WO2011034322A3 - 발광다이오드의 밀봉 방법 및 이에 의해 밀봉된 발광다이오드 - Google Patents

발광다이오드의 밀봉 방법 및 이에 의해 밀봉된 발광다이오드 Download PDF

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Publication number
WO2011034322A3
WO2011034322A3 PCT/KR2010/006249 KR2010006249W WO2011034322A3 WO 2011034322 A3 WO2011034322 A3 WO 2011034322A3 KR 2010006249 W KR2010006249 W KR 2010006249W WO 2011034322 A3 WO2011034322 A3 WO 2011034322A3
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WO
WIPO (PCT)
Prior art keywords
light
emitting diode
sealing method
same
sealed
Prior art date
Application number
PCT/KR2010/006249
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English (en)
French (fr)
Other versions
WO2011034322A2 (ko
Inventor
손정현
주한복
박종대
김재현
Original Assignee
주식회사 동진쎄미켐
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Application filed by 주식회사 동진쎄미켐 filed Critical 주식회사 동진쎄미켐
Publication of WO2011034322A2 publication Critical patent/WO2011034322A2/ko
Publication of WO2011034322A3 publication Critical patent/WO2011034322A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Sealing Material Composition (AREA)

Abstract

본 발명은 발광다이오드의 밀봉 방법 및 이에 의해 밀봉된 발광다이오드에 관한 것으로, 상기 밀봉 방법은 광경화형 수지 조성물과 광반도체 칩을 유체 레일을 따라 이동시키면서 마스크 없이 노광 및 광경화 공정을 수행하기 때문에 연속공정이 가능하고, 마스크 없이 이미지로 구현된 패턴에 따라 노광하여 밀봉 공정을 진행함으로써 발광다이오드의 양산 수율을 향상시킬 수 있다.
PCT/KR2010/006249 2009-09-17 2010-09-14 발광다이오드의 밀봉 방법 및 이에 의해 밀봉된 발광다이오드 WO2011034322A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0087936 2009-09-17
KR1020090087936A KR20110030014A (ko) 2009-09-17 2009-09-17 발광다이오드의 밀봉 방법 및 이에 의해 밀봉된 발광다이오드

Publications (2)

Publication Number Publication Date
WO2011034322A2 WO2011034322A2 (ko) 2011-03-24
WO2011034322A3 true WO2011034322A3 (ko) 2011-07-07

Family

ID=43759158

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/006249 WO2011034322A2 (ko) 2009-09-17 2010-09-14 발광다이오드의 밀봉 방법 및 이에 의해 밀봉된 발광다이오드

Country Status (3)

Country Link
KR (1) KR20110030014A (ko)
TW (1) TW201123554A (ko)
WO (1) WO2011034322A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101131884B1 (ko) * 2010-07-30 2012-04-03 우리엘에스티 주식회사 발광소자의 코팅 방법
KR101616159B1 (ko) * 2012-12-12 2016-04-27 제일모직주식회사 봉지용 조성물, 이를 포함하는 장벽층, 이를 포함하는 장벽 스택, 이를 포함하는 봉지화된 장치, 및 이를 이용하는 장치의 봉지 방법
KR102016348B1 (ko) * 2013-02-28 2019-08-30 주식회사 동진쎄미켐 광학소자 봉지용 수지 조성물
US9783717B2 (en) * 2013-08-19 2017-10-10 Sumitomo Seika Chemicals Co., Ltd. Addition-curable silicone resin composition, addition-curable silicone resin cured product, and sealed optical semiconductor element
KR20180034937A (ko) 2016-09-28 2018-04-05 모멘티브퍼포먼스머티리얼스코리아 주식회사 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006291018A (ja) * 2005-04-08 2006-10-26 Shin Etsu Chem Co Ltd Ｌｅｄ素子封止用硬化性樹脂組成物
KR20070032320A (ko) * 2004-08-04 2007-03-21 와커 헤미 아게 수지로 봉지된 발광 다이오드 및 발광 다이오드의 봉지법
WO2007046399A1 (ja) * 2005-10-18 2007-04-26 Asahi Kasei Kabushiki Kaisha 熱硬化性樹脂組成物及び光半導体封止材
US20080058441A1 (en) * 2003-12-10 2008-03-06 Toshinori Watanabe Active Energy Ray-Curable, Organopolysiloxane Resin Composition, Light-Transmitting Component, And Method For Manufacturing The Light-Transmitting Component
KR20090008339A (ko) * 2006-05-17 2009-01-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 다층 규소 함유 봉지재를 갖는 발광 소자의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080058441A1 (en) * 2003-12-10 2008-03-06 Toshinori Watanabe Active Energy Ray-Curable, Organopolysiloxane Resin Composition, Light-Transmitting Component, And Method For Manufacturing The Light-Transmitting Component
KR20070032320A (ko) * 2004-08-04 2007-03-21 와커 헤미 아게 수지로 봉지된 발광 다이오드 및 발광 다이오드의 봉지법
JP2006291018A (ja) * 2005-04-08 2006-10-26 Shin Etsu Chem Co Ltd Ｌｅｄ素子封止用硬化性樹脂組成物
WO2007046399A1 (ja) * 2005-10-18 2007-04-26 Asahi Kasei Kabushiki Kaisha 熱硬化性樹脂組成物及び光半導体封止材
KR20090008339A (ko) * 2006-05-17 2009-01-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 다층 규소 함유 봉지재를 갖는 발광 소자의 제조 방법

Also Published As

Publication number Publication date
WO2011034322A2 (ko) 2011-03-24
KR20110030014A (ko) 2011-03-23
TW201123554A (en) 2011-07-01

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