WO2011021797A3 - 냉각수가 상하층으로 구분되어 흐르는 급속열처리장치의 히터블록 - Google Patents

냉각수가 상하층으로 구분되어 흐르는 급속열처리장치의 히터블록 Download PDF

Info

Publication number
WO2011021797A3
WO2011021797A3 PCT/KR2010/005120 KR2010005120W WO2011021797A3 WO 2011021797 A3 WO2011021797 A3 WO 2011021797A3 KR 2010005120 W KR2010005120 W KR 2010005120W WO 2011021797 A3 WO2011021797 A3 WO 2011021797A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling water
upper layer
lower layer
heater block
inlet ports
Prior art date
Application number
PCT/KR2010/005120
Other languages
English (en)
French (fr)
Other versions
WO2011021797A2 (ko
Inventor
심장우
김성철
김동현
전효영
Original Assignee
에이피시스템 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이피시스템 주식회사 filed Critical 에이피시스템 주식회사
Priority to CN201080037217XA priority Critical patent/CN102484899A/zh
Priority to US13/391,431 priority patent/US20120213499A1/en
Publication of WO2011021797A2 publication Critical patent/WO2011021797A2/ko
Publication of WO2011021797A3 publication Critical patent/WO2011021797A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
    • H01J7/24—Cooling arrangements; Heating arrangements; Means for circulating gas or vapour within the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Resistance Heating (AREA)
  • Hair Curling (AREA)
  • Furnace Details (AREA)
  • Physical Water Treatments (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

본 발명은 가열램프가 끼워지는 램프 포켓(21)을 복수개 가지며, 냉각수 유입구(111a, 111b) 및 냉각수 유출구(112a, 112b)가 마련되어 냉각수 유입구(111a, 111b)에서 유입되어 냉각수 유출구(112a, 112b)로 토출되는 냉각수의 흐름에 의하여 램프 포켓(21)이 냉각되는 급속열처리장치의 히터블록에 관한 것으로서, 구체적으로 냉각수 유입구(111a, 111b)에서 유입되어 냉각수 유출구(112a, 112b)로 토출되는 냉각수의 흐름의 상하층으로 구분되도록 흐르도록 냉각수 유입구(111a, 111b) 및 냉각수 유출구(112a, 112b)가 각각 상하층에 구분되어 설치되는 것을 특징으로 한다. 냉각수 유입구(112a, 112b)의 유입부에는 냉각수를 측방향으로 분산시키기 위한 냉각수 분산수단(140)이 설치되는 것이 바람직하다. 본 발명에 의하면, 냉각수가 상층 및 하층으로 구분되어 흐르기 때문에 냉각효율이 증가하게 되고, 특히 가열램프의 발열이 주로 이루어지는 램프 포켓 하단부의 냉각을 극대화시킬 수 있게 된다. 또한 냉각수 분산수단의 설치로 인하여 사영역(dead zone)이 형성되는 것을 방지할 수 있어 히터블록의 전체가 골고루 냉각되게 된다.
PCT/KR2010/005120 2009-08-21 2010-08-04 냉각수가 상하층으로 구분되어 흐르는 급속열처리장치의 히터블록 WO2011021797A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201080037217XA CN102484899A (zh) 2009-08-21 2010-08-04 用于具有冷媒流过其上及下层的快速加热设备的加热器组件
US13/391,431 US20120213499A1 (en) 2009-08-21 2010-08-04 Heater block for a rapid thermal processing apparatus in which a cooling water flow is divided into an upper layer and a lower layer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090077708A KR20110020035A (ko) 2009-08-21 2009-08-21 냉각수가 상하층으로 구분되어 흐르는 급속열처리장치의 히터블록
KR10-2009-0077708 2009-08-21

Publications (2)

Publication Number Publication Date
WO2011021797A2 WO2011021797A2 (ko) 2011-02-24
WO2011021797A3 true WO2011021797A3 (ko) 2011-05-26

Family

ID=43607437

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/005120 WO2011021797A2 (ko) 2009-08-21 2010-08-04 냉각수가 상하층으로 구분되어 흐르는 급속열처리장치의 히터블록

Country Status (5)

Country Link
US (2) US20120213499A1 (ko)
KR (1) KR20110020035A (ko)
CN (1) CN102484899A (ko)
TW (1) TW201116164A (ko)
WO (1) WO2011021797A2 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101426009B1 (ko) * 2012-11-01 2014-08-05 우범제 온도 제어 장치
GB2574007B (en) * 2018-05-21 2022-09-07 The House Of Curls Ltd Apparatus for curling hair

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100346569B1 (ko) * 1999-11-09 2002-08-03 코닉 시스템 주식회사 급속 열처리 장치
JP2003065696A (ja) * 2001-08-24 2003-03-05 Honda Motor Co Ltd ラジエータ
KR100500195B1 (ko) * 2003-06-30 2005-07-14 (주)대우건설 고온 반응기의 수냉 자켓
KR20090052060A (ko) * 2007-11-20 2009-05-25 엘지전자 주식회사 냉매분배장치
KR20090057729A (ko) * 2007-12-03 2009-06-08 에이피시스템 주식회사 급속열처리장치의 히터블록

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2104897A (en) * 1929-06-05 1938-01-11 Philad Company Method and means for waving hair
US1812442A (en) * 1930-09-25 1931-06-30 Nestle Le Mur Company Method of waving hair
US2145045A (en) * 1937-05-24 1939-01-24 William C Mcfarland Permanent hair waving apparatus and method
US5155336A (en) * 1990-01-19 1992-10-13 Applied Materials, Inc. Rapid thermal heating apparatus and method
US20050061353A1 (en) * 2003-09-19 2005-03-24 Kazutoshi Kaizuka Hair curler
US7509035B2 (en) * 2004-09-27 2009-03-24 Applied Materials, Inc. Lamp array for thermal processing exhibiting improved radial uniformity
JP4940635B2 (ja) * 2005-11-14 2012-05-30 東京エレクトロン株式会社 加熱装置、熱処理装置及び記憶媒体
US8314368B2 (en) * 2008-02-22 2012-11-20 Applied Materials, Inc. Silver reflectors for semiconductor processing chambers
CN101440983B (zh) * 2008-12-30 2010-06-16 哈尔滨工业大学 基于能量梯级利用的空气处理机组

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100346569B1 (ko) * 1999-11-09 2002-08-03 코닉 시스템 주식회사 급속 열처리 장치
JP2003065696A (ja) * 2001-08-24 2003-03-05 Honda Motor Co Ltd ラジエータ
KR100500195B1 (ko) * 2003-06-30 2005-07-14 (주)대우건설 고온 반응기의 수냉 자켓
KR20090052060A (ko) * 2007-11-20 2009-05-25 엘지전자 주식회사 냉매분배장치
KR20090057729A (ko) * 2007-12-03 2009-06-08 에이피시스템 주식회사 급속열처리장치의 히터블록

Also Published As

Publication number Publication date
TW201116164A (en) 2011-05-01
US20120186600A1 (en) 2012-07-26
US20120213499A1 (en) 2012-08-23
CN102484899A (zh) 2012-05-30
WO2011021797A2 (ko) 2011-02-24
KR20110020035A (ko) 2011-03-02

Similar Documents

Publication Publication Date Title
WO2010136108A3 (de) Wärmeübertragereinheit
CA2595071A1 (en) Compact high-efficiency boiler and method for producing steam
TW200634262A (en) Heater device for desiccant rotor dehumidifier
GB201110796D0 (en) Heat exchanger
JP2014525026A5 (ko)
WO2008107760A3 (en) Condensing boiler
MY160332A (en) Combustion apparatus with improved thermal efficiency
WO2015095550A3 (en) Methods and systems for cooling hot particulates
RU2017101495A (ru) Способ и установка для сжигания посредством химических циклов окисления-восстановления с контролем теплообмена
WO2012145802A3 (en) Reactor system and method for thermally activating minerals
RU2013145883A (ru) Способ сушки влажного полимерного порошка и пригодное для этого устройство
MX368798B (es) Instalación mejorada para cocinar alimentos.
RU2014153605A (ru) Способ модернизации действующей установки низкотемпературной сепарации газа
JP2013133779A (ja) ブローバイガス還流装置
WO2011021797A3 (ko) 냉각수가 상하층으로 구분되어 흐르는 급속열처리장치의 히터블록
DE602006018991D1 (de) Verbesserter wärmetauscher
WO2011037393A3 (ko) 실리콘 잉곳 제조장치
RU2013136187A (ru) Устройство прессования
WO2010110551A3 (ko) 폴리실리콘 제조용 화학기상증착 반응기
RU2012146437A (ru) Устройство и способ термической предварительной обработки твердого сырья в концентрическом секционированном кипящем слое
CN202358592U (zh) 食品传送机的热交换改良结构
WO2011006494A3 (de) Radiator
CN109163571A (zh) 基于母管制的罐式煅烧炉余热发电系统
WO2007096457A3 (en) Arrangement and method for cooling a solution
CN202072665U (zh) 改质沥青负压生产联釜装置

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080037217.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10810105

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 13391431

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 10810105

Country of ref document: EP

Kind code of ref document: A2