WO2010006589A4 - Laser-scribing-system zum strukturieren von substraten für dünnschichtsolarmodule - Google Patents
Laser-scribing-system zum strukturieren von substraten für dünnschichtsolarmodule Download PDFInfo
- Publication number
- WO2010006589A4 WO2010006589A4 PCT/DE2009/000985 DE2009000985W WO2010006589A4 WO 2010006589 A4 WO2010006589 A4 WO 2010006589A4 DE 2009000985 W DE2009000985 W DE 2009000985W WO 2010006589 A4 WO2010006589 A4 WO 2010006589A4
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- planar
- scribing
- laser
- rotor
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract 29
- 238000003754 machining Methods 0.000 claims abstract 4
- 230000003287 optical effect Effects 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims 15
- 230000007423 decrease Effects 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- 239000000835 fiber Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000013307 optical fiber Substances 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200980129523.3A CN102105259B (zh) | 2008-07-17 | 2009-07-14 | 用于构建用于薄层太阳能电池组件的基底的激光划切系统 |
US13/003,343 US8263902B2 (en) | 2008-07-17 | 2009-07-14 | Laser-scribing system for structuring substrates for thin layer solar modules |
DE112009001701T DE112009001701B4 (de) | 2008-07-17 | 2009-07-14 | Laser-Scribing-System zum Strukturieren von Substraten, Verfahren zum Strukturieren von Substraten und Verwendung eines Laser-Scribing-Systems |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008033610.6 | 2008-07-17 | ||
DE102008033610 | 2008-07-17 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2010006589A2 WO2010006589A2 (de) | 2010-01-21 |
WO2010006589A3 WO2010006589A3 (de) | 2010-03-11 |
WO2010006589A4 true WO2010006589A4 (de) | 2010-05-14 |
Family
ID=41395964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2009/000985 WO2010006589A2 (de) | 2008-07-17 | 2009-07-14 | Laser-scribing-system zum strukturieren von substraten für dünnschichtsolarmodule |
Country Status (4)
Country | Link |
---|---|
US (1) | US8263902B2 (de) |
CN (1) | CN102105259B (de) |
DE (2) | DE102008059813A1 (de) |
WO (1) | WO2010006589A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105414778B (zh) * | 2015-11-27 | 2017-08-04 | 中国电子科技集团公司第四十八研究所 | 一种用于微波组件的激光焊接对位方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101807529B (zh) * | 2010-03-04 | 2011-09-07 | 成都尚明工业有限公司 | 自动切片分离机 |
CN102825389A (zh) * | 2011-06-15 | 2012-12-19 | 吉富新能源科技(上海)有限公司 | 可提升太阳能电池转化效率的雷射划线定位技术方法 |
DE102011052444A1 (de) * | 2011-08-05 | 2013-02-07 | Jenoptik Automatisierungstechnik Gmbh | Verfahren zur linearen Strukturierung eines beschichteten Substrats zur Herstellung von Dünnschicht-Solarzellenmodulen |
TW201414561A (zh) * | 2012-06-20 | 2014-04-16 | Tel Solar Ag | 雷射劃線系統 |
US9076860B1 (en) * | 2014-04-04 | 2015-07-07 | Applied Materials, Inc. | Residue removal from singulated die sidewall |
US20150287638A1 (en) * | 2014-04-04 | 2015-10-08 | Jungrae Park | Hybrid wafer dicing approach using collimated laser scribing process and plasma etch |
DE102015104443A1 (de) * | 2015-03-24 | 2016-09-29 | Mauser-Werke Oberndorf Maschinenbau Gmbh | Werkzeugmaschine |
CN105149791B (zh) * | 2015-08-07 | 2017-03-08 | 武汉嘉铭激光有限公司 | 一种大幅面激光刻蚀系统及控制方法 |
CN110931383B (zh) * | 2018-09-19 | 2022-11-15 | 浙江曜创科技有限公司 | 一种用于半导体生产的划片装置及其划片方法 |
CN113193078B (zh) * | 2021-04-15 | 2023-04-25 | 山东交通学院 | 一种光伏电池片生产设备 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3816700A (en) * | 1971-10-21 | 1974-06-11 | Union Carbide Corp | Apparatus for facilitating laser scribing |
CN1024438C (zh) * | 1991-08-15 | 1994-05-04 | 中国科学院上海光学精密机械研究所 | 多功能激光调阻机 |
DE19541085C2 (de) | 1995-11-03 | 2000-03-30 | Heinz Peter Brandstetter | Bearbeitungsstand mit planaren elektromagnetischen Zwei-Koordinaten-Direktantrieben |
JP3455102B2 (ja) * | 1998-02-06 | 2003-10-14 | 三菱電機株式会社 | 半導体ウエハチップ分離方法 |
US6559411B2 (en) * | 2001-08-10 | 2003-05-06 | First Solar, Llc | Method and apparatus for laser scribing glass sheet substrate coatings |
FR2832945A1 (fr) * | 2001-11-30 | 2003-06-06 | Technifor | Dispositif d'usinage de pieces a l'aide d'un faisceau laser |
US7119351B2 (en) * | 2002-05-17 | 2006-10-10 | Gsi Group Corporation | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
CN100351703C (zh) * | 2002-06-12 | 2007-11-28 | Asml荷兰有限公司 | 光刻装置和器件的制造方法 |
WO2004067243A1 (ja) * | 2003-01-29 | 2004-08-12 | Mitsuboshi Diamond Industrial Co., Ltd. | 基板分断装置および基板分断方法 |
US7687740B2 (en) * | 2004-06-18 | 2010-03-30 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows |
GB2439962B (en) * | 2006-06-14 | 2008-09-24 | Exitech Ltd | Process and apparatus for laser scribing |
GB0622232D0 (en) | 2006-11-08 | 2006-12-20 | Rumsby Philip T | Method and apparatus for laser beam alignment for solar panel scribing |
US20080263877A1 (en) * | 2007-04-24 | 2008-10-30 | Newport Corporation | Laser scribing system and method of use |
-
2008
- 2008-12-01 DE DE102008059813A patent/DE102008059813A1/de not_active Withdrawn
-
2009
- 2009-07-14 DE DE112009001701T patent/DE112009001701B4/de not_active Expired - Fee Related
- 2009-07-14 WO PCT/DE2009/000985 patent/WO2010006589A2/de active Application Filing
- 2009-07-14 CN CN200980129523.3A patent/CN102105259B/zh not_active Expired - Fee Related
- 2009-07-14 US US13/003,343 patent/US8263902B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105414778B (zh) * | 2015-11-27 | 2017-08-04 | 中国电子科技集团公司第四十八研究所 | 一种用于微波组件的激光焊接对位方法 |
Also Published As
Publication number | Publication date |
---|---|
US8263902B2 (en) | 2012-09-11 |
DE102008059813A1 (de) | 2010-01-21 |
WO2010006589A3 (de) | 2010-03-11 |
US20110111576A1 (en) | 2011-05-12 |
WO2010006589A2 (de) | 2010-01-21 |
CN102105259A (zh) | 2011-06-22 |
DE112009001701A5 (de) | 2011-04-21 |
CN102105259B (zh) | 2014-07-02 |
DE112009001701B4 (de) | 2012-06-21 |
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