WO2010052138A1 - Capteur de débit massique et véhicule automobile doté du capteur de débit massique - Google Patents

Capteur de débit massique et véhicule automobile doté du capteur de débit massique Download PDF

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Publication number
WO2010052138A1
WO2010052138A1 PCT/EP2009/063980 EP2009063980W WO2010052138A1 WO 2010052138 A1 WO2010052138 A1 WO 2010052138A1 EP 2009063980 W EP2009063980 W EP 2009063980W WO 2010052138 A1 WO2010052138 A1 WO 2010052138A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
chip
mass flow
chpl
electrical
Prior art date
Application number
PCT/EP2009/063980
Other languages
German (de)
English (en)
Inventor
Thorsten Knittel
Stefan Pesahl
Stephen Setescak
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Priority to CN2009801444011A priority Critical patent/CN102209885B/zh
Priority to JP2011535070A priority patent/JP5312603B2/ja
Priority to EP09745007A priority patent/EP2356409A1/fr
Publication of WO2010052138A1 publication Critical patent/WO2010052138A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/76—Devices for measuring mass flow of a fluid or a fluent solid material
    • G01F1/78—Direct mass flowmeters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/18—Supports or connecting means for meters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/18—Supports or connecting means for meters
    • G01F15/185—Connecting means, e.g. bypass conduits

Definitions

  • the invention relates to a mass flow sensor and in particular to a mass flow sensor for an air mass sensor for a motor vehicle.
  • Mass flow sensors are suitable for detecting a mass flow of a fluid in a flow channel.
  • a flow channel may for example be an intake tract of an internal combustion engine.
  • diagnoses of, for example, the operation of the internal combustion engine can be carried out as well as a control of the internal combustion engine. For these purposes, a reliable and precise as possible detection of the actual mass flow is important even under different operating conditions.
  • DE 197 24 659 A1 discloses a mass flow sensor device comprising a sensor element.
  • the sensor element is arranged and integrated on a separate chip.
  • a transmitter is disclosed, which is formed separately, but is electrically coupled to the sensor unit.
  • DE 42 19 454 C2 discloses a mass flow sensor device with a measuring chip, which is electrically coupled by means of bonding wires with other circuits. Furthermore, a wall of the mass flow sensor device is in contact with the measuring chip such that a connection region on the measuring chip is spatially separated from the flow channel in which a sensor element of the measuring chip is arranged.
  • the object of the invention is to provide a mass flow sensor and a motor vehicle with the mass flow sensor, which can be operated particularly reliably.
  • the object is solved by the features of the independent claims.
  • Advantageous embodiments of the invention are characterized in the subclaims.
  • the invention is characterized according to a first aspect by a mass flow sensor which has at least one sensor element by means of which a mass flow of a fluid flow can be detected. Furthermore, the mass flow sensor has a sensor chip which has a first chip side and a second opposite chip side. On the first chip side, this is at least one sensor element and on the second chip side, at least one electrical contact is arranged. The at least one electrical contact is electrically coupled to the at least one sensor element by means of at least one electrical connection.
  • the mass flow sensor further has a sensor carrier element, which has at least one electrical line and at least one electrical contact region. The electrical contact region is electrically coupled to the at least one electrical line.
  • the sensor chip is arranged on the sensor carrier element such that the at least one electrical contact on the second chip side of the sensor chip is electrically coupled to the at least one electrical contact region of the sensor carrier element.
  • the fluid may be formed as a gas or a liquid.
  • the fluid is in particular air, so that the mass flow sensor can be used in particular in an air mass sensor.
  • the electrical line can, for example, as an applied on the sensor support element conductor track, such. B. as a glued trace, be formed.
  • the sensor chip is typically arranged in a flow channel and can be exposed to the fluid flow in it.
  • a wall is preferably provided as a media separation, which is arranged such that a part of the mass flow sensor, such. B. the sensor chip, the flow channel is assigned, while another Part of the mass flow sensor is spatially separated from the flow channel. Due to the electrical coupling of the sensor element to the electrical line of the sensor carrier element, the wall can be designed to be particularly reliable. In particular, the mass flow sensor can be operated particularly reliable because no free-running electrical wires, such. As bonding wires, are present, which could be damaged by the wall. Due to the arrangement of the at least one electrical contact on the second chip side of the sensor chip, the electrical contact and the electrical contact region is also protected from moisture and particles transported in the fluid flow.
  • the electrical connection comprises an electrical through-connection through the sensor chip from the first chip side to the second chip side.
  • This allows a particularly reliable electrical connection between the at least one sensor element and the at least one electrical contact.
  • the at least one electrical through-connection is electrically coupled directly to the at least one electrical contact.
  • the electrical via is preferably formed as a vertical electrical feedthrough.
  • the at least one electrical contact is formed, for example, as a soldering point or as an electrically conductive adhesive point.
  • the invention is characterized according to a second aspect by a mass flow sensor which has at least one sensor element, by means of which a mass flow of a fluid flow can be determined.
  • the mass flow sensor further has a sensor carrier element which has at least one electrical line.
  • the mass flow sensor has a sensor chip which has a first chip side and a second opposite chip side. The sensor chip is coupled with its second chip side with the sensor carrier element. On the first chip side, this is at least one sensor arranged sorelement.
  • the at least one sensor element is electrically coupled to the at least one electrical line of the sensor carrier element by means of at least one electrical connection.
  • the electrical contacting of the at least one electrical connection with the at least one electrical line of the sensor carrier element preferably takes place directly adjacent to a connection point of the second chip side of the sensor chip to the sensor carrier element. This has the advantage that the mass flow sensor is particularly reliable operable.
  • the at least one electrical connection comprises at least one surface conductor track, which is arranged along a surface of the sensor chip.
  • the electrical connection is particularly simple executable.
  • the at least one surface conductor track can be formed, for example, as at least one printed conductor glued onto the surface of the sensor chip.
  • at least one of the at least one electrical connection comprises the at least one surface conductor track and at least one further of the at least one electrical connection comprises at least one electrical through-connection.
  • the mass flow sensor has an evaluation unit, which is electrically coupled to the at least one sensor element by means of the at least one electrical line of the sensor carrier element.
  • the evaluation unit is designed to determine the mass flow of the fluid flow by means of the at least one sensor element.
  • the sensor carrier element is designed as a leadframe.
  • the sensor carrier element designed as a leadframe is designed as a sheet metal stamping component and already has an electrical conductivity. This has the advantage that the sensor carrier element is already designed as at least one electrical line and can be used for the electrical coupling of the at least one sensor element with preferably the evaluation unit.
  • the first sensor chip is formed at least as part of a media separation.
  • the media separation is designed to spatially separate the evaluation unit from the fluid flow. This allows a particularly simple and cost-effective execution of the media separation.
  • the invention is characterized according to a third aspect by a motor vehicle having at least one mass flow sensor according to the first or second aspect.
  • the motor vehicle has an internal combustion engine.
  • the at least one mass flow sensor is preferably arranged in an intake tract of the internal combustion engine and, in particular during operation of the internal combustion engine, is exposed to an air flow as fluid flow therein.
  • FIG. 1 shows a first embodiment of a mass flow sensor in cross section
  • FIG. 2 shows a second embodiment of a mass flow sensor in cross section
  • 3 shows a mass flow sensor as part of a media separation in cross section.
  • FIG. 1 shows a first embodiment of a mass flow sensor LMM is shown in cross section.
  • the mass flow sensor LMM for example, in an air mass sensor in a
  • the mass flow sensor LMM is at least partially disposed in a flow channel FC and in this a fluid flow FF, such. B. a stream of air, interchangeable.
  • the flow channel FC is formed, for example, as a bypass channel of a housing body, which is for example part of a mass flow sensor device with the mass flow sensor LMM, z.
  • the air mass sensor which is preferably arranged downstream of an air filter in an intake tract of an internal combustion engine of the motor vehicle.
  • a flow direction of the fluid flow FF in the flow channel FC is perpendicular in FIG. 1 into the plane of the figure.
  • the mass flow sensor LMM has a first sensor chip CHPL, such.
  • the sensor element SU comprises a membrane M on which, for example, one or more temperature sensors TS are arranged.
  • the first sensor chip CHPL is designed and provided to be arranged in the flow channel FC and to be exposed to the fluid flow FF with its first chip side CHP1_1.
  • the second chip side CHPl 2 is arranged facing away from the fluid flow and not exposed to this.
  • the first sensor chip CHPl also has an electrical feedthrough V which, in FIG.
  • the electrical through V is, for example, as a copper (copper pillar bump) formed in the first sensor chip CHPl.
  • the electrical feedthrough V can also be designed as a solder ball (solder ball bump) or as another embodiment known to a person skilled in the art.
  • the electrical via V is electrically coupled on the first chip side CHPl 1 of the first sensor chip CHPl to a first end of a first electrical line CPl.
  • a second end of the first electrical line CP1 is electrically coupled to the temperature sensor TS of the sensor element SU.
  • first electrical lines CPl can also be arranged on the membrane M of the sensor element SU and be electrically coupled to further first electrical lines CPl.
  • the at least one first electrical line CP1 is formed, for example, as an integrated conductor track on the first sensor chip CHPL.
  • the electrical feedthrough V is electrically coupled to an electrical contact SP.
  • the electrical contact SP is formed, for example, as a soldering point or an electrically conductive adhesive dot. Other electrical contacts SP known to the person skilled in the art can also be used.
  • the first sensor chip CHP1 can also have more than one electrical via V and more than one first electrical line CPI.
  • the respective first electrical line CP1 can also be electrically coupled with its respective first end to a surface conductor track SCP which extends along a first printed circuit
  • first sensor chip CHPl Surface of the first sensor chip CHPl is arranged (dotted lines in Figure 1). Basically it is too it is possible that, in the case of a plurality of first electrical lines CP1, at least one of the at least one first electrical line CP1 is electrically coupled to at least one surface conductor track SCP, while at least one other of the at least one first electrical line CP1 is electrically coupled to the at least one electrical via V. is.
  • the first electrical line CP1 and the electrical through-connection V and / or the surface trace SCP can be referred to as an electrical connection between the first chip side CHP1_1 and the second chip side CHP1_2 of the first sensor chip CHPL, which connects the sensor element SU to the at least one electrical contact SP electrically couples on the second chip side CHPl 2 of the first sensor chip CHPl.
  • the mass flow sensor LMM further has a sensor carrier element LF, which is preferably designed as a leadframe. Trained as a leadframe sensor carrier element LF is formed for example as a sheet metal stamping device and has by itself already an electrical conductivity. Alternatively, however, the sensor carrier element LF can also be designed as a printed circuit board.
  • the sensor carrier element LF has at least one second electrical line CP2, which in the case of the leadframe is designed as the leadframe itself. If the sensor carrier element LF is designed as a printed circuit board, the at least one second electrical line CP2 is designed, for example, as a glued-on conductor track.
  • the sensor carrier element LF has at least one electrical contact region CA, which is electrically coupled to one end of the at least one second electrical line CP2.
  • the first sensor chip CHPl is preferably coupled to the sensor carrier element LF by means of an encoder AD with its second chip side CHPL 2.
  • the adhesive AD is preferably formed electrically non-conductive.
  • the first sensor chip CHPl is arranged on the sensor carrier element LF such that the at least one electrical contact SP on the second chip side CHPL 2 of the first sensor chip CHPL is electrically coupled to the at least one electrical contact region CA of the sensor carrier element LF, the adhesive AD preferably being in this region not applied.
  • the electrical coupling can be effected, for example, by means of the soldering point or by means of the electrically conductive adhesive point.
  • the mass flow sensor LMM to a second sensor chip CHP2, which is for example formed as a silicon chip.
  • the second sensor chip CHP2 has an evaluation unit, such. B. an integrated evaluation unit.
  • the evaluation unit on the second sensor chip CHP2 is electrically coupled to a further end of the at least one second electrical line CP2 of the sensor carrier element LF and thus to the sensor unit SU on the first sensor chip CHPl.
  • the evaluation unit of the second sensor chip CHP2 is designed to determine, by means of the sensor element SU, a sensor signal which is representative of the determined mass flow of the fluid flow FF and to make it available on the output side.
  • the mass flow sensor LMM has the first and second sensor chip CHP1, CHP2 and is thus designed as a dual-chip sensor.
  • the first sensor chip CHPL is exposed to the fluid flow FF during operation of the internal combustion engine of the motor vehicle.
  • the second sensor chip CHP2 is preferably also not exposed to the fluid flow FF during operation of the internal combustion engine, since particles entrained with the fluid flow FF and moisture could damage the evaluation unit on the second sensor chip CHP2.
  • the housing body of the mass flow sensor device has a wall W, which between the first and second Sensor chip CHPl, CHP2 of the mass flow sensor LMM is arranged, that the second sensor chip CHP2 is spatially separated from the flow channel FC.
  • the wall W is preferably formed as a sealing lip and glued to a contact point of the sealing lip with the sensor carrier element LF with this.
  • the contact point is in the region of the sensor carrier element LF, in which the at least one second electrical line CP2 extends. Because of the at least one second electrical line CP2 integrated in the sensor carrier element LF or applied to the sensor carrier element LF, the wall W can come into contact with the sensor carrier element LF in a particularly suitable manner.
  • the wall W represents a media separation, which is designed to spatially separate the flow channel FC, in which the first sensor chip CHPl is arranged, from the second sensor chip CHP2 with the evaluation unit.
  • the wall W is particularly easy to carry out, since no free-running bonding wires or other free-running electrical conductors between the first and second sensor chip CHPl, CHP2 are present. This also has the advantage that the mass flow sensor device can be manufactured and operated particularly reliably with the mass flow sensor LMM.
  • FIG. 2 shows a second embodiment of the mass flow sensor LMM in cross section with the sensor carrier element LF and the first and second sensor chips CHP1, CHP2.
  • the first sensor chip CHPl is coupled with its second chip side CHP1_2 with the sensor carrier element LF, such. B. by means of the adhesive AD.
  • the sensor element SU on the first chip side CHPl 1 of the first sensor chip CHPl is electrically coupled to the second end of the at least one first electrical line CPl.
  • the sensor element SU in particular at least one component of the sensor element SU, is electrically coupled to the first end of the at least one first electrical line CP1 with the at least one surface conductor track SCP.
  • the at least one electrical contact SP is di- arranged right next to a junction of the first sensor chip CHPl with the sensor carrier element LF.
  • the sensor carrier element LF has the electrical contact region CA, which, in comparison to FIG. 1, is not arranged below the second chip side CHPL 2 of the first sensor chip CHPL. This also allows the wall W to come into contact with the sensor carrier element LF between the first and second sensor chips CHP1, CHP2 in such a way that reliable media separation between the fluid flow FF and the evaluation unit on the second sensor chip CHP2 is ensured.
  • FIG. 3 shows the mass flow sensor LMM with the wall W in cross section.
  • the wall W is not in contact with the at least one second electrical line CP2 of the sensor carrier element LF or with the sensor carrier element LF.
  • the wall W is preferably in contact with a side of the wall W in contact with an end face FS of the first sensor chip CHPl.
  • the front side FS faces the second sensor chip CHP2.
  • the first sensor chip CHP1, in particular the front side FS of the first sensor chip CHP1 forms with the wall W the media separation between the first and second sensor chips CHP1, CHP2.

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Volume Flow (AREA)
  • Combined Controls Of Internal Combustion Engines (AREA)

Abstract

L’invention concerne un capteur de débit massique (LMM) qui présente au moins un élément de détection (SU). Le capteur de débit massique (LMM) présente en outre une puce de capteur (CHP1) qui présente une première et une deuxième face de puce (CHP1_1, CHP1_2) opposées. Ledit élément de détection (SU) est disposé sur la première face de puce (CHP1_1) et au moins un contact électrique (SP) est disposé sur la deuxième face de puce (CHP1_2). Ledit contact électrique (SP) est relié électriquement audit élément de détection (SU) au moyen d’au moins une liaison électrique (CPl, V, SCP). Le capteur de débit massique (LMM) présente un élément porteur de capteur (LF) qui présente au moins une ligne électrique (CP2) et au moins une zone de contact électrique (CA), laquelle est reliée électriquement avec ladite ligne électrique (CP2). La puce de capteur (CHP1) est disposée sur l’élément porteur de capteur (LF) de telle sorte que ledit contact électrique (SP) sur la deuxième face de puce (CHP1_2) de la puce de capteur (CHP1) est relié électriquement avec ladite zone de contact électrique (CA) de l’élément porteur de capteur (LF).
PCT/EP2009/063980 2008-11-06 2009-10-23 Capteur de débit massique et véhicule automobile doté du capteur de débit massique WO2010052138A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2009801444011A CN102209885B (zh) 2008-11-06 2009-10-23 质量流传感器和具有质量流传感器的机动车
JP2011535070A JP5312603B2 (ja) 2008-11-06 2009-10-23 マスフローセンサおよびマスフローセンサを備えた自動車
EP09745007A EP2356409A1 (fr) 2008-11-06 2009-10-23 Capteur de débit massique et véhicule automobile doté du capteur de débit massique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008056198.3 2008-11-06
DE102008056198.3A DE102008056198B4 (de) 2008-11-06 2008-11-06 Massenstromsensor und Kraftfahrzeug mit dem Massenstromsensor

Publications (1)

Publication Number Publication Date
WO2010052138A1 true WO2010052138A1 (fr) 2010-05-14

Family

ID=41786168

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/063980 WO2010052138A1 (fr) 2008-11-06 2009-10-23 Capteur de débit massique et véhicule automobile doté du capteur de débit massique

Country Status (6)

Country Link
EP (1) EP2356409A1 (fr)
JP (1) JP5312603B2 (fr)
KR (1) KR101642142B1 (fr)
CN (1) CN102209885B (fr)
DE (1) DE102008056198B4 (fr)
WO (1) WO2010052138A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5743922B2 (ja) * 2012-02-21 2015-07-01 日立オートモティブシステムズ株式会社 熱式空気流量測定装置
DE102013215522A1 (de) * 2013-08-07 2015-02-12 Robert Bosch Gmbh Sensorvorrichtung zur Bestimmung wenigstens eines Parameters eines durch einen Kanal strömenden fluiden Mediums

Citations (6)

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Publication number Priority date Publication date Assignee Title
DE4219454C2 (de) 1992-06-13 1995-09-28 Bosch Gmbh Robert Massenflußsensor
DE19724659A1 (de) 1996-06-12 1997-12-18 Unisia Jecs Corp Vorrichtung zum Messen einer Gasflußrate
US20020148289A1 (en) 2001-03-30 2002-10-17 Toshiki Isogai Fluid flow sensor and method of fabricating the same
WO2005029008A2 (fr) 2003-09-22 2005-03-31 Robert Bosch Gmbh Capteur massique d'air a film chaud comportant des contacts traversants sur la puce de capteur
DE10350551A1 (de) 2003-10-29 2005-06-02 Robert Bosch Gmbh Aufbau- und Verbindungstechnik für Sensoren
DE102006060978A1 (de) 2006-12-20 2008-07-03 Ifm Electronic Gmbh SMD-Bauelement

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JPS60230020A (ja) * 1984-04-28 1985-11-15 Toyota Motor Corp 感熱抵抗型流量検出装置
JPH05231898A (ja) * 1992-02-25 1993-09-07 Aisan Ind Co Ltd 感熱抵抗型検出器とその製造方法
JPH06230020A (ja) * 1993-01-29 1994-08-19 Ono Sokki Co Ltd 速度計
WO2003063258A1 (fr) * 2002-01-24 2003-07-31 Mitsubishi Denki Kabushiki Kaisha Dispositif semi-conducteur
DE102005038598A1 (de) * 2005-08-16 2007-02-22 Robert Bosch Gmbh Heißfilmluftmassenmesser mit Strömungsablösungselement
JP2007322320A (ja) * 2006-06-02 2007-12-13 Yazaki Corp フローセンサ及びその製造方法
JP4882732B2 (ja) * 2006-12-22 2012-02-22 株式会社デンソー 半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4219454C2 (de) 1992-06-13 1995-09-28 Bosch Gmbh Robert Massenflußsensor
DE19724659A1 (de) 1996-06-12 1997-12-18 Unisia Jecs Corp Vorrichtung zum Messen einer Gasflußrate
US20020148289A1 (en) 2001-03-30 2002-10-17 Toshiki Isogai Fluid flow sensor and method of fabricating the same
WO2005029008A2 (fr) 2003-09-22 2005-03-31 Robert Bosch Gmbh Capteur massique d'air a film chaud comportant des contacts traversants sur la puce de capteur
DE10350551A1 (de) 2003-10-29 2005-06-02 Robert Bosch Gmbh Aufbau- und Verbindungstechnik für Sensoren
DE102006060978A1 (de) 2006-12-20 2008-07-03 Ifm Electronic Gmbh SMD-Bauelement

Non-Patent Citations (1)

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Title
See also references of EP2356409A1 *

Also Published As

Publication number Publication date
CN102209885B (zh) 2013-12-11
JP2012507730A (ja) 2012-03-29
KR20110082045A (ko) 2011-07-15
EP2356409A1 (fr) 2011-08-17
CN102209885A (zh) 2011-10-05
KR101642142B1 (ko) 2016-07-22
DE102008056198B4 (de) 2015-02-19
DE102008056198A1 (de) 2010-05-20
JP5312603B2 (ja) 2013-10-09

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