WO2010090488A3 - Conductive pattern and manufacturing method thereof - Google Patents
Conductive pattern and manufacturing method thereof Download PDFInfo
- Publication number
- WO2010090488A3 WO2010090488A3 PCT/KR2010/000763 KR2010000763W WO2010090488A3 WO 2010090488 A3 WO2010090488 A3 WO 2010090488A3 KR 2010000763 W KR2010000763 W KR 2010000763W WO 2010090488 A3 WO2010090488 A3 WO 2010090488A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive pattern
- manufacturing
- pattern
- conductive
- etching resist
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000005530 etching Methods 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011549071A JP5486019B2 (en) | 2009-02-06 | 2010-02-08 | Conductive pattern and manufacturing method thereof |
EP10738772.2A EP2395541B1 (en) | 2009-02-06 | 2010-02-08 | Manufacturing method for conductive pattern |
CN201080007007.6A CN102308365B (en) | 2009-02-06 | 2010-02-08 | An conductive pattern and method for manufacturing same |
US13/148,251 US8637776B2 (en) | 2009-02-06 | 2010-02-08 | Conductive pattern and manufacturing method thereof |
US14/080,980 US9615450B2 (en) | 2009-02-06 | 2013-11-15 | Conductive pattern and manufacturing method thereof |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0009750 | 2009-02-06 | ||
KR20090009750 | 2009-02-06 | ||
KR1020090127756A KR20100090628A (en) | 2009-02-06 | 2009-12-21 | Preparation method for insulated conductive pattern |
KR10-2009-0127756 | 2009-12-21 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/148,251 A-371-Of-International US8637776B2 (en) | 2009-02-06 | 2010-02-08 | Conductive pattern and manufacturing method thereof |
US14/080,980 Continuation US9615450B2 (en) | 2009-02-06 | 2013-11-15 | Conductive pattern and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010090488A2 WO2010090488A2 (en) | 2010-08-12 |
WO2010090488A3 true WO2010090488A3 (en) | 2010-11-18 |
Family
ID=42542532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/000763 WO2010090488A2 (en) | 2009-02-06 | 2010-02-08 | Conductive pattern and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2010090488A2 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990013298A (en) * | 1997-07-29 | 1999-02-25 | 구자홍 | Thin film transistor, liquid crystal display device and manufacturing method |
KR20020082420A (en) * | 2001-04-19 | 2002-10-31 | 캐논 가부시끼가이샤 | Metal or metal compound pattern and forming method of pattern, and electron emitting device, electron source, and image-forming apparatus using the pattern |
KR20060045260A (en) * | 2004-11-12 | 2006-05-17 | 엘지.필립스 엘시디 주식회사 | Method of fabricating thin film transistor substrate of poly-type |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007034481A1 (en) | 2007-07-20 | 2009-01-22 | Huf Hülsbeck & Fürst Gmbh & Co. Kg | Locking device with locking part |
KR100958099B1 (en) | 2008-06-09 | 2010-05-17 | 주식회사 삼양옵틱스 | Method for manufacturing hybrid lens |
-
2010
- 2010-02-08 WO PCT/KR2010/000763 patent/WO2010090488A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990013298A (en) * | 1997-07-29 | 1999-02-25 | 구자홍 | Thin film transistor, liquid crystal display device and manufacturing method |
KR20020082420A (en) * | 2001-04-19 | 2002-10-31 | 캐논 가부시끼가이샤 | Metal or metal compound pattern and forming method of pattern, and electron emitting device, electron source, and image-forming apparatus using the pattern |
KR20060045260A (en) * | 2004-11-12 | 2006-05-17 | 엘지.필립스 엘시디 주식회사 | Method of fabricating thin film transistor substrate of poly-type |
Non-Patent Citations (1)
Title |
---|
See also references of EP2395541A4 * |
Also Published As
Publication number | Publication date |
---|---|
WO2010090488A2 (en) | 2010-08-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010090487A2 (en) | Touch screen and manufacturing method thereof | |
TW200802536A (en) | Method of manufacturing semiconductor device | |
TW200834245A (en) | Method for manufacturing semiconductor device with four-layered laminate | |
TW200705564A (en) | Method for manufacturing a narrow structure on an integrated circuit | |
GB2487309A (en) | Multiple width features in integrated circuits | |
WO2009085564A3 (en) | Etch with high etch rate resist mask | |
TW200717710A (en) | Method of manufacturing semiconductor device | |
WO2010090394A3 (en) | Method for manufacturing an insulated conductive pattern | |
WO2009085598A3 (en) | Photoresist double patterning | |
WO2012071193A3 (en) | Double patterning with inline critical dimension slimming | |
WO2012151209A3 (en) | Methods for fabricating high-density integrated circuit devices | |
WO2009078190A1 (en) | Pattern forming method and pattern formed body | |
WO2012082955A3 (en) | Etched wafers and methods of forming the same | |
SG150421A1 (en) | Method of forming thin film metal conductive lines | |
WO2013036806A3 (en) | Methods for manufacturing integrated circuit devices having features with reduced edge curvature | |
WO2014120320A3 (en) | Formation of a composite pattern including a periodic pattern self-aligned to a prepattern | |
WO2010135120A3 (en) | Selective self-aligned double patterning of regions in an integrated circuit device | |
WO2011059961A3 (en) | Semiconductor device fabrication using a multiple exposure and block mask approach to reduce design rule violations | |
WO2012169866A3 (en) | Printed circuit board and method for manufacturing the same | |
WO2014051511A3 (en) | Electroless metal through silicon via | |
WO2009008407A1 (en) | Process for producing organic semiconductor element, organic semiconductor element, and organic semiconductor device | |
WO2013012195A3 (en) | Method for manufacturing substrate and method or manufacturing electronic device using same | |
TW200634983A (en) | Method of forming a plug | |
WO2008139745A1 (en) | Manufacturing method for display device and display device | |
WO2013012466A3 (en) | Process for making nanocone structures and using the structures to manufacture nanostructured glass |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080007007.6 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10738772 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010738772 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011549071 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13148251 Country of ref document: US |