CN100552287C - 大功率半导体照明灯 - Google Patents

大功率半导体照明灯 Download PDF

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CN100552287C
CN100552287C CNB200710041405XA CN200710041405A CN100552287C CN 100552287 C CN100552287 C CN 100552287C CN B200710041405X A CNB200710041405X A CN B200710041405XA CN 200710041405 A CN200710041405 A CN 200710041405A CN 100552287 C CN100552287 C CN 100552287C
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CN101315175A (zh
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金松山
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BEIJING HENGRUI TIAN QI TECHNOLOGY Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本发明公开了一种大功率半导体照明灯，包括灯头、LED驱动器、绝缘外壳、散热片交叉型散热器和大功率LED，在散热片交叉型散热器底面上设置有环型凹槽，在其环型凹槽中心平面上固定大功率LED，并以反光镜包围大功率LED，灯罩与环型凹槽密封连接；散热片交叉型散热器由凹型导热体、肋片、传热片、鳍片和散热片构成，在凹型导热体内垂直排列有肋片，在其外壁上环绕排列传热片，在传热片的始端两侧和末端上设置有鳍片，其鳍片的宽度是从下到上变窄，散热片的宽度是从上到下变窄，并分布在传热片之间，与鳍片交叉排列，且与凹型导热体外壁上相连接。采用导热性好的铝材料压铸而成的散热片交叉型散热器，提升了向周围空间的散热能力，将最大限度的降低大功率LED的光衰，能够实现结构紧凑的室内外普通照明和装饰用灯具。

Description

大功率半导体照明灯
技术领域
本发明涉及一种半导体照明灯，特别是一种单颗大功率LED固定在散热片交叉型散热器上的大功率半导体照明灯。
背景技术
半导体电光源是一种无灯丝的电光源，是一种直接把电能转化为光能的发光器件，称为发光二极管，也称为半导体灯，英文简称LED。半导体照明被认为是21世纪的照明新节能光源。LED不仅节能，还具有寿命长、体积小、安全、环保、免维护、易控制等特点。LED已经可以在很多场所代替传统光源使用，特别是大功率LED的出现，加速了LED取代传统照明光源的速度，也使得LED在室内外照明的大面积应用变得现实。
大功率LED是LED产业未来发展的一个方向，但大功率LED对散热技术要求较高，LED的功率越大，其芯片的热流密度就越高，环境温度达到一定的限度就会很快产生光衰，直接导致LED寿命的下降，当散热器的效果不良时LED芯片的温度急剧上升而损坏LED芯片，只有解决大功率LED的散热技术，最大限度的延缓LED的光衰，才能大面积的推广大功率LED的应用。
现有技术中的半导体照明灯，如图1所示的结构，一组大功率LED12固定在漏斗型散热器17上，并与灯头1和LED驱动器2电连接，漏斗型散热器17被固定在散热器架16上，并由绝缘外壳3和灯罩10将大功率LED12包围起来。这种结构的半导体组合灯，发光强度不均衡，且因漏斗型散热器17被灯罩10大面积包围，不能与空气进行充分的热交换，散热性能较差，而较快产生光衰，直接导致LED寿命的下降。
发明内容
为解决半导体组合灯的发光强度不均衡和大功率LED散热效果较差而导致LED寿命的下降，本发明提供一种把漏斗型散热器17和散热器架16连成一体，并改进为散热片交叉型散热器，且采用单颗大功率LED的大功率半导体照明灯。
本发明解决其技术问题所采用的技术方案是：包括灯头、LED驱动器、绝缘外壳、散热片交叉型散热器和大功率LED，其中灯头、LED驱动器和大功率LED电连接，在散热片交叉型散热器底面上设置有环型凹槽，在其环型凹槽中心平面上固定大功率LED，并以反光镜包围大功率LED，灯罩与环型凹槽密封连接；在绝缘外壳上设置有光敏传感器。
所述的散热片交叉型散热器由凹型导热体、肋片、传热片、鳍片和散热片构成；在凹型导热体内壁和底面上环绕并垂直排列有肋片；在凹型导热体外壁上环绕并垂直排列传热片，在传热片的始端两侧和末端上设置有鳍片，其鳍片的宽度是从下到上变窄；散热片的宽度是从上到下变窄，并分布在传热片之间，与鳍片交叉排列，且与凹型导热体外壁上相连接。
在LED驱动器结构中，光控PCB固定在LED电源PCB的一侧，并与光敏传感器电连接；在LED电源PCB的另一侧固定有高频的隔离变压器。
本发明的有益效果是，这种顺着热气流向上的方向垂直排列散热片，并与鳍片交叉排列的结构，与现有技术中的漏斗型散热器相比，其显著优点是，大功率LED中的热量通过凹型导热体传递给传热片和散热片，与空气进行热交换，而把散热片和鳍片的热量带走。空气带走热量多少与散热片和鳍片的表面积大小有关。散热片的表面积越大，传递的热量越多，散热效果就越高。但受空间和成本所限，散热器的体积就难以继续增大。因此为了继续提升散热器的散热效果，不得不在散热片的造型和数量上下工夫。在实际应用中散热片或鳍片间距过小，很容易被积尘淤满，并在间距的热量不易与空气充分进行热交换，因此散热片求多求大，但不求密。
在散热片交叉型散热器结构中，散热片和鳍片的上下宽度不等，并交叉方式排列，在宽度较窄的一侧留有足够的空间，即使散热片的间距较密，热量和周围空气能进行充分的热交换，而减小散热器和周围空气之间的温度差，将最大限度的降低大功率LED中的温度，减少大功率LED的光衰，能够实现结构紧凑的室内外普通照明和装饰用灯具。
附图说明
图1是现有技术中的一种半导体组合灯的结构示意图。
图2是本发明一个实施例的结构示意图。
图3是图2所示实施例中的散热片交叉型散热器的俯视图。
图4是图3的A-A半剖视图。
图5是图3的仰视图。
图6是LED驱动器的结构示意图。
图中1.灯头，2.LED驱动器，201.隔离变压器，202.LED电源PCB，203.光控PCB，3.绝缘外壳，4.散热片，5.凹型导热体，6.肋片，7.鳍片，8.传热片，9.环形凹槽，10.灯罩，11.反光镜，12.大功率LED，13.鳍片，14.光敏传感器，15.散热片交叉型散热器，16.散热器架，17.漏斗型散热器。
具体实施方式
由图2～图6所示，本发明包括灯头1、LED驱动器2、绝缘外壳3、散热片交叉型散热器15和大功率LED12，其中灯头1和LED驱动器2分别与光敏传感器14和大功率LED12电连接。在绝缘外壳3上设置有光敏传感器14。LED驱动器2被灯头1、绝缘外壳3、散热片交叉型散热器15包围。根据灯具安装使用要求，也可以不用灯头1，电源直接经绝缘外壳3，和LED驱动器2连接。
绝缘外壳3和散热片交叉型散热器15可密封连接，不需要密封时可在绝缘外壳3的周围上开槽或开空，以便凹型导热体5内的热量散发，进一步降低大功率LED12的温度。当大功率LED12的温度超过限定温度时，LED驱动器2的热量管理及时控制大功率LED12的亮度调低或熄灭。为了节能，在个别场合的使用灯具，可以设置光敏传感器14，控制天亮与暗的时段内对灯光的强弱与熄灭。
在散热片交叉型散热器15底面上设置有环型凹槽9，在其环型凹槽9的中心平面上固定大功率LED12，并以反光镜11包围大功率LED12，灯罩10与环型凹槽9密封连接。该灯罩10是半圆型，也可以采用平板型或其他形状，只要具有透光率高，防眩光，护眼功能即可。
散热片交叉型散热器15是由凹型导热体5、肋片6、传热片8、鳍片7、鳍片13和散热片4构成，并用导热和散热性能好的铝材料高压铸造成一体。在凹型导热体5内设置有肋片6，并和凹型导热体5的底面与内壁上以环绕方式垂直排列；在凹型导热体5外壁上环绕分布并垂直方向排列传热片8和鳍片7，传热片8是在凹型导热体5外壁的顶部或中部开始往下逐渐变宽，其宽度一定时加长鳍片13，鳍片7是从顶部开始往下逐渐变宽，并与传热片8的始端两侧开始连接到底；散热片4的宽度是从上到下变窄，并分布在传热片8之间，与鳍片7交叉排列，且与凹型导热体5外壁上相连接。
大功率LED12的输出功率和散热基板(LED自带的散热片或螺栓)的大小或其固定方式的不同，凹型导热体5的直径和底面形状以及肋片6、传热片8和散热片4的数目和大小则略有不同。
在LED驱动器2的结构中，光控PCB203固定在LED电源PCB202的一侧，并与光敏传感器14电连接；在LED电源PCB202的另一侧固定有高频的隔离变压器201。

Claims (3)

1、一种大功率半导体照明灯，包括灯头、LED驱动器、绝缘外壳、散热片交叉型散热器和大功率LED，其中灯头、LED驱动器和大功率LED电连接，其特征是：
在散热片交叉型散热器底面上设置有环型凹槽，在其环型凹槽中心平面上固定大功率LED，并以反光镜包围大功率LED，灯罩与环型凹槽密封连接；在绝缘外壳上设置有光敏传感器；
所述的散热片交叉型散热器由凹型导热体、肋片、传热片、鳍片和散热片构成；在凹型导热体内壁上环绕并垂直排列有肋片；在凹型导热体外壁上环绕并垂直排列传热片，在传热片的始端两侧和末端上设置有鳍片，其鳍片的宽度是从下到上变窄；散热片的宽度是从上到下变窄，并分布在传热片之间，与鳍片交叉排列，且与凹型导热体外壁上相连接。
2、根据权利要求1所述的大功率半导体照明灯，其特征是：在LED驱动器结构中，光控PCB固定在LED电源PCB的一侧，并与光敏传感器电连接；在LED电源PCB的另一侧固定有高频的隔离变压器。
3、根据权利要求1所述的大功率半导体照明灯，其特征是：散热片交叉型散热器用导热和散热性好的铝材料高压铸造而成。
CNB200710041405XA 2007-05-29 2007-05-29 大功率半导体照明灯 Expired - Fee Related CN100552287C (zh)

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CN102563575A (zh) * 2010-12-16 2012-07-11 金松山 Led灯具的隔离型散热装置
KR102125887B1 (ko) * 2010-12-31 2020-06-26 커런트 라이팅 솔루션즈, 엘엘씨 발광 장치 및 램프
CN103062643B (zh) * 2011-10-21 2015-11-18 深圳长城开发科技股份有限公司 一种led球泡灯
CN103090339A (zh) * 2011-10-29 2013-05-08 金松山 Led灯交叉式散热器
CN104180345B (zh) * 2013-05-28 2017-09-22 深圳市海洋王照明工程有限公司 一种灯具
CN104654255A (zh) * 2013-11-22 2015-05-27 苏州承源光电科技有限公司 Led用散热器
WO2016070368A1 (zh) * 2014-11-06 2016-05-12 袁志贤 一种新型散热led灯

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