulic Co Ltd | Pipe to flange couplings |
US3942141A (en) * | 1972-05-26 | 1976-03-02 | Licentia Patent-Verwaltungs-G.M.B.H. | Flange |
FR2490246A1 (fr) * | 1980-09-17 | 1982-03-19 | Cit Alcatel | Dispositif de deposition chimique activee sous plasma |
US4448448A (en) * | 1982-03-22 | 1984-05-15 | Raphael Theresa Pollia | Coupling system |
JPH0719143Y2 (ja) * | 1990-04-26 | 1995-05-01 | 日本エー・エス・エム株式会社 | ガス導入装置を有するcvd装置 |
JPH04280420A (ja) * | 1991-03-07 | 1992-10-06 | Toshiba Corp | 熱処理装置 |
US5318633A (en) * | 1991-03-07 | 1994-06-07 | Tokyo Electron Sagami Limited | Heat treating apparatus |
JPH05243161A (ja) * | 1992-01-29 | 1993-09-21 | Nec Corp | 気相成長装置及びエピタキシャル膜の成長方法 |
US5441570A (en) * | 1993-06-22 | 1995-08-15 | Jein Technics Co., Ltd. | Apparatus for low pressure chemical vapor deposition |
US5578132A (en) * | 1993-07-07 | 1996-11-26 | Tokyo Electron Kabushiki Kaisha | Apparatus for heat treating semiconductors at normal pressure and low pressure |
JPH09260298A (ja) * | 1996-03-18 | 1997-10-03 | Kokusai Electric Co Ltd | 半導体製造装置の反応ガス導入ノズル支持構造 |
JP2001230212A (ja) * | 2000-02-16 | 2001-08-24 | Tokyo Electron Ltd | 縦型熱処理装置 |
JP2001267255A (ja) * | 2000-03-21 | 2001-09-28 | Nec Corp | 気相成長装置及び気相成長方法 |
US6450346B1 (en) | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
US6455395B1 (en) * | 2000-06-30 | 2002-09-24 | Integrated Materials, Inc. | Method of fabricating silicon structures including fixtures for supporting wafers |
JP3572247B2 (ja) * | 2000-10-06 | 2004-09-29 | 東芝セラミックス株式会社 | 半導体熱処理炉用ガス導入管 |
JP2002334868A (ja) * | 2001-05-10 | 2002-11-22 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
US20020170487A1 (en) * | 2001-05-18 | 2002-11-21 | Raanan Zehavi | Pre-coated silicon fixtures used in a high temperature process |
US7083694B2 (en) * | 2003-04-23 | 2006-08-01 | Integrated Materials, Inc. | Adhesive of a silicon and silica composite particularly useful for joining silicon parts |
US6830449B1 (en) * | 2004-02-02 | 2004-12-14 | Sis Microelectronics Corporation | Injector robot for replacing a gas injector in a furnace |
JP2006080256A (ja) * | 2004-09-09 | 2006-03-23 | Hitachi Kokusai Electric Inc | 基板処理装置 |
US20060185589A1 (en) * | 2005-02-23 | 2006-08-24 | Raanan Zehavi | Silicon gas injector and method of making |
US7910494B2 (en) * | 2006-03-29 | 2011-03-22 | Tokyo Electron Limited | Thermal processing furnace, gas delivery system therefor, and methods for delivering a process gas thereto |
US8070880B2 (en) * | 2007-10-22 | 2011-12-06 | Hitachi Kokusai Electric, Inc. | Substrate processing apparatus |
JP5237133B2 (ja) * | 2008-02-20 | 2013-07-17 | 株式会社日立国際電気 | 基板処理装置 |
-
2010
- 2010-09-24 US US12/890,329 patent/US20110232568A1/en not_active Abandoned
- 2010-09-24 EP EP10819542.1A patent/EP2481082B1/fr active Active
- 2010-09-24 CN CN201080042558.6A patent/CN102656666B/zh active Active
- 2010-09-24 KR KR1020127006659A patent/KR20120085745A/ko not_active Application Discontinuation
- 2010-09-24 JP JP2012531072A patent/JP5802672B2/ja active Active
- 2010-09-24 WO PCT/US2010/050217 patent/WO2011038242A2/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10284426A (ja) * | 1997-04-10 | 1998-10-23 | Kokusai Electric Co Ltd | ノズル |
JP2001351871A (ja) * | 2000-06-09 | 2001-12-21 | Asm Japan Kk | 半導体製造装置 |
WO2006030857A1 (fr) * | 2004-09-16 | 2006-03-23 | Hitachi Kokusai Electric Inc. | Appareil de traitement thermique et procede de fabrication de substrat |
US20060211218A1 (en) * | 2005-03-03 | 2006-09-21 | Boyle James E | Baffle wafers and randomly oriented polycrystalline silicon used therefor |
Also Published As
Publication number | Publication date |
---|---|
EP2481082A4 (fr) | 2013-07-10 |
WO2011038242A2 (fr) | 2011-03-31 |
EP2481082B1 (fr) | 2017-06-21 |
CN102656666A (zh) | 2012-09-05 |
JP2013506300A (ja) | 2013-02-21 |
US20110232568A1 (en) | 2011-09-29 |
CN102656666B (zh) | 2015-06-24 |
KR20120085745A (ko) | 2012-08-01 |
JP5802672B2 (ja) | 2015-10-28 |
EP2481082A2 (fr) | 2012-08-01 |
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