Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/851—Wavelength conversion means
  • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
  • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
  • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
  • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
  • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
  • H05B33/145—Arrangements of the electroluminescent material
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/01—Manufacture or treatment
  • H10H20/036—Manufacture or treatment of packages
  • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/851—Wavelength conversion means
  • H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/12—Passive devices, e.g. 2 terminal devices
  • H01L2924/1204—Optical Diode
  • H01L2924/12041—LED
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/12—Passive devices, e.g. 2 terminal devices
  • H01L2924/1204—Optical Diode
  • H01L2924/12043—Photo diode
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/30—Technical effects
  • H01L2924/35—Mechanical effects
  • H01L2924/351—Thermal stress
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31652—Of asbestos
  • Y10T428/31663—As siloxane, silicone or silane

Definitions

• Conversion agent body optoelectronic semiconductor chip and method for producing an optoelectronic
• Another problem to be solved is a
• an object to be solved is to specify a method for producing such an optoelectronic semiconductor chip.
• Conversion body is this intended to be attached to an optoelectronic semiconductor chip.
• the semiconductor chip may be a photodiode, a laser diode or, preferably, a light emitting diode.
• the conversion medium body has geometrical dimensions that match those of the semiconductor chip
• Conversion agent body between 0.3 mm and 10.0 mm, in particular between 0.5 mm and 3.0 mm. According to at least one embodiment of the
• Conversion agent body comprises this a matrix material and conversion agent particles which are embedded in the matrix material.
• conversion agent particles can be used here.
• the matrix material is incompletely cured and / or incompletely crosslinked.
• a hardness and / or a modulus of elasticity of the matrix material can be increased by a further curing process or crosslinking process.
• Conversion agent body has this at room temperature a hardness between Shore A 0 and Shore A35 A or between including Shore A 2 and Shore A 15 and / or a viscosity of between 10.0 Pa-s and
• Matrix material is therefore comparatively soft.
• Conversion agent body which is provided for an optoelectronic semiconductor chip, includes this
• the matrix material is incompletely cured and / or incompletely crosslinked and the conversion agent body shows a room temperature Hardness between and including Shore A 10 and Shore A 35 and / or a viscosity between 10 Pa-s and 70 Pa-s inclusive.
• the conversion agent body is incomplete in that
• Semiconductor layer sequence can be attached in a form-fitting manner.
• a subsequent hardening of the conversion agent body is a special solid mechanical connection between the
• Conversion agent body comprises the matrix material
• Silicone or consists of such. It is the same
• the matrix material comprises or consists of an epoxy or a silicone-epoxy hybrid material. According to at least one embodiment of the
• Base materials for a silicone and / or a highly viscous starting material for the matrix material a segregation and / or a decrease in the conversion agent particles in the uncured matrix material can be prevented. This makes it possible to dispense with a thixotropic agent present in particular as particles, especially nanoparticles.
• Conversion agent body is a weight fraction of
• Conversion agent particles between 20% and 20% 75%, preferably between 55% and 70% inclusive. In other words, a significant weight fraction of the
• Conversion agent body caused by the conversion agent particles.
• Conversion agent body is this one-piece molded. That is, the matrix material forms a continuous, uninterrupted unit in which the conversion agent particles are embedded.
• the matrix material forms a continuous, uninterrupted unit in which the conversion agent particles are embedded.
• Conversion medium body then no subregions with a plurality of conversion agent particles, which are delimited from each other by phase boundaries and / or differ from each other in a middle material composition and / or in a physical property.
• an optoelectronic semiconductor chip which, for example, a conversion agent body according to one or more of the above
• Embodiments comprises. Features of the
• semiconductor chips this includes a semiconductor layer sequence with at least one active layer. Furthermore, the semiconductor chip includes an integral conversion body with a matrix material in which conversion agent particles are embedded. In this case, the conversion agent body is in direct contact with the semiconductor layer sequence and is furthermore free of bonding agent on the
• a hardness of Conversion medium body is at least Shore A 30 and at most Shore D 80, preferably at least Shore A 60 and at most Shore D 80, in particular at least Shore D 30 and at most Shore D 75.
• Lens-free can mean that there is no bonding agent such as an adhesive, an adhesive film or a solder between the semiconductor layer sequence and the conversion agent body.
• the fact that the semiconductor layer sequence and the conversion agent body can be in direct contact at least in places means that the
• Matrix material at least in places is in physical contact with a semiconductor material of the semiconductor layer sequence.
• Semiconductor layer sequence should be counted if the contact structures are directly, permanently, permanently and / or integrally connected to the semiconductor material. That is, in direct contact with the semiconductor layer sequence may also mean that the conversion agent body is applied directly on such electrical contact structures, which are formed for example with a metal or a transparent conductive oxide.
• At least 90% of a radiation passage area and flanks of the semiconductor layer sequence are covered by the conversion medium body.
• Covering degree is in particular perpendicular in one direction to determine the respective areas of the semiconductor layer sequence.
• the conversion medium body is applied
• Conversion agent body result, creating a particularly high adhesion between the conversion agent body and
• Semiconductor layer sequence can be achieved. Likewise, a contact surface between the semiconductor layer sequence and the conversion agent body increases, so that the
• Adhesion mediation increases via adhesion forces.
• Boundary surface of the semiconductor body side facing away from the conversion agent body can hereby be smooth or even
• flanks of the conversion agent body are uncovered. Furthermore, a method for producing a
• Semiconductor chip is configured, for example, according to one or more of the above embodiments.
• this comprises the steps:
• Hardening of the conversion agent body wherein after curing the hardness of the conversion agent body is at least Shore A 30 and at most Shore D 80, and
• the conversion agent body is applied to a carrier film and covered by a cover film.
• the conversion agent body is located between the carrier foil and the cover foil.
• At least the cover can be from remove the conversion agent body non-destructive, especially as long as the matrix material of the
• both the carrier film and the cover film can be removed from the conversion agent body without damaging it, as long as the matrix material has not been completely cured.
• the carrier film and / or the cover film is at least partially radiation-transmissive in the ultraviolet and / or blue spectral range. This makes it possible for the matrix material to be photochemically crosslinkable and / or curable by, for example, the carrier film.
• the conversion medium body is provided in such a way that it has lateral extensions and / or shapes of the semiconductor chip, in particular with a tolerance of at most 25% or at most 5%.
• the conversion agent body can therefore already be shaped and / or cut to size prior to application to the semiconductor chip, such as or approximately like a radiation passage area of the semiconductor chip.
• the conversion agent body is thus formed in particular congruent with the radiation passage area, for example on the carrier film, and applied to the semiconductor chip.
• Figures 1 to 4 are schematic sectional views of
• Figure 5 is a schematic representation of a
• Figure 8 is schematic sectional views of conventional
• Figure 1 is an embodiment of a
• Semiconductor chip 1 comprises a semiconductor layer sequence 3, which contains at least one active layer.
• the semiconductor layer sequence 3 is a light-emitting diode, which in operation, in particular, ultraviolet and / or blue
• the semiconductor chip 1 comprises a
• the conversion agent body 5 has conversion agent particles 55, which in a
• Conversion agent particles 55 are randomly and / or homogeneously distributed in the matrix material 50.
• Conversion agent particle 55 is one of the
• the conversion agent body 5 is preferably photochemically stable with respect to a radiation emitted by the semiconductor layer sequence 3 and
• a mean diameter of the conversion agent particles 55 is for example between 1 nm and 100 nm. It is also alternatively or additionally possible for a diameter of the conversion agent particles 55 or further conversion agent particles to be between 1 ⁇ m and 20 ⁇ m. In the other pictures that are
• Matrix material 50 and the conversion agent particles 55 are not shown.
• the integral conversion body 5 nestles positively against the roughening of the
• Radiation passage area 32 of the semiconductor layer sequence 3 at. Between the roughening of the radiation passage area 32 and the matrix material 50 results from this a toothing on a microscopic scale, whereby a particularly stable adhesion between the semiconductor layer sequence 3 and the conversion center body 5 can be realized.
• the conversion center body 5 terminates flush with the flanks 34 of the semiconductor layer sequence 3 in a lateral direction. Lateral dimensions of the conversion agent body 5 and / or the semiconductor layer sequence 3 are preferably between 300 and 3 mm, in particular between 500 and 2 mm. A thickness of
• Conversion agent body is preferably between
• Semiconductor layer sequence 3 is preferably at most
• Conversion center body 5 the semiconductor layer sequence 3 in the lateral direction.
• the semiconductor layer sequence 3 is applied to a carrier 2.
• Semiconductor layer sequence 3 is not of the carrier 2, the conversion center body 5 and in Figure 2
• Conversion agent body 5 has a lens-like shape in a region above the radiation passage area 32. In other words, a height of the
• Conversion agent body 5 based on the carrier 2, not constant over the entire lateral extent.
• Conversion agent body 5 based on the carrier 2, not constant over the entire lateral extent.
• Figure 3 are electrical
• the contact structure 6c which is shaped as a bonding wire, penetrates the integral one in a direction perpendicular to a main extension direction of the semiconductor layer sequence 3
• the conversion agent body 5 covers each case
• the electrical contact structure 6b is
• Semiconductor layer sequence 3 vapor-deposited.
• the one-piece applied directly to the semiconductor layer sequence 3 is one-piece
• Conversion center body 5 completely penetrated by the contact structure 6b, which is produced for example via a vapor deposition and / or a photolithographic process. Both the contact structure 6b and the
• Conversion center body 5 are of an electrical
• Insulating layer 11 completely covered.
• a material of the insulating layer 5 is preferably different from that
• a hardness of the conversion agent body 5 is between Shore D 45 and Shore D 80 inclusive. Due to this high hardness, the semiconductor layer sequence 3 by the
• Conversion agent body 5 mechanically protectable.
• the high hardness allows a particularly efficient
• FIG. 5 illustrates a shear force F as a function of a time t of a conversion agent body, for example according to one of FIGS. 1 to 4, on a semiconductor layer sequence 3. Over the entire period of 1000 h, this is a temperature at 185 ° C. A shear force in which delamination of the conversion agent body 5
• FIG. 6 shows a production method for the
• a carrier film 8 which is, for example, an ethylene-tetrafluoroethylene film, is provided in particular via
• Matrix material here is for example LPS-AF500Y of
• Conversion agent body has a hardness between Shore A 10 and Shore A 35, so that the
• the conversion agent body 5 produced on the carrier film 8 can be smoothed in an optional further method step not illustrated in FIG. 6, so that a particularly uniform thickness of the conversion agent body 5 results, and / or can be cut to size in lateral dimensions.
• the carrier foil 8 can be flush with the lateral direction
• FIG. 6C shows that subsequently the
• a curing time is preferably at least 10 minutes. For example, this is done
• Conversion medium body 5 are pressed against the semiconductor layer sequence 3 via a pressure p and / or pressed.
• Conversion medium body 5 takes place for example via a temperature effect T and / or by ultraviolet or blue radiation through the carrier film 8 therethrough. After curing, the conversion agent body 5 has only a low hardness and / or only a comparatively low viscosity of between 10 Pa-s and 70 Pa-s.
• stamping or compression molding is possible, in particular if the conversion agent body 5 is shaped like a lens.
• FIG. 7B after the curing, the covering film 9 is removed from the conversion agent body 5.
• the conversion medium body 5 remains on the carrier film 8.
• FIG. 7C shows that the conversion agent body 5 is attached to the semiconductor layer sequence 3 via the carrier film 8. Curing via the effect of temperature T or photochemical curing of the one-piece
• Conversion agent body 5 preferably takes place
• the carrier film 8 may still be on the conversion agent body 5 during curing
• FIG. 8 shows conventional semiconductor components which likewise comprise a conversion center body 5.
• the conversion agent body 5 which in particular comprises a silicone, is attached to the semiconductor layer sequence 3 via a connection means 4.
• the connecting means 4 is, for example, a low-viscosity silicone adhesive.
• the connecting means 4 has only a low viscosity during application, during the application of the Conversion center body 5 in the lateral direction of the
• Connecting means 4 partially the flanks 34 of
• Carrier 2 and / or the semiconductor layer sequence 3 can be dispensed with.
• the conversion agent body 5 is applied directly to the semiconductor layer sequence 3 by means of a screen printing method. Such a process requires a high level
• a starting material and in particular also the finished conversion medium body 5 has only a comparatively low hardness, in particular less than Shore A 80 or less than Shore A 60.
• Figures 1 to 4 designed uneven, causing local
• Semiconductor layer sequence 3 the risk of contamination of the flanks 34 or the carrier 2 by a material of the

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• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Inorganic Chemistry (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• Led Device Packages (AREA)
• Electroluminescent Light Sources (AREA)

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Citations (4)

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• 2009
  • 2009-09-04 DE DE102009040148A patent/DE102009040148A1/de not_active Withdrawn
• 2010
  • 2010-08-10 EP EP10740673.8A patent/EP2474203B1/de not_active Not-in-force
  • 2010-08-10 JP JP2012527269A patent/JP2013504188A/ja active Pending
  • 2010-08-10 CN CN201080030130.XA patent/CN102498751B/zh not_active Expired - Fee Related
  • 2010-08-10 US US13/377,593 patent/US9055655B2/en not_active Expired - Fee Related
  • 2010-08-10 WO PCT/EP2010/061648 patent/WO2011026716A1/de not_active Ceased
  • 2010-08-10 KR KR20127004528A patent/KR20120062725A/ko not_active Ceased
  • 2010-09-03 TW TW99129814A patent/TWI470839B/zh not_active IP Right Cessation

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