WO2010086806A2 - Système de réfrigération et procédé de commande d'un tel système - Google Patents

Système de réfrigération et procédé de commande d'un tel système Download PDF

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Publication number
WO2010086806A2
WO2010086806A2 PCT/IB2010/050371 IB2010050371W WO2010086806A2 WO 2010086806 A2 WO2010086806 A2 WO 2010086806A2 IB 2010050371 W IB2010050371 W IB 2010050371W WO 2010086806 A2 WO2010086806 A2 WO 2010086806A2
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WO
WIPO (PCT)
Prior art keywords
working fluid
evaporator
stage
component
temperature
Prior art date
Application number
PCT/IB2010/050371
Other languages
English (en)
Other versions
WO2010086806A3 (fr
Inventor
Bruno Michel
Brian Smith
Original Assignee
International Business Machines Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corporation filed Critical International Business Machines Corporation
Publication of WO2010086806A2 publication Critical patent/WO2010086806A2/fr
Publication of WO2010086806A3 publication Critical patent/WO2010086806A3/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B5/00—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity
    • F25B5/04—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity arranged in series
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/21—Refrigerant outlet evaporator temperature

Definitions

  • the present invention relates to a refrigeration system and a method for controlling the refrigeration system.
  • the present invention particularly relates to a refrigeration system for cooling electronic components.
  • a method for controlling a refrigeration system. Further, a corresponding refrigeration system is provided.
  • the refrigeration system comprises a compressor, a condenser and at least one multi-stage evaporator.
  • the at least one multi-stage evaporator respectively comprises at least one first evaporator as a first stage. Each first evaporator is adapted to being arranged at a respective first component for absorbing heat dissipated by the respective first component.
  • the at least one multi-stage evaporator comprises at least one expansion device evaporator as at least one further stage downstream the corresponding first stage. Each expansion device evaporator is adapted to being arranged at a respective at least one further component for absorbing heat dissipated by the respective further component.
  • the method comprises controlling a flow of a working fluid of the refrigeration system such that the working fluid is in a liquid state when entering the first stage and is in a vapor state when leaving a last stage of the respective multi-stage evaporator.
  • the re- frigeration system further comprises a control device adapted to perform the method.
  • An advantage is that not only heat dissipated by the first component is absorbed but also heat dissipated by the at least one further component is absorbed.
  • a further advantage is that, because two-phase flow boiling is used in the first stage of the multistage evaporator, the temperature of the working fluid may be rather high when entering the multi-stage evaporator. This allows for a small temperature lift from the working fluid leaving the condenser to the working fluid entering the condenser. The small temperature lift, conse- quently, allows for a small pumping power of the compressor.
  • the refrigeration system can thus be energy efficient and can thus help to reduce carbon dioxide emissions.
  • the controlling of the working fluid may be performed, for example, by controlling a flow rate of the compressor and/or an inflow of working fluid in the multi-stage evaporator by con- trolling an opening of a control valve.
  • the compressor preferably is designed as a variable flow compressor and the control valve is preferably designed as a proportional valve.
  • the first and the further components are electronic components.
  • the electronic components for example, are arranged on a circuit board and dissipate heat during operation.
  • each circuit board has its own multi-stage evaporator.
  • the first compo- nent is the component with the greatest heat flux of all components on the circuit board.
  • all components on the circuit board dissipating a significant amount of heat are considered to represent the at least one first or the at least one further component being cooled by the multi-stage evaporator and contributing to the evaporation or heating of the working fluid.
  • the circuit board with the electronic components form part of a computer system.
  • the refrigeration system is particularly suited for data centers with many such circuit boards and a high degree of heat dissipation.
  • the heat dissipated by the electronic components may be collected with the multi-stage evaporators and may be recycled and may even be sold. The data center may thus be operated highly energy and cost efficient.
  • the first evaporator is designed for flow boiling of the working fluid.
  • the first evaporator is designed as a micro-channel evaporator. This allows for effective cooling of the first component.
  • the flow of the working fluid is controlled such that the working fluid is in vapor state when entering the last stage of the respective multi-stage evaporator. This helps to make sure that the working fluid is completely in vapor state when entering the compressor. This helps to achieve a good reliability of the refrigeration system, a long life, and a low energy consumption of the compressor.
  • the compressor may thus be designed to work with vapor only and may thus be inexpensive and efficient. Expensive measures for preventing fluid from entering the compressor may not be necessary.
  • the flow of the working fluid is controlled such that 40 to 60 percent of a mass of the working fluid leaving the first stage is in vapor state.
  • the first component being a high heat flux component may be cooled very effectively.
  • drying out of the first evaporator may be prevented and, as a result, overheating of the first component may be prevented.
  • the subsequent further component directly downstream of the first component may also be cooled effectively by a liquid- vapor-mixture of the working fluid.
  • the flow of the working fluid is controlled such that 50 percent of the mass of the working fluid leaving the first stage is in vapor state.
  • a tolerance may be accepted, preferably up to ten percent of the mass of the working fluid leaving the first stage.
  • At least one temperature and/or pressure of the working fluid is determined and the flow of the working fluid is controlled dependent on the at least one temperature and/or pressure.
  • the advantage is that this is simple. Temperatures and pressures can be determined easily, for example with a respective temperature sensor or pressure sensor. Preferably, at least two temperatures of the working fluid at different points of the refrigeration system are determined.
  • the at least one temperature and/or pressure of the work- ing fluid is determined for the working fluid entering one of the stages or leaving one of the stages of the respective multi-stage evaporator.
  • a first temperature is determined of the working fluid at a first point entering one of the at least one further stages and a second temperature is determined of the working fluid at a second point downstream the first point leaving one of the at least one further stages.
  • the flow of the working fluid is controlled dependent on the first and the second temperature such that the second temperature exceeds the first temperature by at least a predetermined deviation value.
  • the first and second temperatures are both determined at the last stage or a stage before the last stage of the respective multi-stage evaporator. By this it can reliably be made sure that no liquid working fluid leaves the multi-stage evaporator and that no liquid working fluid enters the compressor.
  • the predetermined deviation value amounts to at least 0.1 degrees Celsius. This is a temperature rise which is sufficient for reliably detecting the all vapor state of the working fluid.
  • the predetermined deviation value amounts to at least 0.5 degrees Celsius. This is a temperature rise which is significantly greater than the uncertainty of the measurement. This allows for a particularly reliable detection of the all vapor state of the working fluid.
  • the at least one first evaporator is a micro- channel flow boiler evaporator. This allows for particularly effective cooling of the first component, which may be a very high heat flux component. The first component may thus be prevented reliably from overheating.
  • the respective first component is a microprocessor.
  • the microprocessor as a high heat flux component may be cooled effectively and reliably.
  • a temperature of the microprocessor may reliably be kept below a temperature limit of, for example, 85 degrees Celsius.
  • the respective at least one further component comprises a DC-DC converter and/or a memory and/or a further electronic component dissipating heat during operation.
  • DC-DC converters and memories typically dissipate a lot of heat. It is advantageous to use this heat for evaporating the liquid working fluid or raising the temperature of the vapor working fluid. This heat may then be recycled and used for other purposes. Because DC-DC converters have a higher allowed operation temperature and memories typically have a smaller heat flux than, for example, the microprocessor, the DC- DC converter and/or memory are considered as further components cooled by the expansion device evaporator, which may be less efficient than the first evaporator.
  • the first component is the microprocessor
  • a second component is the DC-DC converter
  • a third component is the memory
  • a fourth component is the at least one further electronic component.
  • this order may represent an order of heat flux of the respective components.
  • the components with the greatest heat flux are cooled first, preferably with liquid working fluid or a mixture of liquid and vapor working fluid. Components with smaller heat flux may be cooled with vapor only working fluid. By this, most heat dissipated by the components may be absorbed and all components may be cooled sufficiently to allow for reliable operation.
  • the first component is the microprocessor
  • the second component is the memory
  • the third component is the DC-DC converter
  • the fourth component is the at least one further electronic component.
  • this order may represent an order of heat flux and/or temperature sensitivity of the respective components.
  • the components with the greatest heat flux and lowest required operation temperature are cooled first, preferably with liquid working fluid or a mixture of liquid and vapor working fluid. Components with smaller heat flux or higher operation temperatures may be cooled with vapor only working fluid. By this, most heat dissipated by the components may be absorbed and all components may be cooled sufficiently to allow for reliable operation.
  • a flow path of the working fluid branches downstream the first com- ponent into at least two parallel flow paths.
  • Each of these parallel flow paths comprise at least one expansion device evaporator adapted for being arranged at at least one of the further components.
  • a respective control valve is arranged hydrauli- cally between the condenser and each multi-stage evaporator.
  • the working fluid is supplied from the condenser to each control valve.
  • the working fluid is supplied from each multi-stage evaporator to the compressor.
  • FIG. 1 a refrigeration system and FIG. 2, a flow diagram for controlling the refrigeration system.
  • FIG. 1 shows a refrigeration system comprising a compressor COMP, a condenser COND and at least one multi-stage evaporator MSE.
  • a respective control valve CV is arranged hydraulically between the condenser COND and each multi-stage evaporator MSE.
  • FIG. 1 only a single multi-stage evaporator MSE is shown. Preferably, more than one multi-stage evaporator MSE is provided.
  • Such further multi-stage evaporators FMSE may be arranged in parallel to the multi-stage evaporator MSE shown in FIG. 1 and a flow of a working fluid WF through each of the multi-stage evaporator MSE and further multi-stage evaporators FMSE may be controlled individually by controlling an opening of the respective con- trol valve CV corresponding to the respective multi-stage evaporator MSE and further multistage evaporator FMSE.
  • the refrigeration system is described only with respect to the multi-stage evaporator MSE shown in FIG. 1.
  • Working fluid WF is supplied from the condenser COND to each control valve CV and working fluid WF leaving each multi-stage evaporator MSE and further multi-stage evaporator FMSE is supplied to the compressor COMP.
  • the compressor COMP pumps the working fluid WF into the condenser COND and by this raises the pressure and temperature of the working fluid WF supplied to the condenser COND.
  • the refrigeration system further comprises a control device CD and may further comprise at least one sensor, particularly at least one temperature sensor and/or pressure sensor.
  • the compressor COMP is designed as a variable speed compressor allowing for adjusting a flow rate of the working fluid in the refrigeration system.
  • the at least one control valve CV preferably is designed as a proportional valve.
  • the compressor COMP and/or the at least one control valve CV are coupled with the control device CD and may be controlled by the control device CD, that is, the flow rate of the compressor COMP and/or the opening of the respective control valve CV may be controlled by the control device CD.
  • the multi-stage evaporator MSE comprises at least one first evaporator FBE as a first stage and at least one expansion device evaporator EDE as at least one further stage.
  • the at least one first evaporator FBE preferably is designed as a micro-channel evaporator.
  • the first evaporator FBE is designed for flow boiling.
  • the at least one first evaporator FBE thus is preferably designed as a micro-channel flow boiler evaporator MCE.
  • the micro-channel flow boiler evaporator MCE preferably comprises multiple micro-channels for conducting the working fluid WF.
  • each micro-channel comprises a constriction and a flow deflection portion at its entrance to allow for a smooth and steady boiling without superheating and maldistribution of the working fluid WF in the respective micro-channel.
  • the at least one ex- pansion device evaporator EDE preferably is designed as a single meandering tube.
  • a diameter of the tube increases in a designated direction of the flow of the working fluid WF.
  • at least two stages of the expansion device evaporator EDE are provided. In FIG. 1, three stages of the expansion device evaporator EDE are shown.
  • each multi-stage evaporator MSE is used for absorbing heat dissipated by components and particularly electronic components of one circuit board.
  • Each circuit board with its electronic components may form part of a computer system and particularly of a server.
  • Each circuit board for example, may be a processor board of the computer system or server.
  • a first component Cl is arranged on the circuit board.
  • the first component Cl preferably is the component with the greatest heat flux of all components on the circuit board.
  • the first component C 1 preferably is a microprocessor CPU.
  • the first evaporator FBE is arranged on the first component Cl such that at least part of the heat dissipated by the first component Cl is absorbed by the first evaporator FBE when the working fluid WF flows through the first evaporator FBE.
  • the respective expansion device evaporator EDE is arranged on at least one further component FC on the circuit board such that at least part of the heat dissipated by the respective further component FC is absorbed by the expansion device evaporator EDE when the working fluid WF flows through the expansion device evaporator EDE.
  • the at least one further component FC preferably comprises a DC-DC converter DDC and/or a memory MEM and/or at least one further electronic component FEC on the circuit board dissipating heat during operation.
  • the at least one further component FC comprises a second component C2, a third component C3 and a fourth component C4 in the designated direction of flow of the working fluid WF.
  • the second component C2 is the DC-DC converter DDC
  • the third component C3 is the memory MEM
  • the fourth component C4 is the at least one further electronic component FEC.
  • the second component C2 is the memory MEM
  • the third component C3 is the DC-DC converter DDC
  • the fourth component C4 is the at least one further electronic component FEC. It may be necessary in this second embodiment to provide a heat spreader to the DC-DC converter DDC to reduce the heat flux and to be sufficiently cooled as the third component C3.
  • a temperature one Tl and/or a temperature two T2 and/or a temperature three T3 and/or a temperature four T4 and/or a temperature five T5 of the working fluid WF are determined.
  • a pressure one Pl and/or a pressure two P2 and/or a pressure three P3 and/or a pressure four P4 and/or a pressure five P5 of the working fluid WF are determined.
  • a vapor quality one ql and/or a vapor quality two q2 and/or a vapor quality three q3 and/or a vapor quality four q4 and/or a vapor quality five q5 of the working fluid WF may be determined.
  • a vapor quality of zero represents an all liquid working fluid WF and a vapor quality of one represents an all vapor working fluid WF.
  • Vapor quality values between zero and one represent a ratio of a mass of the working fluid WF in vapor state with respect to a total mass of the working fluid WF at the respective point in the refrigeration system.
  • the determining of the temperatures, pressures or vapor qualities may be performed by measurement with an appropriate sensor or by calculation according to a model of the refrigeration system.
  • the temperature one Tl, the pressure one Pl and the vapor quality one ql correspond to a point of the refrigeration system with the working fluid WF entering the first evaporator FBE, that is hydraulically between the control valve CV and the corresponding first evaporator FBE.
  • the temperature two T2, the pressure two P2 and the vapor quality two q2 correspond to a point of the refrigeration system with the working fluid WF leaving the first evaporator FBE, that is hydraulically between the first evaporator FBE and the expansion device evapo- rator EDE of the second component C2.
  • the temperature three T3, the pressure three P3 and the vapor quality three q3 correspond to a point of the refrigeration system with the working fluid WF leaving the expansion device evaporator EDE of the second component C2, that is hydraulically between the expansion device evaporator EDE of the second component C2 and the expansion device evaporator EDE of the third component C3.
  • the temperature four T4, the pressure four P4 and the vapor quality four q4 correspond to a point of the refrigeration system with the working fluid WF leaving the expansion device evaporator EDE of the third component C3, that is hydraulically between the expansion device evaporator EDE of the third component C3 and the expansion device evaporator EDE of the fourth component C4.
  • the temperature five T5, the pressure five P5 and the vapor quality five q5 correspond to a point of the refrigeration system with the working fluid WF leaving the expansion device evaporator EDE of the fourth component C4, that is hydraulically between the expansion device evaporator EDE of the fourth component C4 and the compressor COMP.
  • FIG. 2 shows a flow diagram of a program for controlling the refrigeration system.
  • the control device CD preferably is adapted to execute the program and to control the flow of the working fluid WF in the refrigeration system accordingly, for example by controlling the flow rate of the compressor COMP and/or by controlling the opening of the respective control valve CV.
  • the program begins in a step Sl. In a step S2, at least one temperature and/or pressure of the working fluid WF is determined.
  • the temperature one Tl and/or the temperature two T2 and/or the temperature three T3 and/or the temperature four T4 and/or the temperature five T5 and/or the pressure one Pl and/or the pressure two P2 and/or the pressure three P3 and/or the pressure four P4 and/or the pressure five P5 of the working fluid WF are determined.
  • a first temperature TEMPI and a second temperature TEMP2 are determined.
  • the first temperature TEMPI is the temperature three T3 or the temperature four T4.
  • the second temperature TEMP2 is the temperature four T4 if the first temperature TEMPI is the temperature three T3 or the second temperature TEMP2 is the temperature five T5.
  • the first and second temperature TEMPI, TEMP2 may be de- fined differently.
  • the first and second temperature TEMPI, TEMP2 are determined by measurement.
  • a step S3 may be provided for determining the vapor quality one ql and/or the vapor quality two q2 and/or the vapor quality three q3 and/or the vapor quality four q4 and/or the vapor quality five q5 of the working fluid WF, preferably by calculation dependent on at least one of the temperatures and/or pressures determined in step S2.
  • a step S4 it is determined if the current flow of the working fluid WF is appropriate for sufficiently cooling the components. Further, an amount of energy required for driving the compressor COMP should be small to allow for an efficient operation of the refrigeration system. If the current flow of the working fluid WF is considered appropriate, the current flow rate is maintained in a step S5.
  • the program ends in a step S6 or, preferably, is continued in step S2. If the current flow of the working fluid WF is considered not appropriate, that is too high or too low, the flow is adapted appropriately in a step S7.
  • the program then ends in step S6 or, preferably, is continued in step S2.
  • the flow of the working fluid is controlled such that the vapor quality one ql equals zero or is approximately zero.
  • the flow of the working fluid is further controlled such that the vapor quality five q5 is always one and preferably also the vapor quality four q4 equals one or is approximately one.
  • liquid working fluid WF is prevented from enter- ing and destroying the compressor COMP.
  • this can be achieved by controlling the flow of the working fluid WF such that the second temperature TEMP2 exceeds the first temperature TEMPI by at least a deviation value DVAL.
  • the deviation value DVAL is greater than zero and preferably amounts to at least +0.1 degrees Celsius.
  • the deviation value DVAL amounts to at least +0.5 degrees Celsius.
  • the flow of the working fluid WF is controlled such that the vapor quality two q2 is in a range between 0.4 and 0.6.
  • the vapor quality of the working fluid WF preferably is kept as low as possible.
  • the vapor quality cannot be too low, however, since otherwise the subsequent further components cannot convert the rest of the fluid to vapor and guarantee that no fluid enters the compressor.
  • the lowest vapor quality may for example be calculated by dividing the power of the processor by the total power of the electronic board and adding a safety margin of at least 10%.
  • the flow of the working fluid WF is controlled such that a system pressure and/or a system temperature level of the working fluid WF in the refrigeration system is in a respective predetermined range.
  • the system pressure and/or the system temperature level may be determined dependent on the temperature one Tl and/or the temperature two T2 and/or the temperature three T3 and/or the temperature four T4 and/or the temperature five T5 and/or the pressure one Pl and/or the pressure two P2 and/or the pressure three P3 and/or the pressure four P4 and/or the pressure five P5 as determined in step S2.
  • the DC-DC converter DDC cooling as described above: either they are cooled with a compact cooler directly after the microprocessor CPU with a vapor quality lower than one or they are cooled after the memory MEM preferably with a vapor quality of one and a heat spreader to distribute the relative high power density of these chips over a greater surface.
  • the remainder of the further components FC that is the further electronic components FEC, is then cooled with the working fluid vapor leading to a temperature increase and also allow- ing for a safety margin that guarantees that the output is under all load conditions 100 percent vapor and no liquid.
  • An effective hydraulic radius of the expansion device evaporator EDE of the DC-DC con- verter DDC preferably is larger than that of the first evaporator FBE, particularly that of the micro-channel flow boiler evaporator MCE, to allow larger volume fluxes with the increased vapor quality.
  • a power density of the memory MEM typically is smaller than that of the DC- DC converter DDC. The memory MEM may thus be cooled safely by direct heat transfer from solid to the working fluid vapor.
  • An optimum geometry of the multi-stage evaporator MSE may be based on a balance between pressure drop in the fluid loop and the ability to transfer heat from components to the working fluid.
  • the flow control is done preferably by a proportional valve, that is the control valve CV, hydraulically arranged upstream of each multi-stage evaporator MSE.
  • a proportional valve that is the control valve CV
  • the control of the flux of the working fluid WF preferably is accomplished by the variable speed compressor COMP.
  • the speed of the compressor COMP preferably is controlled by a setup that tries to control the control valves CV to a desired average opening value of about 70 percent and to keep the opening value of the maximally open control valve CV below 95 percent.
  • the invention is used to collect most energy dissipated from a typical processor board and to deliver it via the condenser COND to a remote heating network for community heating with a temperature level preferably between 60 and 70 degrees Celsius.
  • the temperature of the working fluid entering the multi-stage evaporator MSE preferably is maintained at a quite high level, for example at 40-50° C, so that the required compressor energy is kept small.
  • One bar pressure drop along all components with a system pressure of 4 bar, for example, leads to a temperature lift of 68 degrees Celsius while the temperature lift is only 34 degrees Celsius at a system pressure of 8 bar.
  • the pumping energy in the latter case is only half since the mass flow is twofold smaller. Higher system pressures are advantageous since mass flow and compressor power are smaller.
  • the overall pressure drop preferably is minimized so that not too much energy is needed for the compressor COMP.
  • control valves CV are kept completely closed. This ensures that in the whole loop the vapor quality is one. This ensures that during startup the compressor COMP has vapor at its input. To ensure that this condition remains during the entire startup phase the control valves CV preferably are carefully opened until the control loop can take over and the vapor qualities at each control point are as specified.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Sorption Type Refrigeration Machines (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un système de réfrigération qui comprend un compresseur (COMP), un condenseur (COND) et au moins un évaporateur à plusieurs étages (MSE), au moins un premier évaporateur (FBE) formant un premier étage et au moins un évaporateur du détendeur (EDE) formant au moins un étage supplémentaire en aval du premier étage correspondant. Chaque premier évaporateur (FBE) est disposé au niveau d'un premier composant respectif (C1) pour absorber la chaleur dégagée par celui-ci (C1). Chaque évaporateur du détendeur (EDE) est disposé au niveau d'au moins un composant supplémentaire respectif (FC) pour absorber la chaleur dégagée par celui-ci (FC). Un flux de fluide actif (WF) du système de réfrigération est régulé de façon à ce que ledit fluide (WF) se trouve dans un état liquide lorsqu'il entre dans le premier étage et qu'il se trouve dans un état de vapeur lorsqu'il quitte un dernier étage de l'évaporateur à plusieurs étages (MSE) respectif.
PCT/IB2010/050371 2009-01-31 2010-01-27 Système de réfrigération et procédé de commande d'un tel système WO2010086806A2 (fr)

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EP09151831 2009-01-31
EP09151831.6 2009-01-31

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Publication number Priority date Publication date Assignee Title
US3992898A (en) * 1975-06-23 1976-11-23 Carrier Corporation Movable expansion valve
US4655051A (en) * 1985-11-26 1987-04-07 Uhr Corporation Heat exchange system with reversing receiver flow
US5819554A (en) * 1995-05-31 1998-10-13 Refrigeration Development Company Rotating vane compressor with energy recovery section, operating on a cycle approximating the ideal reversed Carnot cycle
US6457325B1 (en) * 2000-10-31 2002-10-01 Modine Manufacturing Company Refrigeration system with phase separation
US6672381B2 (en) * 2001-04-30 2004-01-06 Hewlett-Packard Development Company, L.P. Multi-load thermal regulating system with multiple serial evaporators

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Title
BRUNO AGOSTINI; MATTEO FABBRI; JUNG E. PARK; LESZEK WOJTAN; JOHN R. THOME; BRUNO MICHEL: "Heat Transfer Engineering", vol. 28, 2007, TAYLOR AND FRANCIS, article "State of the Art of High Heat Flux Cooling Technologies", pages: 258 - 281

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