WO2010138451A3 - Pré-incision laser de verre à températures élevées - Google Patents
Pré-incision laser de verre à températures élevées Download PDFInfo
- Publication number
- WO2010138451A3 WO2010138451A3 PCT/US2010/035954 US2010035954W WO2010138451A3 WO 2010138451 A3 WO2010138451 A3 WO 2010138451A3 US 2010035954 W US2010035954 W US 2010035954W WO 2010138451 A3 WO2010138451 A3 WO 2010138451A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- glass
- laser
- temperature
- laser beam
- scoring
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201080023841.4A CN102448661B (zh) | 2009-05-27 | 2010-05-24 | 在升高温度下的玻璃的激光刻痕 |
JP2012513152A JP5636423B2 (ja) | 2009-05-27 | 2010-05-24 | 高温でのガラスのレーザ・スコアリング |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18147309P | 2009-05-27 | 2009-05-27 | |
US61/181,473 | 2009-05-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010138451A2 WO2010138451A2 (fr) | 2010-12-02 |
WO2010138451A3 true WO2010138451A3 (fr) | 2011-03-10 |
Family
ID=43223318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/035954 WO2010138451A2 (fr) | 2009-05-27 | 2010-05-24 | Pré-incision laser de verre à températures élevées |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5636423B2 (fr) |
KR (1) | KR101549721B1 (fr) |
CN (1) | CN102448661B (fr) |
TW (1) | TWI494186B (fr) |
WO (1) | WO2010138451A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
TWI513670B (zh) * | 2010-08-31 | 2015-12-21 | Corning Inc | 分離強化玻璃基板之方法 |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
CN103009896B (zh) * | 2012-12-12 | 2015-03-25 | 徐林波 | 热态玻璃板激光雕刻技术、工艺及设备 |
EP3544760B1 (fr) * | 2016-11-23 | 2020-11-25 | Aperam | Procédé de décapage laser d'un produit métallique en défilement, et installation pour son exécution |
CN107876969B (zh) * | 2017-11-06 | 2019-07-23 | 江门市蓬江区珠西智谷智能装备协同创新研究院 | 一种三维激光镭射效果的检测方法 |
CN110449745A (zh) * | 2019-08-29 | 2019-11-15 | 翔实光电科技(昆山)有限公司 | 一种防眩玻璃的激光刻蚀方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH058062A (ja) * | 1991-07-03 | 1993-01-19 | Toshiba Corp | レーザ加工装置 |
JP2005537934A (ja) * | 2002-09-06 | 2005-12-15 | アルストム テクノロジー リミテッド | レーザー金属成形による硬い層の微細構造の制御方法 |
JP2006281250A (ja) * | 2005-03-31 | 2006-10-19 | Sunx Ltd | レーザ加工装置及びその出力制御方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO134614C (fr) * | 1972-10-12 | 1976-11-17 | Glaverbel | |
US5776220A (en) * | 1994-09-19 | 1998-07-07 | Corning Incorporated | Method and apparatus for breaking brittle materials |
JPH08231239A (ja) * | 1994-12-27 | 1996-09-10 | Asahi Glass Co Ltd | ガラスリボンの割断方法およびそのための装置 |
DE19918936A1 (de) * | 1999-04-27 | 2000-11-02 | Schott Glas | Verfahren und Vorrichtung zur Herstellung von Einzelglasscheiben |
US6796144B2 (en) * | 2001-05-30 | 2004-09-28 | Battelle Memorial Institute | System and method for glass processing and temperature sensing |
KR100794284B1 (ko) * | 2001-09-29 | 2008-01-11 | 삼성전자주식회사 | 비금속 기판 절단 방법 |
US20060021977A1 (en) * | 2004-07-30 | 2006-02-02 | Menegus Harry E | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
US7371143B2 (en) * | 2004-10-20 | 2008-05-13 | Corning Incorporated | Optimization of parameters for sealing organic emitting light diode (OLED) displays |
CN100475419C (zh) * | 2004-10-25 | 2009-04-08 | 三星钻石工业股份有限公司 | 裂痕形成方法及裂痕形成装置 |
US7292616B2 (en) * | 2005-02-09 | 2007-11-06 | Ultratech, Inc. | CO2 laser stabilization systems and methods |
DE102006024825A1 (de) | 2006-05-23 | 2007-11-29 | Jenoptik Automatisierungstechnik Gmbh | Verfahren und Vorrichtung zum Randbeschneiden eines Floatglasbandes |
JP2008062489A (ja) | 2006-09-07 | 2008-03-21 | Systec Inoue Corp | 脆性材料の割断方法、および脆性材料の割断装置 |
JP5235987B2 (ja) * | 2007-04-30 | 2013-07-10 | コーニング インコーポレイテッド | 移動中の帯状ガラスに切断線を設ける装置、システム及び方法 |
JP2009084096A (ja) * | 2007-09-28 | 2009-04-23 | Omron Laserfront Inc | ガラス切断装置及び方法 |
-
2010
- 2010-05-24 KR KR1020117031066A patent/KR101549721B1/ko active IP Right Grant
- 2010-05-24 WO PCT/US2010/035954 patent/WO2010138451A2/fr active Application Filing
- 2010-05-24 JP JP2012513152A patent/JP5636423B2/ja not_active Expired - Fee Related
- 2010-05-24 CN CN201080023841.4A patent/CN102448661B/zh not_active Expired - Fee Related
- 2010-05-27 TW TW099117054A patent/TWI494186B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH058062A (ja) * | 1991-07-03 | 1993-01-19 | Toshiba Corp | レーザ加工装置 |
JP2005537934A (ja) * | 2002-09-06 | 2005-12-15 | アルストム テクノロジー リミテッド | レーザー金属成形による硬い層の微細構造の制御方法 |
JP2006281250A (ja) * | 2005-03-31 | 2006-10-19 | Sunx Ltd | レーザ加工装置及びその出力制御方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
Also Published As
Publication number | Publication date |
---|---|
KR101549721B1 (ko) | 2015-09-02 |
CN102448661B (zh) | 2014-08-13 |
JP2012528068A (ja) | 2012-11-12 |
TW201105447A (en) | 2011-02-16 |
WO2010138451A2 (fr) | 2010-12-02 |
KR20120030458A (ko) | 2012-03-28 |
TWI494186B (zh) | 2015-08-01 |
CN102448661A (zh) | 2012-05-09 |
JP5636423B2 (ja) | 2014-12-03 |
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