WO2010039358A3 - Caloduc en céramique avec mèche en céramique poreuse - Google Patents
Caloduc en céramique avec mèche en céramique poreuse Download PDFInfo
- Publication number
- WO2010039358A3 WO2010039358A3 PCT/US2009/054846 US2009054846W WO2010039358A3 WO 2010039358 A3 WO2010039358 A3 WO 2010039358A3 US 2009054846 W US2009054846 W US 2009054846W WO 2010039358 A3 WO2010039358 A3 WO 2010039358A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ceramic
- heat pipe
- wick
- heat
- extends
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title abstract 6
- 229910010293 ceramic material Inorganic materials 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- H01L33/64—
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Porous Artificial Stone Or Porous Ceramic Products (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009801384650A CN102171819A (zh) | 2008-09-30 | 2009-08-25 | 具有多孔陶瓷芯的陶瓷热管 |
JP2011529054A JP2012504339A (ja) | 2008-09-30 | 2009-08-25 | 多孔性セラミック芯を有するセラミックヒートパイプ |
EP09818180.3A EP2332172A4 (fr) | 2008-09-30 | 2009-08-25 | Caloduc en ceramique avec meche en ceramique poreuse |
CA2738072A CA2738072A1 (fr) | 2008-09-30 | 2009-08-25 | Caloduc en ceramique avec meche en ceramique poreuse |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/242,051 | 2008-09-30 | ||
US12/242,051 US20100078151A1 (en) | 2008-09-30 | 2008-09-30 | Ceramic heat pipe with porous ceramic wick |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2010039358A2 WO2010039358A2 (fr) | 2010-04-08 |
WO2010039358A3 true WO2010039358A3 (fr) | 2010-05-27 |
WO2010039358A8 WO2010039358A8 (fr) | 2011-04-21 |
Family
ID=42056134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/054846 WO2010039358A2 (fr) | 2008-09-30 | 2009-08-25 | Caloduc en céramique avec mèche en céramique poreuse |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100078151A1 (fr) |
EP (1) | EP2332172A4 (fr) |
JP (1) | JP2012504339A (fr) |
KR (1) | KR20110063844A (fr) |
CN (1) | CN102171819A (fr) |
CA (1) | CA2738072A1 (fr) |
WO (1) | WO2010039358A2 (fr) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5417338B2 (ja) * | 2007-10-31 | 2014-02-12 | ラム リサーチ コーポレーション | 冷却液と構成部品本体との間の熱伝導性を制御するためにガス圧を使用する温度制御モジュール及び温度制御方法 |
CN101552212B (zh) * | 2008-04-02 | 2011-01-12 | 展晶科技(深圳)有限公司 | 半导体元件与热管的接合方法 |
CN101865370B (zh) * | 2009-04-16 | 2013-08-07 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
US9603233B2 (en) | 2010-11-11 | 2017-03-21 | Schlumberger Technology Corporation | Particle accelerator with a heat pipe supporting components of a high voltage power supply |
TWI465678B (zh) * | 2011-08-29 | 2014-12-21 | Asia Vital Components Co Ltd | 均溫板結構及其製造方法 |
US11765861B2 (en) * | 2011-10-17 | 2023-09-19 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
US20190271510A1 (en) * | 2011-10-17 | 2019-09-05 | Asia Vital Components Co., Ltd. | Manufacturing method of vapor chamber |
CN103292629A (zh) * | 2012-03-01 | 2013-09-11 | 欧司朗股份有限公司 | 热管及其制造方法 |
US9018022B2 (en) | 2012-09-24 | 2015-04-28 | Lam Research Corporation | Showerhead electrode assembly in a capacitively coupled plasma processing apparatus |
CN102881663A (zh) * | 2012-09-29 | 2013-01-16 | 江苏宏微科技股份有限公司 | 带散热功能的覆金属陶瓷基板 |
CN102867788B (zh) * | 2012-09-29 | 2016-03-02 | 江苏宏微科技股份有限公司 | 基于新型覆金属陶瓷基板的功率模块 |
WO2014170907A2 (fr) * | 2013-04-17 | 2014-10-23 | Venkata Sundereswar Rao Vempati | Générateur de vapeur sans pression écoénergétique |
US20150101192A1 (en) * | 2013-10-15 | 2015-04-16 | Hao Pai | Method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction |
JP5793551B2 (ja) * | 2013-12-09 | 2015-10-14 | 東芝三菱電機産業システム株式会社 | 水冷却フィン及び高電圧装置 |
US20150219406A1 (en) * | 2014-01-31 | 2015-08-06 | Asia Vital Components Co., Ltd. | Heat Dissipation Device |
CN106461168A (zh) * | 2014-05-22 | 2017-02-22 | 飞利浦照明控股有限公司 | 用于led照明应用的热‑光学外壳 |
US10578293B2 (en) | 2014-07-22 | 2020-03-03 | Signify Holding B.V. | Light source cooling body, light source assembly, a luminaire and method to manufacture a light source cooling or a light source assembly |
US9401468B2 (en) | 2014-12-24 | 2016-07-26 | GE Lighting Solutions, LLC | Lamp with LED chips cooled by a phase transformation loop |
WO2016137958A1 (fr) | 2015-02-23 | 2016-09-01 | Exotex, Inc. | Procédé et appareil de réalisation de tuyaux et de panneaux à l'aide d'un fil de fibre traité |
JP2018527760A (ja) * | 2015-08-26 | 2018-09-20 | シン サーマル エクスチェンジ ピーティーイー エルティーディー | 真空コア回路基板 |
WO2017053388A1 (fr) | 2015-09-21 | 2017-03-30 | Exotex, Inc. | Tuyaux d'isolation thermique |
DE102015221802A1 (de) * | 2015-11-06 | 2017-05-11 | Bayerische Motoren Werke Aktiengesellschaft | Rotationsmaschine und Kraftfahrzeug |
KR101810167B1 (ko) * | 2015-11-11 | 2017-12-19 | 전남대학교산학협력단 | 3차원 열흡수 장치 |
US10403792B2 (en) * | 2016-03-07 | 2019-09-03 | Rayvio Corporation | Package for ultraviolet emitting devices |
CN106066131B (zh) * | 2016-07-22 | 2019-03-12 | 中国科学院上海硅酸盐研究所 | 一种环路热管用多孔氮化硅毛细芯 |
CN106225535B (zh) * | 2016-07-22 | 2018-12-21 | 北京空间机电研究所 | 一种圆柱型环路热管毛细泵组件 |
WO2018208801A1 (fr) * | 2017-05-08 | 2018-11-15 | Kelvin Thermal Technologies, Inc. | Plans de gestion thermique |
US11300362B2 (en) | 2019-01-31 | 2022-04-12 | Toyota Motor Engineering & Manufacturing North America, Inc. | Hybrid evaporator-feeding wicks for uniform fluid delivery to multiple heat sources in a vapor chamber |
CN111504105B (zh) * | 2020-04-30 | 2022-01-18 | 北京工业大学 | 采用复相造孔剂造孔的热管或均热板用吸液芯及其制法 |
US11879690B2 (en) | 2020-05-06 | 2024-01-23 | Asia Vital Components (China) Co., Ltd. | Flexible wick structure and deformable heat-dissipating unit using the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH113893A (ja) * | 1997-06-13 | 1999-01-06 | Orion Mach Co Ltd | 半導体基板の温度調節装置 |
JP2001165584A (ja) * | 1999-12-02 | 2001-06-22 | Tokai Rubber Ind Ltd | シート状ヒートパイプ |
US20050258438A1 (en) * | 2004-05-21 | 2005-11-24 | Gelcore, Llc | Light emitting diode apparatuses with heat pipes for thermal management |
US20080189948A1 (en) * | 2002-12-30 | 2008-08-14 | Jurgen Schulz-Harder | Heat sink in the form of a heat pipe and process for manufacturing such a heat sink |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2350348A (en) * | 1942-12-21 | 1944-06-06 | Gen Motors Corp | Heat transfer device |
GB1027719A (fr) * | 1963-12-02 | |||
US3563309A (en) * | 1968-09-16 | 1971-02-16 | Hughes Aircraft Co | Heat pipe having improved dielectric strength |
LU66369A1 (fr) * | 1972-10-26 | 1973-01-23 | ||
CA1066964A (fr) * | 1976-09-28 | 1979-11-27 | Edna A. Dancy | Fabrication de caloducs en ceramique |
US4274479A (en) * | 1978-09-21 | 1981-06-23 | Thermacore, Inc. | Sintered grooved wicks |
JPS5849607B2 (ja) * | 1979-04-09 | 1983-11-05 | 日本鋼管株式会社 | 非融着型二重冷却管を備えたク−リングステ−ブ |
JPS5825248A (ja) * | 1982-07-12 | 1983-02-15 | Ngk Spark Plug Co Ltd | 電子部品のセラミック基板用ヒ−トシンクの製造方法 |
US4701739A (en) * | 1984-03-30 | 1987-10-20 | Figaro Engineering Inc. | Exhaust gas sensor and process for producing same |
US5587228A (en) * | 1985-02-05 | 1996-12-24 | The Boeing Company | Microparticle enhanced fibrous ceramics |
DE3504992A1 (de) * | 1985-02-14 | 1986-08-14 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul mit integriertem waermerohr |
US4885129A (en) * | 1988-10-24 | 1989-12-05 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks |
US4883116A (en) * | 1989-01-31 | 1989-11-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ceramic heat pipe wick |
JP2583343B2 (ja) * | 1990-06-12 | 1997-02-19 | 株式会社フジクラ | ヒートパイプ式電子部品冷却器 |
US5386143A (en) * | 1991-10-25 | 1995-01-31 | Digital Equipment Corporation | High performance substrate, electronic package and integrated circuit cooling process |
JP2002327993A (ja) * | 2001-05-01 | 2002-11-15 | Fujitsu Ltd | 薄型ヒートパイプ、薄型ヒートシンク、熱制御システムおよび薄型ヒートパイプの製造方法 |
US20020185726A1 (en) * | 2001-06-06 | 2002-12-12 | North Mark T. | Heat pipe thermal management of high potential electronic chip packages |
JP2003171656A (ja) * | 2001-12-03 | 2003-06-20 | Mitsubishi Electric Corp | ヒートパイプ用作動流体およびヒートパイプの製造方法 |
JP4194276B2 (ja) * | 2002-01-25 | 2008-12-10 | 株式会社フジクラ | 平板型ヒートパイプ |
JP2003343987A (ja) * | 2002-05-24 | 2003-12-03 | Mitsubishi Electric Corp | ウイック構造体の製造方法 |
US7007863B2 (en) * | 2002-10-08 | 2006-03-07 | S.C. Johnson & Son, Inc. | Wick-based delivery system with wick made of different composite materials |
US6945317B2 (en) * | 2003-04-24 | 2005-09-20 | Thermal Corp. | Sintered grooved wick with particle web |
US6994152B2 (en) * | 2003-06-26 | 2006-02-07 | Thermal Corp. | Brazed wick for a heat transfer device |
KR100795753B1 (ko) * | 2006-06-26 | 2008-01-21 | (주)셀시아테크놀러지스한국 | 판형 열전달장치 및 그것의 제조 방법 |
DE202006019275U1 (de) * | 2006-12-21 | 2007-05-24 | Schmid, Christoph | Wärmerohr |
JP2008218513A (ja) * | 2007-02-28 | 2008-09-18 | Fujikura Ltd | 冷却装置 |
-
2008
- 2008-09-30 US US12/242,051 patent/US20100078151A1/en not_active Abandoned
-
2009
- 2009-08-25 WO PCT/US2009/054846 patent/WO2010039358A2/fr active Application Filing
- 2009-08-25 KR KR1020117009691A patent/KR20110063844A/ko not_active Application Discontinuation
- 2009-08-25 CN CN2009801384650A patent/CN102171819A/zh active Pending
- 2009-08-25 EP EP09818180.3A patent/EP2332172A4/fr not_active Withdrawn
- 2009-08-25 CA CA2738072A patent/CA2738072A1/fr not_active Abandoned
- 2009-08-25 JP JP2011529054A patent/JP2012504339A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH113893A (ja) * | 1997-06-13 | 1999-01-06 | Orion Mach Co Ltd | 半導体基板の温度調節装置 |
JP2001165584A (ja) * | 1999-12-02 | 2001-06-22 | Tokai Rubber Ind Ltd | シート状ヒートパイプ |
US20080189948A1 (en) * | 2002-12-30 | 2008-08-14 | Jurgen Schulz-Harder | Heat sink in the form of a heat pipe and process for manufacturing such a heat sink |
US20050258438A1 (en) * | 2004-05-21 | 2005-11-24 | Gelcore, Llc | Light emitting diode apparatuses with heat pipes for thermal management |
Also Published As
Publication number | Publication date |
---|---|
US20100078151A1 (en) | 2010-04-01 |
KR20110063844A (ko) | 2011-06-14 |
EP2332172A2 (fr) | 2011-06-15 |
EP2332172A4 (fr) | 2013-10-09 |
WO2010039358A2 (fr) | 2010-04-08 |
CA2738072A1 (fr) | 2010-04-08 |
CN102171819A (zh) | 2011-08-31 |
WO2010039358A8 (fr) | 2011-04-21 |
JP2012504339A (ja) | 2012-02-16 |
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