WO2010094534A3 - Starrflexible trägerplatte - Google Patents

Starrflexible trägerplatte Download PDF

Info

Publication number
WO2010094534A3
WO2010094534A3 PCT/EP2010/050889 EP2010050889W WO2010094534A3 WO 2010094534 A3 WO2010094534 A3 WO 2010094534A3 EP 2010050889 W EP2010050889 W EP 2010050889W WO 2010094534 A3 WO2010094534 A3 WO 2010094534A3
Authority
WO
WIPO (PCT)
Prior art keywords
flexirigid
support plate
light source
semiconductor light
support region
Prior art date
Application number
PCT/EP2010/050889
Other languages
English (en)
French (fr)
Other versions
WO2010094534A2 (de
Inventor
Thomas Preuschl
Original Assignee
Osram Gesellschaft mit beschränkter Haftung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gesellschaft mit beschränkter Haftung filed Critical Osram Gesellschaft mit beschränkter Haftung
Priority to US13/201,870 priority Critical patent/US20110299292A1/en
Priority to CN2010800081333A priority patent/CN102318449A/zh
Priority to EP10711596A priority patent/EP2399433A2/de
Publication of WO2010094534A2 publication Critical patent/WO2010094534A2/de
Publication of WO2010094534A3 publication Critical patent/WO2010094534A3/de

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/047Box-like arrangements of PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09127PCB or component having an integral separable or breakable part
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Die starrflexible Trägerplatte (1) dient zur Befestigung mindestens einer Halbleiter-Lichtquelle (12) und weist mindestens einen starren Trägerbereich zur Befestigung der mindestens einen Halbleiter-Lichtquelle (12) und einen flexiblen Trägerbereich (3) auf, wobei der flexible Trägerbereich (3) durch Abdünnung eines starren Trägerbereichs erzeugt worden ist. Die Leuchtvorrichtung (16) ist mit mindestens einer starrflexiblen Trägerplatte (15) ausgerüstet, wobei auf mindestens einer starrflexiblen Trägerplatte mindestens eine Halbleiter-Lichtquelle angebracht ist.
PCT/EP2010/050889 2009-02-17 2010-01-27 Starrflexible trägerplatte WO2010094534A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/201,870 US20110299292A1 (en) 2009-02-17 2010-01-27 Flexirigid support plate
CN2010800081333A CN102318449A (zh) 2009-02-17 2010-01-27 刚柔性承载板
EP10711596A EP2399433A2 (de) 2009-02-17 2010-01-27 Starrflexible trägerplatte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009009288.9 2009-02-17
DE102009009288A DE102009009288A1 (de) 2009-02-17 2009-02-17 Starrflexible Trägerplatte

Publications (2)

Publication Number Publication Date
WO2010094534A2 WO2010094534A2 (de) 2010-08-26
WO2010094534A3 true WO2010094534A3 (de) 2010-12-29

Family

ID=42200817

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/050889 WO2010094534A2 (de) 2009-02-17 2010-01-27 Starrflexible trägerplatte

Country Status (5)

Country Link
US (1) US20110299292A1 (de)
EP (1) EP2399433A2 (de)
CN (1) CN102318449A (de)
DE (1) DE102009009288A1 (de)
WO (1) WO2010094534A2 (de)

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DE102010042193A1 (de) * 2010-10-08 2012-04-12 Zumtobel Lighting Gmbh LED-Leuchte mit gebogenem Lichtabgebebereich
ITMI20110325A1 (it) * 2011-03-02 2012-09-03 Luxall S R L Striscia di led con circuito stampato flessibile, piegabile e curvabile
JP5750297B2 (ja) * 2011-04-19 2015-07-15 日本メクトロン株式会社 基板組立体および照明装置
DE102011084795B4 (de) 2011-10-19 2013-11-07 Osram Gmbh Halbleiterleuchtvorrichtung mit einem galvanisch nicht-isolierten Treiber
US9194556B1 (en) * 2012-02-22 2015-11-24 Theodore G. Nelson Method of producing LED lighting apparatus and apparatus produced thereby
DE102012106023A1 (de) * 2012-07-05 2014-05-22 Hella Kgaa Hueck & Co. Beleuchtungsvorrichtung für Fahrzeuge
US9528689B2 (en) * 2013-03-13 2016-12-27 Palo Alto Research Center Incorporated LED lighting device with cured structural support
CN103278956A (zh) * 2013-05-08 2013-09-04 京东方科技集团股份有限公司 显示面板及其制造方法
TWI548125B (zh) * 2013-08-22 2016-09-01 隆達電子股份有限公司 發光模組
US20150117039A1 (en) * 2013-10-25 2015-04-30 Kevin Yang Substrate Gap Mounted LED
US9555610B2 (en) 2014-03-10 2017-01-31 Forever Bulb, Llc LED light bulb with internal flexible heatsink and circuit
CN104019385B (zh) * 2014-04-21 2016-08-31 上海霓弘光电科技有限公司 一种立方体led发光器件
PL2993384T3 (pl) * 2014-07-11 2019-12-31 Vosla Gmbh Taśmowy element świecący, żarówka oraz metoda produkcji taśmowego elementu świecącego
TW201625872A (zh) * 2015-01-13 2016-07-16 李政道 立體結構之車載照明電路裝置
USD774474S1 (en) * 2015-02-04 2016-12-20 Xiaofeng Li Light emitting diodes on a printed circuit board
DE102015012279A1 (de) 2015-09-24 2017-03-30 Audi Ag Biegung einer organischen Leuchtdiodenvorrichtung
DE102015012278A1 (de) 2015-09-24 2017-03-30 Audi Ag Dreidimensionale organische Leuchtdiodenvorrichtung
WO2017059234A1 (en) * 2015-09-30 2017-04-06 GE Lighting Solutions, LLC Led lamp platform
US10064276B2 (en) * 2015-10-21 2018-08-28 Adventive Ipbank 3D bendable printed circuit board with redundant interconnections
JP2017098212A (ja) * 2015-11-18 2017-06-01 株式会社小糸製作所 灯具及びその製造方法
US10036546B2 (en) * 2015-11-18 2018-07-31 Koito Manufacturing Co., Ltd. Lamp and manufacturing method thereof
DE102016204993A1 (de) * 2016-03-24 2017-09-28 Zumtobel Lighting Gmbh LED-Platine für Leuchte, Herstellungsverfahren für eine solche LED-Platine sowie Leuchte
CN106015984A (zh) * 2016-06-30 2016-10-12 浙江生辉照明有限公司 散热器及led灯
CN106402681A (zh) * 2016-10-17 2017-02-15 漳州立达信光电子科技有限公司 发光二极管照明装置
DE102017000863A1 (de) * 2017-01-20 2018-02-22 Diehl Aerospace Gmbh Leuchtband für eine Flugzeugkabine und Flugzeugkabine
EP3418694B1 (de) * 2017-06-21 2020-01-01 Optosys SA Näherungssensor
DE102017116924B4 (de) * 2017-07-26 2023-03-16 Ledvance Gmbh Leuchtmittel und Verfahren zum Herstellen eines Leuchtmittels
EP3671013A1 (de) * 2018-12-18 2020-06-24 ZKW Group GmbH Kraftfahrzeugscheinwerfer sowie verfahren zum ausrichten von zumindest einer lichtquelle eines kraftfahrzeugscheinwerfers
DE102019201281B4 (de) * 2019-01-31 2022-07-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Trägeranordnung und Verfahren zur Herstellung einer Trägeranordnung
CN113363164A (zh) * 2021-06-29 2021-09-07 广东佛智芯微电子技术研究有限公司 一种方体芯片封装方法及其封装结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0358937A2 (de) * 1988-09-15 1990-03-21 Siemens Aktiengesellschaft Dreidimensionale Leiterplatte
EP0534290A2 (de) * 1991-09-25 1993-03-31 Degussa Aktiengesellschaft Starre, in Teilbereichen biegbare Gedruckte Schaltungen und Verfahren zu deren Herstellung
WO1999057945A1 (en) * 1998-05-04 1999-11-11 Fiber Optic Designs, Inc. A lamp employing a monolithic led device
US20040114367A1 (en) * 2002-12-13 2004-06-17 Jui-Tuan Li Light emitting diode light bulb
WO2010017911A1 (fr) * 2008-08-14 2010-02-18 Johnson Controls Technology Company Unite pour illuminer une plaque de guide de lumiere de retroeclairage d'une dalle d'ecran numerigue

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Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
EP0358937A2 (de) * 1988-09-15 1990-03-21 Siemens Aktiengesellschaft Dreidimensionale Leiterplatte
EP0534290A2 (de) * 1991-09-25 1993-03-31 Degussa Aktiengesellschaft Starre, in Teilbereichen biegbare Gedruckte Schaltungen und Verfahren zu deren Herstellung
WO1999057945A1 (en) * 1998-05-04 1999-11-11 Fiber Optic Designs, Inc. A lamp employing a monolithic led device
US20040114367A1 (en) * 2002-12-13 2004-06-17 Jui-Tuan Li Light emitting diode light bulb
WO2010017911A1 (fr) * 2008-08-14 2010-02-18 Johnson Controls Technology Company Unite pour illuminer une plaque de guide de lumiere de retroeclairage d'une dalle d'ecran numerigue

Also Published As

Publication number Publication date
CN102318449A (zh) 2012-01-11
US20110299292A1 (en) 2011-12-08
EP2399433A2 (de) 2011-12-28
DE102009009288A1 (de) 2010-08-26
WO2010094534A2 (de) 2010-08-26

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