WO2010074366A1 - Système de transport de plaquettes, structure d'installation de fabrication de semi-conducteurs l'utilisant et procédé de transport de plaquettes - Google Patents

Système de transport de plaquettes, structure d'installation de fabrication de semi-conducteurs l'utilisant et procédé de transport de plaquettes Download PDF

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Publication number
WO2010074366A1
WO2010074366A1 PCT/KR2009/000560 KR2009000560W WO2010074366A1 WO 2010074366 A1 WO2010074366 A1 WO 2010074366A1 KR 2009000560 W KR2009000560 W KR 2009000560W WO 2010074366 A1 WO2010074366 A1 WO 2010074366A1
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WO
WIPO (PCT)
Prior art keywords
wafer
process chamber
transfer box
transferring
module
Prior art date
Application number
PCT/KR2009/000560
Other languages
English (en)
Korean (ko)
Inventor
황무성
김종욱
서상원
Original Assignee
Hwang Moo Sung
Kim Jong Wook
Seo Sang Won
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hwang Moo Sung, Kim Jong Wook, Seo Sang Won filed Critical Hwang Moo Sung
Publication of WO2010074366A1 publication Critical patent/WO2010074366A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Definitions

  • the present invention relates to a wafer transfer system, a semiconductor fab structure including the same, and a wafer transfer method.
  • a new concept wafer transfer system and semiconductor comprising an integrated structure of a front-end manufacturing equipment installed in a semiconductor manufacturing line and an automatic logistics system for wafer transfer Fab structure and wafer transfer method.
  • the preprocessing equipment for processing wafers in the semiconductor fabrication line of the semiconductor fab includes exposure equipment, chemical vapor deposition equipment (CVD), physical vapor deposition equipment (PVD), etching equipment (Etcher), It refers to the production equipment needed to implement microelectronic circuits in the form of structures on the wafer surface, such as furnaces, implanters, and wet stations.
  • CVD chemical vapor deposition equipment
  • PVD physical vapor deposition equipment
  • Etcher etching equipment
  • the deposition process CVD, PVD
  • etching process Etcher
  • FIG. 1 is a structural diagram of a conventional sheet type semiconductor manufacturing equipment.
  • One feature of the sheet type semiconductor manufacturing equipment 70 shown in FIG. 1 is a large transfer chamber 30 that maintains a vacuum state in the center, and a plurality of process chambers 40 that operate independently around them.
  • One side of the transfer chamber 30 moves up and down the atmospheric pressure and vacuum state and transfers single or multiple wafers from the wafer cassette 50 or transfers the processed wafers from the process chamber 40 to the wafer cassette 50.
  • One or two load lock chambers 20 are mounted.
  • a high-precision transfer chamber robot arm 35 operating in a vacuum state to perform a process of transferring the wafer between the load lock chamber 20 and the process chamber 40.
  • a plurality of wafer cassettes 50 are placed in the wafer storage unit 10 located in front of the semiconductor manufacturing equipment 70, and a single wafer is loaded into the load lock chamber 20 through the storage robot arm 15. Unloaded from the load lock chamber 20 into the wafer cassette 50.
  • FIG. 2 is a structural diagram of a conventional semiconductor manufacturing line.
  • FIG. 2 shows a typical planar layout of a semiconductor manufacturing line, centered around the sheet type semiconductor manufacturing equipment 70 shown in FIG. 1 and the automated logistics system 80 for wafer transfer.
  • the line is designed and operated in the same or similar form.
  • the interior of the semiconductor manufacturing line is isolated from the outside, and various filters and air conditioning facilities are installed to maintain the cleanliness level of 1 to 100 (that is, 1 to 100 dust particles in 1 m 3 ). Therefore, it is possible to enter inside only through the air shower chamber 60 at the inlet of the semiconductor manufacturing line.
  • the basic structure inside the semiconductor manufacturing line is a plurality of semiconductor manufacturing equipment 70 is arranged in a regular form at predetermined intervals, there is a horizontal-vertical grid (Corridor) between the operator's movement, processing wafer Logistics movement of various pre / post processing and processed wafers.
  • the movement passage is a place where loading or unloading of the wafer cassette 50 is performed through the load lock chamber 20 provided in the semiconductor manufacturing equipment.
  • the wafer contained in the wafer cassette 50 is moved by a separate wafer veterinary system 80 installed on a moving passage for the purpose of proceeding to a subsequent process or being stored in a specific space.
  • the wafer veterinary system 80 is The vertical movement path which can transfer the wafer cassette 50 from the stocker 90 and the stocker 90 to which the wafer cassette 50 is put down and the transfer rail 95 installed at the ceiling height is manufactured. It is composed of a horizontal movement path formed in a lattice form throughout the line.
  • the wafer cassette 50 (shown as a square dot in FIG. 2) from the load lock chamber 20 of the semiconductor manufacturing equipment 70 to the stocker 90 of the wafer autonomous system 80.
  • the shuttle robot (not shown) that automatically moves is applied to automate almost the entire logistics line.
  • Wafers used in semiconductor manufacturing lines have reached 150mm and 200mm, and now reach 300mm. In the future, 450mm and larger large-diameter wafers are expected to be applied to semiconductor production sites. However, in a large-diameter wafer production environment of 300 mm or more, it is virtually impossible for a worker to manually operate or move the wafer cassette 50 equipped with single and multiple wafers.
  • the semiconductor manufacturing equipment 70 maintains the existing single-leaf concept, it is difficult to timely supply the equipment due to various technical problems associated with the enlargement of the equipment. do.
  • the process chambers 40 have to be enlarged and thus a large transfer chamber 30 and a large vacuum transfer chamber robot arm 35 connected with a plurality of process chambers have to be developed.
  • the footprint of semiconductor manufacturing lines has to be expanded due to the increasingly large size of semiconductor manufacturing equipment, and accordingly, the wafer-waste animal system 80, which has been enlarged, must be provided accordingly. There is a serious problem such as a sharp increase in the operating cost of the semiconductor manufacturing line.
  • the conventional semiconductor manufacturing line is designed and provided with various processing gas supply pipes, vacuum pumps, etc. in accordance with the arrangement of the sheet-type semiconductor manufacturing equipment 70, the modification or rearrangement of the semiconductor manufacturing line is cost-effective Considering it is virtually impossible.
  • an object of the present invention is to provide a semiconductor fab structure integrated with a wafer logistics system, semiconductor manufacturing equipment and other production equipment, and a wafer transfer system and a wafer transfer method applied thereto in order to solve the above problems.
  • the present invention minimizes the technical and cost burden of the equipment developer for the development of ultra-large vacuum robot by removing the transfer chamber that is getting bigger by expanding and developing the existing cluster concept, maximizing the density by eliminating unnecessary space occupancy To provide a wafer transfer method and system and a semiconductor fab structure using the same that can dramatically reduce the initial investment costs.
  • an object of the present invention is to provide a wafer transfer system and a semiconductor fab structure that can accommodate the semiconductor manufacturing equipment of the present invention without increasing the size of the auxiliary equipment or the structure of the semiconductor manufacturing line.
  • the present invention provides a three-dimensional multi-layer semiconductor fabrication structure to replace the conventional two-dimensional semiconductor fabrication line to minimize the space occupancy required for the semiconductor manufacturing line installation, unit concept (Unit block) concept
  • the aim is to have a high degree of scalability that can be infinitely expanded as needed.
  • the semiconductor Fab structure comprises a multilayer structure having a cavity in the center; Connection windows for mounting a plurality of process chamber modules formed in each layer of the multilayer structure; And an elevation channel for transferring a wafer transfer box accommodated in the cavity of the center to each of the at least one wafer to the upper and lower layers of the multilayer structure.
  • the semiconductor fab structure may further include a wafer station module for loading or unloading a wafer cassette into a wafer transfer box of the elevation channel.
  • the semiconductor fab structure may further include process chamber modules for wafer processing connected to the connection window for mounting the process chamber module.
  • the elevation channel is configured to include a plurality of vertical lift rails that operate independently from each other, wherein the semiconductor fab structure is formed for each layer along the edge of the cavity to form the vertical lift with the process chamber modules in the same layer. It characterized in that it further comprises a horizontal rotary rail for horizontally transporting the wafer transfer box between the rails.
  • the elevation channel is composed of a plurality of layers each independently rotatable, each layer of the elevation channel is characterized in that corresponding to the height of each layer of the semiconductor fab structure.
  • the elevation channel has a vertical polyhedral shape and is characterized in that the vertical lift rail for mounting the wafer transfer box on each side.
  • the process chamber module may include a process chamber and a docking chamber
  • the docking chamber may include a wafer cassette stage and a wafer handler.
  • it characterized in that it comprises a docking stage and a connecting rail for transferring the wafer transfer box between the horizontal rotating rail and the docking chamber adjacent the respective connecting windows of the multilayer structure.
  • the wafer station module is characterized in that it comprises a kiosk for the control of the semiconductor fab structure.
  • the wafer station module may also include a loading station for loading the wafer cassette into the elevation channel, and an unloading station for unloading the wafer cassette from the elevation channel.
  • the wafer transfer box is characterized in that it comprises a tag for identification.
  • the wafer transfer box has a space for accommodating a wafer cassette in which a plurality of wafers are loaded, and has a wafer transfer box cover that can be opened and closed automatically on the front side, and an outer rear side for coupling with the vertical lift rail. And a connection connector for coupling the lift connector to the connection rail.
  • the wafer handler is characterized in that for transporting the wafer through a linear reciprocating motion between the docking chamber and the process chamber module.
  • the apparatus may further include a partition wall that spatially separates the elevation channel and the wafer station module, and a control panel installed on the partition wall to monitor and control the process chamber module.
  • the inside of the transfer tower including the elevation channel is set to an atmospheric pressure or a vacuum state, characterized in that the process chamber is set to a vacuum, atmospheric pressure or high pressure state.
  • the semiconductor manufacturing line for achieving the above object of the present invention characterized in that configured by arranging two or more of the semiconductor fab structures side by side.
  • a wafer transfer method for achieving the above object of the present invention a method for transferring the wafer using any one of the above semiconductor fab structures, comprising the steps of: mounting a wafer cassette in the wafer transfer box; Transferring the wafer transfer box in a vertical direction along the elevation channel; Transferring the wafer transfer box in a horizontal direction in a layer having a required process chamber module; And transferring the wafer cassette mounted on the wafer transfer box to a corresponding process chamber module through a connection window for mounting the process chamber module.
  • the method may further include transferring the wafer cassette loaded on the loading station of the semiconductor fab structure to the wafer transfer box of the elevation channel; And transferring the wafer cassette separated from the wafer transfer box of the elevation channel to the unloading station.
  • the method may further include identifying, via the kiosk, a wafer cassette placed on one of a plurality of stages provided in the loading station of the semiconductor fab structure; And instructing the control of the kiosk to transfer the wafer cassette to a corresponding process chamber module through a screen.
  • the step of automatically identifying the wafer cassette completed the process in the wafer station module; And automatically transferring the wafer cassette to any one of the empty stages of the unloading station.
  • the method may further include transferring wafers one by one into the process chamber from a wafer cassette located in the wafer cassette stage using a wafer handler located in a docking chamber of the semiconductor fab structure; And transferring the wafers one by one to the wafer cassette by using the wafer handler after the process is completed in the process chamber.
  • a new concept of semiconductor fab structure is provided that replaces a conventional semiconductor manufacturing line and semiconductor manufacturing equipment, provided that the diameter of the wafer increases to a large diameter of 300 mm and larger.
  • a new type of semiconductor fab structure incorporating a wafer automated logistics system, semiconductor manufacturing equipment and other production facilities, and a wafer transfer system and wafer transfer method applied thereto.
  • a wafer transfer system and a semiconductor fab structure capable of accommodating this without increasing the size of the auxiliary equipment or the structure of the semiconductor manufacturing line.
  • the semiconductor fabrication structure having a three-dimensional multilayer structure that replaces the conventional semiconductor manufacturing line having a two-dimensional structure since the semiconductor fabrication structure having a three-dimensional multilayer structure that replaces the conventional semiconductor manufacturing line having a two-dimensional structure is provided, the space occupancy required for installing the semiconductor manufacturing line is minimized, and a unit block is provided.
  • the introduction of the concept provides a highly scalable semiconductor fab structure that can scale infinitely as needed.
  • a new type of semiconductor fab structure and wafer transfer system in which the fab structure of the semiconductor manufacturing line and the semiconductor manufacturing equipment are integrated so that the boundary between them is not separated, thereby operating a semiconductor manufacturing line.
  • the chip maker will have a higher level of control.
  • the developer of semiconductor manufacturing equipment does not develop single-piece equipment, but develops a single process chamber and integrates it to operate with the semiconductor fab structure of the present invention. This allows the equipment developer to concentrate on the technical development of the process chamber, thereby improving the process quality.
  • FIG. 1 is a structural diagram of a conventional sheet type semiconductor device.
  • FIG. 2 is a structural diagram of a conventional semiconductor manufacturing line.
  • FIG. 3 is a plan view of a semiconductor fab structure in accordance with an embodiment of the present invention.
  • FIG. 4 is a structural diagram of an elevation channel according to an embodiment of the present invention.
  • 5 to 8 are schematic views of a wafer transfer box according to an embodiment of the present invention.
  • FIG. 9 is a configuration of a wafer transfer box horizontal transfer system according to an embodiment of the present invention.
  • FIGS. 10-12 are schematic diagrams of a wafer cassette loading mechanism in accordance with one embodiment of the present invention.
  • FIG. 13 and 14 is a block diagram of a process chamber module according to an embodiment of the present invention.
  • 15 is a block diagram of a wafer station according to an embodiment of the present invention.
  • 16 is a block diagram of a control panel according to an embodiment of the present invention.
  • 17 is a side view of a semi-doped fab structure in accordance with an embodiment of the present invention.
  • FIG. 18 is a layout view of a semiconductor manufacturing line in accordance with an embodiment of the present invention.
  • FIG. 3 is a plan view of a semiconductor fab structure according to an embodiment of the present invention. A side view of the semiconductor fab structure of FIG. 3 will be described with reference to FIG. 17 simultaneously.
  • the semiconductor fab structure of FIG. 3 is a structure in which a plurality of process chamber modules 200 are radially mounted around one transfer tower 100, and wafer transfer boxes 120 are positioned at upper and lower layers in the center of the transfer tower 100. Elevation channel 110 is provided for vertical movement.
  • the elevation channel 110 is configured as four channels to enable independent operation of each other. However, when designing a semiconductor fab structure, the number of elevation channels 110 may be freely increased or decreased as necessary.
  • the elevation channel 110 is configured to have a vertical lift rail coupled with one side of the wafer transfer box 120. The structure of the elevation channel 110 will be described later in detail with reference to FIG. 4.
  • the transfer tower 100 is provided with a rotary rail 150 for horizontally transferring the wafer transfer box 120 transferred to the corresponding layer in front of the process chamber module 200, and a vertical lift rail of the elevation channel 110.
  • Rotating stage module 140 for seating the connection channel 130 and the wafer transfer box 120 for guiding the short distance horizontal transfer of the wafer transfer box 120 between the rotary rail 150 and the rotary rail 150 This is provided.
  • the process chamber module 200 includes a process chamber 220 and a docking chamber 210.
  • the process chamber module 200 receives the wafer transfer box 160 from the rotating stage module 140, extracts a wafer cassette, and transfers the wafer cassette to the docking chamber 210. Docking stage module 160 for delivery is provided.
  • a wafer station 300 for supplying a wafer to the transfer tower 100 is provided at one side of the transfer tower 100, and the wafer station 300 is a wafer in the wafer transfer box 120 of the elevation channel 110. It has a structure capable of loading or unloading a cassette. The structure of the wafer station 300 will be described later in detail with reference to FIG. 15.
  • the wafer transfer box 120 transferred from the upper layer or the lower layer to the corresponding layer through the elevation channel 110 is transferred to the rotary stage module 140 through the connection channel 130, and the rotary stage module 140 is a rotary rail ( After rotating along 150, the process chamber module 200 stops in front of the process chamber module 200 to be processed and is moved back to the docking stage module 160.
  • the wafer transfer box 120 placed on the docking stage module 160 automatically opens the cover door 125 at the front portion, and the docking chamber 210 reaches atmospheric pressure to open and close the door 211 to open the wafer transfer box ( 160, the wafer cassette 600 fixed inside is moved out and moved to the cassette stage 212 inside the docking chamber 210 (see FIGS. 10 to 12).
  • the docking chamber 210 When the opening / closing door 211 of the docking chamber 210 is closed and the pumping valve is opened, the docking chamber 210 is in a vacuum state at atmospheric pressure, and when the vacuum degree similar to the process chamber 220 is reached, the slit of the process chamber 220 is reached. The valve is opened and the wafer 700 of the sheet unit is transferred from the wafer cassette 600 to the process chamber 220 using the wafer handler (see FIGS. 13 and 14).
  • the inside of the transfer tower 100 including the elevation channel 110 is illustrated in the atmospheric pressure state, and the process chamber 220 in the vacuum state, but the pressure is variously set according to the actual manufacturing process.
  • the inside of the transfer tower 100 including the elevation channel 110 is set to an atmospheric pressure or a vacuum state
  • the process chamber 220 is set to a vacuum, atmospheric pressure or high pressure state, such as low pressure CVD, atmospheric pressure CVD, High pressure CVD processes and the like.
  • the wafer cassette 600 returns to the wafer transfer box 120 through the process opposite to the above loading procedure.
  • 150 is transferred to the upper and lower layers via the elevation channel 110 via the connection channel 130 or unloaded to the wafer station 300 to wait for further work of the operator.
  • the components of the semiconductor fabrication structure will be divided into a transfer tower 100, a process chamber module 200, and a wafer station 300.
  • the transfer tower 100 illustrated in FIG. 3 is generally circular, but may be configured in various ways such as square, pentagon, hexagon, and octagon, depending on the shape of the semiconductor zero line or the mounting method of the process chamber module 200. Therefore, it is noted that the shape of the detailed components of the transfer tower 100 may also be variously changed.
  • the transfer tower 100 includes a wall structure or a cavity that can accommodate the elevation channel 110, the wafer transfer box 120, the connection channel 130, the rotation stage module 140, and the docking stage module 160. It can be described as (Cavity). Connection windows (not shown) for mounting the process chamber module 200 are provided on the wall surface of the transfer tower 100.
  • FIG. 4 is a structural diagram of an elevation channel according to an embodiment of the present invention.
  • the elevation channel 110 is installed at the center of the transfer tower 100 to transfer the wafer transfer box 120 to the upper and lower layers.
  • the elevation channel is composed of four channels, each having vertical lift rails 111, 112, 113, and 114 assigned thereto, wherein the first and second lift rails 111, 112 transfer the wafer upward only.
  • the upper rail transports the box 120 and the third and fourth lift rails 113 and 114 are lower rails that transport the wafer transfer box 120 only downward, the four channels are different from each other. Two-way transfer is possible, or by implementing four or more channels may be assigned different number of up and down transfer channel in accordance with the transfer amount or may vary depending on the situation.
  • the vertical lift rails 111, 112, 113, and 114 are configured to be driven up and down by corresponding lift rail drives 116, 117, 118, and 119, respectively.
  • the lift rails 111, 112, 13, and 114 are driven by conveyor belts or chain belts that move in the vertical direction, or are implemented by a combination of a plurality of gears that independently rotate.
  • the lift rail driving apparatuses 116, 117, 118, and 119 may be implemented by a known driving apparatus suitable for each driving method.
  • 5 to 8 are front, perspective, and side views, respectively, of the wafer transfer box according to an embodiment of the present invention.
  • the wafer transfer box 120 includes a lift connector 121 for coupling with the vertical lift rails 111 to 114 and a connection connector 122 for coupling with the connection channel 130.
  • the stage connector 123 is provided on the lower surface to ensure stable binding when the wafer transfer box 120 is placed on the rotary stage module 140.
  • the inside of the wafer transfer box 120 is a space for accommodating the wafer cassette 600.
  • the stage connector 123 is integrated with the wafer cassette 600, but the stage connector 123 is mounted on the lower outer surface of the wafer transfer box 120 separately from the wafer cassette 600.
  • the stage connector 123 is mounted on the lower outer surface of the wafer transfer box 120 separately from the wafer cassette 600.
  • Various implementations are possible.
  • the wafer transfer box 120 has a cover door 125 in the front portion and the automatic opening and closing device 126 supports the cover door 125, the wafer transfer box 120
  • the cover door 125 is automatically opened and the wafer cassette 600, which is bound therein, is transferred to the wafer transfer box ( It is designed to be separated from the 120).
  • the wafer transfer box 120 may include a barcode, an RFID tag, or a wireless personal area network (WPAN) tag such as Zigbee or Bluetooth, which may identify the embedded wafer cassette 600. It is attached in the form.
  • the docking stage position or wafer station inlet to be described later is equipped with a bar code reader or tag reader that can identify the wafer transfer box 120 can be controlled to move and stop the specific wafer transfer box 120 to a desired position.
  • FIG. 9 is a configuration of a wafer transfer box horizontal transfer system according to an embodiment of the present invention.
  • FIG. 9 illustrates an elevation channel 110, a wafer transfer box 120, a connection channel module 130, a rotation stage module 140, a docking stage module 160, and a docking chamber 210 constituting an interior of the transfer tower 100. Shows vertical cross-sections interconnected.
  • connection channel module 130 of FIG. 9 is a component that receives the wafer transfer box 120 from the elevation channel 110 and transfers the wafer back to the rotating stage module 140.
  • the connection channel stage for supporting the connection channel module ( 135 and the connection channel flange 134 and the connection channel side bar 133, the connection channel side bar 133, the connection rail 131 and the wafer transfer box for binding with the wafer transfer box 120 Connection guide 132 for stable movement of the 120 is provided.
  • the rotating stage module 140 is a component that rotates and transfers the wafer transfer box 120 to a desired docking stage module 160, and includes a rotating stage 143, a rotating stage feed pin 141, and a rotating stage drive. It is configured to include the device 142, the rotary rail 150, the rotary rail connector 151.
  • the rotary stage 143 is a component that moves along the rotary rail 150 by loading the wafer transfer box 120.
  • the rotary stage driving device 142 receives power from the rotary rail 150 and moves along the rotary rail 150 together with the rotary stage 143, and the rotary stage transfer pin 141 is desired by the rotary stage 143.
  • it pops out and serves to horizontally move the wafer transfer box 120 on the rotating stage 143 onto the docking stage module 160.
  • an electromagnetic driving method using an electromagnet is most preferable. (Mechanical) implementation may also be applied.
  • the docking stage module 160 is a component that receives the wafer transfer box 120 from the rotating stage module 140 and transfers the wafer cassette 600 embedded in the wafer transfer box 120 to the docking chamber 210.
  • the docking stage 164, the docking stage driving device 162, the docking stage shaft 161, and the docking stage connecting portion 163 are configured.
  • the docking chamber 210 is configured to include a cassette stage 212, a cassette stage drive shaft 213, a chamber door 211, and a wafer handler 214 for supporting a wafer cassette received from the docking stage module 160. .
  • the docking chamber 210 will be described later in detail with reference to FIGS. 7 and 8.
  • the docking stage module 160 is fixed to the wall of the structure by the docking stage connector 163, and the rotary rail connector 151 is coupled to the docking stage connector 163 of the docking stage module 160.
  • the rotary rail connecting portion 151 and the docking stage connecting portion 163 may be fixed to the wall independently of each other.
  • the lifter connector 121 disconnects the elevation channel 110 and connects the connection connector 122 to the connection channel module 130. After the binding with the rail 131 is made to move along the connection guide 132 in the direction of the rotary stage module 140 while being coupled to the connection channel side bar 133.
  • the stage connection unit 123 is moved along the upper surface of the connection channel stage 135 of the connection channel module 130, and reaches the rotation stage 143 of the rotation stage module 140 below the rotation stage 143
  • the rotating stage driving device 142 receives the wafer transfer box 120 from the connection channel module 130 and horizontally moves to the desired position.
  • the rotation stage 143 carrying the wafer transfer box 120 stops rotation when the rotation stage 143 is rotated along the rotation rail 150 to reach the desired docking stage module 160.
  • the docking stage shaft 161 supporting the docking stage module 160 horizontally moves through the docking stage driving device 162 to move the docking stage module 160 to a position in contact with the rotating stage module 140.
  • the rotary stage transfer pin 141 pushes the wafer transfer box 120 toward the docking stage module 160 to move the wafer transfer box 120 onto the docking stage 164.
  • 10 to 12 are schematic views of a wafer cassette loading mechanism according to an embodiment of the present invention, which simplifies a process in which the wafer cassette 600 is horizontally transferred from the docking stage module 160 to the docking chamber 210. will be.
  • the wafer transfer box 120 reaching the docking stage module 160 is separated from the wafer cassette 600 therein, so that the cassette stage 212 in which only the wafer cassette 600 is in the docking chamber 210.
  • the docking stage drive shaft 161 is tilted at an angle of about 10 to 20 degrees to the docking stage 164 and horizontally in contact with the cassette stage 212 as shown in FIG. Move.
  • the docking stage 164 is inclined at a predetermined inclination so that the positions of the respective wafers contained in the wafer cassette 600 are aligned at the same position without forward movement.
  • the cassette stage drive shaft 213 also inclines the cassette stage 212 to be in line with the docking stage 164 by inclining 10 to 20 degrees.
  • the wafer cassette 600 is separated from the wafer transfer box 120 through the stage connection unit 123 bound to the bottom surface of the docking stage module 160.
  • the cover door 125 of the wafer transfer box 120 must first be opened by the automatic opening and closing device 126.
  • FIG. 13 and 14 are configuration diagrams of a process chamber module according to an embodiment of the present invention.
  • the process chamber module 200 may be largely divided into a docking chamber 210 and a process chamber 220, and a slit valve 221 may be provided at a connection portion between the docking chamber 210 and the process chamber 220.
  • the process chamber 220 and the docking chamber 210 are separated from each other by repeating opening and closing only during the transfer.
  • the docking chamber 210 has a cassette stage 212 on which a wafer cassette 600 is placed, and a cassette stage drive shaft 213 capable of driving the cassette stage 212 up and down is mounted.
  • a wafer handler 214 capable of lifting the wafer 700 from the wafer cassette 600 and transferring the wafer 700 to the process chamber 220.
  • the wafer handler 214 is implemented to perform only a simple reciprocating motion, thereby reducing the installation cost. It is desirable to minimize it.
  • the wafer handler 214 inside the docking chamber 210 depends on the method in which the wafer 700 is loaded in the corresponding process chamber 220.
  • the wafer 700 is loaded vertically, the wafer in the horizontal state ( It will be necessary to use a wafer handler 214 having a structure capable of lifting 700 and turning it vertically to load the process chamber 220.
  • the docking chamber 210 should be manufactured in accordance with the process chamber 220, the equipment development company manufacturing the process chamber 220 is designed, manufactured and manufactured to be most suitable for the process chamber 220 of its own chip Delivery to the manufacturer will be most realistic. Therefore, the detailed driving method and operation mechanism of the docking chamber 210 is preferably applied to the unique design to fit the equipment for each equipment manufacturer.
  • the docking chamber 210 is connected to a vacuum pump P, a pumping valve 215, a venting gas line, and a venting valve 216 to move up and down a vacuum state and an atmospheric pressure state.
  • 15 is a block diagram of a wafer station according to an embodiment of the present invention.
  • the wafer station 300 is largely composed of five parts: the loading station 310, the unloading station 320, the station channel 330, the front stage 340, and the kiosk 350.
  • the loading station 310 is used by workers who wish to send the wafer transfer box 120 to the process chamber 220 installed in the same layer to process the process or load into the transfer tower 100 for transfer to the upper and lower layers. It is shown that a plurality of loading stages 312 are provided to put up to eight wafer transfer boxes 120 at the same time.
  • the kiosk 350 automatically identifies the identification number of the corresponding loading stage 312 and the wafer transfer box placed there. The unique number of 120 is recognized and displayed on the screen.
  • the schedule will be marked through the central control system and ready to begin operation at the click of a button of the operator.
  • the worker is instructed to manually instruct the user to check the availability in real time by entering the worker ID and password of the worker, and the work history is centralized. Automatically save to computer system. Since such automation related technologies are well known per se, those skilled in the art will be able to implement the wafer stage 300 by applying appropriate techniques.
  • the unloading station 320 is a place where the wafer transfer box 120, which has been delivered or transferred from another layer, arrives. If the schedule is to be performed in the corresponding layer process chamber 220 after the work is completed, The worker may move the wafer transfer box 120 to the loading station 310 and then resume the process after checking through the kiosk 350. In FIG. 15, the unloading station 320 is also illustrated so that up to eight wafer transfer boxes 120 may be loaded on the unloading stage 322.
  • the number of stages installed in each of the loading station 310 and the unloading station 320 is limited to eight, but in actual implementation, various stages may be designed such that more stages are installed, including a multilayer structure stage. .
  • the wafer station 300 is implemented with a separate kiosk 350 that can operate the device.
  • the worker puts the wafer transfer box 120 in charge on the empty loading stage 312 and designates the process chamber 220 suitable for the subsequent work through the kiosk 350, the wafer station 300
  • the management program to automatically manage the loading of the wafer transfer box 120 to the corresponding process chamber 220 in order to automatically allow the operator to proceed to the next operation.
  • 16 is a block diagram of a control panel according to an embodiment of the present invention.
  • FIG. 16 illustrates a transparent or opaque bulkhead 500 that spatially separates the transfer tower 100 and the wafer station 300 when viewed from the front with the wafer station 300 at the center and installed on the floor.
  • FIG. 1 illustrates an embodiment in which a control panel 400 is installed to monitor a state of a production facility and a process progress state and allow an operator to control a corresponding process chamber module 200.
  • the front and rear spaces separated by the partition wall 500 are preferably designed to maintain different cleanliness.
  • a space where the wafer station 300 is disposed in front of the partition wall 500 and the workers handle the wafer 700 should maintain the same or higher level of cleanliness as the inside of the transfer tower 100.
  • the space located behind the bulkhead 500 and the process chamber module 200 is mounted and operated can be maintained at a relatively low level of cleanliness because the work of installation, movement, and maintenance of production equipment is performed. .
  • the control panel 400 is installed on the left and right sides of the wafer station 300 as a display screen for controlling each process chamber module 200.
  • One control panel 400 may control all process chambers, and each control panel 400 may be installed for each process chamber module 200.
  • FIG. 16 illustrates an example in which control panels for the number of process chamber modules 200 are installed and individually controlled.
  • FIG. 17 is a side view of a semiconductor fab structure in accordance with an embodiment of the present invention.
  • FIG. 17 illustrates a semiconductor fab structure which is implemented and operated by a production line of three floors and a service floor of a lower floor along the transfer tower 100, and installs only one transfer tower 100. And it is an embodiment for the minifab (Minifab) model implemented by installing the process chamber module 200 in the circumferential direction of the transfer tower 100 for each floor.
  • minifab Minifab
  • each of the production facilities constituting the first to third layers should be arranged between layers and layers in consideration of production optimization such as connection between processes and process similarity.
  • the bottom layer is a service layer or auxiliary equipment layer, which is connected to each equipment installed on the first to third floors, and operates a vacuum pump 810, a control rack 820, and an RF generator ( 830), a heat exchanger 840 and a gas cabinet 850 are installed, and the initial investment cost, operation cost, maintenance cost, etc. through proper area division, sharing of common elements, integration by use, etc. Can greatly reduce.
  • Multi-floor Fab Multi-floor Fab
  • FIG. 18 is a layout view of a semiconductor manufacturing line in accordance with an embodiment of the present invention.
  • FIG. 18 is an embodiment of an extended form in which a plurality of transfer towers 100 are installed to implement a semiconductor manufacturing line. If the semiconductor fab structure in the embodiment of FIG. 3 is assumed to be one production block, the three-layer implementation of the production block may be referred to as shown in FIG. 17, and the plurality of structures of FIG. 17 are arranged side by side. It will be said that the semiconductor manufacturing line of FIG. 18 was installed.
  • the wafer transfer box 120 may also be transferred from the transfer tower 100 to another transfer tower 100 so that a continuous process may be possible.
  • the multilayer semiconductor illustrated in FIG. 17 may be used.
  • a separate wafer transfer box transfer path layer (not shown) may be formed on the top layer to implement a separate rail (not shown) in the horizontal direction connecting the transfer towers 100.
  • the semiconductor fabrication line applying the semiconductor fabrication structure according to the present invention can be implemented in various ways through the optimization design of the fabrication line, such as worker's copper wire, wafer movement path, integration of production facilities, and maximization of space efficiency.
  • the elevation channel 110 when the elevation channel 110 is composed of a plurality of independently rotatable layers, the elevation channel 110 may also function as the rotation stage module 140, in which case the rotation stage Since the module 140 is removed from the transfer tower 100, the diameter of the elevation channel 110 should be increased so that the outer diameter of the elevation channel 110 is approximated with the inner diameter of the transfer tower 100.
  • each layer of the elevation channel 110 corresponds to the height of each layer of the semiconductor fab structure, and thus can be directly transferred to the wafer transfer box 120 docking stage module 160 coupled to the elevation channel 110. do.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un système de transport de plaquettes, une structure d'installation de fabrication de semi-conducteurs le comprenant et un procédé de transport de plaquettes où le système de transport de plaquettes est un système de transport de plaquettes de conception nouvelle comportant une structure dans laquelle tout l'équipement installé pour le processus dans les lignes de fabrication de semi-conducteurs est intégré avec un système de distribution automatique pour transporter les plaquettes.
PCT/KR2009/000560 2008-12-23 2009-02-05 Système de transport de plaquettes, structure d'installation de fabrication de semi-conducteurs l'utilisant et procédé de transport de plaquettes WO2010074366A1 (fr)

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KR10-2008-0132398 2008-12-23
KR1020080132398A KR20100073670A (ko) 2008-12-23 2008-12-23 웨이퍼 이송 시스템과 이를 포함하는 반도체 팹 구조물 및 웨이퍼 이송 방법

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WO2014046903A3 (fr) * 2012-09-18 2014-05-22 Varian Semiconductor Equipment Associates, Inc. Optimisation de courroies transporteuses utilisées pour traitement de pièces à travailler
CN109244186A (zh) * 2018-09-19 2019-01-18 通威太阳能（安徽）有限公司 一种新型背钝化背膜正膜机台镀膜连体上下料装置及方法
CN113151799A (zh) * 2021-05-21 2021-07-23 安徽亦高光电科技有限责任公司 一种镀膜机
CN114823426A (zh) * 2022-05-26 2022-07-29 北京北方华创微电子装备有限公司 半导体工艺设备
CN115148651A (zh) * 2022-08-01 2022-10-04 弥费实业(上海)有限公司 晶圆盒交换传输设备及其驱动装置、存储库
CN116528518A (zh) * 2023-05-12 2023-08-01 广东省慧程智能设备有限公司 预叠设备以及预叠方法

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US9916995B2 (en) * 2014-02-24 2018-03-13 Lam Research Corporation Compact substrate processing tool with multi-station processing and pre-processing and/or post-processing stations
KR101885434B1 (ko) 2016-10-31 2018-09-10 세메스 주식회사 구동 모듈 및 이를 포함하는 타워 리프트
KR101864947B1 (ko) 2016-10-31 2018-06-05 세메스 주식회사 브레이크 모듈을 포함하는 타워 리프트
KR102616683B1 (ko) 2016-11-30 2023-12-21 세메스 주식회사 오토 텐셔너 및 이를 포함하는 타워 리프트
KR102557804B1 (ko) 2016-12-08 2023-07-20 세메스 주식회사 웨이트 모듈을 포함하는 타워 리프트
KR102607317B1 (ko) 2016-12-15 2023-11-29 세메스 주식회사 타워 리프트
KR102503286B1 (ko) 2018-05-08 2023-02-23 세메스 주식회사 타워 리프트
KR102141200B1 (ko) 2018-12-24 2020-09-14 세메스 주식회사 이송 로봇 및 이를 포함하는 이송 장치
KR102189275B1 (ko) 2019-07-08 2020-12-09 세메스 주식회사 이송 로봇 및 이를 포함하는 이송 장치
KR102185264B1 (ko) 2019-07-29 2020-12-01 세메스 주식회사 이송 장치
KR20210124612A (ko) 2020-04-06 2021-10-15 세메스 주식회사 반송 트랙 및 반송 장치
CN117231657B (zh) * 2023-11-11 2024-01-30 沈阳富创精密设备股份有限公司 一种用于晶圆盒运输车的旋转限位止回装置及其工作方法

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WO2014046903A3 (fr) * 2012-09-18 2014-05-22 Varian Semiconductor Equipment Associates, Inc. Optimisation de courroies transporteuses utilisées pour traitement de pièces à travailler
US9145271B2 (en) 2012-09-18 2015-09-29 Varian Semiconductor Equipment Associates, Inc. Optimization of conveyor belts used for workpiece processing
CN109244186A (zh) * 2018-09-19 2019-01-18 通威太阳能（安徽）有限公司 一种新型背钝化背膜正膜机台镀膜连体上下料装置及方法
CN109244186B (zh) * 2018-09-19 2024-02-27 通威太阳能（安徽）有限公司 一种新型背钝化背膜正膜机台镀膜连体上下料装置及方法
CN113151799A (zh) * 2021-05-21 2021-07-23 安徽亦高光电科技有限责任公司 一种镀膜机
CN114823426A (zh) * 2022-05-26 2022-07-29 北京北方华创微电子装备有限公司 半导体工艺设备
CN115148651A (zh) * 2022-08-01 2022-10-04 弥费实业(上海)有限公司 晶圆盒交换传输设备及其驱动装置、存储库
CN115148651B (zh) * 2022-08-01 2023-05-02 弥费科技(上海)股份有限公司 晶圆盒交换传输设备及其驱动装置、存储库
CN116528518A (zh) * 2023-05-12 2023-08-01 广东省慧程智能设备有限公司 预叠设备以及预叠方法
CN116528518B (zh) * 2023-05-12 2023-12-15 广东省慧程智能设备有限公司 预叠设备以及预叠方法

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