DE112009001701A5 - Laser-Scribing-System zum Strukturieren von Substraten für Dünnschichtsolarmodule - Google Patents

Laser-Scribing-System zum Strukturieren von Substraten für Dünnschichtsolarmodule Download PDF

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Publication number
DE112009001701A5
DE112009001701A5 DE112009001701T DE112009001701T DE112009001701A5 DE 112009001701 A5 DE112009001701 A5 DE 112009001701A5 DE 112009001701 T DE112009001701 T DE 112009001701T DE 112009001701 T DE112009001701 T DE 112009001701T DE 112009001701 A5 DE112009001701 A5 DE 112009001701A5
Authority
DE
Germany
Prior art keywords
laser
thin
film solar
solar modules
scribing system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112009001701T
Other languages
English (en)
Other versions
DE112009001701B4 (de
Inventor
Johann Peter Dr. Ing. Feraric'
Rüdiger Dr. Hack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE112009001701A5 publication Critical patent/DE112009001701A5/de
Application granted granted Critical
Publication of DE112009001701B4 publication Critical patent/DE112009001701B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Photovoltaic Devices (AREA)
DE112009001701T 2008-07-17 2009-07-14 Laser-Scribing-System zum Strukturieren von Substraten, Verfahren zum Strukturieren von Substraten und Verwendung eines Laser-Scribing-Systems Expired - Fee Related DE112009001701B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008033610 2008-07-17
DE102008033610.6 2008-07-17
PCT/DE2009/000985 WO2010006589A2 (de) 2008-07-17 2009-07-14 Laser-scribing-system zum strukturieren von substraten für dünnschichtsolarmodule

Publications (2)

Publication Number Publication Date
DE112009001701A5 true DE112009001701A5 (de) 2011-04-21
DE112009001701B4 DE112009001701B4 (de) 2012-06-21

Family

ID=41395964

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102008059813A Withdrawn DE102008059813A1 (de) 2008-07-17 2008-12-01 Laser-Scribing-System zum Strukturieren von Substraten für Dünnschichtsolarmodule
DE112009001701T Expired - Fee Related DE112009001701B4 (de) 2008-07-17 2009-07-14 Laser-Scribing-System zum Strukturieren von Substraten, Verfahren zum Strukturieren von Substraten und Verwendung eines Laser-Scribing-Systems

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102008059813A Withdrawn DE102008059813A1 (de) 2008-07-17 2008-12-01 Laser-Scribing-System zum Strukturieren von Substraten für Dünnschichtsolarmodule

Country Status (4)

Country Link
US (1) US8263902B2 (de)
CN (1) CN102105259B (de)
DE (2) DE102008059813A1 (de)
WO (1) WO2010006589A2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101807529B (zh) * 2010-03-04 2011-09-07 成都尚明工业有限公司 自动切片分离机
CN102825389A (zh) * 2011-06-15 2012-12-19 吉富新能源科技(上海)有限公司 可提升太阳能电池转化效率的雷射划线定位技术方法
DE102011052444A1 (de) * 2011-08-05 2013-02-07 Jenoptik Automatisierungstechnik Gmbh Verfahren zur linearen Strukturierung eines beschichteten Substrats zur Herstellung von Dünnschicht-Solarzellenmodulen
WO2013189605A2 (en) * 2012-06-20 2013-12-27 Tel Solar Ag Laser scribing system
US9076860B1 (en) * 2014-04-04 2015-07-07 Applied Materials, Inc. Residue removal from singulated die sidewall
US20150287638A1 (en) * 2014-04-04 2015-10-08 Jungrae Park Hybrid wafer dicing approach using collimated laser scribing process and plasma etch
DE102015104443A1 (de) * 2015-03-24 2016-09-29 Mauser-Werke Oberndorf Maschinenbau Gmbh Werkzeugmaschine
CN105149791B (zh) * 2015-08-07 2017-03-08 武汉嘉铭激光有限公司 一种大幅面激光刻蚀系统及控制方法
CN105414778B (zh) * 2015-11-27 2017-08-04 中国电子科技集团公司第四十八研究所 一种用于微波组件的激光焊接对位方法
CN110931383B (zh) * 2018-09-19 2022-11-15 浙江曜创科技有限公司 一种用于半导体生产的划片装置及其划片方法
CN113193078B (zh) * 2021-04-15 2023-04-25 山东交通学院 一种光伏电池片生产设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3816700A (en) * 1971-10-21 1974-06-11 Union Carbide Corp Apparatus for facilitating laser scribing
CN1024438C (zh) * 1991-08-15 1994-05-04 中国科学院上海光学精密机械研究所 多功能激光调阻机
DE19541085C2 (de) * 1995-11-03 2000-03-30 Heinz Peter Brandstetter Bearbeitungsstand mit planaren elektromagnetischen Zwei-Koordinaten-Direktantrieben
JP3455102B2 (ja) * 1998-02-06 2003-10-14 三菱電機株式会社 半導体ウエハチップ分離方法
US6559411B2 (en) * 2001-08-10 2003-05-06 First Solar, Llc Method and apparatus for laser scribing glass sheet substrate coatings
FR2832945A1 (fr) * 2001-11-30 2003-06-06 Technifor Dispositif d'usinage de pieces a l'aide d'un faisceau laser
US20040144760A1 (en) * 2002-05-17 2004-07-29 Cahill Steven P. Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein
TWI248559B (en) * 2002-06-12 2006-02-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN101585656B (zh) * 2003-01-29 2012-03-21 三星宝石工业株式会社 基板切割设备和基板切割方法
US7687740B2 (en) * 2004-06-18 2010-03-30 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
GB2439962B (en) * 2006-06-14 2008-09-24 Exitech Ltd Process and apparatus for laser scribing
GB0622232D0 (en) 2006-11-08 2006-12-20 Rumsby Philip T Method and apparatus for laser beam alignment for solar panel scribing
US20080263877A1 (en) 2007-04-24 2008-10-30 Newport Corporation Laser scribing system and method of use

Also Published As

Publication number Publication date
CN102105259A (zh) 2011-06-22
WO2010006589A2 (de) 2010-01-21
US20110111576A1 (en) 2011-05-12
CN102105259B (zh) 2014-07-02
DE112009001701B4 (de) 2012-06-21
WO2010006589A3 (de) 2010-03-11
DE102008059813A1 (de) 2010-01-21
WO2010006589A4 (de) 2010-05-14
US8263902B2 (en) 2012-09-11

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Effective date: 20110407

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee