WO2010119808A1 - 製品の製造方法および製造システム - Google Patents
製品の製造方法および製造システム Download PDFInfo
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- WO2010119808A1 WO2010119808A1 PCT/JP2010/056374 JP2010056374W WO2010119808A1 WO 2010119808 A1 WO2010119808 A1 WO 2010119808A1 JP 2010056374 W JP2010056374 W JP 2010056374W WO 2010119808 A1 WO2010119808 A1 WO 2010119808A1
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- manufacturing
- storage unit
- conditions
- product
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 198
- 238000000034 method Methods 0.000 title claims description 16
- 238000003860 storage Methods 0.000 claims abstract description 154
- 238000012545 processing Methods 0.000 claims description 24
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 abstract description 12
- 230000015572 biosynthetic process Effects 0.000 description 37
- 238000004891 communication Methods 0.000 description 29
- 238000007689 inspection Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 238000012546 transfer Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Definitions
- the present invention relates to a manufacturing method and a manufacturing system of a product, and particularly relates to a manufacturing method and a manufacturing system of a product using a storage unit that stores manufacturing conditions.
- Some manufacturing apparatuses for manufacturing products have a storage unit for storing manufacturing conditions.
- the supply device has a microcomputer. This microcomputer stores the heating output pattern of the heater and the output pattern of the carrier gas.
- an object of the present invention is to provide a manufacturing method and a manufacturing system that can be easily maintained and inspected and that can prevent information leakage of manufacturing conditions.
- the manufacturing method of the product of this invention has the following processes. Manufacturing conditions are stored in the first storage unit. The manufacturing conditions are transmitted from the first storage unit to the second storage unit in order to store the manufacturing conditions in the second storage unit. A product is manufactured based on the manufacturing conditions stored in the second storage unit. After the product is manufactured, the manufacturing conditions are erased from the second storage unit.
- the manufacturing conditions are erased from the second storage unit after the product is manufactured. Thereby, it is possible to prevent leakage of manufacturing condition information.
- the second storage unit is installed outside the restricted area, an operator who performs maintenance and inspection of the manufacturing system can access the second storage unit, so that maintenance and inspection of the manufacturing system can be easily performed. Can be done.
- the second storage unit is volatile.
- storage part is erase
- the first storage unit is nonvolatile. Therefore, even if it is a case where a power supply is turned off, a manufacturing condition can be continuously preserve
- the manufacturing conditions are not stored in a non-volatile manner outside the first storage unit.
- a signal requesting transmission of the manufacturing conditions from the first storage unit to the second storage unit is generated.
- the manufacturing conditions are stored again in the second storage unit, the product can be manufactured again. That is, the production of the product can be repeated.
- a product is preferably manufactured by each of the plurality of processing units. Further, the signal includes information for specifying any of the plurality of processing units.
- any one of the plurality of processing units can be specified, and further, manufacturing conditions suitable for the specific processing unit can be selectively transmitted.
- the manufacturing system of the present invention includes a manufacturing device, a storage device, and a control device.
- a manufacturing apparatus manufactures a product.
- the storage device includes a first storage unit that stores manufacturing conditions for controlling the manufacturing device, and can transmit the manufacturing conditions stored in the first storage unit.
- the control device includes a second storage unit that stores the manufacturing condition transmitted from the storage device, and a control unit that controls the manufacturing device based on the manufacturing condition stored in the second storage unit.
- the control unit is configured to erase the manufacturing conditions from the second storage unit after controlling the manufacturing apparatus based on the manufacturing conditions stored in the second storage unit.
- the control unit controls the manufacturing apparatus based on the manufacturing conditions stored in the second storage unit, and then deletes the manufacturing conditions from the second storage unit. Thereby, it is possible to prevent leakage of manufacturing condition information.
- the second storage unit is installed outside the restricted area, an operator who performs maintenance and inspection of the manufacturing system can access the second storage unit, so that maintenance and inspection of the manufacturing system can be easily performed. Can be done.
- the storage device is preferably installed in the first area, and the control device and the manufacturing device are installed in a second area different from the first area. More preferably, the first area is more restricted from entering people in terms of information management than the second area.
- the second storage unit is volatile.
- storage part is erase
- the first storage unit is preferably nonvolatile. Therefore, even if it is a case where a power supply is turned off, a manufacturing condition can be continuously preserve
- the above manufacturing system is preferably configured so that the manufacturing conditions are not stored in a non-volatile manner outside the first storage unit.
- control unit is preferably configured to generate a signal requesting that the manufacturing conditions be transmitted from the first storage unit to the second storage unit.
- the manufacturing condition when the manufacturing condition is not stored in the second storage unit, the manufacturing condition can be stored in the second storage unit by generating the signal.
- the manufacturing apparatus preferably includes a plurality of processing units each manufacturing a product. Further, the signal includes information for specifying any of the plurality of processing units.
- any one of the plurality of processing units can be specified, and further, manufacturing conditions suitable for the specific processing unit can be selectively transmitted.
- the manufacturing system 100 of the present embodiment includes a storage device 10 and a basic system 50.
- the storage device 10 is installed in a restricted area CA (first area).
- the basic system 50 is installed in a processing area PA (second area), which is a place where entry of people for information management is not restricted as compared with the restricted area CA.
- the basic system 50 includes a control device 20 and a manufacturing device 30.
- the manufacturing apparatus 30 includes a processing unit 31 that manufactures a product.
- the product includes an incomplete product in the middle of the manufacturing process.
- the manufacturing apparatus 30 is, for example, a CVD (Chemical Vapor Deposition) apparatus having one film forming chamber.
- the processing unit 31 is a film forming chamber and its internal structure.
- the storage device 10 includes a first storage unit 11 and a first communication unit 12.
- the first storage unit 11 is for storing manufacturing conditions for controlling the manufacturing apparatus 30, and is preferably a non-volatile storage device such as an HDD (Hard Disk Drive) or a flash memory. .
- the 1st communication part 12 can transmit the manufacturing conditions preserve
- the storage device 10 is realized by, for example, a PC (Personal Computer).
- the control device 20 includes a second storage unit 21, a second communication unit 22, and a control unit 23.
- the control apparatus 20 is implement
- the second storage unit 21 is for storing the manufacturing conditions transmitted from the first communication unit 12 of the storage device 10, and is preferably a volatile storage device such as a RAM (Random Access Memory).
- the second communication unit 22 is connected to each of the first communication unit 12, the second storage unit 21, and the control unit 23.
- the control unit 23 is for controlling the manufacturing apparatus 30 based on the manufacturing conditions stored in the second storage unit 21.
- the control unit 23 is configured to erase the manufacturing conditions from the second storage unit 21 after controlling the manufacturing apparatus 30 based on the manufacturing conditions stored in the second storage unit 21.
- the control unit 23 is configured to generate a signal that requests transmission of manufacturing conditions from the first storage unit 11 to the second storage unit 21.
- the manufacturing system 100 is configured such that manufacturing conditions are not stored in a non-volatile manner outside the first storage unit 11.
- step S ⁇ b> 1 manufacturing conditions are stored in first storage unit 11 in restricted area CA.
- step S2 the control unit 23 generates a signal requesting that the manufacturing conditions be transmitted from the first storage unit 11 to the second storage unit 21. This signal is transmitted to the first communication unit 12 via the second communication unit 22.
- step S ⁇ b> 3 the first communication unit 12 that has received the signal transmits the manufacturing conditions stored in the first storage unit 11 to the second communication unit 22.
- the second communication unit 22 receives the manufacturing conditions transmitted from the first communication unit 12, and then transmits the received manufacturing conditions to the second storage unit 21.
- the second storage unit 21 stores the manufacturing conditions transmitted from the second communication unit 22. As described above, the manufacturing conditions are transmitted from the first storage unit 11 to the second storage unit 21 and stored in the second storage unit 21.
- step S 4 the control unit 23 controls the processing unit 31 of the manufacturing apparatus 30 based on the manufacturing conditions stored in the second storage unit 21. Thereby, the manufacturing apparatus 30 manufactures a product. Specifically, for example, film formation is performed by a CVD apparatus based on film formation conditions that define power, gas flow rate, film formation time, and the like.
- step S5 after the product is manufactured as described above, the control unit 23 erases the manufacturing conditions from the second storage unit 21.
- step S6 the control unit 23 determines whether or not to repeat the manufacturing. For example, if the number of manufactured products is less than the predetermined number set in the control unit 23 in advance, a determination is made to repeat manufacturing, and if the number reaches the predetermined number, a determination is made not to repeat.
- step S6 If it is determined in step S6 that the manufacturing is repeated, the process returns to step S2.
- step S6 if it is determined in step S6 that the production is not repeated, the basic system 50 is maintained and inspected in step S7.
- the operator stores the maintenance / inspection conditions in the second storage unit 21 in the processing area PA, so that the manufacturing apparatus 30 can be operated using the control device 20.
- control unit 23 controls the manufacturing apparatus 30 based on the manufacturing conditions stored in the second storage unit 21 and then deletes the manufacturing conditions from the second storage unit 21. Thereby, it is possible to prevent leakage of manufacturing condition information.
- control device 20 having the second storage unit 21 when the control device 20 having the second storage unit 21 is installed in a place outside the processing area PA, that is, the restriction area CA, an operator who performs maintenance and inspection of the basic system 50 accesses the second storage unit 21. be able to. As a result, the manufacturing apparatus 30 using the control apparatus 20 can be maintained and inspected with operations.
- the second storage unit 21 is volatile, the information stored in the second storage unit 21 is erased when the power is turned off. Therefore, leakage of manufacturing conditions from the second storage unit 21 can be prevented more reliably.
- the manufacturing conditions can be continuously stored in the first storage unit 11 even when the power is turned off.
- the manufacturing system 100 is configured such that the manufacturing conditions are not stored in a non-volatile manner outside the first storage unit 11. Thereby, when the power is turned off, the manufacturing conditions are erased outside the first storage unit 11. Therefore, since manufacturing conditions remain only in the 1st storage part 11 located in restriction area CA, leak of manufacturing conditions can be prevented more certainly.
- control unit 23 is configured to be able to generate a signal requesting that the manufacturing conditions be transmitted from the first storage unit 11 to the second storage unit 21 after erasing the manufacturing conditions.
- manufacturing conditions are memorize
- film formation system 100M (manufacturing system) of the present embodiment includes storage device 10 and film formation basic system 50M.
- the film forming basic system 50M is installed in the processing area PA, and includes a control device 20M and a film forming device 30M (manufacturing device).
- the film forming apparatus 30M includes first to third film forming units 31a to 31c (a plurality of processing units), a transfer unit 32, and a front chamber 33.
- Each of the first to third film forming units 31a to 31c is a film forming chamber and its internal structure, and a film-formed substrate (product) can be manufactured by forming a film on the substrate.
- the transport unit 32 is for transporting the substrate between each of the first to third film forming units 31a to 31c and the front chamber 33 as indicated by an arrow in FIG.
- the control device 20M includes a second storage unit 21, a second communication unit 22, and a control unit 23M.
- the control unit 23M is for controlling the film forming apparatus 30M based on the film forming conditions (manufacturing conditions) stored in the second storage unit 21.
- the control unit 23M is configured to erase the film formation conditions from the second storage unit 21 after controlling the film formation apparatus 30M based on the film formation conditions stored in the second storage unit 21.
- the control unit 23M is configured to generate a signal requesting transmission of the film forming conditions from the first storage unit 11 to the second storage unit 21. This signal includes information specifying any of the plurality of first to third film forming units 31a to 31c.
- Control device 20M is realized by, for example, a PC or a PLC.
- the film forming system 100M is configured such that the film forming conditions are not stored in a non-volatile manner outside the first storage unit 11.
- first to third film forming conditions for each of first to third film forming units 31a to 31c are stored in first storage unit 11 in restricted area CA (FIG. 2). : Step S1).
- the substrate 70 is transferred from the front chamber 33 to the first to third film forming units 31a to 31c via the transfer unit 32 (arrows I1 to I3 in FIG. 5). Further, the control unit 23M generates a signal requesting transmission of the first to third film forming conditions from the first storage unit 11 to the second storage unit 21 (FIG. 2: step S2). This signal is transmitted to the first communication unit 12 via the second communication unit 22.
- the first communication unit 12 Upon receiving the signal, the first communication unit 12 transmits the first to third film forming conditions stored in the first storage unit 11 to the second communication unit 22.
- the second communication unit 22 receives the first to third film formation conditions transmitted from the first communication unit 12, and then transmits the received film formation conditions to the second storage unit 21.
- the second storage unit 21 stores the first to third film forming conditions transmitted from the second communication unit 22. As described above, the first to third film forming conditions are transmitted from the first storage unit 11 to the second storage unit 21 and stored in the second storage unit 21 (FIG. 2: step S3).
- control unit 23M performs first to third film forming units of film forming apparatus 30M. 31a to 31c are controlled. Thereby, the film forming apparatus 30M forms a film (FIG. 2: Step S4).
- the time when film formation is completed is not necessarily the same between the first to third film forming units 31a to 31c. At a certain time, for example, film formation is completed only in the first film forming unit 31a. That is, the film-formed substrate 71 (product) is obtained in the film-forming part 31a.
- control unit 23M selectively selects the first film formation condition that is the film formation condition for the first film formation unit 31a from the second storage unit 21. Erasing is performed (FIG. 2: step S5).
- the film-formed substrate 71 is transferred from the first film forming unit 31a to the front chamber 33 via the transfer unit 32 as indicated by an arrow O1. Further, the control unit 23M determines whether or not to repeat the film formation by the first film forming unit 31a (FIG. 2: step S6). For example, if the number of film-formed substrates 71 is less than the predetermined number set in the control unit 23M in advance, a determination is made to repeat the film formation, and if the predetermined number is reached, a determination is made not to repeat.
- step S6 if it is determined in step S6 that the film formation is to be repeated, the substrate is transferred from the front chamber 33 to the first film forming unit 31a via the transfer unit 32 as indicated by an arrow I1. 70 is conveyed.
- the control unit 23M selects the first film formation condition, which is the film formation condition for the first film formation unit 31a, from the first to third film formation conditions from the first storage unit 11 to the second storage unit 21.
- a signal requesting transmission is generated (FIG. 2: step S2). This signal is transmitted to the first communication unit 12 via the second communication unit 22.
- the first communication unit 12 that has received the signal transmits the first film formation condition stored in the first storage unit 11 to the second communication unit 22.
- the second communication unit 22 receives the first film formation condition transmitted from the first communication unit 12, and then transmits the received first film formation condition to the second storage unit 21 (FIG. 2: step). S3).
- step S4 the film formation by the first film forming unit 31a is repeated.
- the control unit 23M selectively erases the first film forming condition, which is the film forming condition for the first film forming unit 31a, from the second storage unit 21. (FIG. 2: Step S5).
- the control unit 23M determines again whether or not to repeat the film formation by the first film formation unit 31a (FIG. 2: step S6).
- step S6 If it is determined in step S6 that the film formation is not repeated, the repetition of the film formation by the first film forming unit 31a is completed.
- step S7 the film forming basic system 50M is maintained and inspected.
- the operator stores the conditions for maintenance / inspection in the second storage unit 21 in the processing area PA, so that the film forming apparatus 30M can be operated using the control device 20M.
- each of the first to third film forming units 31a to 31c is selectively transmitted.
- the film forming conditions suitable for the above can be used.
- the first to third film forming conditions used for the first to third film forming units 31a to 31c are selectively erased, the first to third film forming conditions are used for control. It is possible to prevent erasing what is being done. Thereby, it can be avoided that the film formation is hindered by erasing the film formation conditions.
- the film forming system has been described as the manufacturing system.
- the present invention is not limited to this, and may be, for example, an etching system having an etching apparatus.
- the present invention can be applied particularly advantageously to a manufacturing method and a manufacturing system of a product using a storage unit that stores manufacturing conditions.
- 10 storage device 11 first storage unit, 12 first communication unit, 20, 20M control device, 21 second storage unit, 22 second communication unit, 23, 23M control unit, 30 manufacturing device, 30M film forming device (manufacturing Equipment), 31 processing units, 31a to 31c, first to third film forming units (processing units), 32 transfer unit, 33 front chamber, 50 basic system, 50M basic film forming system, 70 substrates, 71 already formed substrates ( Product), 100 manufacturing system, 100M film forming system (manufacturing system), CA restricted area (first area), PA processing area (second area).
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Abstract
Description
たとえば特開平4-99279号公報(特許文献1)に記載の技術においては、供給装置はマイクロコンピュータを有する。このマイクロコンピュータは、ヒータの加熱出力パターンとキャリアガスの出力パターンとを記憶する。
第1記憶部に製造条件が保存される。製造条件を第2記憶部に記憶させるために製造条件が第1記憶部から第2記憶部へ送信される。第2記憶部に記憶された製造条件に基づいて製品が製造される。製品が製造された後に、第2記憶部から製造条件が消去される。
これにより、第2記憶部に記憶された情報は、電源が切られた場合に消去される。よって第2記憶部からの製造条件の漏えいを、より確実に防止することができる。
これにより、電源が切られた場合であっても、第1記憶部において製造条件を保存し続けることができる。
これにより、第2記憶部に記憶された情報は、電源が切られた場合に消去される。よって第2記憶部からの製造条件の漏えいを、より確実に防止することができる。
これにより、電源が切られた場合であっても、第1記憶部において製造条件を保存し続けることができる。
(実施の形態1)
はじめに本実施の形態の製造システムについて説明する。
図1および図2を参照して、ステップS1にて、制限エリアCAにおいて第1記憶部11に製造条件が保存される。
図3を参照して、本実施の形態の成膜システム100M(製造システム)は保存装置10および成膜基本システム50Mを有する。成膜基本システム50Mは、処理エリアPAに設置されており、制御装置20Mおよび成膜装置30M(製造装置)を有する。
図3を参照して、まず制限エリアCAにおいて第1記憶部11に、第1~第3成膜部31a~31cのそれぞれのための第1~第3成膜条件が保存される(図2:ステップS1)。
第1成膜部31aにおける上記の成膜が完了した後に、制御部23Mは第1成膜部31a用の成膜条件である第1成膜条件を第2記憶部21から選択的に消去する(図2:ステップS5)。そして制御部23Mは、第1成膜部31aによる成膜を繰り返すか否か再度判断する(図2:ステップS6)。
また第1~第3成膜部31a~31cに用いられる第1~第3成膜条件のうち特定のものが選択的に送信されるので、第1~第3成膜部31a~31cの各々に適した成膜条件を用いることができる。
Claims (14)
- 第1記憶部(11)に製造条件を保存する工程と、
前記製造条件を第2記憶部(21)に記憶させるために前記製造条件を前記第1記憶部(11)から前記第2記憶部(21)へ送信する工程と、
前記第2記憶部(21)に記憶された前記製造条件に基づいて製品(71)を製造する工程と、
前記製品(71)を製造する工程の後に、前記第2記憶部(21)から前記製造条件を消去する工程とを備えた、製品(71)の製造方法。 - 前記第2記憶部(21)は揮発性である、請求の範囲第1項に記載の製品(71)の製造方法。
- 前記第1記憶部(11)は不揮発性である、請求の範囲第1項または第2項に記載の製品(71)の製造方法。
- 前記製造条件は前記第1記憶部(11)の外部において不揮発に記憶されない、請求の範囲第1項~第3項のいずれかに記載の製品(71)の製造方法。
- 前記製造条件を消去する工程の後に、前記製造条件を前記第1記憶部(11)から前記第2記憶部(21)へ送信することを要求する信号を発生する工程をさらに備えた、請求の範囲第1項~第4項のいずれかに記載の製品(71)の製造方法。
- 前記製品(71)を製造する工程は複数の処理部(31a~31c)の各々によって行なわれ、
前記信号は、前記複数の処理部(31a~31c)のいずれかを特定する情報を含む、請求の範囲第5項に記載の製品(71)の製造方法。 - 製品(71)を製造する製造装置(30)と、
前記製造装置(30)を制御するための製造条件を保存する第1記憶部(11)を有し、かつ前記第1記憶部(11)に保存された前記製造条件を送信することができる保存装置(10)と、
前記保存装置(10)から送信された前記製造条件を記憶する第2記憶部(21)と、前記第2記憶部(21)に記憶された前記製造条件に基づいて前記製造装置(30)を制御する制御部(23)とを有する制御装置(20)と備え、
前記制御部(23)は、前記第2記憶部(21)に記憶された前記製造条件に基づいて前記製造装置(30)を制御した後に、前記第2記憶部(21)から前記製造条件を消去するように構成されている、製造システム(100)。 - 前記保存装置は第1エリアに設置されており、前記制御装置および前記製造装置は前記第1エリアと異なる第2エリアに設置されている、請求の範囲第7項に記載の製造システム(100)。
- 前記第1エリアは前記第2エリアに比して情報管理の上で人の立ち入りが制限されている、請求の範囲第8項に記載の製造システム(100)。
- 前記第2記憶部(21)は揮発性である、請求の範囲第7項~第9項に記載の製造システム(100)。
- 前記第1記憶部(11)は不揮発性である、請求の範囲第7項~第10項に記載の製造システム(100)。
- 前記製造条件が前記第1記憶部(11)の外部において不揮発に記憶されないように構成されている、請求の範囲第7項~第11項のいずれかに記載の製造システム(100)。
- 前記制御部(23)は、前記製造条件を前記第1記憶部(11)から前記第2記憶部(21)へ送信することを要求する信号を発生することができるように構成されている、請求の範囲第7項~第12項のいずれかに記載の製造システム(100)。
- 前記製造装置(30M)は、各々が前記製品(71)を製造する複数の処理部(31a~31c)を含み、
前記信号は、前記複数の処理部(31a~31c)のいずれかを特定する情報を含む、請求の範囲第13項に記載の製造システム(100M)。
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EP10764392A EP2421025A1 (en) | 2009-04-15 | 2010-04-08 | Method and system for manufacturing product |
JP2011509270A JPWO2010119808A1 (ja) | 2009-04-15 | 2010-04-08 | 製品の製造方法および製造システム |
US13/258,803 US20120016506A1 (en) | 2009-04-15 | 2010-04-08 | Manufacturing method and manufacturing system for product |
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US (1) | US20120016506A1 (ja) |
EP (1) | EP2421025A1 (ja) |
JP (1) | JPWO2010119808A1 (ja) |
WO (1) | WO2010119808A1 (ja) |
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JP6313671B2 (ja) | 2014-06-23 | 2018-04-18 | 株式会社Screenホールディングス | 基板処理装置のためのスケジュール作成方法および基板処理装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0499279A (ja) | 1990-08-08 | 1992-03-31 | Seiko Epson Corp | 液体材料の気体化供給方法と供給装置 |
JP2001075628A (ja) * | 1999-09-01 | 2001-03-23 | Tokyo Electron Ltd | 半導体製造装置及びその動作条件パラメータの管理方法 |
JP2008147489A (ja) * | 2006-12-12 | 2008-06-26 | Tokyo Electron Ltd | 群管理システム、サーバ装置、およびプログラム |
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JP2002252161A (ja) * | 2001-02-23 | 2002-09-06 | Hitachi Ltd | 半導体製造システム |
US8161225B2 (en) * | 2003-08-06 | 2012-04-17 | Panasonic Corporation | Semiconductor memory card, access device and method |
JP2007109182A (ja) * | 2005-10-17 | 2007-04-26 | Canon Inc | ワークフローシステムおよびオブジェクト生成装置 |
JP5093652B2 (ja) * | 2007-06-12 | 2012-12-12 | 株式会社ニコン | 研磨装置 |
-
2010
- 2010-04-08 WO PCT/JP2010/056374 patent/WO2010119808A1/ja active Application Filing
- 2010-04-08 EP EP10764392A patent/EP2421025A1/en not_active Withdrawn
- 2010-04-08 JP JP2011509270A patent/JPWO2010119808A1/ja active Pending
- 2010-04-08 US US13/258,803 patent/US20120016506A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0499279A (ja) | 1990-08-08 | 1992-03-31 | Seiko Epson Corp | 液体材料の気体化供給方法と供給装置 |
JP2001075628A (ja) * | 1999-09-01 | 2001-03-23 | Tokyo Electron Ltd | 半導体製造装置及びその動作条件パラメータの管理方法 |
JP2008147489A (ja) * | 2006-12-12 | 2008-06-26 | Tokyo Electron Ltd | 群管理システム、サーバ装置、およびプログラム |
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EP2421025A1 (en) | 2012-02-22 |
US20120016506A1 (en) | 2012-01-19 |
JPWO2010119808A1 (ja) | 2012-10-22 |
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