WO2010066119A1 - 一种功率型发光二极管 - Google Patents

一种功率型发光二极管 Download PDF

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Publication number
WO2010066119A1
WO2010066119A1 PCT/CN2009/070616 CN2009070616W WO2010066119A1 WO 2010066119 A1 WO2010066119 A1 WO 2010066119A1 CN 2009070616 W CN2009070616 W CN 2009070616W WO 2010066119 A1 WO2010066119 A1 WO 2010066119A1
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WO
WIPO (PCT)
Prior art keywords
shell
small bracket
bracket
tube
power led
Prior art date
Application number
PCT/CN2009/070616
Other languages
English (en)
French (fr)
Inventor
朱火生
王月华
卞长友
Original Assignee
鑫谷光电股份有限公司
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Filing date
Publication date
Application filed by 鑫谷光电股份有限公司 filed Critical 鑫谷光电股份有限公司
Publication of WO2010066119A1 publication Critical patent/WO2010066119A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a power type light emitting diode. Background technique
  • LEDs are well known, and they have already shown great advantages in energy saving, longevity and fast response in applications such as landscape, indication, display, backlight, and special lighting.
  • LED has only been developed for decades, but it has been dominated by low-power LED applications.
  • LEDs have easy dynamic control of brightness and color, small size, long life, no infrared and ultraviolet light in the beam, and strong directionality of light. This is the advantage of LED in the field of general lighting.
  • power-type LEDs must be developed to improve luminous efficiency.
  • the present invention adopts the following design scheme:
  • a power type light emitting diode is composed of a bracket and a light emitting diode chip placed thereon coated with glue.
  • the bracket comprises a tube shell and a small bracket, and the tube shell is composed of an upper prismatic ring body, a central reflecting cup body and a lower column body, and a cavity is formed in a center of the tube shell.
  • the small bracket is a prismatic ring frame that stands on the tube casing.
  • the small bracket is spaced apart from the shell, and the inner cavity of the shell and the inner cavity of the shell are filled with an insulating substance.
  • the poles drawn from the small bracket extend through the insulation of the central cavity of the casing to the bottom.
  • the set of diode chips are arranged on the tube shell, one pole of each diode chip is electrically connected to the small bracket, and the other reverse pole is electrically connected with the tube shell.
  • the shell and the small bracket are made of metal.
  • the prismatic ring body on the upper portion of the envelope is triangular or more.
  • the small bracket is a prismatic ring frame corresponding to the prism cross section of the upper portion of the envelope.
  • the set of diode chips are evenly distributed on the envelope.
  • the shell and the small bracket surface are plated with a metal layer that reflects light and prevents oxidation of the stent.
  • the metal bracket has small thermal resistance, which can be used as a heat sink to improve the heat dissipation performance. It can dissipate the heat generated by the use of the LED to improve its service life.
  • the light-emitting diode chip on each surface of the bracket shell forms a multi-chip integrated light-emitting diode after packaging.
  • the working current is above 320mA, and different light-emitting diode chips can be used, and the power can reach 1W, 3W or higher.
  • the illumination angle is 360 °, which can be assembled in multiple units or directly applied to lighting products.
  • FIG. 1 is a schematic view showing the structure of an embodiment of the present invention (without a rubber seal layer; half cross-sectional view).
  • FIG. 2 is a schematic structural view of another embodiment of the present invention (with a rubber seal layer, a front view). detailed description
  • the power LED of the present invention comprises a bracket and a light emitting diode chip.
  • the bracket includes a bulb 1 and a small bracket 4.
  • the casing 1 is composed of a combination of an upper prismatic ring body, a central reflecting cup body and a lower column body.
  • the prismatic ring body on the upper part of the shell 1 may be a multi-prism or a cylinder of more than 3 ribs or a cylinder, and may be made of a metal material.
  • the bottom of the upper prism-shaped ring body is joined to the reflector cup 2.
  • the reflector cup 2 is used.
  • the truncated cone type reflector cup having a diameter of 1 to 15 mm may be square, diamond or elliptical, and the bottom of the reflector cup 2 is joined to the cylinder 3 for positioning and heat dissipation.
  • the cylinder 3 may be a cylinder.
  • the envelope 1 has a hollow interior.
  • the small bracket may also be a cylindrical ring frame 4 made of metal, and a polarity lead-out leg 5 is connected to the bottom.
  • the small bracket 4 is spaced apart from the envelope 1 and the insulating material 6 is filled between the two.
  • the small bracket leads the foot 5 through the insulation of the inner cavity of the envelope to the bottom.
  • the negative (positive) pole of the light-emitting diode chip 7 is electrically connected to the envelope through the metal wire 8
  • the positive (negative) pole of the light-emitting diode is electrically connected to the small bracket through the metal wire 8.
  • the small bracket may be a prismatic ring frame made of metal, which may be a prismatic ring frame corresponding to the prism and the cross section of the upper part of the casing, or may be slightly different or different in shape, such as a cylindrical shape. , square or Mitsubishi or more diamond ring frame.
  • the LED chip illumination is full-angle illumination, and the design of the glue layer coated on the outside of the chip and the bracket can determine the overall illumination angle.
  • the invention is selected by the position combination of the multi-chip and the glue coated on the chip and the bracket. It is transparent and has a light refraction effect, making the new power LEDs have an overall illumination angle of 360 °.
  • the shell and the small bracket material are plated with a layer of silver, nickel or other metal that reflects light and prevents oxidation of the stent.
  • the prismatic ring body at the upper portion of the envelope is more than three ribs, and is generally 3-10 ribs, preferably an 8-sided prism.
  • the set of diode chips may be single or multiple, and are evenly distributed on the package. In the case of a plurality of diode chips, if the number of diode chips coincides with the number of edges of the upper prismatic ring of the envelope, each of the diode chips is placed on a plane between the corresponding edges of the envelope.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

一种功率型发光二极管 技术领域
本发明涉及一种功率型发光二极管。 背景技术
发光二极管 LED的优势已广为人知， 在景观、 指示、 显示、 背光、 特种照明 等应用领域已经发挥了节能、 长寿、 响应速度快等巨大的优势。 在照明技术发展 的百年历史中， LED的发展不过几十年， 但是以前一直以小功率发光二极管应用 为主。 我们可以看到 LED在亮度和色彩的动态控制容易、 外形尺寸小、 长寿命、 光束中不含红外线和紫外线、很强的发光方向性等特点是 LED大规模进军普通照 明领域的优势。 要想充分发挥 LED的性能优势， 进入普通照明市场， 必须发展功 率型发光二极管， 提高发光效率。
而目前市场上的功率型 LED , 主要是以表贴型结构为主， 这种结构存在角度 限制， 要用于普通照明， 必须对其进行多颗组装成模组后才能使用。 发明内容
本发明的目的是提供一种能直接用做照明的功率型发光二极管，利用其可作 为半导体照明光源。
为实现上述目的， 本发明采取以下设计方案：
一种功率型发光二极管，由支架和置于其上被胶涂覆住的发光二极管芯片组 合构成。 所述的支架包括管壳和小支架， 管壳由上部的棱柱型环体、 中部的反射 杯体及下部的柱体组合构成， 管壳内中心形成空腔。 小支架为棱柱型环架， 立于 管壳之上。 小支架与管壳间隔相置， 两者间及管壳中心空腔内填充绝缘物质。 由 小支架引出的极脚穿过管壳中心空腔的绝缘物至底部延出。所述的一组二极管芯 片布在管壳上， 各二极管芯片的一个极与小支架电连接， 另一个反向极与管壳形 成电连接。 管壳和小支架均为金属材质制成。
所述管壳上部的棱柱型环体为三棱以上。所述的小支架为与管壳上部的棱柱 体横截面相对应的棱柱型环架。
所述的一组二极管芯片均布在管壳上。
所述的管壳和小支架表面镀有起到反射光线、 防止支架氧化的金属层。 本发明的优点是：
1、 金属支架热阻小， 既导通电性， 又能充当热沉， 提高散热性能， 将发光 二极管使用中产生的热能散发出去， 提高其使用寿命。
2、 支架管壳每个面上固有发光二极管芯片， 封装后形成多芯片集成发光二 极管， 其工作电流在 320mA以上， 使用不同的发光二极管芯片， 功率可达到 1W、 3W或更高。
3、 发光角度为全角 360 ° ， 既可以多颗组装使用， 也可单颗直接应用于照 明产品。 附图说明
图 1 为本发明一实施例结构示意图 （不带胶封层； 半剖视） 。
图 2 为本发明另一实施例结构示意图 （带胶封层， 主视） 。 具体实施方式
参阅图 1、 图 2所示， 本发明功率型发光二极管包括支架和发光二极管芯片。 所述的支架包括管壳 1和小支架 4。
所述的管壳 1由上部的棱柱型环体、中部的反射杯体及下部的柱体组合构成。 管壳 1上部的棱柱型环体可以是 3棱以上的多棱柱体或者是圆柱体，可由金属材 质制成， 上部棱柱型环体的底部接合反射杯 2， 本实施例中， 反射杯 2采用底圆 直径为 l〜15mm 的圆台型反射杯， 亦可采用方形、 菱形或椭圆形等， 反射杯 2 的底部再与起到定位、 散热作用的柱体 3接合， 该柱体 3可以是圆柱型、 带螺纹 的圆柱型或其他型。 管壳 1具有一中空内腔。 所述的小支架亦可以是金属材质的柱体环架 4， 底部接有极性引出脚 5。 小 支架 4与管壳 1间隔相置， 两者间及管壳空腔内填充绝缘物质 6。 小支架引出脚 5穿过管壳内腔的绝缘物质至底部延出。
所述的发光二极管芯片 7的负 （正） 极通过金属线 8与管壳形成电连接， 发 光二极管的正 （负） 极通过金属线 8与小支架形成电连接。
小支架可以是金属材质的棱柱型环架， 既可以与管壳上部的棱柱体是相对应 位置及横截面大小的棱柱型环架， 亦可略有不同或为不同形态， 如可为圆柱形、 方形或三菱以上菱形的环架。
发光二极管芯片发光是全角度发光的， 涂覆在芯片和支架外的胶层的设计可 以决定其整体发光的角度，本发明通过多芯片的位置组合及涂覆在芯片和支架外 的胶选用的是透明的并具有光线折射作用，使此新型功率型发光二极管整体发光 角度为 360 ° 。
所述的管壳和小支架材质表面镀有起到反射光线、 防止支架氧化的银、 镍或 其他金属层。
所述管壳上部的棱柱型环体为三棱以上， 一般为 3-10棱， 最好是 8面棱柱体。 所述的一组二极管芯片可以是单个， 亦可以是多个， 均布在管壳上。 当为多 个时， 如果一组二极管芯片的数量与管壳的上棱柱型环体的棱数一致， 则每一个 二极管芯片各自置于管壳对应两棱间的平面上。
上述各实施例可在不脱离本发明的范围下加以若干变化，故以上的说明所包 含及附图中所示的结构应视为例示性， 而非用以限制本发明的申请专利保护范 围。

Claims

权 利 要 求 书
1、 一种功率型发光二极管， 由支架和置于其上的被胶封的发光二极管芯片 组合构成， 其特征在于： 所述的支架包括管壳和小支架， 管壳由上部的棱柱型环 体、 中部的反射杯体及下部的柱体组合构成， 管壳内中心形成空腔； 小支架为立 于管壳之上的环架；小支架与管壳间隔相置，两者间及管壳空腔内填充绝缘物质; 由小支架引出的极脚穿过管壳中心空腔的绝缘物至底部延出；反射杯的底部接有 起定位、 散热作用的螺纹柱体； 所述的一组二极管芯片布在管壳上， 各二极管芯 片的一个极与小支架电连接， 另一个反向极与管壳形成电连接。
2、 根据权利要求 1所述的功率型发光二极管， 其特征在于： 所述管壳上部 的棱柱型环体为 3-10棱。
3、 根据权利要求 2所述的功率型发光二极管， 其特征在于： 所述的管壳上 部的棱柱型环体为 8棱。
4、 根据权利要求 1所述的功率型发光二极管， 其特征在于： 所述的小支架 为与管壳管壳上部的棱柱体横截面相对应的棱柱型环架。
5、 根据权利要求 1所述的功率型发光二极管， 其特征在于： 所述的一组二 极管芯片均布在管壳上。
6、 根据权利要求 1所述的功率型发光二极管， 其特征在于： 所述的一组二极管 芯片的数量与管壳的上棱柱型环体的棱数一致， 每一个二极管芯片各自置于管壳对 应两棱间的平面上。
7、 根据权利要求 1所述的功率型发光二极管， 其特征在于： 所述的管壳和 小支架材质表面镀有起到反射光线、 防止支架氧化的金属层。
8、 根据权利要求 7所述的功率型发光二极管， 其特征在于： 所述的金属层 为银或镍层。
9、 根据权利要求 1所述的功率型发光二极管， 其特征在于： 所述的小支架 为圆柱形、 方形或三菱以上菱形的环架。
10、 根据权利要求 1所述的功率型发光二极管， 其特征在于： 所述的管壳和 小支架均由金属材质制成。
PCT/CN2009/070616 2008-12-12 2009-03-03 一种功率型发光二极管 WO2010066119A1 (zh)

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CNU2008201247143U CN201319376Y (zh) 2008-12-12 2008-12-12 一种功率型发光二极管
CN200820124714.3 2008-12-12

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CN105706258A (zh) * 2013-10-30 2016-06-22 爱信高丘株式会社 热电元件、热电模块及其制造方法

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US8264076B2 (en) * 2010-03-12 2012-09-11 Changyou Bian Power type LED
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CN105706258B (zh) * 2013-10-30 2018-06-12 爱信高丘株式会社 热电元件、热电模块及该热电模块的制造方法
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