WO2010002157A3 - Ｌｅｄ를 이용한 등기구용 방열장치 - Google Patents

Ｌｅｄ를 이용한 등기구용 방열장치 Download PDF

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Publication number
WO2010002157A3
WO2010002157A3 PCT/KR2009/003513 KR2009003513W WO2010002157A3 WO 2010002157 A3 WO2010002157 A3 WO 2010002157A3 KR 2009003513 W KR2009003513 W KR 2009003513W WO 2010002157 A3 WO2010002157 A3 WO 2010002157A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipating
dissipating device
lamp
heat
leds
Prior art date
Application number
PCT/KR2009/003513
Other languages
English (en)
French (fr)
Other versions
WO2010002157A2 (ko
Inventor
이동석
Original Assignee
주식회사 미광엔비텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 미광엔비텍 filed Critical 주식회사 미광엔비텍
Publication of WO2010002157A2 publication Critical patent/WO2010002157A2/ko
Publication of WO2010002157A3 publication Critical patent/WO2010002157A3/ko

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

본 발명에 따르면, LED를 이용한 등기구용 방열장치가 개시된다. 개시된 LED를 이용한 등기구용 방열장치는, LED 모듈을 포함한 등기구로부터 발생하는 열을 방출시키기 위한 것으로서, 일측부에 LED 모듈을 고정하고, 밀폐된 내부공간을 형성하는 몸체부; LED 모듈의 배면에 인접하도록 몸체부 내에 설치되어 LED 모듈로부터 발생한 열을 전달받고, 대략 L의 형상을 갖는 열전달부; 몸체부의 밀폐된 내부공간에 채워져 열전달부로부터 열을 전달받는 열전도성의 냉매: 및 몸체부 내의 냉매 속에 설치되어 온도차에 의해 상승하는 냉매의 순환대류를 유도하는 순환유도부를 구비한다. 이와 같은 LED를 이용한 등기구용 방열장치에 의하면, 별도의 전원이나 추가적인 보조장치를 구비하지 않고도 자연대류 방식의 간단한 구조를 채용함으로써 고효율의 열방출 효과를 얻을 수 있으며, 내구성 측면에서도 반영구적으로 사용이 가능하다. 또한 다양한 형태의 디자인 변형이 가능하므로 복잡하고 다양한 형태로 변화하는 등기구 변화에 대해서도 능동적이고 탄력적으로 대응이 가능하다.
PCT/KR2009/003513 2008-07-04 2009-06-29 Ｌｅｄ를 이용한 등기구용 방열장치 WO2010002157A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0064691 2008-07-04
KR1020080064691A KR100932430B1 (ko) 2008-07-04 2008-07-04 Ｌｅｄ를 이용한 등기구용 방열장치

Publications (2)

Publication Number Publication Date
WO2010002157A2 WO2010002157A2 (ko) 2010-01-07
WO2010002157A3 true WO2010002157A3 (ko) 2010-04-01

Family

ID=41466440

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/003513 WO2010002157A2 (ko) 2008-07-04 2009-06-29 Ｌｅｄ를 이용한 등기구용 방열장치

Country Status (2)

Country Link
KR (1) KR100932430B1 (ko)
WO (1) WO2010002157A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101228889B1 (ko) 2010-08-24 2013-02-06 티티엠주식회사 엘이디 패키지 방열용 원바디타입 나노유체 베이퍼챔버
CN107726136A (zh) * 2017-10-12 2018-02-23 泉州市泉港鑫林机械科技有限公司 一种适用于高功率蓝牙控制的主动散热型led灯装置
KR102534824B1 (ko) 2023-03-06 2023-05-18 박용균 밀폐형 led제품의 과열방지 구조

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040184284A1 (en) * 2003-03-07 2004-09-23 Buelow Roger F. Light appliance and cooling arrangement
KR100646198B1 (ko) * 2005-01-25 2006-11-14 엘지전자 주식회사 엘이디 패키지의 열 방출 구조 및 그 구조를 구비한엘이디 패키지
KR100708124B1 (ko) * 2005-02-07 2007-04-16 삼성전자주식회사 수냉식 냉각구조를 채용한 조명유니트
KR200438525Y1 (ko) * 2007-09-10 2008-02-26 티엠컨버전스주식회사 비전도성 액체를 이용한 엘이디 광원체의 냉각장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100766564B1 (ko) * 2004-04-10 2007-10-11 엘지전자 주식회사 방열장치
KR200389520Y1 (ko) 2005-04-06 2005-07-14 다테크 테크놀러지 코 엘티디 대칭식 열 파이프를 구비한 방열모듈구조
KR20080003545U (ko) * 2007-02-22 2008-08-27 광성전기산업(주) 교류 전원용 발광 다이오드 모듈을 구비한 공랭식 조명장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040184284A1 (en) * 2003-03-07 2004-09-23 Buelow Roger F. Light appliance and cooling arrangement
KR100646198B1 (ko) * 2005-01-25 2006-11-14 엘지전자 주식회사 엘이디 패키지의 열 방출 구조 및 그 구조를 구비한엘이디 패키지
KR100708124B1 (ko) * 2005-02-07 2007-04-16 삼성전자주식회사 수냉식 냉각구조를 채용한 조명유니트
KR200438525Y1 (ko) * 2007-09-10 2008-02-26 티엠컨버전스주식회사 비전도성 액체를 이용한 엘이디 광원체의 냉각장치

Also Published As

Publication number Publication date
WO2010002157A2 (ko) 2010-01-07
KR100932430B1 (ko) 2009-12-17

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