WO2011015959A1 - Led with silicone layer and laminated remote phosphor layer - Google Patents

Led with silicone layer and laminated remote phosphor layer Download PDF

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Publication number
WO2011015959A1
WO2011015959A1 PCT/IB2010/053113 IB2010053113W WO2011015959A1 WO 2011015959 A1 WO2011015959 A1 WO 2011015959A1 IB 2010053113 W IB2010053113 W IB 2010053113W WO 2011015959 A1 WO2011015959 A1 WO 2011015959A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
silicone
phosphor layer
phosphor
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2010/053113
Other languages
English (en)
French (fr)
Inventor
Grigoriy Basin
Paul S. Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Lumileds LLC
Original Assignee
Koninklijke Philips Electronics NV
Philips Lumileds Lighing Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV, Philips Lumileds Lighing Co LLC filed Critical Koninklijke Philips Electronics NV
Priority to BR112012002431-0A priority Critical patent/BR112012002431A2/pt
Priority to JP2012523405A priority patent/JP2013501372A/ja
Priority to RU2012108576/28A priority patent/RU2012108576A/ru
Priority to KR1020127006022A priority patent/KR20120056843A/ko
Priority to EP10740008A priority patent/EP2462634A1/en
Priority to CN2010800350575A priority patent/CN102473820A/zh
Publication of WO2011015959A1 publication Critical patent/WO2011015959A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Definitions

  • Non- remote phosphors Problems with such non- remote phosphors include: 1) the photon density is very high for high power LEDs and saturates the phosphor; 2) the LED is very hot and phosphors may react to the heat to cause darkening of the polymer binder layer (e.g., silicone) in which the phosphor particles are imbedded; 3) due to the various angles of blue light rays passing through different thicknesses of phosphors (a normal blue light ray passing through the least thickness), the color varies with viewing angle; and 4) it is difficult to create very uniform phosphor layer thicknesses and densities.
  • the polymer binder layer e.g., silicone
  • the mold 30 is then heated to cure the silicone 34, depending on the type of silicone 34 used. If the original silicone 34 was a solid (e.g., a powder or tablets) at room
  • the mold 30 is cooled to harden the silicone 34.
  • a transparent mold may be used and the silicone 34 may be cured with UV light.
  • a phosphor layer 42 may be laminated with a non-phosphor optical layer 50 that may be a pigmented color filter, a light scattering layer (e.g., silicone containing particles OfTiO 2 ), or other type of layer.
  • Fig. 11 illustrates the wafer 12 with the laminated phosphor layer 38 being brought against a mold 60 in order to form a silicone lens over the LEDs. This will protect the laminated phosphor layer 38, create any desired emission pattern, and increase light extraction by tailoring the refractive index of the silicone and the shape of the lens.
  • the mold 60 contains cavities 62 filled with silicone 64 for forming a hemispherical lens 66 (Fig. 12).

Landscapes

  • Led Device Packages (AREA)
PCT/IB2010/053113 2009-08-07 2010-07-07 Led with silicone layer and laminated remote phosphor layer Ceased WO2011015959A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
BR112012002431-0A BR112012002431A2 (pt) 2009-08-07 2010-07-07 método para fabricar um dispositivo emissor de luz e dispositivo emissor de luz
JP2012523405A JP2013501372A (ja) 2009-08-07 2010-07-07 シリコーン層及び積層された遠隔蛍光体層を備えるｌｅｄ
RU2012108576/28A RU2012108576A (ru) 2009-08-07 2010-07-07 Сид с силиконовым слоем и листовым отдаленным слоем люминофора
KR1020127006022A KR20120056843A (ko) 2009-08-07 2010-07-07 실리콘 층 및 라미네이트된 리모트 인광체 층을 갖는 ｌｅｄ
EP10740008A EP2462634A1 (en) 2009-08-07 2010-07-07 Led with silicone layer and laminated remote phosphor layer
CN2010800350575A CN102473820A (zh) 2009-08-07 2010-07-07 具有硅树脂层和层叠远程磷光体层的led

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/537,909 2009-08-07
US12/537,909 US20110031516A1 (en) 2009-08-07 2009-08-07 Led with silicone layer and laminated remote phosphor layer

Publications (1)

Publication Number Publication Date
WO2011015959A1 true WO2011015959A1 (en) 2011-02-10

Family

ID=43017061

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2010/053113 Ceased WO2011015959A1 (en) 2009-08-07 2010-07-07 Led with silicone layer and laminated remote phosphor layer

Country Status (9)

Country Link
US (1) US20110031516A1 (https=)
EP (1) EP2462634A1 (https=)
JP (1) JP2013501372A (https=)
KR (1) KR20120056843A (https=)
CN (1) CN102473820A (https=)
BR (1) BR112012002431A2 (https=)
RU (1) RU2012108576A (https=)
TW (1) TW201123549A (https=)
WO (1) WO2011015959A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
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WO2016146665A3 (de) * 2015-03-16 2016-11-03 Osram Opto Semiconductors Gmbh Lichtemittierendes bauelement und verfahren zur herstellung eines lichtemittierenden bauelements
EP3946574B1 (de) 2019-04-03 2024-12-04 JK-Holding GmbH Bestrahlungsmodul sowie vorrichtung zum bestrahlen mit medizinisch-kosmetischer strahlung

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KR20120056843A (ko) 2012-06-04
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