WO2010150747A1 - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
- Publication number
- WO2010150747A1 WO2010150747A1 PCT/JP2010/060477 JP2010060477W WO2010150747A1 WO 2010150747 A1 WO2010150747 A1 WO 2010150747A1 JP 2010060477 W JP2010060477 W JP 2010060477W WO 2010150747 A1 WO2010150747 A1 WO 2010150747A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- path
- refrigerant
- heat sink
- connection
- height
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat sink.
- the present invention relates to a heat sink provided in an inverter.
- the heat sink is for attaching and cooling a component to be cooled such as an electronic component.
- a water-cooled heat sink that circulates cooling water inside the heat sink has advantages such as stable cooling and resistance to the temperature inside the apparatus, as compared to an air-cooled heat sink.
- FIG. 5 shows an exploded perspective view of the water-cooled heat sink 20 described in Patent Document 1. As shown in FIG.
- the upper plate 12 and the lower plate 14 sandwich a metal flat plate-like middle plate 13 in which the opening 19 is formed, thereby forming a flow path of cooling water.
- Inner fins 15, 16, 17 are interposed in the opening 19 of the middle plate 13.
- the upper plate 12 is provided with a cooled component (not shown).
- the heat of the parts to be cooled is heat-exchanged to low temperature cooling water through the upper plate 12 and the inner fins 15, 16, 17, whereby the parts to be cooled are cooled.
- the cooling efficiency of the water-cooled heat sink is lowered when the cooling water does not flow smoothly or when the cooling water is distributed unevenly.
- the guide grooves 23 and 24 are formed in a step shape in the portion where the cooling water turns, thereby cooling the inner fin 16 close to the partition portion 22. It has a structure in which water can easily flow. Therefore, the cooling water uniformly flows into the entire inner fins 16 and the heat exchange efficiency of the inner fins 16 is improved.
- Patent Document 1 As shown in FIG. 6, the pressure loss is reduced by forming the end portion 21 of the portion where the cooling water turns into a projecting shape so that the depth is secured. ing.
- the heat sink includes a plurality of refrigerant paths and a connection path connecting the refrigerant paths in a non-linear manner, and the height of the flow path on the refrigerant flow side of the connection path is
- the height of the flow path of the connection path is set to be higher than the height of the refrigerant path connected to the flow path on the refrigerant inflow side, and the height of the flow path of the connection path is decreased as it reaches the end on the refrigerant outflow side of the connection path. It is characterized in that it was formed.
- the present invention contributes to improving the cooling efficiency of the heat sink without increasing the size of the heat sink.
- FIG. 1 The perspective view of the heat sink concerning the embodiment of the present invention.
- A Top view of heat sink according to Embodiment 1 of the present invention,
- b AA sectional view of heat sink according to Embodiment 1 of the present invention,
- c B- of heat sink according to Embodiment 1 of the present invention B sectional drawing,
- d CC sectional drawing of the heat sink which concerns on Embodiment 1 of this invention.
- FIG. 1 A) Top view of heat sink according to Embodiment 2 of the present invention, (b) AA sectional view of heat sink according to Embodiment 2 of the present invention, (c) B-of heat sink according to Embodiment 2 of the present invention B sectional drawing, (d) CC sectional drawing of the heat sink which concerns on Embodiment 2 of this invention.
- the disassembled perspective view of the water cooling type heat sink which concerns on a prior art.
- the enlarged view of the U-turn part of the water-cooled heat sink which has a U-shaped water flow path which concerns on a prior art.
- the present invention relates to a heat sink provided with a plurality of refrigerant passages and a connection passage connecting the refrigerant passages in a non-linear manner.
- the pressure in the connection path is set by setting the height of the flow path of the connection path on the side to which the refrigerant flows in greater than the height of the flow path of the refrigerant path that circulates the inflowing refrigerant. We are curbing losses.
- the height of the flow path of the connection path is formed so as to gradually decrease as it reaches the end on the outflow side of the refrigerant of the connection path, so that the refrigerant flowing out of the connection path can be It can be made to distribute
- the cooling efficiency can be improved without increasing the size of the heat sink.
- the embodiments of the present invention described below relate to a water-cooled heat sink, but the refrigerant according to the present invention is not limited to water.
- the water-cooled heat sink 1 has a structure in which a refrigerant passage 2 and a refrigerant passage 3 are connected in a U-shape via a connection passage 4. And the partition part 7 is formed by the refrigerant path 2, the refrigerant path 3, and the connection path 4 being connected in a U-shape.
- a connection passage 4 is connected to one end of the refrigerant passage 2 so as to communicate with the refrigerant passage 2.
- the other end of the refrigerant passage 2 is connected to an inlet pipe 5 for the refrigerant.
- One end of the refrigerant path 3 is in communication with the flow path on the side where the cooling water of the connection path 4 flows out. Then, the outlet pipe 6 for the cooling water is connected to the end of the refrigerant path 3 to which the connection path 4 is not connected.
- the refrigerant passages 2 and 3 form a plate-like cylinder, but the shape of the refrigerant passages 2 and 3 of the heat sink 1 according to the present invention is not limited to this, and any arbitrary cylinder may be used. You can use the body.
- connection path having the same shape as the connection path 4 may be connected to the end of the refrigerant path 3 to connect another heat sink 1 or another refrigerant path.
- the refrigerant passage 3 is disposed on the same plane as and in parallel with the refrigerant passage 2, but the arrangement location of the refrigerant passage 3 can be set arbitrarily.
- a component to be cooled 8 is provided in the vicinity of the heat sink 1, and the heat of the component to be cooled 8 is heat-exchanged with the cooling water flowing through the connection path 2 or 3.
- the cooling water to be subjected to the heat exchange flows from the inlet pipe 5 into the refrigerant path 2, passes through the connection path 4 and the refrigerant path 3, and flows out from the outlet pipe 6.
- the height of the flow passage on the side where the cooling water flows in the connection passage 4 is set higher than the height of the refrigerant passage 2.
- the height of the flow path of the connection path 4 on the side into which the refrigerant flows is formed to increase successively from the connection portion 4 a between the connection path 4 and the refrigerant path 2.
- the flow path height of the refrigerant path 2 in the vicinity of the connection path 4 is formed such that the height of the flow path is gradually increased as the connection path 4 is approached.
- the width direction height of the flow passage from the connection portion 4a between the connection passage 4 and the refrigerant passage 2 is increased.
- the flow velocity of the cooling water flowing from the refrigerant path 2 into the connection path 4 becomes constant at the left and right of the flow path.
- the refrigerant passage 2 leading to the connection portion 4a is increased in height in the width direction of the flow passage, the refrigerant passage 2 is increased.
- the flow velocity of the circulating cooling water becomes constant at the left and right of the flow path. Therefore, while being able to suppress the pressure loss in connection way 4, cooling water comes to circulate through the inside of refrigerant way 2 uniformly.
- the to-be-cooled component 8 is provided on the upper surface of the refrigerant passage 2 as illustrated in FIGS. 2B and 2C, even if the connection passage 4 is increased in the height direction, the water cooling method is used. There is no hindrance to miniaturizing the heat sink 1.
- connection path 4 is a flow path of the connection path 4 as it approaches the end 4 c on the side where the cooling water flows out from the flow path central portion 4 b in the flow direction of the connection path 4. Is formed to be low in height.
- the position at which the height of the connection path 4 decreases is not limited to the central portion 4 b, and may be any portion in the longitudinal direction of the connection path 4 from the refrigerant path 2 to the refrigerant path 3.
- the cooling water can flow uniformly.
- the shape of the connection path 4 is not limited to this embodiment, and the cooling water is uniform in the refrigerant path 3
- the heat sink according to the second embodiment of the present invention is different from the heat sink 1 according to the first embodiment in the shape of the flow path of the connection path. Therefore, in each component which constitutes the heat sink concerning Embodiment 2, about the thing similar to the heat sink 1 concerning Embodiment 1, the same numerals are attached and detailed explanation is omitted.
- the heat sink 10 has a structure in which the refrigerant path 2 and the refrigerant path 3 are connected in a U-shape via the connection path 11. And the partition part 7 is formed by the refrigerant path 2, the refrigerant path 3, and the connection path 11 being connected in a U-shape.
- a connection passage 11 is connected to one end of the refrigerant passage 2 so as to be in communication with the refrigerant passage 2.
- the other end of the refrigerant passage 2 is connected to an inlet pipe 5 for the refrigerant.
- One end of the refrigerant passage 3 is in communication with the passage on the side where the cooling water of the connection passage 11 flows out.
- the outlet pipe 6 of the cooling water is connected to an end of the refrigerant passage 3 to which the connection passage 11 is not connected.
- connection path having the same shape as that of the connection path 11 may be connected to the end of the refrigerant path 3 to connect another heat sink or another refrigerant path.
- the refrigerant passage 3 is disposed on the same plane as and in parallel with the refrigerant passage 2, but the arrangement location of the refrigerant passage 3 can be set arbitrarily.
- a component to be cooled 8 is provided in the vicinity of the heat sink 10, and the heat of the component to be cooled 8 is heat exchanged with the cooling water flowing through the connection path 2 or 3.
- the cooling water to be subjected to the heat exchange flows from the inlet pipe 5 into the refrigerant path 2, passes through the connection path 4 and the refrigerant path 3, and flows out from the outlet pipe 6.
- the height of the connection path 11 on the side where the cooling water flows in is formed higher than the height of the refrigerant path 2.
- the height of the connection path 11 on the side where the refrigerant flows in is formed to increase successively from the connection portion 11 b between the connection path 11 and the refrigerant path 2.
- the height of the refrigerant passage 2 in the vicinity of the connection passage 11 is formed to increase successively as the connection passage 11 is approached.
- the to-be-cooled component 8 is provided on the upper surface of the refrigerant path 2, even if the connection path 11 is increased in the height direction, the miniaturization of the water-cooled heat sink 10 is not hindered.
- connection path 11 on the side where the cooling water flows in is formed to increase successively, the connection is made so that the height in the width direction (the direction of the arrow E in FIG. 3C) becomes equal.
- the height of the passage 11 is increased, and the passage of the connection passage 11 located on the extension of the refrigerant passage 2 is formed to warp in the height direction of the connection passage 11.
- the cross section of the flow path substantially equal to the cross section of the flow path of the refrigerant path 2 from the connection portion 11 b of the refrigerant path 2 and the connection path 11 to the upper end portion 11 a of the connection path 11 where the cooling water abuts
- the flow velocity of the cooling water can be made substantially constant until the cooling water flowing through the refrigerant passage 2 reaches the upper end portion 11a of the connecting passage 11, and the cooling water flowing through the connecting passage 11 can flow substantially uniformly.
- the height of the flow path of the connection path 11 is lower as the connection path 11 approaches the end 11 d on the side where the cooling water flows out from the flow direction central portion 11 c of the connection path 11. It is formed to be
- the position at which the height of the connection path 11 decreases is not limited to the central portion 11 c, and may be any portion in the longitudinal direction of the connection path 11 from the refrigerant path 2 to the refrigerant path 3.
- the cooling water can flow uniformly.
- connection path 11 is not limited to this embodiment, What is necessary is just to set the shape which a cooling water flows uniformly to the refrigerant path 3, suitably. That is, the pressure loss of the cooling water is equalized as the cooling water in the flow direction central portion 11c of the connection passage 11 approaches the end 11d on the side where the cooling water in the connection passage 11 flows out. You just have to make it flow.
- the heat sink of the present invention As described above in detail by exemplifying the first and second embodiments, according to the heat sink of the present invention, the pressure loss of the refrigerant flowing through the heat sink is suppressed, and the refrigerant flows uniformly in the refrigerant path. Thus, the cooling efficiency of the heat sink can be improved. In addition, it is possible to minimize the increase in the volume in the depth direction (the depth of the portion where the refrigerant flow path of the heat sink U-turns), and the heat sink can be made compact. Therefore, it is possible to obtain a heat sink having a uniform temperature distribution, space saving and a small pressure loss.
- the heat sink according to the present invention is an invention relating to the flow path through which the refrigerant of the heat sink flows, and the configuration may be changed as appropriate without departing from the effects of the present invention.
- a heat sink may be formed in which flow paths having the same shape as the refrigerant paths 2 and 3 and the connection path 4 are formed.
- connection path according to the heat sink of the present invention is not limited to the case where the refrigerant makes a U-turn as described in the embodiment, and may be appropriately used if the flow direction of the refrigerant changes. it can.
- a refrigerant way and a connection way may be constituted separately, respectively, a refrigerant way and a connection way may be formed in one.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本発明の実施形態1に係る水冷式ヒートシンクについて、図1及び図2(a)~(d)を参照して詳細に説明する。
本発明の実施形態2に係るヒートシンクは、接続路の流路の形状が実施形態1に係るヒートシンク1と異なるものである。よって、実施形態2に係るヒートシンクを構成する各構成要素において、実施形態1に係るヒートシンク1と同様のものについては、同様の符号を付し詳細な説明は省略する。
2、3…冷媒路
4、11…接続路
7…仕切り部
8…被冷却部品
9…フィン
Claims (4)
- 複数の冷媒路と、
前記冷媒路を非直線状に接続する接続路と
を備えたヒートシンクにおいて、
前記接続路の冷媒が流入する側の流路の高さを、前記冷媒が流入する側の流路に接続される冷媒路の高さより高く形成し、
前記接続路の流路の高さを、前記接続路の冷媒が流出する側の端部に至るにつれて減少するように形成した
ことを特徴とするヒートシンク。 - 前記冷媒が流入する側の接続路の高さは、前記接続路と前記冷媒が流入する側の流路に接続される冷媒路との接続部から逐次増大する
ことを特徴とする請求項1に記載のヒートシンク。 - 前記冷媒が流入する側の流路に接続される冷媒路の延長に位置する接続路の流路の断面は、前記冷媒が流入する側の流路に接続される冷媒路の流路の断面と略等しく、且つ、前記接続路の高さ方向に湾曲して形成された
ことを特徴とする請求項1又は請求項2に記載のヒートシンク。 - 前記冷媒が流入する側の流路に接続される冷媒路と、前記接続路の冷媒が流出する側の流路に接続される冷媒路が平行に配置された
ことを特徴とする請求項1から請求項3のいずれか1項に記載のヒートシンク。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112010002307T DE112010002307T5 (de) | 2009-06-22 | 2010-06-21 | Kühlkörper |
CN201080028136.3A CN102804369B (zh) | 2009-06-22 | 2010-06-21 | 散热器 |
US13/379,905 US20120097381A1 (en) | 2009-06-22 | 2010-06-21 | Heat sink |
JP2011519886A JP5488599B2 (ja) | 2009-06-22 | 2010-06-21 | ヒートシンク |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009147138 | 2009-06-22 | ||
JP2009-147138 | 2009-06-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010150747A1 true WO2010150747A1 (ja) | 2010-12-29 |
Family
ID=43386516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/060477 WO2010150747A1 (ja) | 2009-06-22 | 2010-06-21 | ヒートシンク |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120097381A1 (ja) |
JP (1) | JP5488599B2 (ja) |
CN (1) | CN102804369B (ja) |
DE (1) | DE112010002307T5 (ja) |
WO (1) | WO2010150747A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016076641A (ja) * | 2014-10-08 | 2016-05-12 | カルソニックカンセイ株式会社 | 半導体冷却装置 |
JP2017044455A (ja) * | 2015-08-28 | 2017-03-02 | 三菱重工業株式会社 | 空気調和装置 |
US20190162483A1 (en) * | 2017-11-29 | 2019-05-30 | Honda Motor Co., Ltd. | Cooling apparatus |
US10847441B2 (en) | 2017-03-16 | 2020-11-24 | Mitsubishi Electric Corporation | Cooling system |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150034280A1 (en) * | 2013-08-01 | 2015-02-05 | Hamilton Sundstrand Corporation | Header for electronic cooler |
US20190301809A1 (en) * | 2018-04-03 | 2019-10-03 | Aavid Thermalloy, Llc | Wrap around heat exchanger |
CN111447805A (zh) * | 2020-05-11 | 2020-07-24 | 珠海格力电器股份有限公司 | 散热效率高的散热组件、电器盒及空调 |
CN114811756A (zh) * | 2022-04-14 | 2022-07-29 | 青岛海尔空调器有限总公司 | 一种散热器以及空调器 |
EP4311384A1 (en) * | 2022-07-22 | 2024-01-24 | Aptiv Technologies Limited | Cooling system with flow guiding element |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03113843U (ja) * | 1990-03-09 | 1991-11-21 | ||
JP2006295178A (ja) * | 2005-04-11 | 2006-10-26 | Samsung Electronics Co Ltd | 電子素子用ヒートシンク装置 |
JP2007150203A (ja) * | 2005-11-30 | 2007-06-14 | Toyota Central Res & Dev Lab Inc | ヒートシンク |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2640000C2 (de) * | 1976-09-04 | 1986-09-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben |
US5159529A (en) * | 1991-05-15 | 1992-10-27 | International Business Machines Corporation | Composite liquid cooled plate for electronic equipment |
DE19830863A1 (de) * | 1998-07-10 | 2000-01-13 | Behr Gmbh & Co | Flachrohr mit Querversatz-Umkehrbogenabschnitt und damit aufgebauter Wärmeübertrager |
CN2372785Y (zh) * | 1999-05-28 | 2000-04-05 | 郭清松 | 用于电器的散热器 |
CA2392610C (en) * | 2002-07-05 | 2010-11-02 | Long Manufacturing Ltd. | Baffled surface cooled heat exchanger |
CA2425233C (en) * | 2003-04-11 | 2011-11-15 | Dana Canada Corporation | Surface cooled finned plate heat exchanger |
JP4379339B2 (ja) * | 2005-01-19 | 2009-12-09 | トヨタ自動車株式会社 | 半導体冷却装置 |
JP2008235725A (ja) * | 2007-03-23 | 2008-10-02 | Calsonic Kansei Corp | 水冷式ヒートシンク |
US20090114373A1 (en) * | 2007-11-02 | 2009-05-07 | Calsonic Kansei Corporation | Heat exchanger |
-
2010
- 2010-06-21 DE DE112010002307T patent/DE112010002307T5/de not_active Ceased
- 2010-06-21 US US13/379,905 patent/US20120097381A1/en not_active Abandoned
- 2010-06-21 CN CN201080028136.3A patent/CN102804369B/zh not_active Expired - Fee Related
- 2010-06-21 WO PCT/JP2010/060477 patent/WO2010150747A1/ja active Application Filing
- 2010-06-21 JP JP2011519886A patent/JP5488599B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03113843U (ja) * | 1990-03-09 | 1991-11-21 | ||
JP2006295178A (ja) * | 2005-04-11 | 2006-10-26 | Samsung Electronics Co Ltd | 電子素子用ヒートシンク装置 |
JP2007150203A (ja) * | 2005-11-30 | 2007-06-14 | Toyota Central Res & Dev Lab Inc | ヒートシンク |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016076641A (ja) * | 2014-10-08 | 2016-05-12 | カルソニックカンセイ株式会社 | 半導体冷却装置 |
JP2017044455A (ja) * | 2015-08-28 | 2017-03-02 | 三菱重工業株式会社 | 空気調和装置 |
US10847441B2 (en) | 2017-03-16 | 2020-11-24 | Mitsubishi Electric Corporation | Cooling system |
US20190162483A1 (en) * | 2017-11-29 | 2019-05-30 | Honda Motor Co., Ltd. | Cooling apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN102804369B (zh) | 2015-11-25 |
DE112010002307T5 (de) | 2012-06-21 |
JP5488599B2 (ja) | 2014-05-14 |
CN102804369A (zh) | 2012-11-28 |
US20120097381A1 (en) | 2012-04-26 |
JPWO2010150747A1 (ja) | 2012-12-10 |
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