WO2011035526A1 - 一种大功率led灯 - Google Patents

一种大功率led灯 Download PDF

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Publication number
WO2011035526A1
WO2011035526A1 PCT/CN2010/000231 CN2010000231W WO2011035526A1 WO 2011035526 A1 WO2011035526 A1 WO 2011035526A1 CN 2010000231 W CN2010000231 W CN 2010000231W WO 2011035526 A1 WO2011035526 A1 WO 2011035526A1
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WO
WIPO (PCT)
Prior art keywords
refrigerant
heat
heat pipe
led lamp
plate
Prior art date
Application number
PCT/CN2010/000231
Other languages
English (en)
French (fr)
Inventor
汪纯燕
Original Assignee
Wang Chunyan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN200910192767A external-priority patent/CN101666440A/zh
Priority claimed from CN2009202365103U external-priority patent/CN201475757U/zh
Application filed by Wang Chunyan filed Critical Wang Chunyan
Publication of WO2011035526A1 publication Critical patent/WO2011035526A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the invention relates to the field of LED lamp lighting devices, in particular to a high-power LED lamp using a heat pipe heat dissipation method. Background technique
  • high-performance high-power LED lamps are widely used in lighting and lighting applications such as roads, buildings, and plazas.
  • the power of the LED lamp is increased, and the heat generation is also increased. If the heat generated by the high-power LED chip in the lamp housing cannot be discharged in time, the high-power LED lamp cannot be normally illuminated.
  • the above phenomenon occurs mainly because the heat generated by the chip of the LED lamp during operation cannot be quickly transmitted to the surface of the heat sink, thereby generating a junction temperature. When the junction temperature exceeds a certain value, the chip will have a large light decay or even burn out. , seriously affect the life of LED lights.
  • High-power LED lamps when the power reaches 100W or more, if the natural convection heat is used, only the heat pipe radiator can be used for heat dissipation, and the heat pipe radiator is the best heat transfer device at present.
  • the heat pipe heat sink and the LED chip substrate currently used are separate components, and the substrate (b) of the packaged LED chip (a) is connected with the refrigerant plate (c) of the heat pipe heat sink by screws for assembly, in order to increase the heat conduction effect, generally Apply thermal grease (d) between the refrigerant plate (c) of the heat pipe radiator and the substrate (b), as shown in Figure 1.
  • the object of the present invention is to overcome the deficiencies of the prior art and provide a high-power LED lamp with high heat dissipation efficiency, strong applicability, which can promote product development to high power and effectively reduce cost.
  • a high-power LED lamp comprising an LED chip and a heat pipe heat sink, the heat pipe heat sink comprising a refrigerant plate and a heat pipe connected to the refrigerant plate, wherein the heat pipe is provided with a cold medium, a heat pipe
  • the heat dissipating fin is arranged on the surface, wherein the LED chip is directly packaged on a refrigerant plate, and a refrigerant chamber is opened in the refrigerant plate, and the refrigerant chamber is connected with the heat pipe, and the refrigerant medium body is charged.
  • the cold medium mass flow, the cold medium in the heat pipe and the cold medium in the refrigerant chamber are connected to form a heat transfer medium, which constitutes a heat dissipation channel for the heat generated by the LED chip to conduct outward.
  • the heat pipe is fixed to the refrigerant plate by welding and communicates with the refrigerant chamber.
  • the heat pipe is inserted into the refrigerant chamber; or the port of the heat pipe is connected to the side wall of the refrigerant plate and the refrigerant chamber is connected.
  • the refrigerant plate is an aluminum substrate; or the refrigerant plate is copper.
  • the invention basically applies a high-power LED lamp with a centralized package and a heat pipe heat sink (with heat-dissipating fin) structure in the prior art.
  • the LED chip is directly packaged on the refrigerant plate, and a refrigerant chamber connected to the heat pipe is opened in the refrigerant plate.
  • the heat pipe and the refrigerant chamber together form a refrigerant cavity, which constitutes heat generated by the LED chip.
  • the heat generated by the LED chip is directly and timely transmitted to the cold medium through the refrigerant plate, and then the heat is radiated outward through the heat pipe and the heat dissipating fin, replacing the conventional technology refrigerant plate and the packaged LED chip.
  • the connection relationship between the substrates avoids the thermal resistance of the metal connection cross section and greatly improves the thermal efficiency of the high power LED lamp.
  • the product of the invention has a simple structure and can be widely promoted in a high-power LED lamp with a heat pipe radiator (with heat-dissipating fin) structure, and has strong applicability; at the same time, the invention can better solve the heat dissipation of the high-power LED lamp.
  • the problem can effectively promote the development of LED products to high power, breaking through the traditional product centralized packaging high-power LED light chip can only reach the bottleneck below 300W, greatly expanding the application field of high-power LED lights;
  • the LED lamp reduces the process of applying thermal grease between the refrigerant plate and the substrate in the traditional product, effectively reducing the production cost of the product, integrating the structure of the product, increasing the integrity, and greatly avoiding the product during transportation or use. Loose or damaged.
  • FIG. 1 is a schematic structural view of a conventional LED lamp according to the background art
  • Figure 2 is a schematic structural view of a preferred embodiment of the present invention.
  • Figure 3 is a schematic view showing the structure of a refrigerant plate and a heat pipe according to a preferred embodiment of the present invention
  • Figure 4 is a schematic view showing another structure of the refrigerant plate and the heat pipe in the preferred embodiment of the present invention.
  • the high-power LED lamp of the present invention is mainly for a high-power LED lamp with a centralized package and a heat pipe radiator (with a heat dissipating fin) structure, and includes an LED chip 1 and a heat pipe radiator.
  • the heat pipe heat sink can conduct heat to the LED chip 1 to prevent the LED chip 1 from overheating.
  • the LED lamp of the centralized structure of the present invention has a heat pipe radiator including a refrigerant plate 2 and a heat pipe 3, and the heat pipe 3 is connected to the refrigerant plate 2, and the heat pipe 3 can be an aluminum pipe, a copper pipe or a stainless steel pipe.
  • the heat pipe 3 may be provided in a multi-tube structure.
  • the heat pipe 3 is provided with a cold medium, and the cold medium is generally filled with the inner cavity of the heat pipe 3.
  • the heat pipe 3 is provided with a heat radiating fin 4, and the heat radiating fin 4 is a sun finned structure, which can be pressed by an aluminum plate or a copper plate.
  • the cold medium in the heat pipe 3 absorbs the heat generated by the LED chip 1, and then transfers the heat to the heat radiating fin 4 to realize the heat dissipation effect of the LED lamp.
  • the LED chip 1 is directly packaged in a refrigerant plate.
  • the refrigerant plate 2 serves as a mounting substrate for the LED chip 1 and as a refrigerant substrate for the heat pipe heat sink.
  • a refrigerant chamber 5 is opened in the refrigerant plate 2.
  • the refrigerant chamber 5 is connected to the heat pipe 3, and the refrigerant chamber 5 is filled with a cold medium mass flow, and the cold medium in the heat pipe 3 communicates with the cold medium in the refrigerant chamber 5 to form a heat transfer medium, which constitutes the LED chip 1
  • the heat radiates out of the heat conduction channel.
  • the refrigerant chamber 5 may be a large cavity in the refrigerant plate 2 or a plurality of small chambers spaced apart from each other.
  • the heat pipe 3 is fixed to the refrigerant plate 2 by welding and communicates with the refrigerant chamber 5.
  • the heat generated by the LED chip 1 is directly and timely transmitted to the cold medium through the refrigerant plate 2, and then the heat is radiated outward through the heat pipe 3 and the heat dissipating fin 4, replacing the conventional technology refrigerant plate 2 and
  • the connection relationship between the substrates of the packaged LED chip 1 avoids the thermal resistance of the metal connection cross section, and greatly improves the thermal efficiency of the high power LED lamp.
  • the heat-dissipating tube 3 is inserted into the refrigerant chamber 5, and is fixed to the heat-dissipating tube 3 by a welded structure at the side contact portion of the refrigerant sheet 2, as shown in FIG. As shown in FIG. 3; or the flat seat type is used to fix the heat pipe 3 to the refrigerant plate 2, specifically, the port of the heat pipe 3 is flatly connected to the side wall of the refrigerant plate 2, and the refrigerant chamber 5 is connected to communicate with each other during heat dissipation. Tube 3 and refrigerant plate 2 is also fixed by the welded structure, as shown in Figure 4. Further, in the specific manufacturing process of the LED lamp according to the present invention, the refrigerant plate 2 is an aluminum substrate; or the refrigerant plate 2 is a copper substrate.
  • the high-power LED lamp adopting the structure of the invention has simple product structure and can be widely promoted in the heat pipe radiator (with heat-dissipating fin) structure, and has high applicability; it can better solve the high-power LED lamp.
  • the heat dissipation problem can effectively promote the development of LED products to high power, breaking through the traditional products, centralized packaging, high-power LED light chips can only reach the bottleneck below 300W, greatly expanding the application field of high-power LED lights;
  • the LED lamp of the invention reduces the process of applying thermal grease between the refrigerant plate 2 and the substrate in the conventional product, thereby effectively reducing the production cost of the product; and avoiding the need for the thermal grease to volatilize during future use. Regular maintenance work; product integration structure, increased integrity, and greatly avoid loose or damaged products during transportation or use.

Description

一种大功率 LED灯 技术领域
本发明涉及 LED灯照明器件领域，尤其是一种采用热管散热方式的大功率 LED灯。 背景技术
随着城市照明亮化工程的推进， 高性能大功率 LED灯被广泛应用于道路、 建筑、广场等室内外的照明亮化场合上。这种 LED灯功率的提高， 发热量也随 之增加，灯壳内的大功率 LED芯片发出的热量如果不能及时排出，将导致大功 率 LED灯不能正常发光。上述现象的出现， 主要是 LED灯的芯片在工作时产生 的热量不能迅速传递到散热器表面， 从而产生结温， 当结温超过一定值时， 就 会使芯片产生较大光衰甚至烧坏， 严重影响 LED灯寿命。 大功率 LED灯，当功 率达到 100W以上时， 如果采用自然对流方式散热， 只能用热管散热器散热， 而且热管散热器是目前最好的传递热量的器件。 目前使用的热管散热器与 LED 芯片基板是分体部件，装配时用螺丝把封装 LED芯片 （a) 的基板 （b ) 与热管 散热器的冷媒板（c )连接， 为增加导热效果， 一般在热管散热器的冷媒板（c ) 与基板 （b ) 之间涂上导热硅脂 （d ) ， 如图 1 所示。 上述结构中， 封装 LED 芯片 （a) 的基板 （b ) 与热管散热器的冷媒板 （c ) 连接后， 在金属连接界面 产生热阻， 该连接界面的热阻拖慢了散热效率， 使 LED灯的功率局限于 300W 以下， 而且耗能多， 致使成本增大。 发明内容
本发明的目的在于克服现有技术的不足，提供一种散热效率高、适用性强、 能促进产品向高功率发展、 有效降低成本的大功率 LED灯。
本发明的发明目的是这样实现的： 一种大功率 LED灯，包括 LED芯片及热 管散热器， 热管散热器包括冷媒板和连接在冷媒板上的散热管， 散热管内装有 冷媒介质， 散热管上设有散热翅， 其特征在于： 所述 LED芯片直接封装在冷媒 板上， 冷媒板内开有贮冷媒腔体， 贮冷媒腔体与散热管连通， 贮冷媒腔体内充 满冷媒介质流，散热管内的冷媒介质与贮冷媒腔体内的冷媒介质连通成一热量 传输媒介， 构成 LED芯片产生的热量向外传导的热散发通道。
上述结构的改进中， 所述散热管通过焊接固定在冷媒板上、并与贮冷媒腔 体连通。
作为上述结构的进一歩改进及细化， 所述散热管插入到贮冷媒腔体内； 或 者， 所述散热管的端口平接在冷媒板的侧壁上、 并贮冷媒腔体连通。
上述的任何一种结构中， 所述冷媒板为铝基板； 或者， 所述冷媒板为铜基 本发明对现有技术中集中式封装、 热管散热器（带散热翅）结构的大功率 LED灯进行改进， 将 LED芯片直接封装在冷媒板上， 并在冷媒板内开有与散热 管连通的贮冷媒腔体， 散热管与贮冷媒腔体共同构成一冷媒腔， 构成 LED芯片 产生的热量向外传导的热散发通道， LED 芯片所产生的热量直接、 及时地通 过冷媒板传输到冷媒介质上， 进而通过散热管、散热翅实现向外散发热量， 取 代了传统技术冷媒板与用于封装 LED芯片的基板之间的连接关系，避免了金属 连接截面的热阻， 大大提高了大功率 LED灯散的热效率。此外， 本发明所述的 产品结构简单， 可在热管散热器 （带散热翅） 结构的大功率 LED灯广泛推广， 适用性强； 同时， 由于本发明较好的解决了大功率 LED灯的散热问题， 能有效 促使 LED产品往高功率发展，突破了传统产品集中式封装大功率 LED灯芯片只 能做到达 300W以下的瓶颈， 大大地拓展了大功率 LED灯的应用领域； 而且， 本发明所述的 LED 灯， 减免了传统产品在冷媒板与基板之间涂导热硅脂的工 序， 有效降低产品的生产成本， 产品一体化结构， 增加了整体性， 也大大避免 产品在运输或使用过程中出现松脱或损坏现象。 附图说明
附图 1为背景技术所述传统 LED灯的结构示意图；
附图 2为本发明最佳实施例的结构示意图；
附图 3为本发明最佳实施例中， 冷媒板与散热管连接的结构示意图； 附图 4 为本发明最佳实施例中， 冷媒板与散热管连接的另一种结构示意 图。 具体实施方式
下面结合附图对本发明作进一歩的描述。
根据附图 2所示， 本发明所述的大功率 LED灯， 主要是针对集中式封装、 热管散热器 (带散热翅)结构的大功率 LED灯进行， 它包括 LED芯片 1及热管 散热器， 热管散热器作为一个独立的散热机构， 可对 LED芯片 1产生的热量向 外传导， 避免 LED芯片 1过热。本发明所涉及的集中式结构的 LED灯， 它的热 管散热器包括冷媒板 2和散热管 3， 散热管 3连接在冷媒板 2上， 散热管 3可 为铝管、 铜管或不锈钢管， 同时， 为了增强 LED灯的散热效果， 散热管 3可设 置为多管结构。散热管 3内装有冷媒介质，冷媒介质一般均充满散热管 3的内 腔， 散热管 3上设有散热翅 4， 散热翅 4为太阳花翅片结构， 可由铝板片或铜 板片压制而成。 LED灯工作时， 散热管 3内的冷媒介质吸收了 LED芯片 1产生 的热量， 然后将热量传输到散热翅 4上， 实现 LED灯的散热效果。
在图 2所示结构中， 本发明为了克服现有技术中集中式封装、热管散热器 (带散热翅）结构的大功率 LED灯的不足之处，将所述 LED芯片 1直接封装在 冷媒板 2上，冷媒板 2既作为 LED芯片 1的安装基板， 也作为热管散热器的冷 媒基板。同时，冷媒板 2内开有贮冷媒腔体 5。贮冷媒腔体 5与散热管 3连通， 贮冷媒腔体 5内充满冷媒介质流，散热管 3内的冷媒介质与贮冷媒腔体 5内的 冷媒介质连通成一热量传输媒介，构成 LED芯片 1产生的热量向外传导的热散 发通道。期间， 贮冷媒腔体 5可为可在冷媒板 2内一个大腔体， 也可为多个相 互间隔开的小腔体。在该结构的改进中，所述散热管 3通过焊接固定在冷媒板 2上、 并与贮冷媒腔体 5连通。 LED灯工作时， LED芯片 1所产生的热量直接、 及时地通过冷媒板 2传输到冷媒介质上， 进而通过散热管 3、 散热翅 4实现向 外散发热量，取代了传统技术冷媒板 2与用于封装 LED芯片 1的基板之间的连 接关系， 避免了金属连接截面的热阻， 大大提高了大功率 LED灯散的热效率。
在本发明所述的大功率 LED灯结构中， 所述散热管 3插入到贮冷媒腔体 5 内， 在冷媒板 2的侧面接触处通过焊接结构将其与散热管 3固定， 如图 2、 图 3所示； 或者采用平座式来将散热管 3固定在冷媒板 2， 具体是将散热管 3的 端口平接在冷媒板 2的侧壁上、并贮冷媒腔体 5连通， 期间散热管 3与冷媒板 2之间同样通过焊接结构固定， 如图 4所示。 此外， 在本发明所述的 LED灯的 具体制造过程中， 所述冷媒板 2为铝基板； 或者， 所述冷媒板 2为铜基板。
采用本发明结构的大功率 LED灯，它的产品结构简单，可在热管散热器（带 散热翅） 结构的大功率 LED灯广方推广， 适用性强； 它较好的解决了大功率 LED灯的散热问题， 能有效促使 LED产品往高功率发展， 突破了传统产品集中 式封装大功率 LED灯芯片只能做到达 300W以下的瓶颈， 极大地拓展了大功率 LED灯的应用领域； 而且， 本发明所述的 LED灯， 减免了传统产品在冷媒板 2 与基板之间涂导热硅脂的工序， 有效降低产品的生产成本； 并且在今后的使用 过程中避免了因导热硅脂挥发而需进行的定期维护工作； 产品一体化结构， 增 加了整体性， 也大大避免产品在运输或使用过程中出现松脱或损坏现象。

Claims

权 利 要 求
1、 一种大功率 LED灯，包括 LED芯片 （1) 及热管散热器， 热管散热器包 括冷媒板 （2) 和连接在冷媒板 （2) 上的散热管 （3)， 散热管 （3) 内装有冷 媒介质， 散热管 （3)上设有散热翅（4)， 其特征在于： 所述 LED芯片 （1)直 接封装在冷媒板（2)上， 冷媒板（2)内开有贮冷媒腔体（5)， 贮冷媒腔体（5) 与散热管 （3) 连通， 贮冷媒腔体 （5) 内充满冷媒介质流， 散热管 （3) 内的 冷媒介质与贮冷媒腔体 （5) 内的冷媒介质连通成一热量传输媒介， 构成 LED 芯片 （1) 产生的热量向外传导的热散发通道。
2、 根据权利要求 1所述的， 其特征在于： 所述散热管 （3)通过焊接固定 在冷媒板 （2) 上、 并与贮冷媒腔体 （5) 连通。
3、 根据权利要求 2所述的大功率 LED灯， 其特征在于： 所述散热管 （3) 插入到贮冷媒腔体 （5) 内。
4、 根据权利要求 2所述的大功率 LED灯， 其特征在于： 所述散热管 （3) 的端口平接在冷媒板 （2) 的侧壁上、 并与贮冷媒腔体 （5) 连通。
5、 根据权利要求 1至 4中任何一项所述的大功率 LED灯， 其特征在于： 所述冷媒板 （2) 为铝基板。
6、 根据权利要求 1至 4中任何一项所述的大功率 LED灯， 其特征在于： 所述 冷媒板 （2) 为铜基板。
PCT/CN2010/000231 2009-09-24 2010-02-24 一种大功率led灯 WO2011035526A1 (zh)

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CN2009202365103U CN201475757U (zh) 2009-09-24 2009-09-24 一种大功率led灯

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