JP2012120960A - Adhesive supply device and method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive supply device and method therefor which can ensure a uniform and high bonding thickness while maintaining the line width for preventing the flowing of an adhesive narrow.SOLUTION: The adhesive supply device has a supply portion 10 for forming a bank part B by supplying an adhesive R1 to a work S1 to be bonded along the edge of the work S1, and a curing treatment portion 11 for performing treatment for curing the adhesive R1 on the outer peripheral edge of the work S1 in the adhesive R1. After an adhesive R2 is filled inside the bank part B, formed on the work S1, by the supply portion 10, works are bonded to each other at a bonding part.

Description

  The present invention relates to an adhesive supply device and an adhesive supply method in which, for example, a technique for supplying an adhesive to a workpiece in order to bond a pair of workpieces is improved.

  In general, a liquid crystal display is configured by laminating a liquid crystal module, an operation touch panel, a protective panel (cover panel) for protecting the surface, and the like. These liquid crystal module, touch panel, protective panel, and the like (hereinafter referred to as a work) are incorporated in the casing of the liquid crystal display.

  In order to bond such workpieces, there are a method using an adhesive sheet and a method using a resin adhesive. The adhesive sheet is relatively expensive compared to the adhesive, and a process such as peeling of the release paper is required. For this reason, due to the recent demand for cost reduction, bonding using an adhesive has become the mainstream.

  In addition, when an air layer enters between the stacked workpieces, the visibility of the display surface of the liquid crystal decreases due to reflection of external light. In order to cope with this, an adhesive layer is formed by filling a gap (gap) between the workpieces with an adhesive when bonding the workpieces.

  Such an adhesive layer has a function of protecting the workpiece as a spacer between the workpieces. In addition, due to an increase in the size of the liquid crystal display, the work also has a large area and is likely to be deformed. For this reason, in order to absorb a deformation | transformation and to protect a workpiece | work, it exists in the tendency for the thickness requested | required of a contact bonding layer to increase. For example, a thickness of several hundred μm has been required.

  Ensuring such thickness increases the amount of adhesive required. Then, the adhesive supplied to the work flows and easily protrudes from the work. Therefore, a method using a highly viscous resin (resin) with little flow is conceivable. However, even in such a case, if the process conditions such as the application position of the adhesive are not strictly adjusted, the adhesive may protrude from a predetermined region at the time of bonding.

  In order to cope with this, there is a sealing method in which a seal is formed in advance on the outer periphery that defines the application region by using a high-viscosity resin, a temporary curing resin, or the like (see Patent Document 1). In this method, a resin adhesive is applied to a workpiece in a frame shape and temporarily cured to form a seal, and the inside is filled with the resin adhesive to bond the workpieces together. In this sealing method, since there is a seal on the outer periphery, this seal serves as a bank and can prevent protrusion due to the flow of the adhesive during bonding.

  In addition, in order to eliminate optical irregular reflection, the space between the workpieces may be filled with a substance (functional material) having a refractive index close to the workpiece. In this case, the filling material also has a function of bonding the workpiece.

JP 2010-66711 A

  By the way, a boundary may remain between the seal formed by the above-described sealing method and a filling material such as an adhesive filled in the inside. For example, in a liquid crystal display with a touch panel, the visibility of the screen is hindered when the boundary between the previously cured seal and the internal adhesive enters the visual field range of the user.

  Regarding this visual field range, it is desired to secure a wide area because of the demand for larger screens. On the other hand, the entire apparatus is required to be downsized. For this reason, it is difficult to secure a sufficient space for applying the sealing adhesive that defines the filling region, in addition to the visual field range of the workpiece. For example, as for the protective panel on the surface, the range of the user's visual field is widened, but the area of the surrounding decorative frame tends to be narrowed. For this reason, it is necessary to make the width | variety of the application part for a seal as thin as possible. As a guideline, it is desirable to make the wire thinner than 1 mm.

  On the other hand, as described above, from the viewpoint of securing the thickness of the adhesive layer, it is necessary to increase the seal. For example, considering the compression of the seal due to the pressure of the workpiece at the time of bonding, a height higher than the final adhesive layer is required when forming the seal.

  However, in general, in order to reduce the coating width, the coating thickness must be reduced, and it is difficult to ensure a sufficient height as a filling space. This is because if the coating amount is increased, the coating thickness can be increased, but the coating line width is also increased. This is because the coating line width is expanded by leveling (smoothing, flattening) after coating, and the leveling increases as the coating amount increases. For this reason, in order to ensure the height of the filling space, it has been necessary to allow the coating width to be increased to some extent.

  As in Patent Document 1, when the surface of the adhesive is irradiated with ultraviolet rays and temporarily cured, leveling can be suppressed to some extent. However, even in such a case, it is difficult to achieve both a thin line that does not impair the visibility of the visual field range and a high coating thickness. Moreover, for example, if the curing of the adhesive is promoted too much, the cushioning property of the adhesive is lost. Then, at the time of bonding, the upper and lower workpieces may not be adapted, and the uniformity of the bonding thickness may be impaired.

  Moreover, if a high viscosity resin is used like patent document 1, it will lead to a certain leveling suppression. However, when the viscosity is high, the coating line height and the coating line width increase with respect to the coating amount, and the inclination tends to increase. The application amount directly affects the size of the application shape, and also affects the ease of shape deformation due to leveling. Moreover, in general, when the viscosity is high, it is difficult to maintain the uniformity of the supply amount, such as being difficult to discharge, and the controllability at the time of supply is lowered.

  The present invention has been proposed in order to solve the above-mentioned problems of the prior art, and its purpose is to maintain a narrow line width for preventing the flow of adhesive and to achieve uniform and high bonding. An object of the present invention is to provide an adhesive supply device and an adhesive supply method capable of securing a thickness.

  In order to achieve the above object, the present invention supplies a filler by supplying an adhesive to a workpiece in an adhesive supply device that supplies the adhesive to the workpiece to be bonded. A supply part that forms a bank part that defines an area; a curing process part that performs a process of advancing the curing of the adhesive with respect to an edge on the edge side of the work in the bank part; and an edge side of the work in the bank part And a filler supply section for supplying the filler on the opposite side.

  In the invention as described above, curing is performed on the edge of the bank portion, so that the amount of the adhesive is increased while maintaining the narrow width of the flow preventing portion by curing, and high bonding is performed. Thickness can be secured. Moreover, since a filler is supplied to the side which is not hardened in a bank part, it is easy to integrate after that.

In another aspect, the supply unit and the curing processing unit are configured to be integrally movable so that the process of advancing curing by the curing unit is performed along with the supply of the adhesive by the supply unit. It is characterized by being.
In the above aspect, since the process of advancing curing is performed with the supply of the adhesive, the flow can be prevented efficiently.

In another aspect, the curing processing unit is configured to be positioned laterally with respect to a traveling direction of the supply unit.
In the above aspects, since the hardening process part is located beside the advancing direction of a supply part, the edge of a bank part can be hardened with supply of an adhesive agent.

In another aspect, the adhesive is a resin that is cured by irradiation with electromagnetic waves, and the curing unit includes an irradiation device that irradiates electromagnetic waves at an edge of an adhesive supply region.
In the above aspect, the width of the flow preventing portion and the degree of curing can be easily changed by adjusting the irradiation width and intensity.

  Each of the above aspects can also be understood as an invention of an adhesive supply method.

  As described above, according to the present invention, an adhesive supply device and an adhesive supply method capable of ensuring a uniform and high bonding thickness while maintaining a narrow line width for preventing the flow of adhesive are provided. can do.

It is explanatory drawing which shows the adhesive supply in one Embodiment of this invention, ultraviolet irradiation (A) (B), and filling (C) (D) of an adhesive agent. It is explanatory drawing which shows the bonding part in embodiment of FIG. It is the top view (A) and sectional drawing (B) which show the example of application | coating of the adhesive agent in embodiment of FIG. It is sectional drawing which shows the relationship between the bank part and filling part in the embodiment of FIG. 1, and a visual field range, (A) is before bonding, (B) is after bonding. It is explanatory drawing which shows the scanning example of a supply part and a hardening process part. It is explanatory drawing which shows the scanning example of a supply part and a hardening process part. It is explanatory drawing which shows the case where it condenses and irradiates an ultraviolet-ray (A), and the case where it irradiates without condensing (B). It is the top view (A) and sectional drawing (B) which show an example of the hardening process using a mask. It is a top view which shows the example which formed the bank part avoiding a specific area | region.

Embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.
[A. Constitution]
First, the configuration of the adhesive supply device (hereinafter referred to as this device) of this embodiment will be described. This apparatus has the bank formation part 1, the bonding part 2, etc., as shown in FIG.1 and FIG.2. The workpiece S <b> 1 to be bonded is provided so as to be movable between the bank forming unit 1 and the bonding unit 2 by the transport unit 3.

  As an adhesive used in the present embodiment, for example, it is conceivable to use an ultraviolet (UV) curable resin. In FIG. 1, B is a bank portion (seal portion) that defines a region where an adhesive is supplied, and F is a filling portion in which the bank portion B is filled with an adhesive. The adhesive for forming the bank portion B is R1, and the adhesive for forming the filling portion F is R2.

  The bank forming unit 1 includes a supply unit 10, a curing processing unit 11, and the like. The supply unit 10 includes, for example, a dispenser that drops the adhesives R1 and R2 accommodated in the tank T onto the workpiece S1 through a pipe. In the present embodiment, the supply part for forming the bank part B and the supply part (filler supply part) for forming the filling part F are common.

  The curing processing unit 11 includes, for example, an irradiation unit that irradiates the adhesive R1 with UV light from a UV light source (not shown) via an optical fiber. The irradiation unit itself may be used as a light source. This irradiation unit includes an optical member (concentrating member) that irradiates a spot-like or narrow area. As this optical member, for example, a condensing lens, a slit, a thin-line optical fiber, a light guide plate (for example, glass or plastic molded into a thin rectangle), a reflection mirror, a concave mirror, or the like is applicable. The irradiation aperture and the irradiation width can be adjusted by such an optical member. Irradiation intensity can be adjusted not only by adjusting the intensity of the light source but also by such an optical member.

  In the present embodiment, the supply unit 10 and the curing processing unit 11 constitute one unit as a pair. For example, it is configured to be integrally movable by a scanning device (not shown) that scans the dispenser. The irradiation aperture, irradiation width, irradiation intensity, and the like by the irradiation unit can be adjusted by raising and lowering the curing processing unit 11 by the scanning device. Such adjustment may be performed by providing an elevating mechanism for elevating and lowering only the curing processing unit 11 independently.

  Further, the supply unit 10 and the curing processing unit 11 always perform the curing process on the edge of the supplied adhesive on the edge side of the work S1 (in this case, the outer edge, the edge on the outer peripheral side of the work S1). Is arranged. For example, at the corner of the workpiece S1, the irradiation unit is always positioned on the edge side of the workpiece S1 by changing the positional relationship between the dispenser and the irradiation unit viewed from the plane direction. That is, the curing processing units 11 are not arranged in the traveling direction with respect to the supply unit 10, but are arranged in a direction different from the traveling direction (lateral to the traveling direction). Thereby, it is comprised so that irradiation by the irradiation part may be performed to the edge of the bank part B. FIG.

  For example, at the corner of the workpiece S1, the angle between the dispenser and the irradiation unit can be changed with respect to the direction in which the dispenser has traveled. This may be such that the position of the irradiation unit changes according to the change in the angle of the dispenser, or the irradiation unit moves independently. The drive source and mechanism for that are free. For example, a configuration in which the motor is rotated about an axis may be used, or a configuration in which the angle is changed by a specific member coming into contact with each other and being biased when passing through the shaft may be used. In addition, it is desirable to provide a light shielding member and a light shielding mechanism between the dispenser and the irradiation unit, for example, in order to prevent the adhesive from being cured by the scattered light hitting the nozzle of the dispenser.

  The bonding part 2 has the bonding apparatus 20 which bonds the workpiece | work S2 with respect to the bank part B and the filling part F of the workpiece | work S1, as shown in FIG. The bonding apparatus 20 includes, for example, a vacuum chamber 21 and a pressing device 22.

  The vacuum chamber 21 is a chamber that constitutes a vacuum chamber by covering the periphery of the workpieces S1 and S2 to be bonded and sealing the space between the transfer unit 3 and the workpiece. A vacuum pump (not shown), which is a vacuum source (decompression device), is connected to the vacuum chamber 21 via a pipe. The vacuum chamber 21 can be moved up and down by a lifting mechanism (not shown).

  The pressing device 22 is a device that attaches the work S2 to the work S1 by pressing the work S2. The pressing device 22 includes, for example, a holding unit that holds the workpiece S2, a lifting mechanism that lifts and lowers the holding unit, and the like.

  The conveyance part 3 has the conveyance apparatus 30 which conveys the workpiece | work S1 from the bank formation part 1 to the bonding part 2. FIG. As the transport device 30, for example, a turntable, a conveyor, and the like and a driving mechanism thereof can be considered. However, any apparatus may be used as long as it can convey the workpiece between the above-described units. The transport device 30 transports the workpiece S <b> 1 while being placed on the placement unit 31.

[B. Action]
The operation of the present embodiment having the above configuration will be described with reference to FIGS.

  First, as shown in FIG. 1, the transport device 30 transports the work S <b> 1 placed on the placement unit 31 from the previous process to the bank forming unit 1. In bank formation part 1, as shown in Drawing 1 (A) and (B), supply part 10 supplies adhesive R1 to work S1.

  For example, the adhesive R1 is dropped onto the workpiece S1 from the nozzle of the dispenser. By scanning the dispenser with a scanning device, the bank portion B is formed by supplying the adhesive R1 along the edge of the workpiece S1. For example, the adhesive R1 is dropped and applied in a square frame shape.

  At the same time, the UV light is irradiated to the edge of the adhesive R1 by the irradiation unit of the curing processing unit 11 that moves together with the supply unit 10. It is conceivable that the UV irradiation conditions are set to such an intensity that an appropriate pre-cured (semi-cured) state can be obtained at the same speed as the application. This depends on the type of adhesive used.

  Further, in an atmosphere where oxygen is present, such as in the air, the progress of curing is slowed by oxygen inhibition, so that semi-curing tends to occur. However, the degree of curing is free, and the edge may be fully cured. If an exhaust device or an inert gas supply device is provided and oxygen is excluded by this, main curing is likely to occur.

  Thereby, since the edge part of the bank part B becomes the hardening part H, leveling is suppressed. In particular, the flow of the bank portion B toward the outer periphery of the workpiece S1 is suppressed. And application | coating is complete | finished when the start end and the termination | terminus of bank part B correspond and close (refer FIG. 3 (A)). When the bank portion B is seen in the XX ′ cross-sectional view of FIG. 3 (A), the adhesive R1 forms a mountain, and the cured portion H is formed at the base (FIG. 3). (See (B)). Note that the inside of the bank B is not exposed to UV light or has little influence on it, so that the adhesiveness and cushioning properties are maintained.

  And as shown to FIG.1 (C) and (D), the supply part 10 supplies adhesive R2 with respect to the inside of the bank part B of the workpiece | work S1. For example, the bank portion B is filled with the adhesive R2 by scanning with the scanning device while dropping the adhesive R2 from the nozzle of the dispenser. Thereby, the inside of the bank part B becomes the filling part F.

  Then, the conveying apparatus 30 conveys the workpiece | work S1 in which the bank part B and the filling part F were formed to the bonding part 2. FIG. In the bonding part 2, as shown to FIG. 2 (A), the vacuum chamber 21 holding the workpiece | work S2 in the press apparatus 22 descends, and the circumference | surroundings of workpiece | work S1 and S2 are sealed. Then, when the decompression pump is activated, decompression (exhaust) in the vacuum chamber 21 is started.

  After completion of evacuation, the work S2 is pressed against the work S1 by lowering the pressing device 22 (FIG. 2B). At this time, the cushioning property is maintained inside the bank portion B as described above. For this reason, the distortion etc. at the time of bonding are absorbed. Further, the inside of the bank portion B is not hardened and the adhesiveness is maintained, so that it is integrated with the filling portion F. On the other hand, the edge of the bank portion B is the hardened portion H as described above. For this reason, the hardening part H plays the role of the spacer which maintains thickness, and can suppress the spread by crushing. Thereby, the uniformity of bonding thickness is realizable.

  Thereafter, vacuum breakage is performed by opening the exhaust passage or the like, and the vacuum chamber 21 is raised, so that the bonded workpieces S1 and S2 are opened to the atmosphere. Furthermore, the conveyance apparatus 30 carries out workpiece | work S1, S2 from the bonding part 2 to the following process. For example, the conveyance device 30 moves the workpieces S1 and S2 to a curing unit that cures the adhesives R1 and R2 by irradiation with electromagnetic waves.

[C. effect]
According to the present embodiment as described above, the following effects can be obtained. That is, the flow of the adhesives R1 and R2 can be prevented by the cured portion H while increasing the supply amount of the adhesive R1 to ensure the bonding thickness. Moreover, since the cushioning property is maintained inside the bank part B, the distortion | strain etc. at the time of bonding are absorbed, and a uniform contact bonding layer can be formed.

  Since the formation of the hardened portion H is performed simultaneously with the supply of the adhesive R1, the bank portion B can be formed efficiently. Such a hardened portion H can have a narrow width at the edge of the bank portion B. And since the inner side of the bank part B is uncured, it can be integrated with the adhesive R2 (filling part F) filled later. This can be said to be an excellent effect as compared with the case where the entire cured portion is used as in the above-described prior art and the integration is easily inhibited.

  Further, the hardened portion H in the bank portion B is generated inside the bank portion B, unlike the cured seal portion in the above prior art, and the state of hardening gradually changes. For this reason, unlike contact with a hardened surface, an interface does not occur or is unclear and does not cause a visual hindrance. Furthermore, as shown in FIGS. 4A and 4B, if only the hardened portion H (very narrow width) of the edge of the bank portion B is outside the user's visual field range W, there will be no residual boundary. Even if it occurs, visibility is prevented from being hindered.

[D. Other Embodiments]
The present invention is not limited to the embodiment as described above. For example, the number of times of supply (application, dripping, etc.) of the adhesive (number of layers to be formed, number of frames, etc.) is not limited to the above one. For example, the bank portion may be formed by supplying a plurality of times. In the present invention, even if the number of times of application is repeated, the height of the adhesive can be secured by suppressing the flow of the adhesive by the cured portion of the edge.

  The number of supply units and curing processing units may be designed by selecting an optimal number in accordance with the structure and scale of the apparatus, desired tact, cost, and the like. Moreover, the scanning method etc. are free. For example, as shown in FIG. 5, two coating units may perform coating by moving orthogonally in parallel with two orthogonal sides of the workpiece S1. In this case, when the angle is changed at the corner, it is necessary that the supply unit 10 and the curing processing unit 11 rotate about the axis so that the edge curing process is performed together with the application.

  Further, for example, as shown in FIG. 6, the four coating units may perform coating by moving straight or reciprocating in parallel with the respective sides of the workpiece. Thereby, in order to maintain the positional relationship between the supply unit 10 and the curing processing unit 11, it is not necessary to change the angle at the corner. The operation timing of each coating unit is set so as not to interfere with each other in order to reduce tact time. In addition, it is possible to configure a unit in which a plurality of supply units and a curing processing unit are combined. Multiple dispensers and irradiation devices can also be used.

  Further, the supply of the filler into or near the bank may be performed by a supply unit (filler supply unit) provided separately from the supply unit. For example, when the type of the adhesive for forming the bank portion and the internal adhesive is changed, or when the characteristics are changed by an additive or the like, it may be possible to separate the supply unit. In this case, it is conceivable that the adhesive on the bank portion has a high viscosity and the internal adhesive has a low viscosity, or those having different curing rates are used. The scanning direction of the supply unit at the time of filling can be freely designed such as up and down, front and rear, left and right, and rotation. Also in this case, it may be filled efficiently using a multiple dispenser. In addition, various apparatuses such as an apparatus for applying with a roller, an apparatus for applying with a squeegee, and an apparatus for applying spin can be applied. Note that, as the filler, an adhesive similar to or different from that of the bank can be applied, but is not necessarily limited to the adhesive, and may be another functional material.

  The edge curing process by the curing processing unit may be performed every time the adhesive is supplied as in the above example, or may be set to be performed once every plural times. The kind of adhesive to be used is not limited to the ultraviolet curable resin. All kinds of adhesives such as other resins curable by electromagnetic waves and thermosetting resins can be applied. In this case, depending on the type of adhesive, the curing processing unit may apply various devices such as an electromagnetic wave irradiation device, a temperature changing device (heating, cooling), and a blowing device (heating, cooling, drying). It is done.

  For example, in the case of an adhesive that is cured by heating with infrared rays, an optical member such as a reflector such as a concave mirror is effective as the concentrated portion. When hot air or cold air is used, a nozzle or the like can be considered as the concentrated portion. When using a microwave, a magnetic lens or the like is also effective. In the case of ultraviolet rays or infrared rays, irradiation to a narrow region can be realized by laser light.

  For the irradiation of a narrow region, for example, as shown in FIG. 7A, it is not always essential to collect electromagnetic waves. As shown in FIG. 7B, it is only necessary to irradiate the edge of the bank B. It does not matter that the irradiation range extends outside the edge of the bank B. Accordingly, it is only necessary that a part of the irradiation range covers the edge of the bank portion B regardless of the width of the irradiation range. This may be irradiation of only the skirt portion of the inclined surface of the bank portion B, or irradiation may be performed over the entire height of the side surface.

  Further, the curing process by the curing process unit does not necessarily follow the supply of the adhesive. It is also possible to carry out a curing process extensively after supplying the adhesive. For example, as shown in FIGS. 8A and 8B, after applying the adhesive R1 once or a plurality of times, the mask M covers the upper side so that only the edge is exposed, and the electromagnetic wave irradiation device is arranged at the upper side. Therefore, it is possible to irradiate the whole with electromagnetic waves. Thereby, the hardening part H is formed only in an edge and the effect similar to the above can be acquired. In the case of a temperature change device, a blower device, etc., it is possible to similarly perform a curing process on the adhesive after application.

  The line which comprises a bank part does not ask | require the shape. It may be a square, a circle, an ellipse, another polygon, or a curve. For example, as shown in FIG. 9, when there is a region Z where the adhesive R should not be applied, the bank portion B can be formed so as to avoid this. Furthermore, the bank part should just be able to suppress the flow of the adhesive agent in at least one direction. For this reason, the line which prescribes | regulates the filling part does not necessarily comprise the closed area | region. It may be linear, bent, or curved. Therefore, even if it is called a filler and a filling part, the circumference | surroundings of a supply location do not need to be enclosed.

  Further, the portion where the bank portion is formed by supplying the adhesive is not limited to a line that defines the outer periphery of the adhesive supply region. For example, it may be a line that defines the inner circumference of the supply area, such as the inner circumference of a circular disc. In the claims, the edge on the edge side of the work to be hardened is the inner edge of the bank (the edge on the inner circumference) when the bank is formed on a line that defines the inner circumference. )

  Moreover, all the methods and apparatuses which can be used now or in the future are applicable also about a bonding part and a conveyance part. For example, the structure for holding the workpiece with respect to the bonding portion may be any structure such as a mechanical chuck, an electrostatic chuck, or a vacuum chuck. The space for vacuum bonding may be a structure in which the lower member is raised and lowered to be sealed and opened, or a structure in which only the work passage is opened and closed. Furthermore, the apparatus is not necessarily a vacuum bonding apparatus, and may be an apparatus that performs bonding in the atmosphere.

  The transport device may also have any structure such as a turntable, a conveyor, a feed mechanism, and the like. For example, a susceptor or the like can be considered as the mounting portion, but any material and shape may be used as long as they function as a support that can support the workpiece. It is not restricted to what is supported in a horizontal direction. The method for transporting the workpiece is not limited to the case of being placed on the placement unit. It may be placed directly on a moving table.

  Further, a method of manually performing a part of the above work is also conceivable. For example, the operator can perform the supply of the filler to the vicinity of the bank using tools for application, dripping, and the like. The work may be moved manually by the operator.

  The workpieces to be bonded are typically a cover panel, a touch panel and a liquid crystal module, or a display panel and a backlight constituting the liquid crystal module. However, the size, shape, material, etc. of the pair of workpieces to which the present invention is applied are not limited as long as they can be a pair of objects to be attached. For example, the present invention can be applied to various members constituting a display device, a semiconductor wafer, an optical disc, and the like. The present invention is applicable not only when supplying an adhesive to one of the workpieces but also when supplying the adhesive to both.

DESCRIPTION OF SYMBOLS 1 ... Bank formation part 2 ... Pasting part 3 ... Conveying part 10 ... Supplying part 11 ... Curing process part 20 ... Pasting apparatus 21 ... Vacuum chamber 22 ... Pressing apparatus 30 ... Conveying apparatus 31 ... Mounting part

Claims (8)

In an adhesive supply device that supplies an adhesive to a workpiece to be bonded,
A supply part that forms a bank part that defines an area for supplying a filler by supplying an adhesive to the workpiece;
A curing processing unit that performs a process of advancing curing of the adhesive with respect to the edge on the edge side of the workpiece in the bank portion,
On the opposite side to the edge side of the workpiece in the bank portion, a filler supply unit that supplies a filler,
It has adhesive agent supply apparatus characterized by the above-mentioned.   The supply unit and the curing processing unit are configured to be integrally movable so that a process of advancing curing by the curing processing unit is performed along with the formation of the bank unit by the supply unit. The adhesive supply device according to claim 1.   The adhesive supply device according to claim 1, wherein the curing processing unit is configured to be positioned laterally with respect to a traveling direction of the supply unit. The adhesive is a resin that is cured by irradiation with electromagnetic waves,
The adhesive supply device according to claim 1, wherein the curing unit includes an irradiation device that irradiates electromagnetic waves.   The adhesive supply device according to claim 4, wherein the irradiation device has a concentration portion that concentrates electromagnetic waves on an edge of the bank portion. In an adhesive supply method for supplying an adhesive to a workpiece to be bonded,
By supplying adhesive to the workpiece, a bank part that defines the area for supplying the filler is formed,
For the edge on the edge side of the work in the bank portion, perform a treatment to advance the curing of the adhesive,
The adhesive supply method characterized by performing the process which supplies a filler to the edge side opposite to the edge of the workpiece | work in the said bank part.   The adhesive supply method according to claim 6, wherein a process of advancing curing is performed together with the supply of the adhesive. The adhesive is a resin that is cured by irradiation with electromagnetic waves,
The method for supplying an adhesive according to claim 6 or 7, wherein the treatment for causing the curing to proceed is irradiation with electromagnetic waves.

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