WO2010090488A3 - Motif conducteur et procédé de fabrication correspondant - Google Patents

Motif conducteur et procédé de fabrication correspondant Download PDF

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Publication number
WO2010090488A3
WO2010090488A3 PCT/KR2010/000763 KR2010000763W WO2010090488A3 WO 2010090488 A3 WO2010090488 A3 WO 2010090488A3 KR 2010000763 W KR2010000763 W KR 2010000763W WO 2010090488 A3 WO2010090488 A3 WO 2010090488A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive pattern
manufacturing
pattern
conductive
etching resist
Prior art date
Application number
PCT/KR2010/000763
Other languages
English (en)
Korean (ko)
Other versions
WO2010090488A2 (fr
Inventor
황지영
황인석
이동욱
박민춘
이승헌
전상기
손용구
구범모
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090127756A external-priority patent/KR20100090628A/ko
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to CN201080007007.6A priority Critical patent/CN102308365B/zh
Priority to JP2011549071A priority patent/JP5486019B2/ja
Priority to US13/148,251 priority patent/US8637776B2/en
Priority to EP10738772.2A priority patent/EP2395541B1/fr
Publication of WO2010090488A2 publication Critical patent/WO2010090488A2/fr
Publication of WO2010090488A3 publication Critical patent/WO2010090488A3/fr
Priority to US14/080,980 priority patent/US9615450B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Abstract

La présente invention concerne un procédé de fabrication d'un motif conducteur, ainsi que le motif conducteur ainsi produit. Ledit procédé consiste a) à former un film conducteur sur un substrat; b) à créer un motif de photorésine de gravure sur ledit film conducteur; puis c) à graver de manière excessive le film conducteur à l'aide du motif de photorésine de gravure afin d'obtenir un motif conducteur dont la largeur de ligne est inférieure à celle du motif de photorésine de gravure. L'invention permet d'obtenir un motif conducteur à largeur de ligne ultramince et ce, de manière efficace et économique.
PCT/KR2010/000763 2009-02-06 2010-02-08 Motif conducteur et procédé de fabrication correspondant WO2010090488A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201080007007.6A CN102308365B (zh) 2009-02-06 2010-02-08 导电图形及其制造方法
JP2011549071A JP5486019B2 (ja) 2009-02-06 2010-02-08 導電性パターンおよびその製造方法
US13/148,251 US8637776B2 (en) 2009-02-06 2010-02-08 Conductive pattern and manufacturing method thereof
EP10738772.2A EP2395541B1 (fr) 2009-02-06 2010-02-08 Procédé de fabrication d'un motif conducteur
US14/080,980 US9615450B2 (en) 2009-02-06 2013-11-15 Conductive pattern and manufacturing method thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20090009750 2009-02-06
KR10-2009-0009750 2009-02-06
KR1020090127756A KR20100090628A (ko) 2009-02-06 2009-12-21 절연된 도전성 패턴의 제조 방법
KR10-2009-0127756 2009-12-21

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US13/148,251 A-371-Of-International US8637776B2 (en) 2009-02-06 2010-02-08 Conductive pattern and manufacturing method thereof
US14/080,980 Continuation US9615450B2 (en) 2009-02-06 2013-11-15 Conductive pattern and manufacturing method thereof

Publications (2)

Publication Number Publication Date
WO2010090488A2 WO2010090488A2 (fr) 2010-08-12
WO2010090488A3 true WO2010090488A3 (fr) 2010-11-18

Family

ID=42542532

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/000763 WO2010090488A2 (fr) 2009-02-06 2010-02-08 Motif conducteur et procédé de fabrication correspondant

Country Status (1)

Country Link
WO (1) WO2010090488A2 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990013298A (ko) * 1997-07-29 1999-02-25 구자홍 박막트랜지스터, 액정표시장치와 그 제조방법
KR20020082420A (ko) * 2001-04-19 2002-10-31 캐논 가부시끼가이샤 금속 또는 금속화합물패턴 및 패턴형성방법, 패턴을사용한 전자방출소자, 전자원 및 화상형성장치
KR20060045260A (ko) * 2004-11-12 2006-05-17 엘지.필립스 엘시디 주식회사 폴리형 박막 트랜지스터 기판의 제조방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007034481A1 (de) 2007-07-20 2009-01-22 Huf Hülsbeck & Fürst Gmbh & Co. Kg Verriegelungsvorrichtung mit Arretierungsteil
KR100958099B1 (ko) 2008-06-09 2010-05-17 주식회사 삼양옵틱스 하이브리드 렌즈 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990013298A (ko) * 1997-07-29 1999-02-25 구자홍 박막트랜지스터, 액정표시장치와 그 제조방법
KR20020082420A (ko) * 2001-04-19 2002-10-31 캐논 가부시끼가이샤 금속 또는 금속화합물패턴 및 패턴형성방법, 패턴을사용한 전자방출소자, 전자원 및 화상형성장치
KR20060045260A (ko) * 2004-11-12 2006-05-17 엘지.필립스 엘시디 주식회사 폴리형 박막 트랜지스터 기판의 제조방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2395541A4 *

Also Published As

Publication number Publication date
WO2010090488A2 (fr) 2010-08-12

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