WO2012019353A1 - 一种多功能半导体冷藏暖藏两用箱的制作方法 - Google Patents

一种多功能半导体冷藏暖藏两用箱的制作方法 Download PDF

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Publication number
WO2012019353A1
WO2012019353A1 PCT/CN2010/075946 CN2010075946W WO2012019353A1 WO 2012019353 A1 WO2012019353 A1 WO 2012019353A1 CN 2010075946 W CN2010075946 W CN 2010075946W WO 2012019353 A1 WO2012019353 A1 WO 2012019353A1
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Prior art keywords
semiconductor
heater
dual
cooling
heating device
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Application number
PCT/CN2010/075946
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English (en)
French (fr)
Inventor
刘万辉
Original Assignee
重庆森展科技有限公司
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Publication date
Application filed by 重庆森展科技有限公司 filed Critical 重庆森展科技有限公司
Priority to PCT/CN2010/075946 priority Critical patent/WO2012019353A1/zh
Publication of WO2012019353A1 publication Critical patent/WO2012019353A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures

Definitions

  • the invention relates to a method for manufacturing a semiconductor cold and heat box, in particular to a method for manufacturing a multifunctional semiconductor refrigerating and warming dual-purpose box having two independent storage rooms.
  • the evaporator and other related components are basically installed in the box and then foamed.
  • this method is difficult to reheat in the multifunctional semiconductor.
  • the main reason for the industrialization of the dual-use box is that the preparation of the foaming of the box is more difficult.
  • the second reason is that the after-sales maintenance service of the multi-function semiconductor refrigerated warm-up dual-use box is more difficult.
  • the object of the present invention is to overcome the shortcomings of the prior art, and to provide a multifunctional semiconductor refrigerating and warming dual-use box which is easy to operate, reduces the difficulty of preparing the container for foaming, and reduces the workload of the after-sales maintenance service.
  • the main technical solution of the present invention After installing the pre-prepared semiconductor cooling and heating device into the working chamber of each room of the prepared multi-functional semiconductor refrigerating and warming dual-purpose box, the connecting tube is used to connect the semiconductor cooling and heating The device, the rear condenser and the infusion pump constitute a circulating flow path of the liquid refrigerant.
  • the specific manufacturing method of the present invention includes the following steps:
  • the two-purpose box outer plate, inner liner and related parts are assembled and filled into a foaming mold for foaming, and are prepared into a dual-purpose box body, and the dual-purpose box body has two Separate upper and lower chambers, the upper chamber has an upper chamber working inside and outside, and the lower chamber has a lower chamber working inside and outside;
  • connection tube After installing the upper compartment semiconductor cooling heater into the upper chamber studio and the lower compartment semiconductor cooling heater into the lower chamber, the connection tube is used to connect the upper chamber to the semiconductor refrigeration system.
  • the heat exchanger, the lower compartment semiconductor refrigeration heater, the composite condenser and the infusion pump constitute a circulating flow path of the liquid refrigerant.
  • FIG. 1 is a schematic view showing an assembly structure of a multifunctional semiconductor refrigerating and warming dual-use box
  • FIG. 2 is a schematic cross-sectional view of a multifunctional semiconductor refrigerating and warming dual-purpose box
  • FIG. 3 is a schematic diagram of a communication scheme of an upper compartment semiconductor refrigeration heater, a lower compartment semiconductor refrigeration heater, a composite condenser, and an infusion pump in the technical solution of the present invention
  • FIG. 4 is a schematic diagram of a communication scheme of an upper compartment semiconductor refrigeration heater, a lower compartment semiconductor refrigeration heater, a composite condenser, and an infusion pump in the technical solution of the present invention
  • the outer casing, the inner liner and related components of the dual-purpose box are assembled and filled into a foaming mold for foaming, and are prepared into a dual-purpose box body, two
  • the box body has two separate upper compartments 1 and lower compartments 2, the upper compartment 1 has an upper compartment chamber 10 which is internally and externally connected, and the lower compartment 2 has a lower compartment which is open inside and outside.
  • Studio 11 As can be seen from Fig. 1, the semiconductor refrigerating sheet 12, the refrigerating heater metal assembly 14 and the refrigerating heater metal assembly 16 are closely contacted in close contact with each other, and are fastened by fastening members to form upper chamber semiconductor refrigeration.
  • the heating device 5, the semiconductor refrigerating sheet 13, the refrigerating heater metal assembly 15 and the refrigerating heater metal assembly 17 are closely contacted in close contact with each other, and fixed by a fastening member to form a lower compartment semiconductor refrigerating heater 6; as shown in FIG. 1 and FIG. 2, after the upper compartment semiconductor cooling heater 5 is installed in the upper chamber working chamber 10 and the lower compartment semiconductor cooling heater 6 is installed in the lower chamber working chamber 11, Connect the upper chamber with a connecting tube
  • the semiconductor cooling and heating device 5, the lower compartment semiconductor cooling and heating device 6, the composite condenser 7 and the infusion pump 8 constitute a circulating flow path of the liquid refrigerant.
  • the lower compartment semiconductor cooling and heating device 6, the upper compartment semiconductor cooling and heating device 5, the composite condenser 7 and the infusion pump 8 are sequentially connected in series to form a liquid refrigerant. Circulating flow path.
  • the lower compartment semiconductor cooling and heating device 6 and the upper compartment semiconductor cooling and heating device 5 may be connected in parallel, and then the composite condenser 7 and the infusion pump 8 may be sequentially The series is cyclically connected to each other to form a circulating flow path of the liquid refrigerant.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Description

一种多功能半导体冷藏暖藏两用箱的制作方法 技术领域
本发明涉及一种半导体冷热箱的制作方法， 特别是一种有着两个独立的 储藏室的多功能半导体冷藏暖藏两用箱的制作方法。
背景技术
目前具有两个间室的电冰箱类产品， 在制作过程中基本上都是将蒸发器 等相关零部件安装到箱体内后再发泡， 然而， 这种工艺方法却难以在多功能 半导体冷藏暖藏两用箱的工业化中应用， 首要原因是箱体发泡准备工作难度 加大， 其次原因是多功能半导体冷藏暖藏两用箱的售后维修服务工作难度加 大。
发明内容
本发明的目的是克服已有技术的缺点， 提出一种操作简便， 降低箱体发 泡准备工作难度， 减少产品售后维修服务工作量的多功能半导体冷藏暖藏两 用箱的制作方法。
本发明的主要技术方案： 将预先制备好的半导体制冷制热器安装进制备 好的多功能半导体冷藏暖藏两用箱箱体各间室的工作室以后， 再用连接管连 通半导体制冷制热器、 复后式冷凝器及输液泵， 构成液体冷媒的循环流动通 路。
本发明的具体制作方法包括以下步骤：
1.制备两用箱箱体： 将两用箱箱体外板、 内胆及相关零部件组装完毕并 装进发泡模具发泡， 制备成两用箱箱体， 两用箱箱体有两个分别独立的上间 室和下间室， 上间室背部开有内外贯通的上间室工作室， 下间室背部开有内 外贯通的下间室工作室；
2. 制备半导体制冷制热器： 将相关的半导体制冷片、 制冷制热器金属组 件按序紧密接触相贴， 用紧固定接件固定， 组成上间室半导体制冷制热器和 下间室半导体制冷制热器；
3.组装： 将上间室半导体制冷制热器安装进上间室工作室及把下间室半 导体制冷制热器安装进下间室工作室以后， 再用连接管连通上间室半导体制 冷制热器、 下间室半导体制冷制热器、 复合式冷凝器及输液泵， 构成液体冷 媒的循环流动通路。 附图说明
图 1是多功能半导体冷藏暖藏两用箱组装结构示意图；
图 2是多功能半导体冷藏暖藏两用箱箱体剖视示意图；
图 3是本发明技术方案中上间室半导体制冷制热器、 下间室半导体制冷 制热器、 复合式冷凝器及输液泵连通方案示意图；
图 4是本发明技术方案中又一种上间室半导体制冷制热器、 下间室半导 体制冷制热器、 复合式冷凝器及输液泵连通方案示意图；
图中： 1-上间室； 2-下间室； 3-上间室内换热器； 4-下间室内换热器； 5-上间室半导体制冷制热器； 6-下间室半导体制冷制热器； 7-复合式冷凝器 8-输液泵； 9-电气控制板； 10-上间室工作室； 11-下间室工作室； 12-半导体 制冷片； 1 3-半导体制冷片； 14-制冷制热器金属组件； 15-制冷制热器金属组 件； 19-制冷制热器金属组件； 17-制冷制热器金属组件。
下面结合附图对本发明做进一步说明： 由图 2可知， 将两用箱箱体外板、 内胆及相关零部件组装完毕并装进发泡模具发泡， 制备成两用箱箱体， 两用 箱箱体有两个分别独立的上间室 1和下间室 2 ,上间室 1背部开有内外贯通的 上间室工作室 10 , 下间室 2背部开有内外贯通的下间室工作室 11 ; 由图 1可 知， 将半导体制冷片 12、 制冷制热器金属组件 14和制冷制热器金属组件 16 按序紧密接触相贴， 用紧固连接件固定， 组成上间室半导体制冷制热器 5 , 将 半导体制冷片 1 3、 制冷制热器金属组件 15和制冷制热器金属组件 17按序紧 密接触相贴， 用紧固连接件固定， 组成下间室半导体制冷制热器 6 ; 结合图 1 和图 2所示， 将上间室半导体制冷制热器 5安装进上间室工作室 10及把下间 室半导体制冷制热器 6安装进下间室工作室 11以后， 再用连接管连通上间室 半导体制冷制热器 5、 下间室半导体制冷制热器 6、 复合式冷凝器 7及输液泵 8 , 构成液体冷媒的循环流动通路。
如图 3所示本发明技术方案中， 下间室半导体制冷制热器 6、上间室半导 体制冷制热器 5、 复合式冷凝器 7及输液泵 8是依次串行循环连通， 构成液体 冷媒的循环流动通路。
如图 4所示本发明技术方案中， 也可以是下间室半导体制冷制热器 6与 上间室半导体制冷制热器 5先并行连通后， 再与复合式冷凝器 7和输液泵 8 依次相互串行循环连通， 构成液体冷媒的循环流动通路。

Claims

权 利 要 求
1、 一种多功能半导体冷藏暖藏两用箱的制作方法， 其特征在于制备过程 包括以下步骤：
1 )、 制备两用箱箱体： 将箱体外板、 内胆及相关零部件组装完毕并装进 发泡模具发泡， 制备成两用箱箱体， 两用箱箱体有两个分别独立的上间室（1 ) 和下间室 （2 ), 上间室 （1 ) 背部开有内外贯通的上间室工作室 （10), 下间 室 （2) 背部开有内外贯通的下间室工作室 （11 );
2)、 制备半导体制冷制热器： 将半导体制冷片 （12), 制冷制热器金属组 件 （14 )及制冷制热器金属组件 （16 )按序紧密接触相贴， 用紧固连接件固 定， 组成上间室半导体制冷制热器（5 ); 将半导体制冷片 （13), 制冷制热器 金属组件 （15 )及另一制冷制热器金属组件 （17 )按序紧密接触相贴， 用紧 固定连接件固定， 组成下间室半导体制冷制热器（6);
3)、 组装： 将上间室半导体制冷制热器（5)安装进上间室工作室 （10) 及把下间室半导体制冷制热器（6)安装进下间工作室 （11 ) 以后， 再用连接 管连通上间室半导体制冷制热器（5)、 下间室半导体制冷制热器（6)、 复合 式冷凝器（7)及输液泵（8 )是依次串行循环连通， 构成液体冷媒的循环流 动通路。
2、 如权利要求 1所述的一种多功能半导体冷藏暖藏两用箱的制造方法， 其特征是： 下间室半导体制冷制热器（6)、 上间室半导体制冷制热器（5)、 行向量合式冷凝器（7)及输液泵（8 )是依次串行循环连通， 构成液体冷媒 的循环流动通路。
3、 如权利要求 1所述的一种多功能半导体冷藏暖藏两用箱的制造方法， 其特征是： 下间室半导体制冷制热器（6 ) 与上间室半导体制冷制热器（5 ) 先并行连通后， 再与复合式冷凝器（7 )和输液泵（8 )依次相互串行循环连 通， 构成液体冷媒的循环流动通路。
PCT/CN2010/075946 2010-08-12 2010-08-12 一种多功能半导体冷藏暖藏两用箱的制作方法 WO2012019353A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180281957A1 (en) * 2017-03-29 2018-10-04 Rockwell Collins, Inc. Liquid Chilled Galley Bar Unit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006145155A (ja) * 2004-11-24 2006-06-08 Matsushita Electric Ind Co Ltd 冷温蔵庫
CN101769664A (zh) * 2008-12-28 2010-07-07 刘万辉 一种新型耐用多功能半导体冷藏暖藏两用箱
CN101893346A (zh) * 2009-05-22 2010-11-24 刘万辉 一种多功能半导体冷藏暖藏两用箱的制作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006145155A (ja) * 2004-11-24 2006-06-08 Matsushita Electric Ind Co Ltd 冷温蔵庫
CN101769664A (zh) * 2008-12-28 2010-07-07 刘万辉 一种新型耐用多功能半导体冷藏暖藏两用箱
CN101893346A (zh) * 2009-05-22 2010-11-24 刘万辉 一种多功能半导体冷藏暖藏两用箱的制作方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180281957A1 (en) * 2017-03-29 2018-10-04 Rockwell Collins, Inc. Liquid Chilled Galley Bar Unit
US11136125B2 (en) * 2017-03-29 2021-10-05 Rockwell Collins, Inc. Liquid chilled galley bar unit

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