WO2011021579A1 - Dispositif d’entrée - Google Patents

Dispositif d’entrée Download PDF

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Publication number
WO2011021579A1
WO2011021579A1 PCT/JP2010/063736 JP2010063736W WO2011021579A1 WO 2011021579 A1 WO2011021579 A1 WO 2011021579A1 JP 2010063736 W JP2010063736 W JP 2010063736W WO 2011021579 A1 WO2011021579 A1 WO 2011021579A1
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WO
WIPO (PCT)
Prior art keywords
layer
main body
substrate
surface layer
input device
Prior art date
Application number
PCT/JP2010/063736
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English (en)
Japanese (ja)
Inventor
英人 笹川
一芳 山縣
貴志 西山
Original Assignee
アルプス電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Priority to JP2011527659A priority Critical patent/JPWO2011021579A1/ja
Publication of WO2011021579A1 publication Critical patent/WO2011021579A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Definitions

  • the present invention relates to an input device having a lower substrate and an upper substrate disposed opposite to each other, and to a warp correction structure.
  • Patent Document 1 discloses the invention of a touch panel in which the upper and lower surfaces of a polycarbonate plate are sandwiched by polyethylene terephthalate films.
  • Patent Document 2 discloses the invention of a touch panel in which a transparent holding plate made of a polycarbonate plate is provided on the lower surface of a lower electrode sheet provided with a transparent film of polycarbonate.
  • Patent Document 3 describes a touch panel in which a transparent plate made of a rigid glass plate or a resin plate as a support is disposed behind the first quarter-wave plate in order to give rigidity to the low reflection touch panel itself. Invention is disclosed.
  • JP 2000-207983 A JP 2000-207123 A Unexamined-Japanese-Patent No. 2000-321558 Japanese Patent Application Laid-Open No. 7-13695
  • the invention described in the above patent documents discloses a configuration for suppressing the occurrence of warpage with respect to the heat applied to the manufacturing process and the temperature of the use environment.
  • there is a restriction of the material and in the invention described in Patent Document 3, there is a problem that the thickness of the whole touch panel becomes thick.
  • Patent Document 1 since the same polyethylene phthalate film as the lower electrode sheet is used as the warpage correction sheet, a sufficiently thin warpage correction sheet can not be formed, or the thickness of the warpage correction sheet is free There was also a problem with a small degree.
  • Patent Document 3 discloses a configuration in which a plurality of highly rigid glass plates or resins are laminated on the back of the panel, thereby enhancing the overall rigidity of the touch panel. If the amount of warpage with respect to heat of the plate is large, warpage can be suppressed rather than warpage is further increased. Therefore, the configuration of Patent Document 3 can not be said to be an effective structure for warpage suppression.
  • the present invention is intended to solve the above-described conventional problems, and in particular, it is an object of the present invention to provide an input device capable of suppressing warpage more effectively than in the prior art.
  • the input device in the present invention is A main body configured to have a lower substrate and an upper substrate on each of which a conductive layer is formed on the inner surface of each base material disposed opposite to each other, and a warp correction member provided on the lower surface of the main body.
  • the warp correction member has a heat-shrinkable or thermally-expandable surface layer provided on at least one of the substrate surfaces, and has a warp force in a direction opposite to the warp direction of the main body. It is
  • the warp correcting member itself has a warping force in the direction opposite to the warping direction of the main body, and the warp of the main body can be effectively suppressed.
  • the material, thickness, etc. of the surface layer are determined so as to generate the warping force in the opposite direction after grasping the warping direction of the main body. Since it can be selected freely, the degree of freedom of warpage correction is high, and it can also contribute to thinning of the warpage correction member.
  • the member for correcting warpage is provided on the lower surface side of the main body, but it is possible to obtain stable input operability and to easily correct the warpage.
  • the warp correction member is provided on the first surface layer provided on the upper surface of the substrate and the lower surface of the substrate, and the stretching force in the in-plane direction of the substrate is different from that of the first surface layer. It is preferable to be configured to have a second surface layer.
  • the thicknesses of the first surface layer and the second surface layer be different.
  • materials having different thermal contraction rates and thermal expansion rates may be used for the first surface layer and the second surface layer to have the same thickness or different thicknesses.
  • the first surface layer and the second surface layer are preferably formed of an acrylic resin on the upper and lower surfaces of the transparent substrate.
  • Urethane acrylate, an epoxy acrylate, etc. can be shown as acrylic resin.
  • the first surface layer and the second surface layer are provided on the upper and lower surfaces of the base material, for example, the first surface layer and the second surface layer are made of heat-shrinkable material and have different thicknesses.
  • the main body portion can be effectively applied to a configuration in which the support member is provided on the lower surface side of the lower substrate and the warp correction member is provided on the lower surface of the support member.
  • the warpage of the main body can be more effectively suppressed by providing the warp correction member on the lower surface of the support member.
  • the warp correcting member itself has a warping force in the direction opposite to the warping direction of the main body, and the warp of the main body can be effectively suppressed.
  • the material, thickness, etc. of the surface layer are determined so as to generate the warping force in the opposite direction after grasping the warping direction of the main body. Since it can be selected freely, the degree of freedom of warpage correction is high, and it can also contribute to thinning of the warpage correction member.
  • a partial longitudinal sectional view of the input device (touch panel) in the present embodiment A partially enlarged longitudinal sectional view of a member for correcting warpage in the present embodiment;
  • An explanatory view showing a detection operation of the input device The top view of the lower substrate of this embodiment.
  • FIG. 1 is a partial longitudinal sectional view of the input device (touch panel) in the present embodiment
  • FIG. 2 is a partial enlarged longitudinal sectional view of a member for correcting warpage in the present embodiment
  • FIG. 3 is an explanatory view showing a detection operation of the input device.
  • FIG. 4 shows a plan view of the lower substrate.
  • the input device 1 illustrated in FIG. 1 has a configuration in which a support member 50, a lower substrate 10, an upper substrate 20, a decorative layer 23, and a covering layer 24 are sequentially stacked from the bottom.
  • lower substrate 10 includes lower substrate 15, lower conductive layer 11 formed on the upper surface (the inner surface facing upper substrate 20) of lower substrate 15, and the surface of lower conductive layer 11. It is configured to have the formed lower electrode layers 12a and 12a (see also FIG. 3 and FIG. 4).
  • the lower electrode layers 12a, 12a are disposed outside the input area 1a.
  • the upper substrate 20 facing the lower substrate 10 at a predetermined distance in the height direction is the upper base 26 and the lower surface of the upper base 26 (the inner surface facing the lower substrate 10 And a pair of upper electrode layers 22a and 22a formed on the surface of the upper conductive layer 21 (see also FIG. 3).
  • the upper electrode layers 22a, 22a are disposed outside the input area 1a.
  • the lower substrate 15 is transparent such as polycarbonate resin (PC resin), polyethylene terephthalate resin (PET resin), polyethylene naphthalate resin (PEN resin), cyclic polyolefin (COP resin), polymethyl methacrylate resin (acrylic) (PMMA), etc. It is formed of a base material and has a thickness of about 50 ⁇ m to 300 ⁇ m.
  • the lower base 15 is preferably thicker and higher in rigidity than the upper base 26.
  • the upper substrate 26 is made of polycarbonate resin (PC resin), polyethylene terephthalate resin (PET resin), polyethylene naphthalate resin (PEN resin), cyclic polyolefin (COP resin), polymethyl methacrylate resin (acrylic) (PMMA), etc. And a thickness of about 50 ⁇ m to 300 ⁇ m.
  • PC resin polycarbonate resin
  • PET resin polyethylene terephthalate resin
  • PEN resin polyethylene naphthalate resin
  • COP resin cyclic polyolefin
  • PMMA polymethyl methacrylate resin
  • the lower conductive layer 11 and the upper conductive layer 21 are formed by depositing an inorganic transparent conductive material such as ITO (Indium Tin Oxide), SiO 2 , or ZnO by sputtering or vapor deposition. Alternatively, fine powders of these inorganic transparent conductive materials may be fixed. Alternatively, the organic transparent conductive material may be coated with an organic conductive polymer such as carbon nanotubes, polythiophine, or polypyrrole. The thickness of each of the conductive layers 11 and 21 is about 0.005 ⁇ m to 2 ⁇ m.
  • the lower electrode layer 12a and the upper electrode layer 22a are formed by printing an Ag coating, for example.
  • a conductive material having a resistance value lower than that of the conductive layers 11 and 21 is used for the electrode layers 12a and 22a.
  • each of the substrates 15 and 26 is a flat surface, but in order to suppress the generation of interference fringes and the like, the substrate 15 of the portion facing the liquid crystal display panel (not shown) , 26 may have a prism shape, for example.
  • the input device 1 shown in FIG. 1 has a structure of a resistive touch panel, and is provided with an input area 1a capable of input operation.
  • An air layer 44 is provided between the lower substrate 10 and the upper substrate 20 in the input area 1 a.
  • a number of dot spacers 70 are provided.
  • the surfaces of the electrode layer 12 a and the electrode layer 22 a are covered with an overcoat layer 27 respectively.
  • the overcoat layer 27 is provided on the outer periphery of the input area 1a.
  • the overcoat layer 27 is formed of an insulating material such as polyester resin or epoxy resin.
  • the thickness of the overcoat layer 27 is about 5 ⁇ m to 50 ⁇ m.
  • an electrically insulating bonding layer 40 is provided between the lower substrate 10 and the upper substrate 20 and around the input region 1a, whereby the input between the lower substrate 10 and the upper substrate 20 is performed. It is fixed around the area 1a. Further, as shown in FIG. 1, an air layer 44 is provided between the lower substrate 10 and the upper substrate 20 in the input area 1a.
  • the bonding layer 40 is, for example, an acrylic resin-based adhesive or adhesive. The thickness of the bonding layer 40 is about 5 ⁇ m to 200 ⁇ m.
  • a support member 50 is bonded to the lower surface of the lower substrate 10 via a bonding layer 51.
  • the bonding layer 51 is an acrylic resin-based adhesive or adhesive.
  • a transparent (translucent) adhesive or adhesive is used for the bonding layer 51, and for example, an acrylic resin adhesive tape can be used.
  • the thickness of the bonding layer 51 is about 5 ⁇ m to 200 ⁇ m.
  • the support member 50 is a transparent resin plate, and is preferably formed of a plastic base material such as polycarbonate resin (PC resin), cyclic polyolefin (COP resin), polymethyl methacrylate resin (acrylic) (PMMA), etc. is there.
  • the support member 50 is formed to have a thickness that is thicker than that of the lower base 15, and specifically, is formed to have a thickness of about 0.5 mm to 2 mm.
  • the support member 50 is provided on substantially the entire lower surface of the lower substrate 10.
  • a covering layer 24 is bonded to the upper surface of the upper substrate 20 via a bonding layer 25.
  • the bonding layer 25 is an acrylic resin-based adhesive or adhesive.
  • a transparent (light transmitting) adhesive or adhesive is used for the bonding layer 25.
  • the thickness of the bonding layer 25 is about 5 ⁇ m to 200 ⁇ m.
  • the decorative layer 23 is formed by printing or the like at the outer peripheral position of the covering layer 24 (the outer periphery of the input area 1 a).
  • the covering layer 24 is for protecting the surface of the input area 1a and is preferably made of a transparent resin material.
  • the covering layer 24 is made of polycarbonate resin (PC resin), polyethylene terephthalate resin (PET resin), cyclic polyolefin (COP resin), polymethyl methacrylate resin (acrylic) (PMMA) or the like.
  • the covering layer 24 may be the upper and lower surfaces of a transparent base material formed of polycarbonate resin (PC resin), polyethylene terephthalate resin (PET resin), cyclic polyolefin (COP resin), polymethyl methacrylate resin (acrylic) (PMMA) or the like. It is preferable that it is a hard coat film etc. in which hard coat layers, such as urethane acrylate resin, were formed.
  • the thickness of the covering layer 24 is about 50 ⁇ m to 300 ⁇ m.
  • the decorative layer 23 is non-light transmitting, and the input area 1 a in which the decorative layer 23 is not formed is light transmitting.
  • the decorative layer 23 is colored in a frame shape, and constitutes a part of the design of the display unit of the electronic device in which the input device 1 is incorporated.
  • the upper substrate 20 bends downward, and the upper conductive layer 21 and the lower conductive layer 11 abut on each other.
  • a voltage corresponding to the resistance value obtained by dividing the lower conductive layer 11 in the X direction is obtained from the electrode layers 22a and 22a.
  • a voltage corresponding to the resistance value obtained by dividing the conductive layer 21 in the Y direction is obtained from the electrode layers 12a and 12a.
  • the position of the point P on the XY coordinates can be detected by A / D converting each obtained voltage.
  • a wiring layer 12b is formed on the surface of the lower conductive layer 11 of the lower substrate 10 outside the input region 1a.
  • the electrode layer 12a is electrically connected to the through conductive layer 13 (see also FIG. 1) provided in the through hole via the wiring layer 12b.
  • a connection conductive layer 22c (see also FIG. 1) electrically connected to the upper electrode layer 22a formed on the upper substrate 20 is also electrically connected to the penetrating conductive layer 13 via the wiring layer 12b.
  • an output electrode layer 14 is provided on the lower surface side of the lower base material 15, and the output electrode layer 14 and the penetrating conductive layer 13 are electrically connected.
  • Four output electrode layers 14 are provided side by side as shown in FIG. 4, and the lower electrode layers 12 a and 12 a provided on the lower substrate 10 and the upper electrode layers provided on the upper substrate 20 are respectively provided. It is electrically connected to 22a and 22a.
  • the wiring layer 12b, the through conductive layer 13, the connection conductive layer 22c, and the output electrode layer 14 can be formed of the same material (eg, Ag coating film) as the lower electrode layer 12a.
  • the wiring layer 12 b and the output electrode layer 14 are formed to have substantially the same thickness as the lower electrode layer 12 a.
  • the connection conductive layer 22c is formed thick to have substantially the same height as the air layer 44, and electrically connects the wiring layer 12b and the upper electrode layer 22a.
  • the flexible printed board 30 is electrically connected to the output electrode layer 14.
  • the flexible printed circuit board 30 is provided with four connection electrode layers (not shown) corresponding to the output electrode layers 14 on the upper surface facing the lower substrate 10. Then, the connection electrode layers and the output electrode layers 14 are fixed, for example, by an anisotropic conductive adhesive.
  • the flexible printed circuit 30 can be sandwiched between the lower substrate 10 and the upper substrate 20.
  • the flexible printed circuit 30 extends from the side surface of the input device 1 and the degree of freedom of routing is reduced.
  • the width around the input area 1a is becoming smaller and smaller, and therefore the allowance space for projecting the flexible printed circuit board 30 from the side of the input device 1 is sufficient. In some cases it can not be secured.
  • the above problem can be solved by connecting the flexible printed circuit 30 from the lower surface side of the lower substrate 10 as shown in FIG.
  • the laminated structure from the support member 50 to the covering layer 24 constitutes the main body 60.
  • the warp correction member 72 is provided on the lower surface 60a of the main body 60 (in the embodiment of FIG. 1, the lower surface of the support member 50) via the bonding layer 71 such as an acrylic adhesive tape.
  • the bonding layer 71 such as an acrylic adhesive tape.
  • a transparent (light transmitting) adhesive or adhesive is used for the bonding layer 71.
  • the thickness of the bonding layer 71 is approximately 5 ⁇ m to 200 ⁇ m.
  • the warp correction member 72 is provided, for example, in the form of a sheet having a predetermined thickness over the entire lower surface 60a of the main body 60, and is configured to be translucent.
  • the warp correcting member 72 in the present embodiment has a warping force in the direction opposite to the warping direction of the main body 60, and is formed as shown in FIG. That is, the warp correction member 72 is a laminate of the base material 73, the first surface layer 74 formed on the upper surface 73a of the base material 73, and the second surface layer 75 formed on the lower surface 73b of the base material 73. It is formed of a structure.
  • the surface layers 74 and 75 are preferably formed on the entire upper and lower surfaces of the substrate 73.
  • both the first surface layer 74 and the second surface layer 75 are formed of a heat-shrinkable material.
  • the base material 73 is preferably made of a material that has a smaller dimensional change due to heat than the first surface layer 74 and the second surface layer 75, and has excellent thermal stability.
  • the base material 73 has a smaller thermal deformation rate than the first surface layer 74 and the second surface layer 75.
  • the thickness of the first surface layer 74 is formed to be thicker than the thickness of the second surface layer 75, whereby the first surface layer 74 has a second surface.
  • the contraction force in the in-plane direction of the base material 73 is larger than that of the layer 75. For this reason, when heat is applied to the warp correction member 72 alone shown in FIG. 2, it warps so as to be convex downward.
  • the main body portion 60 is formed by stacking members made of various materials as described above, and in the embodiment shown in FIG. 1 is warped to be upwardly convex by heat treatment. Therefore, as shown in FIG. 1, by installing the warp correction member 72 on the lower surface 60a of the main body 60, when the heat treatment is performed, the warp correction member 72 itself, the warp direction of the main body 60 As a result of the occurrence of the warping force in the opposite direction to the above, the warping of the main body 60 can be reduced.
  • the heat treatment is performed, for example, under pressure in order to suppress the entry of air bubbles into the bonding layer or the interface between the members.
  • the heat treatment temperature is about 40 ° C. to 100 ° C.
  • the warp correction member 72 is installed on the lower surface 60a of the main body 60, but unlike the prior art, the first surface layer 74 and the second surface layer 75 are provided on the upper and lower surfaces of the substrate 73.
  • the warp correction member 72 itself is different in the direction opposite to the warping direction of the main body 60 by making the stretching force of the first surface layer 74 and the second surface layer 75 in the in-substrate direction different. Warpage force can be applied.
  • the material and thickness of the surface layers 74 and 75 are appropriately adjusted, and the main body 60 is not influenced by the material and laminated structure of the main body 60.
  • the warpage of 60 can be effectively reduced, and the degree of freedom of warpage correction is high.
  • the material and thickness of the surface layers 74 and 75 can be freely selected, thinning of the warp correction member 72 can be promoted, and therefore, the thickness of the entire input device 1 can be suppressed.
  • the thickness of the base material 73 is about 30 ⁇ m to 100 ⁇ m, and the thickness of the first surface layer 74 and the second surface layer 75 is about 4 ⁇ m to 15 ⁇ m.
  • the substrate 73 in addition to PET, polycarbonate resin (PC resin), polyethylene naphthalate resin (PEN resin), cyclic polyolefin (COP resin), polymethyl methacrylate resin (acrylic) (PMMA), triacetyl cellulose (TAC) ), Polyether sulfone resin (PES resin) can be presented.
  • the first surface layer 74 and the second surface layer 75 can present an ultraviolet-curable acrylic resin (in particular, a urethane acrylate resin or an epoxy acrylate resin is preferable).
  • siliceous layer made of a compound derived from polysilazane, an inorganic material such as SiO 2 , DLC (diamond like carbon) or the like as the first surface layer 74 and the second surface layer 75. It can.
  • first surface layer 74 and the second surface layer 75 are formed with different materials. In such a case, even if the thicknesses of the first surface layer 74 and the second surface layer 75 are the same, the stretching force in the in-plane direction of the base material 73 between the first surface layer 74 and the second surface layer 75 If it is different, the warping force can be applied to the warp correcting member 72.
  • the warp correction member 72 is provided on the lower surface 60 a of the main body 60. Since the upper surface side of the main body portion 60 is the operation surface side of the input area 1a, providing the warp correction member 72 on the lower surface side of the upper surface side of the main body portion 60 provides stable input operability. it can. Further, as shown in FIG. 1, an acrylic support member 50 having a large thickness is joined to the lower surface side of the lower substrate 10, and in this embodiment, the support member 50 increases the warpage of the main body portion 60. Therefore, by joining the warp correction member 72 to the lower surface of the support member 50, it is possible to reduce the warp of the main body 60 more effectively.
  • the member 72 for curvature correction shown in FIG. 2 can be provided also in the part of the coating layer 24 shown in FIG. Thereby, the warp of the main body 60 can be reduced more effectively.
  • the input device 1 of embodiment shown in FIG. 1 was a resistive touch panel, an electrostatic capacitance touch panel etc. may be sufficient.
  • the surface layers 74 and 75 are provided on the upper and lower surfaces of the base material 73, but only one of them may be provided. However, when the surface layers 74 and 75 are provided on the upper and lower surfaces of the base material 73, it is possible to adjust with high accuracy so that the warp of the main body 60 is reduced.
  • the surface layers 74 and 75 may be a thermally expandable material rather than a thermally shrinkable material.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

L’invention concerne un dispositif d’entrée dans lequel un gauchissement peut être supprimé plus efficacement que dans des dispositifs d’entrée classiques. Un corps principal est formé par la stratification successive depuis le bas, dans cet ordre : d’un élément support, d’un substrat inférieur, d’un substrat supérieur, d’une couche décorative et d’une couche de protection, ces éléments étant réunis entre eux par un adhésif ou analogue. Un élément (72) de correction de gauchissement est prévu sur la surface inférieure du corps principal. L’élément de correction (72) de gauchissement comporte des couches (74, 75) de surface faites, par exemple, d’une résine d’acrylate d’uréthanne présentant des propriétés thermorétractables, sur les faces supérieure et inférieure d’une base (73) faite, par exemple, de PET. L’épaisseur des couches de surface (74, 75) est réglée par rapport à différentes dimensions, de manière à obtenir une force de gauchissement dans la direction opposée à la direction de gauchissement du corps principal.
PCT/JP2010/063736 2009-08-20 2010-08-13 Dispositif d’entrée WO2011021579A1 (fr)

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JP2011527659A JPWO2011021579A1 (ja) 2009-08-20 2010-08-13 入力装置

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JP2009190945 2009-08-20
JP2009-190945 2009-08-20

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WO2011021579A1 true WO2011021579A1 (fr) 2011-02-24

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012185819A (ja) * 2011-03-03 2012-09-27 Trendon Touch Technology Corp タッチセンシティブデバイス及びその製造方法
JP2012238298A (ja) * 2011-05-12 2012-12-06 Eturbotouch Technology Inc 視覚的効果を導入する平坦面タッチ装置
CN108182007A (zh) * 2017-12-29 2018-06-19 业成科技（成都）有限公司 触摸按键结构的保护盖、其制造方法及应用其的触控面板
CN110168482A (zh) * 2017-04-26 2019-08-23 森赛尔股份有限公司 通过层迭不同曲面的表面来预装载电阻式触摸传感器装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002328779A (ja) * 2001-05-07 2002-11-15 Matsushita Electric Ind Co Ltd タッチパネルおよびこれを用いた電子機器
WO2006123616A1 (fr) * 2005-05-16 2006-11-23 Nissha Printing Co., Ltd. Structure de fixation de panneau de protection amovible et feuille de fixation a utiliser avec

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002328779A (ja) * 2001-05-07 2002-11-15 Matsushita Electric Ind Co Ltd タッチパネルおよびこれを用いた電子機器
WO2006123616A1 (fr) * 2005-05-16 2006-11-23 Nissha Printing Co., Ltd. Structure de fixation de panneau de protection amovible et feuille de fixation a utiliser avec

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012185819A (ja) * 2011-03-03 2012-09-27 Trendon Touch Technology Corp タッチセンシティブデバイス及びその製造方法
JP2012238298A (ja) * 2011-05-12 2012-12-06 Eturbotouch Technology Inc 視覚的効果を導入する平坦面タッチ装置
CN110168482A (zh) * 2017-04-26 2019-08-23 森赛尔股份有限公司 通过层迭不同曲面的表面来预装载电阻式触摸传感器装置
US11573656B2 (en) 2017-04-26 2023-02-07 Sensel, Inc. Pre-loading a resistive touch sensor device via lamination of differently curved surfaces
CN110168482B (zh) * 2017-04-26 2023-03-21 森赛尔股份有限公司 通过层迭不同曲面的表面来预装载电阻式触摸传感器装置
CN108182007A (zh) * 2017-12-29 2018-06-19 业成科技（成都）有限公司 触摸按键结构的保护盖、其制造方法及应用其的触控面板

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