WO2010046392A3 - Electrochemical coating method - Google Patents

Electrochemical coating method Download PDF

Info

Publication number
WO2010046392A3
WO2010046392A3 PCT/EP2009/063793 EP2009063793W WO2010046392A3 WO 2010046392 A3 WO2010046392 A3 WO 2010046392A3 EP 2009063793 W EP2009063793 W EP 2009063793W WO 2010046392 A3 WO2010046392 A3 WO 2010046392A3
Authority
WO
WIPO (PCT)
Prior art keywords
deposition
sequence
coating method
electrochemical coating
individual
Prior art date
Application number
PCT/EP2009/063793
Other languages
German (de)
French (fr)
Other versions
WO2010046392A2 (en
Inventor
Selma Hansal
Martina Halmdienst
Wolfgang Hansal
Original Assignee
Happy Plating Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Happy Plating Gmbh filed Critical Happy Plating Gmbh
Priority to EP09740674A priority Critical patent/EP2342371A2/en
Publication of WO2010046392A2 publication Critical patent/WO2010046392A2/en
Publication of WO2010046392A3 publication Critical patent/WO2010046392A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Fuel Cell (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Abstract

The invention relates to an electrochemical coating method for depositing at least one layer on at least one work piece in a deposition bath, comprising at least one deposition sequence (P) that is repeated at least once, wherein provided within the at least one deposition sequence (P) are at least two individual sequences (A, B, C), and each individual sequence (A, B, C) comprises a specific deposition method, and the at least two individual sequences (A, B, C) comprise different deposition methods within a deposition sequence (P).
PCT/EP2009/063793 2008-10-23 2009-10-21 Electrochemical coating method WO2010046392A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP09740674A EP2342371A2 (en) 2008-10-23 2009-10-21 Electrochemical coating method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0166108A AT506583B9 (en) 2008-10-23 2008-10-23 ELECTROCHEMICAL COATING PROCESS
ATA1661/2008 2008-10-23

Publications (2)

Publication Number Publication Date
WO2010046392A2 WO2010046392A2 (en) 2010-04-29
WO2010046392A3 true WO2010046392A3 (en) 2010-07-15

Family

ID=41137170

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/063793 WO2010046392A2 (en) 2008-10-23 2009-10-21 Electrochemical coating method

Country Status (3)

Country Link
EP (1) EP2342371A2 (en)
AT (1) AT506583B9 (en)
WO (1) WO2010046392A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3103897A1 (en) 2015-06-11 2016-12-14 ThyssenKrupp Steel Europe AG Method for the electrochemical deposition of thin inorganic layers
DE102015217815A1 (en) 2015-09-17 2017-03-23 Robert Bosch Gmbh Method for operating a battery cell
DE102016105168A1 (en) * 2016-03-21 2017-09-21 Allectra GmbH Connecting element for gas-tight connection with other components for piping systems

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869971A (en) * 1986-05-22 1989-09-26 Nee Chin Cheng Multilayer pulsed-current electrodeposition process
WO2003083181A2 (en) * 2002-03-27 2003-10-09 Isle Coat Limited Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
WO2006065220A1 (en) * 2004-12-14 2006-06-22 Polymer Kompositer I Göteborg Ab Pulse-plating method and apparatus
WO2006082218A1 (en) * 2005-02-04 2006-08-10 Siemens Aktiengesellschaft Surface comprising a microstructure that reduces wettability and method for the production thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4511438A (en) * 1983-04-05 1985-04-16 Harris Corporation Bi-metallic electroforming technique
GB2230537B (en) 1989-03-28 1993-12-08 Usui Kokusai Sangyo Kk Heat and corrosion resistant plating
JP2000173949A (en) 1998-12-09 2000-06-23 Fujitsu Ltd Semiconductor device, its manufacture, and plating method and device
JP3594894B2 (en) 2000-02-01 2004-12-02 新光電気工業株式会社 Via filling plating method
CA2365749A1 (en) 2001-12-20 2003-06-20 The Governors Of The University Of Alberta An electrodeposition process and a layered composite material produced thereby
EP1526192A1 (en) * 2003-10-24 2005-04-27 Siemens Aktiengesellschaft Electrolytic process for depositing a graded layer on a substrate and component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869971A (en) * 1986-05-22 1989-09-26 Nee Chin Cheng Multilayer pulsed-current electrodeposition process
WO2003083181A2 (en) * 2002-03-27 2003-10-09 Isle Coat Limited Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
WO2006065220A1 (en) * 2004-12-14 2006-06-22 Polymer Kompositer I Göteborg Ab Pulse-plating method and apparatus
WO2006082218A1 (en) * 2005-02-04 2006-08-10 Siemens Aktiengesellschaft Surface comprising a microstructure that reduces wettability and method for the production thereof

Also Published As

Publication number Publication date
AT506583B1 (en) 2009-10-15
EP2342371A2 (en) 2011-07-13
WO2010046392A2 (en) 2010-04-29
AT506583A4 (en) 2009-10-15
AT506583B9 (en) 2009-12-15

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