WO2010072169A1 - 一种耐用半导体冷藏暖藏两用箱 - Google Patents

一种耐用半导体冷藏暖藏两用箱 Download PDF

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Publication number
WO2010072169A1
WO2010072169A1 PCT/CN2009/076017 CN2009076017W WO2010072169A1 WO 2010072169 A1 WO2010072169 A1 WO 2010072169A1 CN 2009076017 W CN2009076017 W CN 2009076017W WO 2010072169 A1 WO2010072169 A1 WO 2010072169A1
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WO
WIPO (PCT)
Prior art keywords
heat exchanger
outdoor heat
liquid refrigerant
semiconductor
heater
Prior art date
Application number
PCT/CN2009/076017
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English (en)
French (fr)
Inventor
刘万辉
Original Assignee
重庆森展科技有限公司
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Publication of WO2010072169A1 publication Critical patent/WO2010072169A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/003—General constructional features for cooling refrigerating machinery
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2600/00—Control issues
    • F25D2600/02—Timing

Definitions

  • the invention relates to a household appliance for cooling and heating a semiconductor, in particular to a novel semiconductor refrigerating and warming dual-purpose box and a novel cold-heat complementary combination applied to the novel multifunctional semiconductor refrigerating and warming dual-purpose box.
  • Heat Exchanger Background technique
  • the heat from the refrigerating compartment cooling and the cooling capacity of the semiconductor refrigerating heater to the heating of the heating compartment are mutually neutralized, thereby improving the cooling efficiency of the semiconductor refrigerating heater and the heating efficiency of the semiconductor refrigerating heater
  • the control method for improving the positive and negative polarity of the direct current output to the semiconductor cooling and heating device by the electronic control board is also improved, and the working life of the semiconductor cooling and heating device is also prolonged.
  • a suitable upper room heat exchanger and a lower room heat exchanger are made of a metal material having good thermal conductivity, and a liquid refrigerant can be internally flowed by using a suitable material.
  • the upper outdoor heat exchanger and the lower outdoor heat exchanger, the inner front surface of the upper outdoor heat exchanger is in close contact with the upper compartment semiconductor refrigeration heater, and the inner front surface is made of a metal material with good thermal conductivity.
  • the upper outdoor heat exchanger has an upper outdoor flow passage through which the liquid refrigerant flows, and the upper outdoor heat exchanger has a liquid connected to the upper outdoor flow passage of the liquid refrigerant flowing inside the upper outdoor heat exchanger.
  • the refrigerant inlet, the liquid refrigerant outlet, and the replenishing air outlet for refilling the system during liquid addition, and the front side of the lower outdoor heat exchanger will be in close contact with the lower compartment semiconductor refrigeration heater.
  • the inner front surface is made of a metal material having good thermal conductivity.
  • the lower outdoor heat exchanger has a lower outdoor flow path through which the liquid refrigerant flows, and the lower outdoor heat exchanger is connected to the lower outdoor flow path of the liquid refrigerant flowing inside the lower outdoor heat exchanger.
  • the liquid refrigerant inlet and the liquid refrigerant outlet are connected to each other to produce a dedicated electronic control board, the electronic control board is electrically connected to the upper compartment semiconductor refrigeration heater, and the electronic control board is electrically connected to the lower compartment semiconductor refrigeration heater.
  • the composite condenser is made of a metal material with good thermal conductivity.
  • the composite condenser is composed of one or more single-layer condensers. The positions of the single-layer condensers are stacked in parallel, and a suitable infusion pump is selected.
  • the upper outdoor heat exchanger, the lower outdoor heat exchanger, the composite condenser and the infusion pump are connected to each other to form a circulating flow path for the liquid refrigerant flow, when the electronic control board changes the output to the upper compartment semiconductor refrigeration heater
  • the direct current is positive or negative
  • the electron when the system board changes polarity to the DC output current between the lower chamber of the semiconductor refrigeration heat, the current value of the direct current output section of the buffer equal to zero short time interval.
  • the working principle of the present invention is as follows.
  • the upper compartment heating and the lower compartment cooling of the two multifunctional semiconductor refrigerating and warming dual-purpose boxes are exemplified, and the multifunctional semiconductor refrigerating warm-up dual-use box is started.
  • the lower compartment semiconductor refrigeration heater continuously draws heat from the lower chamber through the lower indoor heat exchanger, transfers the heat to the lower outdoor heat exchanger, and lowers the indoor temperature to achieve the purpose of cooling.
  • the room semiconductor refrigeration heater continuously collects heat from the outdoor heat exchanger, transfers the heat to the upper indoor heat exchanger, and then transfers the heat to the upper chamber.
  • the upper chamber temperature rises and reaches the system.
  • the liquid refrigerant circulates in such a cold and heat complementary integrated heat exchanger, so that the amount of heat on the upper outdoor heat exchanger and the heat on the lower outdoor heat exchanger are mutually Neutralization, lowering the temperature on the lower outdoor heat exchanger and increasing the temperature on the upper outdoor heat exchanger, so the cooling efficiency of the lower compartment semiconductor refrigeration heater is improved, the upper chamber is semi-conductive The heating efficiency of the body cooling and heating is improved, and the composite condenser is used to dissipate the excess heat of the liquid refrigerant temperature higher than the ambient temperature after the neutralization of the cold heat or to absorb the cold heat and neutralize the liquid refrigerant temperature.
  • the composite condenser consists of one or more single-layer condensers connected, usually consists of two single-layer condensers stacked in parallel, and the effective heat exchange area with the external environment is greater than that of the single The layer condenser, so the heat exchange efficiency with the external environment is greater than that of the single-layer condenser, and the upper and outer outdoor heat exchangers are equipped with liquid discharge and replenishing vents for replenishing the liquid, which facilitates production and Maintenance, if the upper chamber is changed from heating to cooling, only the electronic control board needs to change the positive and negative polarity of the direct current output to the upper compartment semiconductor cooling heater.
  • Figure 1 is a cross-sectional structural view showing an embodiment of the present invention
  • FIG. 2 is a schematic structural view of an embodiment of an electrical connection of the present invention.
  • FIG. 3 is a schematic structural view of a first embodiment of an external circulation heat exchange system of the present invention
  • FIG. 4 is a schematic structural view of a second embodiment of the external circulation heat exchange system of the present invention
  • First embodiment positive cross-sectional view
  • Figure 6 is a front cross-sectional view showing a second embodiment of the upper outdoor heat exchanger of the present invention.
  • Figure 7 is a front cross-sectional view showing a third embodiment of the upper outdoor heat exchanger of the present invention.
  • a suitable upper indoor heat exchanger 3 and a lower indoor heat exchanger 4 are made of a metal material having good thermal conductivity, and a liquid refrigerant is prepared from a suitable material.
  • the upper outdoor heat exchanger 7 is provided with an upper outdoor flow passage 13 through which the liquid refrigerant flows, and the upper outdoor heat exchanger 7 is opened inside the same outdoor heat exchanger 7
  • the upper and lower outdoor flow paths through which the liquid refrigerant flows are the liquid refrigerant inlets connected to the 3rd phase, the liquid refrigerant outlets, and the exhaust air and the rehydration exhaust ports 14 for replenishing the liquid during the system dosing, and the lower outdoor heat exchanger
  • the inner front surface of the 8 is in close contact with the lower compartment semiconductor refrigeration heater 6, which is thermally conductive.
  • the lower outdoor heat exchanger 8 has a lower outdoor flow path through which the liquid refrigerant flows, and the lower outdoor heat exchanger 8 has a liquid inside the lower outdoor heat exchanger 8
  • the liquid refrigerant inlet and the liquid refrigerant outlet which are connected to the lower outdoor flow passage through which the refrigerant flows, produce a dedicated electronic control board 10, and the electronic control board 10 is electrically connected to the upper compartment semiconductor refrigeration heater 5, and the electronic control board 10 It is electrically connected to the lower compartment semiconductor cooling and heating device 6, and is made of a metal material having good thermal conductivity to form a composite condenser 11 which is composed of one or more single-layer condensers, each of which is composed of a single layer.
  • the positions of the condensers are stacked in parallel, and the appropriate infusion pump 12 is selected, characterized in that: the upper outdoor heat exchanger 7, the lower outdoor heat exchanger 8, the composite condenser 11 and the infusion pump 12 are connected to each other to form a liquid.
  • the electronic control board 10 changes the positive and negative polarity of the direct current output to the lower compartment semiconductor cooling and heating device 6, the current value of the output direct current is equal to zero.
  • the time interval is the time interval.
  • the working principle of the present invention is as follows.
  • the upper compartment 1 heating and the lower compartment 2 cooling of the two-compartment multifunctional semiconductor refrigerating and warming dual-purpose box are exemplified, and the multifunctional semiconductor refrigerating warm storage dual-purpose box
  • the lower compartment semiconductor cooling and heating device 6 continuously draws heat from the lower chamber 1 through the lower indoor heat exchanger 4, and transfers the heat to the lower to outer heat exchanger 8 and the lower chamber 2
  • the internal temperature is lowered to achieve the purpose of cooling
  • the upper compartment semiconductor refrigeration heater 5 continuously collects heat from the outdoor heat exchanger 7, and continuously transfers the heat to the upper indoor heat exchanger 3, and then dissipates the heat.
  • the temperature in the upper chamber 1 rises to achieve the purpose of heating.
  • the liquid refrigerant circulates in such a cold and heat complementary integrated heat exchanger, so that the upper chamber
  • the amount of cold on the outdoor heat exchanger 7 and the heat on the lower outdoor heat exchanger 8 are mutually neutralized, and the temperature of the lower indoor/outdoor heat exchanger 8 is lowered to increase the temperature of the upper outdoor heat exchanger 7, so Cooling efficiency of lower compartment semiconductor refrigeration heater 6 High, the heating efficiency of the upper compartment semiconductor refrigeration heater 5 is improved, and the composite condenser 11 is used for dissipating excess heat of the liquid refrigerant temperature higher than the ambient temperature after the neutralization of the cold heat or for absorbing cold heat. And the insufficient heat that causes the liquid refrigerant temperature to be lower than the ambient temperature.
  • the composite condenser 11 is composed of one or more single-layer condensers, it is usually composed of two single-layer condensers stacked in parallel, and the external environment.
  • the effective heat exchange area is larger than that of the single-layer condenser, so the heat exchange efficiency with the external environment is greater than that of the single-layer condenser, and the upper and outer outdoor heat exchangers 7 have the system liquid-filled air and the liquid replacement line for replenishing the liquid.
  • the port 14 is convenient for production and maintenance.
  • the upper chamber 1 is to be changed from heating to cooling, only the electronic control panel 10
  • the positive and negative polarities of the direct current output to the upper compartment semiconductor cooling and heating device 5 are changed, and if such a change is completed in an instant, according to the Lenz's law in electricity, it is known that the upper compartment semiconductor cooling and heating device 5 Excessive induced DC current and excessive induced DC voltage will damage the semiconductor thermopile in the upper compartment semiconductor cooling heater 5.
  • the semiconductor thermopile is also called semiconductor refrigerating sheet, shortening the upper chamber semiconductor system.
  • the interval does not cause excessive induced DC current and excessive induced DC voltage, and does not cause such damage to the upper compartment semiconductor heater 5.
  • the lower outdoor heat exchanger 8, the upper outdoor heat exchanger 7, the composite condenser 1 1 and the infusion pump are serially connected to each other in series to form a circulating flow path for liquid refrigerant flow;
  • the upper outdoor heat exchanger 7 and the lower outdoor heat exchanger 8 may be connected in parallel first, and then serially connected with the composite condenser 1 1 and the infusion pump 12 to form a circulation of the liquid refrigerant.
  • the upper outdoor flow passage 13 in which the liquid refrigerant flows inside the upper outdoor heat exchanger 7 is curved.
  • the upper outdoor flow passage 13 in which the liquid refrigerant flows inside the upper outdoor heat exchanger 7 may also be a plurality of parallel passages.
  • the upper outdoor flow passage 13 through which the liquid refrigerant flows inside the upper outdoor heat exchanger 7 may also be a cavity.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Description

一种耐用半导体冷藏暧藏两用箱 技术领域
本发明涉及到一种半导体制冷制热的家用电器，特别是一种新型半导体 冷藏暖藏两用箱及应用于该新型多功能半导体冷藏暖藏两用箱上的一种新 型冷热互补式综合换热器。 背景技术
目前， 市场上还没有可以同时制冷又制热的多间室半导体制冷制热的家 用电器， 更不要说这种家用电器还具有可以把半导体制冷制热器对冷藏室制 冷所带出的热量和半导体制冷制热器对暖藏室制热所带出的冷量相互中和 利用，从而提高半导体制冷制热器的制冷效率和半导体制冷制热器的制热效 率的特点。 发明内容
本发明的目的是提供这样一种新型耐用多功能半导体冷藏暖藏两用箱， 它有两个间室， 两个间室都可能任意制冷或制热， 还具有可以把半导体制冷 制热器对冷藏室制冷所带出的热量和半导体制冷制热器对暖藏室制热所带 出的冷量相互中和利用，从而提高半导体制冷制热器的制冷效率和半导体制 冷制热器的制热效率的特点， 另外， 由于改善了电子控制板改变输出给半导 体制冷制热器的直流电流的正负极性时的控制方法，也延长了半导体制冷制 热器的工作寿命。
本发明的目的是通过下面的技术方案实现的： 用导热性能良好的金属材 料制作成合适的上间室内换热器和下间室内换热器，用合适的材料制作成液 体冷媒能在内部流动的上间室外换热器和下间室外换热器，上间室外换热器 的内正面将同上间室半导体制冷制热器相紧密接触，该内正面是用导热性能 良好的金属材料制成，上间室外换热器的内部开有液体冷媒流动的上间室外 流动通路，上间室外换热器开有同上间室外换热器内部的液体冷媒流动的上 间室外流动通路相连通的液体冷媒流入口， 液体冷媒流出口， 以及系统加液 时排出空气及用于补充加液的补液排气口， 下间室外换热器内正面将同下间 室半导体制冷制热器相紧密接触，该内正面是用导热性能良好的金属材料制 成， 下间室外换热器的内部开有液体冷媒流动的下间室外流动通路， 下间室 外换热器开有同下间室外换热器的内部的液体冷媒流动的下间室外流动通 路相连通的液体冷媒流入口和液体冷媒出口， 制作专用的电子控制板， 电子 控制板与上间室半导体制冷制热器相电气连接 , 电子控制板与下间室半导体 制冷制热器相电气连接， 用导热性能良好的金属材料制作成复合冷凝器， 复 合式冷凝器由一个或一个以上的单层冷凝器连通组成，各个单层冷凝器的位 置是平行叠放， 选用合适的输液泵， 其特征是： 上间室外换热器， 下间室外 换热器， 复合式冷凝器和输液泵相互连接构成液体冷媒流动的循环流动通 路， 当电子控制板改变输出给上间室半导体制冷制热器的直流电流的正负极 性时， 有一段输出的直流电流的电流值等于零的短暂緩冲时间间隔， 当电子 控制板改变输出给下间室半导体制冷制热器的直流电流的正负极性时，有一 段输出的直流电流的电流值等于零的短暂緩冲时间间隔。
本发明的工作原理是这样的，这里以两间的多功能半导体冷藏暖藏两用 箱的上间室制热及下间室制冷来举例说明， 多功能半导体冷藏暖藏两用箱通 电后开始工作， 下间室半导体制冷制热器通过下间室内换热器不断地从下间 室内吸取热量， 把热量传给下间室外换热器， 下间室内温度降低， 达到制冷 的目的， 上间室半导体制冷制热器不断地丛上间室外换热器吸取热量， 把热 量源源不断地传给上间室内换热器， 再把热量散发到上间室内， 上间室内温 度升高， 达到制热的目的， 由于输液泵的工作， 液体冷媒在这样一种冷热互 补式综合换热器内循环流动，使得上间室外换热器上的冷量和下间室外换热 器上的热量相互中和利用， 降低下间室外换热器上的温度， 提高上间室外换 热器上的温度， 所以下间室半导体制冷制热器的制冷效率提高， 上间室半导 体制冷制热顺的制热效率提高 ,复合式冷凝器则用于散发掉冷热中和后仍使 得液体冷媒温度高于环境温度的多余热量或者用于吸收冷热中和后使得液 体冷媒温度低于环意温度的不足热量， 由于复合式冷凝器由一个或一个以上 的单层冷凝器连通组成， 通常用两个单层冷凝器平行叠放连通组成， 与外部 环境的有效换热面积大于单层冷凝器， 所以与外部环境的换热效率大于单层 冷凝器， 而在上间室外换热器开有系统加液时排出空气及用于补充加液的补 液排气口， 则便于生产和维修， 如果要把上间室由制热改变成制冷， 只需电 子控制板改变输出给上间室半导体制冷制热器的直流电流的正负极性，若这 种改变在瞬间完成， 根据电学中的楞次定律可知， 在上间室半导体制冷制热 器上将会产生过大的感生直流电流及过高的感生直流电压，会损伤半导全制 冷制热器中的半导体热电堆， 半导体热电堆也叫做半导体制冷片， 缩短上间 室半导体制冷制热器的工作寿命， 当电子控制板改变输出给上间室半导体制 冷制热器的直流电流的正负极性时，有一段输出的直流电流的电流值等于零 的短暂緩冲时间间隔，则不会产生过大的感生直流电流及过高的感生直流电 压 , 也不会造成对上间室半导体制冷制热器的这种损伤。 附图说明
本发明的附图说明如下：
图 1是本发明的实施例的剖视结构示意图；
图 2是本发明的电气连接的实施例的结构示意图；
图 3是本发明的外部循环换热系统第一种实施例的结构示意图； 图 4是本发明的外部循环换热系统第二种实施例的结构示意图； 图 5为本发明上间室外换热器第一种实施例正向剖面图；
图 6为本发明上间室外换热器第二种实施例正向剖面图；
图 7为本发明上间室外换热器第三种实施例正向剖面图；
图中： 1-上间室； 2-下间室； 3-上间室内换热器； 4-下间室内换热器； 5-上间室半导体制冷热器； 6-下间室半导体制冷制热器； 7-上间室外换热器； 8-下间室外换热器； 9-循环换热组件； 1 0-电子控制板； 1 1-复合式冷凝器； 12-输液泵； 1 3-上间室外流动通路； 14-补液排气口。
具体实施方式
下面结合附图和实施例对本发明做进一步说明；
如图 1、 图 2、 图 3、 图 5所示， 用导热性能良好的金属材料制作成合适 的上间室内换热器 3和下间室内换热器 4 , 用合适的材料制作成液体冷媒能 在内部流动的上间室外换热器 7和下间室外换热器 8 , 上间室外换热器 7的 内正面将同上间室半导体制冷制热器 5相紧密接触，该内正面是用导热性能 良好的金属材料制成，上间室外换热器 7的内部开有液体冷媒流动的上间室 外流动通路 1 3 ,上间室外换热器 7开有同上间室外换热器 7内部的液体冷媒 流动的上间室外流动通路 1 3相连通的液体冷媒流入口， 液体冷媒流出口， 以及系统加液时排出空气及用于补充加液的补液排气口 14 ,下间室外换热器 8的内正面将同下间室半导体制冷制热器 6相紧密接触， 该内正面是用导热 性能良好的金属材料制成， 下间室外换热器 8的内部开有液体冷媒流动的下 间室外流动通路， 下间室外换热器 8开有同下间室外换热器 8的内部的液体 冷媒流动的下间室外流动通路相连通的液体冷媒流入口和液体冷媒出口，制 作专用的电子控制板 10 , 电子控制板 10与上间室半导体制冷制热器 5相电 气连接， 电子控制板 10与下间室半导体制冷制热器 6相电气连接， 用导热 性能良好的金属材料制作成复合式冷凝器 11 , 复合式冷凝器 11由一个或一 个以上的单层冷凝器连通组成， 各个单层冷凝器的位置是平行叠放， 选项用 合适的输液泵 12 , 其特征是： 上间室外换热器 7 , 下间室外换热器 8 , 复合 式冷凝器 11和输液泵 12相互连接构成液体冷媒流动的循环流动通路， 当电 子控制板 10改变输出给上间室半导体制冷制热器 5的直流电流的正负极性 时， 有一段输出的直流电流的电流值等于零的短暂緩冲时间间隔， 当电子控 制板 10改变输出给下间室半导体制冷制热器 6的直流电流的正负极性时， 有一段输出的直流电流的电流值等于零的短暂緩冲时间间隔。
本发明的工作原理是这样的，这里以两间室的多功能半导体冷藏暖藏两 用箱的上间室 1制热及下间室 2制冷来举例说明， 多功能半导体冷藏暖藏两 用箱通电后开始工作， 下间室半导体制冷制热器 6通过下间室内换热器 4不 断地从下间室 1内吸取热量， 把热量传给下间到外换热器 8 , 下间室 2内温 度降低， 达到制冷的目的， 上间室半导体制冷制热器 5不断地丛上间室外换 热器 7吸取热量， 把热量源源不断地传给上间室内换热器 3 , 再把热量散发 到上间室 1 内， 上间室 1 内温度升高， 达到制热的目的， 由于输液泵 12的 工作， 液体冷媒在这样一种冷热互补式综合换热器内循环流动， 使得上间室 室外换热器 7上的冷量和下间室外换热器 8上的热量相互中和利用， 降低下 间室内外换热器 8的温度， 提高上间室外换热器 7的温度， 所以下间室半导 体制冷制热器 6的制冷效率提高，上间室半导体制冷制热器 5的制热效率提 高， 复合式冷凝器 11 则用于散发掉冷热中和后仍使得液体冷媒温度高于环 境温度的多余热量或者用于吸收冷热中和后使得液体冷媒温度低于环境温 度的不足热量， 由于复合冷凝器 11 由一个或一个以上的单层冷凝器连通组 成， 通常用两个单层冷凝器平行叠放连通组成， 与外部环境的有效换热面积 大于单层冷凝器， 所以与外部环境的换热效率大于单层冷凝器， 而在上间室 外换热器 7开有系统加液时排出空气及用于补充加液的补液排气口 14 ,则便 于生产和维修， 如果要把上间室 1 由制热改变成制冷， 只需电子控制板 1 0 改变输出给上间室半导体制冷制热器 5的直流电流的正负极性，若这种改变 在瞬间完成， 根据电学中的楞次定律可知， 在上间室半导体制冷制热器 5上 将会产生过大的感生直流电流及过高的感生直流电压，会损伤上间室半导体 制冷制热器 5中的半导体热电堆， 半导体热电堆也叫做半导体制冷片， 缩短 上间室半导体制热器 5的工作寿命， 当电子控制板 1 0改变输出给上间室半 导体制冷制热器 5的直流电流的正负极性时，有一段输出的直流电流的电流 值等于零的短暂緩冲时间间隔，则不会产生过大的感生直流电流及过高的感 生直流电压， 也不会造成对上间室半导体制热器 5的这种损伤。
如图 3所示， 下间室外换热器 8、 上间室外换热器 7、 复合式冷凝器 1 1 和输液泵是依次相互串行连接构成液体冷媒流动的循环流动通路；
如图 4所示，上间室外换热器 7与下间室外换热器 8也可以先并行连接 后，再与复合式冷凝器 1 1和输液泵 12依次相互串行连接构成液体冷媒的循 环流动通路；
如图 5所示，上间室外换热器 7内部液体冷媒流动的上间室外流动通路 1 3是弯曲的。
如图 6所示，上间室外换热器 7内部液体冷媒流动的上间室外流动通路 1 3也可以是多条并行通路。
如图 7所示，上间室外换热器 7内部液体冷媒流动的上间室外流动通路 1 3也可以是一个空腔。

Claims

权利要求
1、 一种新型耐用半导体冷藏暖藏两用箱， 它包括上间室 （1)、 下间室 (2)、 上间室内换热器（3)、 上间室半导体制冷制热器（5)、 上间室外换热 器（7)、 下间室内换热器（4)、 下间室半导体制冷制热器（6)、 下间室外换 热器（8)、 复合式冷凝器（11)、 输液泵（12)及电子控制板（10), 上间室 半导体制冷制热器（5)的一面与上间室内换热器（3)相紧密接触， 上间室 半导体制冷制热器（ 5 )的另一面与上间室外换热器（ 7 )内正面相紧密接触， 下间室半导体制冷制热器（6) 的一面与下间室内换热器（4)相紧密接触， 下间室半导体制冷制热器（6)的另一面与下间室外换热器（8 ) 内正面相紧 密接触， 上间室半导体制冷制热器（5) 与电子控制板（10)相电气连接， 下间室半导体制冷制热器（6)与电子控制板（10)相电气连接， 其特征是： 上间室外换热器（ 7 )、 下间室外换热器（ 8 )、 复合式冷凝器（ 11 )及输液泵 ( 12 )相互连接通， 构成液体冷媒的循环流动通路， 当电子控制板（ 10 )改 变输出给上间室半导体制冷制热器（5 ) 的直流电流的正负极性时， 有一段 输出的直流电流的电流值等于零的短暂緩冲时间间隔， 当电子控制板（10) 改变输出给下间室半导体制冷制热器（6) 的直流电流的正负极性时， 有一 段输出的直流电流的电流值等于零的短暂緩冲时间间隔。
2、 如权利要求 1所述一种新型耐用半导体冷藏暖藏两用箱， 其特征是： 下间室外换热器 ( 8 )、 上间室外换热器 ( 7 )、 复合式冷凝器 ( 11 )和输液泵
( 12 )是依次相互串行连接构成液体冷媒流动的循环流动通路。
3、 如权利要求 1所述一种新型耐用半导体冷藏暖藏两用箱， 其特征是： 上间室外换热器（7) 与下间室外换热器（12)先并行连接后， 再与复合式 冷凝器 ( 11 )和输液泵 ( 12 )依次相互串行连接构成液体冷媒流动的循环流 动通路。
4、 如权利要求 1所述一种新型耐用半导体冷藏暖藏两用箱， 其特征是： 上间室外换热器（7)开有补液排气口 （I4 ), 液体冷媒通过液体冷媒流入口 和液体冷媒流出口， 上间室外换热器（7) 内部开有液体冷媒流动的上间室 外流动通路（13)。
5、 如权利要求 1所述一种新型耐用半导体冷藏暖藏两用箱， 其特征是： 下间室外换热器（8 )开有液体冷媒通过的液体冷媒流入口和液体冷媒流出 口， 下间室外换热器内部开有液体冷媒流动的下间室外流动通路。
6、 如权利要求 1所述一种新型耐用半导体冷藏暖藏两用箱， 其特征是： 上间室外换热器（7 ) 内部液体冷媒流动的上间室外流动通路（13)是弯曲 的。
7、 如权利要求 1所述一种新型耐用半导体冷藏暖藏两用箱， 其特征是： 上间室外换热器（7 ) 内部液体冷媒流动的上间室外流动通路（13)是多条 并行通路。
8、 如权利要求 1所述一种新型耐用半导体冷藏暖藏两用箱， 其特征是： 上间室外换热器（7 ) 内部液体冷媒流动的上间室外流动通路（13)是一个 空腔。
9、 如权利要求 1所述一种新型耐用半导体冷藏暖藏两用箱， 其特征是： 复合式冷凝器（11 )是由一个或一个以上的单层冷凝器平行叠放连通组成。
PCT/CN2009/076017 2008-12-28 2009-12-24 一种耐用半导体冷藏暖藏两用箱 WO2010072169A1 (zh)

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