WO2010001831A1 - Organic el panel and process for producing organic el panel - Google Patents

Organic el panel and process for producing organic el panel Download PDF

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Publication number
WO2010001831A1
WO2010001831A1 PCT/JP2009/061734 JP2009061734W WO2010001831A1 WO 2010001831 A1 WO2010001831 A1 WO 2010001831A1 JP 2009061734 W JP2009061734 W JP 2009061734W WO 2010001831 A1 WO2010001831 A1 WO 2010001831A1
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Prior art keywords
sealing
substrate
sealing material
organic el
el panel
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PCT/JP2009/061734
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French (fr)
Japanese (ja)
Inventor
真昭 村山
源田 和男
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コニカミノルタホールディングス株式会社
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Priority to JP2008-175478 priority Critical
Priority to JP2008175478 priority
Application filed by コニカミノルタホールディングス株式会社 filed Critical コニカミノルタホールディングス株式会社
Publication of WO2010001831A1 publication Critical patent/WO2010001831A1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/5253Protective coatings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/524Sealing arrangements having a self-supporting structure, e.g. containers
    • H01L51/5243Sealing arrangements having a self-supporting structure, e.g. containers the sealing arrangements being made of metallic material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/524Sealing arrangements having a self-supporting structure, e.g. containers
    • H01L51/5246Sealing arrangements having a self-supporting structure, e.g. containers characterised by the peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
    • H01L51/52Details of devices
    • H01L51/529Arrangements for heating or cooling

Abstract

Disclosed is a solid sealing method that, in lamination through a sealing material, does not lead to such a defect that the sealing material is extended to contaminate an external electrode.  Also disclosed is a solid sealing method that can cope with multiple face (multiple pieces) obtainment in the production of organic EL.  The sealing method is used in a process for producing an organic EL panel, comprising laminating a sealing substrate through a sealing material onto a substrate, on which an organic EL element comprising at least a first electrode layer, an organic compound layer including a luminescent layer, and a second electrode layer has been formed, by face bonding to form an airtight sealing structure.  The sealing method is characterized by comprising placing a liquid sealing material on at least one of the substrate and the sealing substrate, temporarily curing only the sealing material of the outer peripheral part of the substrate and the sealing substrate to a viscosity of 50 Pa∙sec to 5000 Pa∙sec, stacking the substrate onto the sealing substrate, and further curing the whole sealing face of the sealing material to form an airtight sealing structure.

Description

Organic EL panel and method for manufacturing organic EL panel

The present invention relates to an organic EL panel, in which a substrate on which an organic EL element is formed is bonded to a sealing substrate through a sealing material and bonded to a surface to form a close-sealing structure. It relates to the stopping method. In particular, the present invention relates to a solid sealing method capable of stably sealing without defects such as void mixing and spreading of the sealing material.

In the organic EL panel, when the material and the light emitting element constituting the light emitting layer absorb moisture, the light emission luminance is significantly impaired. For this reason, it is necessary to reduce the humidity inside the organic EL element, and several means are provided to shield and protect the element from the outside air. For example, a casing-type method is disclosed in which a glass cap or a SUS can is bonded using an adhesive to create a secret space, and a desiccant is placed in the space to seal it.

In recent years, an adhesion type sealing method (solid sealing) has been disclosed in which an organic light emitting element on a substrate (entire surface) is sealed by liquid sealing with a liquid sealing material, and is thin and lightweight with excellent moisture resistance. It has been proposed as an organic EL element (for example, Patent Document 1). However, in the close contact type sealing method (solid sealing method), there are problems such as void mixing in the sealing material layer and wetting and spreading of the sealing material, and various studies have been made.

For example, when the substrate and the sealing substrate are bonded via a liquid sealing material, when the sealing material is applied, if the substrate spreads wet, the external electrodes arranged outside the light emitting region may be contaminated. . When contamination occurs, it is difficult to ensure electrical continuity from the outside, which may lead to a serious defect that the organic EL element cannot be driven.

For this reason, in Patent Document 2, in order to prevent the spread, a protective wall is provided so as to surround at least a single area around the external electrode region. However, it is necessary to newly arrange members, and there is a problem in terms of cost and process complexity.

Further, in Patent Document 3, an attempt is made to stabilize the bonding condition by the film thickness gradient of screen printing, but it has not yet reached a fundamental measure for preventing wetting and spreading.

In Patent Document 4, two kinds of peripheral sealing material and filling sealing material are used to prevent wetting and spreading. However, since two kinds of sealing agents are required, the cost increases and the process becomes complicated.

Also, in the manufacturing process of organic EL, in order to improve productivity, a plurality of elements are obtained from one large substrate, that is, multi-cavity (multi-cavity) is often performed. Also in this case, the sealing material arranged between the adjacent elements is pressure-bonded at the time of bonding, and the gap between the substrate and the sealing member diffuses randomly due to capillary action, so there is a possibility of contamination to the external electrode. To be high.

JP 2002-216950 A JP 2004-31226 A JP 2005-11648 A Japanese Patent No. 3650101

Therefore, the object of the present invention is to spread the organic EL element substrate and the sealing substrate through the sealing material, and when applying the liquid sealing material, this spreads and contaminates the external electrode disposed outside the light emitting region. Therefore, it is intended to provide a close-contact type sealing method (solid sealing) by surface bonding of a sealing material that does not cause a serious defect that the organic EL element cannot be driven. An object of the present invention is to provide a solid sealing method that can cope with chamfering (multiple chamfering).

The above object of the present invention is achieved by the following means.

1. At least a first electrode layer, an organic compound layer including a light emitting layer, and a substrate on which an organic EL element composed of a second electrode layer is formed. In the manufacturing method of the organic EL panel to be formed,
A liquid sealing material is disposed on at least one of the substrate and the sealing substrate, and only the sealing material on the outer peripheral portion of the substrate and the sealing substrate is temporarily cured so as to have a viscosity of 50 Pa · sec to 5000 Pa · sec. A method for producing an organic EL panel, comprising: bonding a substrate and a sealing substrate; and further curing the sealing material over the entire sealing surface to form an adhesion sealing structure.

2. A step of disposing a liquid first sealing material on at least one of the substrate and the sealing substrate, a step of disposing a liquid second sealing material similar to the first sealing material on an outer peripheral portion thereof, and the outer peripheral portion Including a temporary curing step in which only the second sealing material disposed on the substrate is cured to have a viscosity of 50 Pa · sec to 5000 Pa · sec. After the temporary curing step, the substrate and the sealing substrate are bonded together, 2. The method for producing an organic EL panel according to 1 above, further comprising a main curing step of curing the sealing material over the entire surface.

3. In the above 1 or 2, the bonding of the substrate and the sealing substrate is performed in a vacuum / depressurized environment, and the sealing material is cured on the entire sealing surface in an atmospheric pressure or a pressure environment higher than atmospheric pressure. The manufacturing method of the organic electroluminescent panel of description.

4. 4. The method for producing an organic EL panel according to any one of 1 to 3, wherein the viscosity of the sealing material before curing is 0.05 Pa · sec to 50 Pa · sec.

5. 5. The method for producing an organic EL panel according to any one of 1 to 4, wherein the viscosity of the sealing material when temporarily cured is 10 to 10,000 times that before the curing.

6. 6. The method for producing an organic EL panel according to any one of 1 to 5, wherein the sealing material is a thermosetting resin or a UV (ultraviolet) curable resin.

7. 7. An organic EL panel produced by using the method for producing an organic EL panel according to any one of 1 to 6 above.

According to the present invention, when the substrate and the sealing substrate are solid-sealed, there is no contamination of the external electrode due to voids or wetting and spreading of the liquid sealing material. Stop) can be provided.

It is a figure showing one of the embodiments of the present invention. It is a figure which shows another example of embodiment of this invention. It is a figure which shows embodiment which performs the sealing material arrangement | positioning to an internal region and an outer peripheral part simultaneously.

In the present invention, a substrate on which an organic electroluminescence (EL) element including at least a first electrode layer, an organic compound layer including a light emitting layer, and a second electrode layer is formed is bonded to a sealing substrate via a liquid sealing material. The present invention relates to a method for manufacturing an organic EL panel in which a close-sealed structure is formed by adhering to each other.

The manufacturing method of the present invention is a method for solid-sealing an organic EL panel, in which a liquid sealing material (adhesive) is disposed on at least one of a substrate on which each layer of an organic EL element is formed or a sealing substrate, Alternatively, the sealing material at the outer periphery of the sealing substrate is temporarily cured, and the sealing material at the outer periphery acts as a protective wall that prevents the sealing material at the center of the sealing surface from spreading out. It suppresses wetting and spreading.

The outer peripheral part refers to the entire area of the peripheral part on the top, bottom, left, and right of the panel sealing surface with the sealing material. The width of the outer peripheral portion of the sealing surface, that is, the temporary curing width is in the range of 0.1 mm to 10 mm, preferably 0.5 mm to 2 mm. As a result, it is possible to reliably suppress the wetting and spreading of the sealing material and the generation of voids.

In order to give the outer peripheral sealing material strength (resistance) that does not lose its adhesiveness, that is, keeps its softness and can resist a certain amount of external stress (deformation) to become a protective wall. When the sealing material is, for example, an ultraviolet curable resin, it is necessary to cause crosslinking to some extent by UV irradiation and to cure to a viscosity at which wetting and spreading to the surroundings can be suppressed (temporary curing).

Therefore, the pre-curing is performed so that the liquid sealing material has a viscosity of 50 Pa · sec to 5000 Pa · sec (25 ° C.), preferably 100 Pa · sec to 5000 Pa · sec (25 ° C.) by UV irradiation or the like. Is. As a result, the sealing material does not lose its adhesiveness, and has a strength (resistance) that can resist a certain amount of stress (deformation) from the outside so as to become a protective wall.

Note that since the viscosity of the sealing material is difficult to measure in a state where a layer or film is formed, the viscosity increasing property of the sealing material is measured in advance, and the temporary curing conditions are determined.

That is, the apparatus uses a viscosity / viscoelasticity measuring device (Rheostress RS600) manufactured by HAAKE, Germany, and in the case of an ultraviolet curable sealing material, the relationship between the ultraviolet irradiation amount (integrated light amount) and the viscosity increase is measured in advance. In addition, from the accumulated light amount, and in the case of a thermosetting sealing material, the relationship between the temperature and time and the increase in viscosity was measured in advance, and the viscosity was determined from the temperature and time, respectively.

The method of the present invention is based on the fact that the sealing material at the outer periphery of the sealing surface is a protective wall at the boundary that prevents the (liquid) sealing material at the center of the sealing surface from spreading from the periphery of the sealing surface. Yes.

In the present invention, only the outer peripheral portion of the liquid sealing material disposed on the sealing surface (light emitting region) is temporarily cured, and then the substrates are bonded together, and then, for example, from the sealing substrate side, photocurable In the case of the sealing material, for example, the entire surface is cured by UV irradiation to form a close-sealing structure.

In one embodiment of the present invention, a liquid sealing material is disposed on the sealing surface of either the substrate on which the organic EL element is formed or the sealing substrate. The liquid sealing material may be disposed by any method such as coating or printing (screen printing / inkjet). Any means that can be applied uniformly is not limited.

The screen printing method is a printing method in which holes are made directly or indirectly in a screen woven from silk, nylon, tetron, stainless steel, etc., and a sealing material is attached only to the hole portions. Liquid sealing material due to features such as printing on the body, printing on curved surfaces because the screen is flexible, and relatively thick adhesive layer printed. It is particularly suitable for coating.

After applying the sealing material to the sealing surface, in the present invention, only the periphery of the sealing surface of the sealing material is preliminarily cured. The temporary curing is performed at a viscosity of 50 Pa · sec to 5000 Pa · sec (25 ° C.), preferably 100 Pa · sec to 5000 Pa · sec (25 ° C.). When a thermosetting resin is used, it is applied by adjusting the amount of irradiation and the amount of heat by heating. Sealing material (cured) as a protective wall against wet spread of the liquid sealing material in the internal area while maintaining the adhesiveness when bonding the sealing material whose viscosity has increased by temporary curing of the outer peripheral part (peripheral part) of the sealing surface Spreading of the conductive resin) to the electrode region can be prevented.

The liquid sealing material is preferably a fluid, heat- or photo-curing resin composition having a viscosity of 0.05 Pa · sec to 50 Pa · sec (25 ° C.), but protection against spreading of the liquid sealing material by temporary curing. In order to form a wall, the viscosity is preferably increased in the range of 10 to 10,000 times by the temporary curing treatment.

Bonding is performed by pressing the substrates together with a predetermined pressure, for example, in the range of 0.5 kPa to 1 MPa, with the outer peripheral portion (peripheral portion) of the sealing material preliminarily cured. ), The surface adhesive adhesion sealing by pasting the substrates through the sealing material without spreading beyond the sealing material of the outer peripheral portion where the sealing material is temporarily cured, and spreading around the sealing surface (light emitting region) A structure can be formed.

Moreover, in the above, it is preferable that the process of bonding substrates together is performed under a reduced pressure atmosphere. Thereby, bubbles can be prevented from remaining between the substrates when the element substrate and the sealing substrate are bonded to each other.

The bonding step preferably includes a step of holding each substrate in a vacuum / depressurized environment in a depressurization apparatus so as to release the volatile components contained in the adhesive. The vacuum / depressurized environment is an environment in the range of 0.003 Pa to 1000 Pa. In addition, the step of maintaining the vacuum / depressurized environment may further include a step of depressurizing the interior of the decompressor to a vacuum / depressurized environment and a step of leaving in a vacuum / depressurized environment for a predetermined time.

It is preferable that the volatile component contained in the sealing material is released as bubbles and is prevented from remaining between the substrates when the substrates are bonded together by leaving them for a predetermined time.

In addition, it is also preferable that after being placed in a vacuum / depressurized environment for a predetermined time, the pressure is increased slightly to suppress the generation of bubbles, and then bonding is performed. Thereby, generation | occurrence | production of a bubble and micro space can be suppressed to the minimum.

Accordingly, the entire surface of the sealing surface is cured by irradiation with ultraviolet rays or the like, after the substrate and the sealing substrate are bonded in the above-described vacuum / depressurized environment, the pressure is higher than atmospheric pressure or atmospheric pressure. It is preferable to dispose under pressure and to cure the entire sealing surface by irradiating it with ultraviolet rays. As a result, the tight sealing can be performed efficiently with minimal generation of bubbles and minute spaces.

In the sealing method of the present invention, the element substrate on which the organic EL element is formed may include a protective film formed on the organic EL element. The protective film may be composed of only an inorganic layer formed of an inorganic material or a composite layer including the inorganic layer and an organic layer formed of an organic material. The thickness of the protective film is preferably in the range of several nanometers to several hundred nanometers, and by providing a protective film containing an inorganic material with excellent moisture resistance and low moisture permeability, it is possible to minimize the adverse effect of moisture on the EL element. it can. Further, by providing the protective film, the sealing material can be prevented from directly touching the EL element and affecting the characteristics. For example, a ceramic film such as silicon oxide or silicon oxynitride thin film formed by sputtering, plasma CVD, or the like is preferable because of its low moisture permeability.

In addition, prior to the step of applying the sealing material, a step of performing ozone treatment or plasma treatment on the surface of the substrate on which the organic EL element is formed, and in particular, the sealing substrate may be included. By performing ozone treatment or plasma treatment, the wettability of the substrate surface is improved and the contact angle of the sealing agent is lowered, so that the adhesive extends evenly on the substrate surface and the surface of the adhesive layer becomes smooth. When the substrates are bonded together, a minute space is hardly generated between the substrates.

Moreover, as another aspect of the present invention, a first sealing material is arranged in advance around the periphery of the sealing surface of the substrate on which the organic EL element is formed or the sealing substrate, and after this is temporarily cured, A two-stage method in which the second sealing material is disposed in the region may be employed.

As a method of arranging the sealing material around the sealing surface, a dispenser can be used, and a sealing material (second sealing material) in the inner region can be arranged using a jet dispenser. At that time, the order of the first and second sealing material arrangements may be reversed or simultaneous.

In the present invention, the substrate (sealing substrate) may be either rigid or flexible, and may be glass, plastic (resin) substrate or film. The same applies to the sealing substrate, and the substrate may be a single wafer, a continuous sheet (roll-to-roll) or the like.

Next, an embodiment of the present invention will be described with reference to the drawings.

(Embodiment of the Invention)
FIG. 1 shows one embodiment of the present invention.

FIG. 1A shows, for example, a glass substrate (thickness: 500 μm) on which a plurality of organic EL elements are formed. For example, a plurality of substantially square elements are arranged in parallel on a glass substrate.

A first electrode layer (anode), an organic layer including a light emitting layer, or a second electrode layer (cathode) are sequentially laminated on the substrate 1 to form organic EL elements, respectively. External electrode terminals are taken out to the electrode region 4. The external electrodes 4 are arranged on the two sides of the substantially square light emitting region 10 so as to protrude from the light emitting region toward the outer peripheral side.

A protective film made of a silicon oxide thin film may be formed on the entire surface of the second electrode layer.

Further, in the present invention, the sealing material layer 2 is formed so as to cover the entire surface of the light emitting region by, for example, a screen printing method using, for example, an ultraviolet curable acrylic resin (Three Bond 3042B) as the sealing material. In FIG. 1A, 2a and 2b show the peripheral part and internal region of the sealing material layer 2. FIG.

In one aspect of the present invention, the peripheral portion 2a of the formed sealing material is first temporarily cured. In the temporary curing, the liquid sealing material is cured in the above-described viscosity range, for example, to have a viscosity of 500 Pa · sec (25 ° C.).

When the sealing material is the photo-curing adhesive, curing is advanced by irradiating UV light to the peripheral portion using, for example, a mask M.

The three-bond 3042B had a viscosity before curing of approximately 40 Pa · sec (25 ° C.), and was irradiated with ultraviolet light so that a 20-fold increase in viscosity was caused by temporary curing.

As a result, the viscosity of the sealing material layer increases due to cross-linking at the outer peripheral portion, and this becomes a wall material. Therefore, the wall itself flows out to the surroundings at the time of bonding, and the liquid sealing material 2b in the internal region diffuses beyond the walls to the surroundings. Can be prevented.

FIG. 1B is a cross-sectional view showing a state in which the outer peripheral portion 2a of the sealing material layer is irradiated with light through the exposure mask M. The irradiation time or intensity is adjusted so that the above viscosity region is obtained.

When the thermosetting resin composition is used as a sealing material, heat treatment is performed only on the outer peripheral sealing material. A heat block or a thermal head can be used. Alternatively, the second sealing material may be disposed in the inner region after the sealing material is disposed only on the outer peripheral portion and heat-treated. In this case as well, the heating time and temperature are adjusted so that the viscosity region is necessary for temporary curing.

Next, this is similarly bonded using a glass substrate having a thickness of 200 μm as a sealing substrate.

FIG. 1 (c) shows a cross-sectional view of a process in which the sealing substrate 3 is laminated and bonded onto the element substrate 1 on which the sealing material layer 2 is formed.

Bonding can be performed by overlapping the substrates with a uniform pressure of at least 0.01 MPa to 1 MPa.

At the time of close contact, the seal material in the inner area is the wall material of the temporarily hardened seal material, and it does not diffuse beyond this.

After bonding (while applying pressure) at the predetermined pressure, UV light is irradiated from a transparent substrate, for example, the sealing substrate 3 side, and the entire surface is cured by light irradiation (FIG. 1D). ). As a result, the organic EL element forms an adhesive sealing structure in which the entire surface of the sealing surface is bonded to the substrate, the sealing substrate, and the cured sealing material.

The light irradiation may give sufficient irradiation energy for the sealing material layer to be crosslinked and cured over the entire bonding surface.

In the present invention, as an embodiment of the bonding step, the bonding of the substrate and the sealing substrate is preferably performed in a vacuum / depressurized environment. After preliminarily curing the outer peripheral sealing material, pasting is performed in a vacuum / depressurized environment, and after placing it in an atmospheric pressure or a pressure environment higher than atmospheric pressure, the sealing material is applied to the entire sealing surface by light irradiation, for example. It is preferable to cure.

The vacuum / depressurized environment is in the range of 0.003 Pa to 1000 Pa, and preferably in the range of 1 Pa to 100 Pa.

That is, the bonding process of FIG. 1 (c) is performed in a vacuum / depressurized environment, and the sealing process by the entire surface curing of FIG. 1 (d) is under atmospheric pressure or higher pressure (0.1 MPa to 1 MPa). It is preferable to carry out with.

Since the sealing material which is temporarily cured in the peripheral portion according to the present invention is not completely cured, the substrates are also in close contact with each other even in the outer peripheral portion of the sealing material layer 2. For example, by placing under atmospheric pressure (approximately 0.1 MPa), atmospheric pressure is applied, so that the pressure is tightly bonded. Since this state is maintained and cured by performing light irradiation over the entire surface in this state, a highly close sealing structure can be formed.

FIG. 2 shows another example of a preferred embodiment of the present invention.

FIG. 2A shows a plastic substrate on which a plurality of organic EL elements are formed as described above. Here, a PEN (polyethylene naphthalate) film (thickness 200 μm) with a silicon oxide layer (thickness 100 nm) was used as the plastic substrate. The gas barrier layer is omitted in the figure. In the figure, a plurality of substantially square elements are arranged in parallel on a resin substrate. The element is formed on the silicon oxide layer of the substrate 1.

A first electrode layer (anode), an organic layer including a light emitting layer, or a second electrode layer (cathode) are sequentially laminated on the substrate 1 to form organic EL elements, respectively. External electrode terminals are taken out to the electrode region 4. The electrode region 4 is disposed on the two sides of the substantially square light emitting region 10 so as to protrude from the light emitting region toward the outer peripheral side.

Also in this case, a protective film made of a silicon oxide thin film or the like may be formed on the entire surface of the second electrode layer.

In this embodiment, the sealing material layer 21 is formed on the outer periphery of the light emitting region 10 on the substrate, and the temporary curing process of the sealing material is first performed.

A dispenser can be used to dispose the sealing material (first sealing material, the above-mentioned ThreeBond 3042B) around the light emitting region (outer periphery). As for the arrangement of the sealing material on the outer periphery, the outer periphery of the sealing surface is defined by the sealing material. Therefore, the shape of the end of the sealing surface is square here, and the light emitting area is accurately defined by a dispenser or the like so as to cover the light emitting surface. It arrange | positions in a circumference part (or outer peripheral part).

After the sealing material layer 21 is disposed on the outer peripheral portion of the sealing surface, it is temporarily cured by irradiation with (UV). That is, it is cured so as to have a viscosity of 50 Pa · sec (25 ° C.) or more, preferably 100 Pa · sec (25 ° C.) or more and 5000 Pa · sec or less. Since the sealing material layer is disposed only in the peripheral portion, the light irradiation can use uniform UV exposure.

This state is shown in a cross-sectional view in FIG.

The first sealing material 21 semi-cured on the outer peripheral portion of the sealing surface (light emitting region) was thereby arranged to act as a wall material for the liquid sealing material arranged in the inner region.

Next, the second sealing material 22 is disposed in the inner region. The second sealing material does not necessarily need to be the same as the first sealing material, but using the same sealing material is economical and advantageous in terms of labor, and the same one is used. The temporarily cured sealing material was disposed so as to surround the periphery of the uncured liquid sealing material in the inner region (FIGS. 2A and 2C).

The amount of sealing material disposed in the inner region may be simply applied to the region, and it is extended by bonding. Therefore, a predetermined amount may be disposed by a jet dispenser or the like.

In this embodiment, the element substrate on which the sealing materials 21 and 22 are arranged is then bonded to the sealing substrate 3 under vacuum. Specifically, as the sealing substrate 3, an aluminum foil (manufactured by Toyo Aluminum Co., Ltd.) having a thickness of 30 μm is used, and a polyethylene terephthalate (PET) film having a thickness of 25 μm is applied to the mat surface with an adhesive for dry lamination (two-component reaction). PET-laminated aluminum foil was used (adhesive layer thickness 1.5 μm).

The glossy surface of the sealing substrate 3 is laminated and bonded onto the substrate 1 on which the layers of the sealing materials 21 and 22 are formed. FIG.2 (c) has shown the process to bond by sectional drawing.

In the bonding step, it is preferable to first include a step of placing each substrate in a vacuum / depressurized environment in a decompression device in order to release the volatile components contained in the adhesive. Further, the method may further include a step of leaving in the decompression device for a predetermined time.

In any case, the substrates are brought into close contact with each other in the decompression device by lightly pressing them. As a result, the substrate 1 and the sealing substrate 3 are brought into close contact with the temporarily cured sealing material on the outer peripheral portion of the sealing surface (FIG. 2D).

Bonding is performed by pressing lightly (substantially 0.01 MPa) under a vacuum apparatus, for example, under a reduced pressure condition of 10 Pa.

After the adhesion and bonding of the substrate and the sealing substrate are performed in a vacuum / depressurized environment, the depressurization in the depressurization apparatus is released and this is returned to the atmospheric pressure environment. Alternatively, the pressure may be returned to a high pressure environment from atmospheric pressure to 0.1 MPa to 0.5 MPa.

When returned to the atmospheric pressure environment, the inside is kept airtight by the temporarily hardened sealing material layer 21 disposed in the peripheral portion, so that the sealing material disposed inside is pressed by the atmospheric pressure and becomes the wall material. It is extended to the surrounding sealing material, and the inside is completely filled with the sealing material.

In the case of UV curable resin, by irradiating the entire sealing surface or the entire surface of the substrate with ultraviolet light, the curing of the sealing material on the outer peripheral portion further progresses, and the entire sealing material is photocured and the substrates are completely surface-bonded. An adhesion sealing structure is formed (FIG. 2E).

In the above embodiment, the solid sealing is described in the order of the arrangement of the sealing material on the outer peripheral portion, the temporary curing of the sealing material on the outer peripheral portion, and the arrangement (dropping) of the sealing material on the inner region. However, it is not necessary to perform the arrangement of the sealing material on the outer peripheral portion of the sealing surface, the temporary curing, and the arrangement of the sealing material in the inner region in the order described above.

When the substrate is a plastic film or the like, since it is flexible, it is particularly effective compared to a rigid substrate to form a wall material by temporary curing around the substrate and suppress the wet spread of the liquid sealing material during handling. .

In FIG. 3, similarly, in an element formed on a PEN (polyethylene naphthalate) film (thickness 200 μm) with a silicon oxide layer (thickness 100 nm), the arrangement of the sealing material in the inner region and the outer periphery of the sealing surface The embodiment which has performed arrangement | positioning of the sealing material simultaneously is shown. In this case, only the outer peripheral sealant is cured using means such as an exposure mask.

3A is a cross-sectional view showing a state in which the sealing material 2 is arranged in the inner region and in the outer peripheral portion on the substrate 1 on which the organic EL element layer 101 is formed with a dispenser. A sealing material 21 is shown at the outer periphery, and a sealing material 22 is shown at the inner region. In FIG. 3B, only the sealing material 21 at the outer peripheral portion is cured by UV irradiation.

Next, similarly to the above, the sealing substrate 3 (the PET laminate aluminum foil) and the substrate 1 on which the sealing material is disposed are disposed in the vacuum device 102 (FIG. 3C).

Further, bonding is performed under vacuum and reduced pressure (FIG. 3 (d)), and the entire sealing surface is irradiated with UV light under atmospheric pressure to sufficiently cure the sealing material.

In the case of a substrate on which a plurality of organic EL elements are formed, after the elements are sealed to produce an organic EL panel, each element is cut from the panel with a cutter or the like, and individual elements are taken out.

An organic EL panel can be obtained by mounting a drive circuit on each organic EL element electrode region.

The element substrate may be an active matrix substrate or a passive matrix substrate.

The substrate on which the element is formed includes a glass substrate and a transparent resin substrate (film). Transparent resin substrates (films) include polyethylene, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polypropylene, polystyrene, polymethyl methacrylate, polyvinyl chloride, polyvinyl alcohol, polyvinyl butyral, nylon, poly Ether ether ketone, polysulfone, polyether sulfone, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, polyvinyl fluoride, tetrafluoroethylene-ethylene copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, polychlorotri Fluoroethylene, polyvinylidene fluoride, polyester, polycarbonate, polyurethane, polyimide, polyetherimide, polyimide, polypropylene And the like.

In particular, the present invention that preliminarily cures the sealing material on the outer peripheral portion of the sealing surface and suppresses the spread of the sealing material is preferable when applied to a resin substrate such as polyethylene terephthalate and polyethylene naphthalate.

Also, a barrier film having a high gas barrier property can be used in the resin film. As the barrier film, a film having a gas barrier film having a sealing function of a thickness of 50 nm to 50 μm, such as a metal oxide film, for example, an oxynitride film, a nitride film, or a metal thin film. Specifically, an alumina vapor deposition film or the like is preferable.

The sealing substrate 30 is preferably made of a material having high transmittance in the visible light region and high moisture resistance. For example, glass, glass with a color filter, glass with CCM (color conversion function), etc. In addition, the transparent resin substrate (film), for example, a resin substrate such as polyethylene terephthalate or polyethylene naphthalate, a resin film, particularly a gas barrier film having a low moisture permeability, such as a water vapor such as silicon oxide or silicon nitride. A resin film or the like on which a gas barrier film having a low transmittance is formed is preferable. As the sealing substrate, a metal foil or the like that does not transmit light can be used.

The metal foil used as the sealing substrate is not particularly limited in the type of metal. For example, copper (Cu) foil, aluminum (Al) foil, gold (Au) foil, brass foil, nickel having a thickness of 9 to 500 μm. (Ni) foil, titanium (Ti) foil, copper alloy foil, stainless steel foil, tin (Sn) foil, high nickel alloy foil, and the like. Among these various metal foils, a particularly preferred metal foil is an Al foil. An aluminum foil having a thickness of about 30 to 50 μm is particularly preferable. These metal foils may be laminated with a polymer film such as PET.

As the sealing material used in the present invention, an example using a UV curable resin (photo-curing adhesive) is shown above. However, in addition to an ultraviolet curing type, a visible light curing type, a thermosetting type, and a composite curing by ultraviolet rays and heat. A mold or a post-curing resin using ultraviolet rays can be used.

Specifically, the sealing material is a thermosetting resin such as a urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, unsaturated polyester resin, polyurethane resin or acrylic resin. Resins, ester acrylates, urethane acrylates, epoxy acrylates, melamine acrylates, acrylates such as acrylic resin acrylates, radical photocuring adhesives using resins such as urethane polyesters, and cationic systems using resins such as epoxies and vinyl ethers A photo-curing adhesive or the like is used.

These sealing materials preferably have a viscosity of 0.05 Pa · sec to 50 Pa · sec. The adhesive spreads uniformly on the substrate surface, and the number of minute spaces generated between the substrates when the substrates are bonded can be reduced. Thereby, since the adhesive can be uniformly applied in a short time, a dropping method or the like is generally used. However, in the case of the organic EL panel of the present embodiment, the sealing material is a sealing substrate or (a protective film is used). Since it is applied to the surface of the element substrate (provided), it may be applied directly by screen printing.

For example, a sealing material may be applied to the display area by screen printing, and a sealing material is preferably applied to the outer peripheral portion by a dispenser.

In addition, a filler may be added to the sealing material. As the filler, for example, an inorganic material such as SiOx, SiON, or SiN, or a metal material such as Ag, Ni, or Al may be used, but the present invention is not limited thereto. Is not to be done. The curing method may be UV curing type, visible light curing type, UV + thermosetting type, thermosetting type, post-curing type UV adhesive, or the like.

Next, the organic EL element will be described.

An organic EL element has a structure in which one or a plurality of organic layers are laminated between electrodes. For example, the simplest example of anode / hole injection / transport layer / light emitting layer / electron injection / transport layer / cathode, etc. An organic material having a structure composed of an anode / a light emitting layer / a cathode and constituting each organic functional layer will be described.

Organic materials used for the hole injection / transport layer are typified by phthalocyanine derivatives, heterocyclic azoles, aromatic tertiary amines, polyvinyl carbazole, polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT: PSS), and the like. A material such as a conductive polymer is used.

Further, for example, carbazole-based luminescent materials such as 4,4′-dicarbazolylbiphenyl, 1,3-dicarbazolylbenzene, (di) azacarbazoles, 1,3,5- Examples thereof include low-molecular light-emitting materials typified by pyrene-based light-emitting materials such as tripyrenylbenzene, polymer light-emitting materials typified by polyphenylene vinylenes, polyfluorenes, polyvinyl carbazoles, and the like. Among these, a low molecular weight light emitting material having a molecular weight of 10,000 or less is preferably used as the light emitting material, and can be used as the film forming material of the present invention.

In the light emitting layer, the light emitting material may preferably contain about 0.1 to 20% by mass of a dopant. Examples of the dopant include known fluorescent dyes such as perylene derivatives and pyrene derivatives, phosphorescent dyes, For example, orthometalated iridium complexes represented by tris (2-phenylpyridine) iridium, bis (2-phenylpyridine) (acetylacetonato) iridium, bis (2,4-difluorophenylpyridine) (picolinato) iridium, etc. And complex compounds.

Examples of the electron injection / transport layer material include metal complex compounds such as 8-hydroxyquinolinate lithium and bis (8-hydroxyquinolinate) zinc, and the following nitrogen-containing five-membered ring derivatives. That is, oxazole, thiazole, oxadiazole, thiadiazole or triazole derivatives are preferred. Specifically, 2,5-bis (1-phenyl) -1,3,4-oxazole, 2,5-bis (1-phenyl) -1,3,4-thiazole, 2,5-bis (1 -Phenyl) -1,3,4-oxadiazole, 2- (4′-tert-butylphenyl) -5- (4 ″ -biphenyl) 1,3,4-oxadiazole, 2,5-bis ( 1-naphthyl) -1,3,4-oxadiazole, 1,4-bis [2- (5-phenyloxadiazolyl)] benzene, 1,4-bis [2- (5-phenyloxadiazolyl) -4-tert-butylbenzene], 2- (4′-tert-butylphenyl) -5- (4 ″ -biphenyl) -1,3,4-thiadiazole, 2,5-bis (1-naphthyl) -1 , 3,4-thiadiazole, 1,4-bis [2- (5-phenyl) Asiazolyl)] benzene, 2- (4′-tert-butylphenyl) -5- (4 ″ -biphenyl) -1,3,4-triazole, 2,5-bis (1-naphthyl) -1,3,4 -Triazole, 1,4-bis [2- (5-phenyltriazolyl)] benzene and the like.

The formation of these organic layers is not limited, and it is possible to form a film using a method such as vapor deposition or coating using a dissolving solvent.

In addition, as the conductive material used for the anode, those having a work function larger than 4 eV are suitable, and silver, gold, platinum, palladium and the like and alloys thereof, tin oxide, indium oxide, ITO and other metal oxides. Furthermore, organic conductive resins such as polythiophene and polypyrrole are used.

Also, as the conductive material used for the cathode, those having a work function smaller than 4 eV are suitable, such as magnesium and aluminum. Typical examples of the alloy include magnesium / silver and lithium / aluminum.

Electrode formation can be performed by sputtering, vapor deposition, or a wet process such as coating depending on the material.

In the solid sealing method of the present invention, it is also preferable that film sealing (barrier thin film) is performed on the organic EL element. For example, a barrier film such as a silicon oxide film is formed on the second electrode. You may seal by applying a sealing material on the top.

The substrate on which the element is formed or the sealing substrate includes the glass substrate and the transparent resin substrate (film) described above.

The present invention has been described based on several embodiments. Those embodiments are exemplifications, and it will be understood by those skilled in the art that various modifications can be made to each of the components, steps, and combinations thereof, and such modifications are within the scope of the present invention. It is understood.

1 Substrate 2 Sealing material 3 Sealing substrate 4 Electrode area 10 Display area

Claims (7)

  1. At least a first electrode layer, an organic compound layer including a light emitting layer, and a substrate on which an organic EL element composed of a second electrode layer is formed. In the manufacturing method of the organic EL panel to be formed,
    A liquid sealing material is disposed on at least one of the substrate and the sealing substrate, and only the sealing material on the outer peripheral portion of the substrate and the sealing substrate is temporarily cured so as to have a viscosity of 50 Pa · sec to 5000 Pa · sec. A method for producing an organic EL panel, comprising: bonding a substrate and a sealing substrate; and further curing the sealing material over the entire sealing surface to form an adhesion sealing structure.
  2. A step of disposing a liquid first sealing material on at least one of the substrate and the sealing substrate; a step of disposing a liquid second sealing material similar to the first sealing material on the outer periphery; Including a temporary curing step in which only the second sealing material disposed on the substrate is cured to a viscosity of 50 Pa · sec to 5000 Pa · sec, and the substrate and the sealing substrate are bonded after the temporary curing step, The method for producing an organic EL panel according to claim 1, further comprising a main curing step of curing the sealing material over the entire surface.
  3. 3. The bonding of the substrate and the sealing substrate is performed in a vacuum / depressurized environment, and the sealing material is cured on the entire sealing surface under an atmospheric pressure or a pressure environment higher than atmospheric pressure. The manufacturing method of the organic electroluminescent panel of description.
  4. 4. The method for producing an organic EL panel according to claim 1, wherein the viscosity of the sealing material before curing is 0.05 Pa · sec to 50 Pa · sec.
  5. The method for producing an organic EL panel according to any one of claims 1 to 4, wherein the viscosity of the sealing material when temporarily cured is 10 to 10,000 times that before curing.
  6. 6. The method for producing an organic EL panel according to claim 1, wherein the sealing material is a thermosetting resin or a UV (ultraviolet) curable resin.
  7. An organic EL panel produced by using the method for producing an organic EL panel according to any one of claims 1 to 6.
PCT/JP2009/061734 2008-07-04 2009-06-26 Organic el panel and process for producing organic el panel WO2010001831A1 (en)

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JP2011158851A (en) * 2010-02-04 2011-08-18 Hitachi Displays Ltd Display device and manufacturing method thereof
JP2011249021A (en) * 2010-05-24 2011-12-08 Lumiotec Inc Organic el lighting panel and method of manufacturing organic el lighting panel
JP2012073534A (en) * 2010-09-29 2012-04-12 Shibaura Mechatronics Corp Sticking device and sticking method
JP2012073533A (en) * 2010-09-29 2012-04-12 Shibaura Mechatronics Corp Sticking device and sticking method
JP2012120960A (en) * 2010-12-07 2012-06-28 Shibaura Mechatronics Corp Adhesive supply device and method therefor
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WO2013073067A1 (en) * 2011-11-17 2013-05-23 三菱重工業株式会社 Method for producing organic el panel and device for sealing organic el panel
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JP2015032552A (en) * 2013-08-06 2015-02-16 常陽工学株式会社 Sealing device, sealing method and functional material device
JP2015045883A (en) * 2014-11-26 2015-03-12 芝浦メカトロニクス株式会社 Device for manufacturing laminated workpiece and method for manufacturing laminated workpiece
JP2015193004A (en) * 2015-05-19 2015-11-05 芝浦メカトロニクス株式会社 Manufacturing apparatus and manufacturing method of component constituting display device
JP2016153910A (en) * 2016-04-05 2016-08-25 芝浦メカトロニクス株式会社 Manufacturing apparatus of laminated work-piece, and manufacturing method of laminated work-piece

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