WO2010059013A3 - 고방열기판을 구비한 엘이디 패키지 - Google Patents

고방열기판을 구비한 엘이디 패키지 Download PDF

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Publication number
WO2010059013A3
WO2010059013A3 PCT/KR2009/006929 KR2009006929W WO2010059013A3 WO 2010059013 A3 WO2010059013 A3 WO 2010059013A3 KR 2009006929 W KR2009006929 W KR 2009006929W WO 2010059013 A3 WO2010059013 A3 WO 2010059013A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat radiation
wiring pattern
effect
circuit wiring
substrate
Prior art date
Application number
PCT/KR2009/006929
Other languages
English (en)
French (fr)
Other versions
WO2010059013A2 (ko
Inventor
김덕용
Original Assignee
주식회사 케이엠더블유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020080117074A external-priority patent/KR20100058316A/ko
Priority claimed from KR1020080125728A external-priority patent/KR101517930B1/ko
Application filed by 주식회사 케이엠더블유 filed Critical 주식회사 케이엠더블유
Publication of WO2010059013A2 publication Critical patent/WO2010059013A2/ko
Publication of WO2010059013A3 publication Critical patent/WO2010059013A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 발명은 엘이디 패키지 기판에 관한 것으로, 엘이디 패키지에 있어서, 방열판과, 상기 방열판의 상부에 형성되는 절연피막층과, 상기 절연피막층위에 형성하는 회로배선패턴층과, 상기 회로배선패턴층에 직접 실장되는 적어도 한 개 이상의 엘이디칩을 포함하는 고방열기판을 포함한다. 이와 같은 구성의 본 발명은, 절연성능은 좋고 두께는 얇은 절연피막층을 형성할 수 있는 효과가 있다. 이로 인해 열 방출 효율이 개선되는 효과가 있다. 또한 본 발명은 상기 절연피막층위에 증착방법을 이용하여 두께가 얇은 전도층을 형성하고 에칭방법을 이용하여 회로배선패턴층을 형성하게 함으로써 보다 얇은 회로 배선패턴을 형성할 수 있는 효과가 있고 이로 인해 열 방출 효율이 개선되는 효과가 있다.
PCT/KR2009/006929 2008-11-24 2009-11-24 고방열기판을 구비한 엘이디 패키지 WO2010059013A2 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020080117074A KR20100058316A (ko) 2008-11-24 2008-11-24 고방열기판을 구비한 엘이디 패키지
KR10-2008-0117074 2008-11-24
KR10-2008-0125728 2008-12-11
KR1020080125728A KR101517930B1 (ko) 2008-12-11 2008-12-11 고방열 기판을 구비하는 멀티칩 엘이디 패키지

Publications (2)

Publication Number Publication Date
WO2010059013A2 WO2010059013A2 (ko) 2010-05-27
WO2010059013A3 true WO2010059013A3 (ko) 2010-09-10

Family

ID=42198700

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/006929 WO2010059013A2 (ko) 2008-11-24 2009-11-24 고방열기판을 구비한 엘이디 패키지

Country Status (1)

Country Link
WO (1) WO2010059013A2 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358371A (ja) * 2000-06-16 2001-12-26 Nichia Chem Ind Ltd 光半導体素子
KR100593933B1 (ko) * 2005-03-18 2006-06-30 삼성전기주식회사 산란 영역을 갖는 측면 방출형 발광다이오드 패키지 및이를 포함하는 백라이트 장치
JP2007184541A (ja) * 2005-12-09 2007-07-19 Matsushita Electric Ind Co Ltd 発光モジュールとその製造方法並びにそれを用いたバックライト装置
KR100784057B1 (ko) * 2005-06-24 2007-12-10 엘지이노텍 주식회사 발광소자 패키지 및 발광소자 패키지 제조 방법
JP2008218998A (ja) * 2007-02-09 2008-09-18 Toshiba Lighting & Technology Corp 発光装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358371A (ja) * 2000-06-16 2001-12-26 Nichia Chem Ind Ltd 光半導体素子
KR100593933B1 (ko) * 2005-03-18 2006-06-30 삼성전기주식회사 산란 영역을 갖는 측면 방출형 발광다이오드 패키지 및이를 포함하는 백라이트 장치
KR100784057B1 (ko) * 2005-06-24 2007-12-10 엘지이노텍 주식회사 발광소자 패키지 및 발광소자 패키지 제조 방법
JP2007184541A (ja) * 2005-12-09 2007-07-19 Matsushita Electric Ind Co Ltd 発光モジュールとその製造方法並びにそれを用いたバックライト装置
JP2008218998A (ja) * 2007-02-09 2008-09-18 Toshiba Lighting & Technology Corp 発光装置

Also Published As

Publication number Publication date
WO2010059013A2 (ko) 2010-05-27

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