WO2009157310A1 - Imaging optical system - Google Patents
Imaging optical system Download PDFInfo
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- WO2009157310A1 WO2009157310A1 PCT/JP2009/060605 JP2009060605W WO2009157310A1 WO 2009157310 A1 WO2009157310 A1 WO 2009157310A1 JP 2009060605 W JP2009060605 W JP 2009060605W WO 2009157310 A1 WO2009157310 A1 WO 2009157310A1
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- optical system
- imaging optical
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- 238000003384 imaging method Methods 0.000 title claims abstract description 61
- 230000003287 optical effect Effects 0.000 title claims abstract description 31
- 125000006850 spacer group Chemical group 0.000 claims abstract description 44
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000011521 glass Substances 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 37
- -1 allyl ester Chemical class 0.000 description 24
- 239000003999 initiator Substances 0.000 description 9
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 238000012719 thermal polymerization Methods 0.000 description 3
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- NTPLXRHDUXRPNE-UHFFFAOYSA-N 4-methoxyacetophenone Chemical compound COC1=CC=C(C(C)=O)C=C1 NTPLXRHDUXRPNE-UHFFFAOYSA-N 0.000 description 2
- QXBYUPMEYVDXIQ-UHFFFAOYSA-N 4-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound CC1CCCC2C(=O)OC(=O)C12 QXBYUPMEYVDXIQ-UHFFFAOYSA-N 0.000 description 2
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical group C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000012663 cationic photopolymerization Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- VKDWOLLHINQPJL-UHFFFAOYSA-N (2,2,3,4,4,5,6,6,7,8,8,9,9,10,10-pentadecafluoro-1-adamantyl) prop-2-enoate Chemical compound FC1(F)C(C2(F)F)(F)C(F)(F)C3(F)C(F)(F)C1(F)C(F)(F)C2(OC(=O)C=C)C3(F)F VKDWOLLHINQPJL-UHFFFAOYSA-N 0.000 description 1
- FDYDISGSYGFRJM-UHFFFAOYSA-N (2-methyl-2-adamantyl) 2-methylprop-2-enoate Chemical compound C1C(C2)CC3CC1C(OC(=O)C(=C)C)(C)C2C3 FDYDISGSYGFRJM-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- YGGARCQQBAOLGB-UHFFFAOYSA-N (3-prop-2-enoyloxy-1-adamantyl) prop-2-enoate Chemical compound C1C(C2)CC3CC1(OC(=O)C=C)CC2(OC(=O)C=C)C3 YGGARCQQBAOLGB-UHFFFAOYSA-N 0.000 description 1
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- HUDYANRNMZDQGA-UHFFFAOYSA-N 1-[4-(dimethylamino)phenyl]ethanone Chemical compound CN(C)C1=CC=C(C(C)=O)C=C1 HUDYANRNMZDQGA-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- DXUMYHZTYVPBEZ-UHFFFAOYSA-N 2,4,6-tris(trichloromethyl)-1,3,5-triazine Chemical compound ClC(Cl)(Cl)C1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 DXUMYHZTYVPBEZ-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- ZPNAPHJIYFPUPB-UHFFFAOYSA-N 2-[(4-propylcyclohexyl)oxymethyl]oxirane Chemical compound C1CC(CCC)CCC1OCC1OC1 ZPNAPHJIYFPUPB-UHFFFAOYSA-N 0.000 description 1
- XIPSMKGYCCJXBF-UHFFFAOYSA-N 2-[1-(2-hydroxyphenyl)-2-adamantyl]phenol Chemical class OC1=CC=CC=C1C1C(C=2C(=CC=CC=2)O)(C2)CC3CC2CC1C3 XIPSMKGYCCJXBF-UHFFFAOYSA-N 0.000 description 1
- ARQXRBBEQBIUBR-UHFFFAOYSA-N 2-[[2-[1-[2-(oxiran-2-ylmethoxy)phenyl]-2-adamantyl]phenoxy]methyl]oxirane Chemical compound C1OC1COC1=CC=CC=C1C1C(C2)CC(C3)CC2CC13C1=CC=CC=C1OCC1CO1 ARQXRBBEQBIUBR-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- MIRQGKQPLPBZQM-UHFFFAOYSA-N 2-hydroperoxy-2,4,4-trimethylpentane Chemical compound CC(C)(C)CC(C)(C)OO MIRQGKQPLPBZQM-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- QKTWWGYCVXCKOJ-UHFFFAOYSA-N 2-methoxy-1-(2-methoxyphenyl)-2-phenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1OC QKTWWGYCVXCKOJ-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 1
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- ABWZSCQIKXOOIP-UHFFFAOYSA-N [3,5-di(prop-2-enoyloxy)-1-adamantyl] prop-2-enoate Chemical compound C1C(C2)CC3(OC(=O)C=C)CC1(OC(=O)C=C)CC2(OC(=O)C=C)C3 ABWZSCQIKXOOIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PAVQGHWQOQZQEH-UHFFFAOYSA-N adamantane-1,3-dicarboxylic acid Chemical compound C1C(C2)CC3CC1(C(=O)O)CC2(C(O)=O)C3 PAVQGHWQOQZQEH-UHFFFAOYSA-N 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- ZNAAXKXXDQLJIX-UHFFFAOYSA-N bis(2-cyclohexyl-3-hydroxyphenyl)methanone Chemical compound C1CCCCC1C=1C(O)=CC=CC=1C(=O)C1=CC=CC(O)=C1C1CCCCC1 ZNAAXKXXDQLJIX-UHFFFAOYSA-N 0.000 description 1
- IDSLNGDJQFVDPQ-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-yl) hexanedioate Chemical compound C1CC2OC2CC1OC(=O)CCCCC(=O)OC1CC2OC2CC1 IDSLNGDJQFVDPQ-UHFFFAOYSA-N 0.000 description 1
- DLTBOMSDLGUXHB-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclopropane-1,2-dicarboxylate Chemical compound C1C(C(=O)OCC2OC2)C1C(=O)OCC1CO1 DLTBOMSDLGUXHB-UHFFFAOYSA-N 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- ARUKYTASOALXFG-UHFFFAOYSA-N cycloheptylcycloheptane Chemical group C1CCCCCC1C1CCCCCC1 ARUKYTASOALXFG-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- MMCOUVMKNAHQOY-UHFFFAOYSA-L oxido carbonate Chemical compound [O-]OC([O-])=O MMCOUVMKNAHQOY-UHFFFAOYSA-L 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- IMACFCSSMIZSPP-UHFFFAOYSA-N phenacyl chloride Chemical compound ClCC(=O)C1=CC=CC=C1 IMACFCSSMIZSPP-UHFFFAOYSA-N 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000012985 polymerization agent Substances 0.000 description 1
- RGBXDEHYFWDBKD-UHFFFAOYSA-N propan-2-yl propan-2-yloxy carbonate Chemical compound CC(C)OOC(=O)OC(C)C RGBXDEHYFWDBKD-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- DGSJFPIRKXALJM-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate;tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C.CC(=C)C(=O)OC(C)(C)C DGSJFPIRKXALJM-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
- G02B5/281—Interference filters designed for the infrared light
- G02B5/282—Interference filters designed for the infrared light reflecting for infrared and transparent for visible light, e.g. heat reflectors, laser protection
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
Definitions
- the present invention relates to an imaging optical system.
- a plurality of curable resin lens portions are provided on a wafer-shaped glass substrate (so-called “wafer lenses” are manufactured), and the wafer-shaped glass substrate is provided for each lens portion.
- Attempts have been made to cut and fragment and use each one as an imaging lens.
- an IR (Infrared Rays) cut coat is formed on a glass substrate of an imaging lens.
- Patent Document 1 There is a description that an IR cut coat is formed on at least one surface.
- the main object of the present invention is to provide an imaging optical system in which an IR cut member can be provided without causing a problem with the adhesion between the IR cut coat and the lens portion.
- An imaging optical system in which a plurality of imaging lenses each having a lens portion made of a curable resin formed on a glass substrate are stacked with a spacer interposed therebetween, There is a portion where the lens portions are concave between the imaging lenses adjacent to each other, and a spacer is disposed in close contact with the portion so as not to contact the lens portion.
- An imaging optical system characterized in that is formed is provided.
- the IR cut coat is formed on the spacer disposed in the portion where the lens portions are concave, the adhesion between the IR cut coat and the lens portion is not a problem in the imaging optical system.
- An IR cut member can be provided.
- an imaging unit 1 mainly includes an imaging optical system 2, a sensor device 4, and a casing 5, and the imaging optical system 2 and the sensor device 4 are a casing 5. It has a covered configuration (in FIG. 1, the internal configuration of the imaging optical system 2 is omitted for the sake of clarity).
- the casing 5 includes a cylindrical cylindrical portion 51 and a rectangular parallelepiped base portion 53.
- the cylindrical portion 51 and the base portion 53 are integrally formed, and the cylindrical portion 51 is erected on the base portion 53.
- the imaging optical system 2 is disposed inside the cylindrical portion 51.
- a circular light transmission hole 51 a is formed in the top plate portion of the cylindrical portion 51.
- the sensor device 4 is disposed in the base portion 53 (bottom portion). For example, a CCD or CMOS is used as the sensor device 4.
- the imaging optical system 2 is mainly composed of three groups of imaging lenses 10, 20, and 30.
- the imaging lens 10 has a glass substrate 11.
- a lens portion 12 is formed on the front surface (upper surface) of the glass substrate 11, and a lens portion 13 is formed on the rear surface (lower surface) of the glass substrate 11.
- the lens portion 12 has a convex shape, and the lens portion 13 has a concave shape at the center.
- the imaging lens 20 has a glass substrate 21.
- a lens portion 22 is formed on the front surface (upper surface) of the glass substrate 21, and a lens portion 23 is formed on the rear surface (lower surface) of the glass substrate 21.
- the lens portion 22 has a concave shape, and the lens portion 23 has a convex shape.
- plate-like spacers are arranged in close contact with each other so that the lens portions do not contact the lens portions between the imaging lenses 10 and 20 adjacent to each other so as not to contact the lens portions.
- An IR cut coat is formed on the spacer.
- the imaging lens 30 has a glass substrate 31.
- a lens portion 32 is formed on the front surface (upper surface) of the glass substrate 31, and a lens portion 33 is formed on the rear surface (lower surface) of the glass substrate 31.
- the lens portion 32 has a convex portion at the center and the peripheral portion, and the lens portion 33 has a concave shape at the center.
- These lens portions 12, 13, 22, 23, 32, and 33 are made of curable resins 12A, 13A, 22A, 23A, 32A, and 33A, respectively.
- a photocurable resin such as an acrylic resin, an allyl ester resin, and an epoxy resin, or a thermosetting resin can be preferably used. Of these, a photocurable resin is preferable.
- the usable resin will be described below.
- the curable resins 12A, 13A, 22A, 23A, 32A, and 33A may be the same type of resin for each of the lens portions 12, 13, 22, 23, 32, and 33, or may be different resins. .
- Curable resin any one of the following (1) acrylic resin, (2) allyl ester resin, and (3) epoxy resin is preferably used.
- (1) Acrylic resin The (meth) acrylate used for the polymerization reaction is not particularly limited, and the following (meth) acrylate produced by a general production method can be used.
- (Meth) acrylate having an alicyclic structure is particularly preferable, and may be an alicyclic structure containing an oxygen atom or a nitrogen atom.
- 2-alkyl-2-adamantyl (meth) acrylate see Japanese Patent Laid-Open No. 2002-193883
- adamantyl di (meth) acrylate Japanese Patent Laid-Open No. 57-5000785
- diallyl adamantyl dicarboxylate Japanese Patent Laid-Open No. 60-100537.
- Perfluoroadamantyl acrylate (JP 2004-123687), manufactured by Shin-Nakamura Chemical Co., Ltd., 2-methyl-2-adamantyl methacrylate, 1,3-adamantanediol diacrylate, 1,3,5-adamantanetriol triacrylate, Saturated carboxylic acid adamantyl ester (JP 2000-119220), 3,3′-dialkoxycarbonyl-1,1 ′ biadamantane (see JP 2001-253835), 1,1′-biadamantane compound (US patent) No.
- (meth) acrylate for example, methyl acrylate, methyl methacrylate, n-butyl acrylate, n-butyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate Tert-butyl methacrylate, phenyl acrylate, phenyl methacrylate, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, and the like.
- polyfunctional (meth) acrylate examples include trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) ) Acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, tripentaerythritol octa (meth) acrylate, tripentaerythritol septa (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripenta Erythritol penta (meth) acrylate, tripentaerythritol tetra (meth) acrylate, tripent
- thermal polymerization initiator examples include hydroperoxide, dialkyl peroxide, peroxy ester, diacyl peroxide, peroxy carbonate, peroxy ketal, and ketone peroxide. Specifically, benzoyl peroxide, diisopropyl peroxy carbonate, t-butyl peroxy (2-ethylhexanoate) dicumyl peroxide, di-t-butyl peroxide, t-butyl peroxybenzoate, t-butyl hydroperoxide Side, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide and the like can be used.
- thermal polymerization initiators may be used alone or in combination of two or more.
- photopolymerization initiator examples include benzophenone, acetophenone, benzoin, benzoin ethyl ether, benzoin isobutyl ether, benzyl methyl ketal, azobisisobutyronitrile, hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1- Phenylpropan-1-one or the like can be used.
- These photopolymerization initiators may be used alone or in combination of two or more. If necessary, a photosensitizer such as an amine compound or a phosphorus compound can be added to speed up the polymerization.
- Allyl ester resin A resin having an allyl group and cured by radical polymerization. Examples thereof include the following, but are not particularly limited to the following.
- Bromine-containing (meth) allyl ester not containing an aromatic ring see JP-A-2003-66201
- allyl (meth) acrylate see JP-A-5-286896
- allyl ester resin JP-A-5-286896
- JP 2003-66201 A a copolymer of an acrylate ester and an epoxy group-containing unsaturated compound
- JP 2003-128725 A an acrylate compound
- an acrylic And ester compounds see JP 2005-2064 A.
- Epoxy resin is not particularly limited as long as it has an epoxy group and is polymerized and cured by light or heat, and an acid anhydride, a cation generator, or the like can be used as a curing initiator.
- Epoxy resin is preferable in that it has a low cure shrinkage and can be a lens with excellent molding accuracy.
- Examples of the epoxy include novolak phenol type epoxy resin, biphenyl type epoxy resin, and dicyclopentadiene type epoxy resin.
- Examples include bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, 2,2′-bis (4-glycidyloxycyclohexyl) propane, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, vinyl Cyclohexene dioxide, 2- (3,4-epoxycyclohexyl) -5,5-spiro- (3,4-epoxycyclohexane) -1,3-dioxane, bis (3,4-epoxycyclohexyl) adipate, 1,2 -Cyclopropanedicarboxylic acid bisglycidyl ester and the like.
- curing agent is used when comprising curable resin material, and there is no limitation in particular.
- an acid anhydride curing agent, a phenol curing agent, or the like can be preferably used.
- acid anhydride curing agents include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride
- examples thereof include an acid, a mixture of 3-methyl-hexahydrophthalic anhydride and 4-methyl-hexahydrophthalic anhydride, tetrahydrophthalic anhydride, nadic anhydride, and methyl nadic anhydride.
- a hardening accelerator is contained as needed.
- the curing accelerator is not particularly limited as long as it has good curability, is not colored, and does not impair the transparency of the thermosetting resin.
- 2-ethyl-4-methylimidazole is not limited. Imidazoles such as (2E4MZ), tertiary amines, quaternary ammonium salts, bicyclic amidines such as diazabicycloundecene and their derivatives, phosphines, phosphonium salts, etc. can be used, Two or more kinds may be mixed and used.
- [Photopolymerization initiator] As the photopolymerization initiator, a radical photopolymerization initiator or a cationic photopolymerization initiator can be used.
- photo radical polymerization agent examples include ⁇ -diketones such as benzyl and diacetyl, acyloins such as benzoin, acyloin ethers such as benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether, thioxanthone, and 2,4-diethyl.
- Benzophenones such as thioxanthone, thioxanthone-4-sulfonic acid, benzophenone, 4,4′-bis (dimethylamino) benzophenone, 4,4′-bis (diethylamino) benzophenone, acetophenone, p-dimethylaminoacetophenone, ⁇ , ⁇ ′ -Dimethoxyacetoxybenzophenone, 2,2'-dimethoxy-2-phenylacetophenone, p-methoxyacetophenone, 2-methyl [4- (methylthio) phenyl] -2-morpholino-1-propyl Acetophenones such as ropanone and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, quinones such as anthraquinone and 1,4-naphthoquinone, phenacyl chloride, tribromomethyl Examples thereof include halogen
- cationic photopolymerization initiator commercially available products as shown below can be used.
- Commercially available products that can be suitably used include Uvacure 1590 (manufactured by Daicel Cytec Co., Ltd.), UVI-6950, UVI-6970, UVI-6974, UVI-6990 (above, Union Carbide), Adekaoptomer SP-150 SP-151, SP-170, SP-171 (above, manufactured by ADEKA Corporation), Irgacure 261 (above, manufactured by Ciba Geigy), CI-2481, CI-2624, CI-2638, CI-2064 (above, Nippon Soda Co., Ltd.), CD-1010, CD-1011, CD-1012 (above, manufactured by Sartomer), DTS-102, DTS-103, NAT-103, NDS-103, TPS-103, MDS-103 , MPI-103, BBI-103 (Midori Chemical Co., Ltd.) It can
- a spacer 40 having an IR cut coat is interposed between the imaging lens 10 and the imaging lens 20.
- the spacer 40 is a glass plate-like member and has a function of keeping the imaging lens 10 and the imaging lens 20 at a constant interval.
- the IR cut coat 110 is preferably formed on the front surface 42 (upper surface) of the spacer 40, and the IR cut coat 120 is formed on the rear surface 44 (lower surface) of the spacer 40.
- the IR cut coat 110 is configured to reflect infrared light having a wavelength of 650 nm to 800 nm
- the IR cut coat 120 is configured to reflect infrared light having a wavelength of 800 nm to 1000 nm. It is preferable to configure the IR cut coat so as to have the performance of cutting the entire infrared light with a wavelength of 650 nm to 1000 nm.
- IR cut coats 110 and 120 are films for shielding infrared rays, and have a transmittance of 50% or more for light having a wavelength of 365 nm. Specifically, the IR cut coats 110 and 120 are formed by alternately laminating a plurality of low refractive index layers A1 and A2 made of a low refractive index material and high refractive index layers B1 and B2 made of a high refractive index material. It is an alternating multilayer film. In the IR cut coats 110 and 120, the low refractive index layers A 1 and A 2 are preferably in direct contact with the spacer 40.
- the low refractive index material constituting the low refractive index layers A1 and A2 SiO 2 or the like is used.
- the high-refractive index material constituting the high refractive index layer B1 B2 TiO 2, Ta 2 O 5, Nb 2 O 3, ZrO 2 and the like are used.
- the low refractive index layers A1 and A2 may be made of different materials, and the high refractive index layers B1 and B2 may be made of different materials.
- the IR cut coats 110 and 120 are usually composed of about 10 to 40 layers, but the number of layers may be the same or different.
- the IR cut coats 110 and 120 are respectively formed on both surfaces of the spacer 40, that is, on the surfaces 42 and 44 of the spacer 40 in contact with the lens portion 13 and the lens portion 22, one surface (surface 42) of the spacer 40.
- the film stress when the IR cut coat 110 is formed can be offset (relaxed) by forming the IR cut coat 120 on the other surface (back surface 44).
- the total thickness of the IR cut coat formed on both sides is set so that the film stress due to the formation of the IR cut coat can be offset each other. It is preferable to arrange so that there is not much difference. Accordingly, in the spacer 40, the total film thickness ratio r of the total film thickness r1 of the IR cut coat 110 formed on the front surface 42 and the total film thickness r2 of the IR cut coat 120 formed on the back surface 44 is preferably It is preferable that the condition (1) is satisfied.
- the total thickness r (A1) of the low refractive index layer A1 of the IR cut coat 110 preferably formed on the front surface 42 and the IR cut coat 120 formed on the back surface 44 are preferably used.
- the high refractive index of the IR cut coat 110 formed on the surface 42 in which the total film thickness ratio r (A) to the total film thickness r (A2) of the low refractive index layer A2 satisfies the condition of the formula (2).
- the total film thickness ratio r (B) between the total film thickness r (B1) of the layer B1 and the total film thickness r (B2) of the high refractive index layer B2 of the IR cut coat 120 formed on the back surface 44 is expressed by the formula ( It is preferable that the condition of 3) is satisfied.
- the spacer member is often a thin plate member having a thickness of about 0.1 mm to 0.3 mm, if the IR cut coats 110 and 120 do not satisfy the above formulas (1) to (3), the stress cannot be relaxed. As a result, spacers are warped and deformed, and assembly accuracy cannot be maintained.
- a spacer 50 is interposed between the imaging lens 20 and the imaging lens 30 as shown in FIG.
- An opening 52 is formed in a portion corresponding to the lens portions 23 and 32 of the spacer 50, and the lens portion 23 of the imaging lens 20 and the lens portion 32 of the imaging lens 30 are opposed to each other through the opening 52. is doing.
- the photocurable resin 12A is applied to a mold having a plurality of shapes corresponding to the lens portion 12, and the wafer-like glass substrate 11 is pressed against the mold to fill the cavity of the mold with the photocurable resin 12A. To do. Thereafter, light is irradiated from above the glass substrate 11 to cure the photocurable resin 12A. As a result, a plurality of lens portions 12 are formed on the glass substrate 11. Thereafter, the glass substrate 11 is turned over, and a plurality of lens portions 13 are formed on the glass substrate 11 in the same manner as described above.
- the plurality of lens portions 22, 23, 32, 33 are formed on both the front and back surfaces of the glass substrates 21, 31 in the same manner as the plurality of lens portions 12, 13 are formed on the front and back surfaces of the glass substrate 11.
- IR cut coats 110 and 120 are formed on both the front and back surfaces of the spacer 40, respectively.
- a method of forming the IR cut coats 110 and 120 a known vacuum deposition method, sputtering, a CVD (Chemical Vapor Deposition) method, or the like is used.
- the glass substrate 11, the spacer 40, the glass substrate 21, the spacer 50, and the glass substrate 31 are bonded to each other with an adhesive and cut into the lens portions 12, 13, 22, 23, 32, and 33 using an end mill or the like. Then, a plurality of imaging optical systems 2 are manufactured. Thereafter, the imaging optical system 2 is incorporated into (attached to) the cylindrical portion 51 of the casing 5, and the sensor device 4 is installed on the base portion 53 to manufacture the imaging unit 1.
- the three groups of imaging lenses 10, 20, 30 are stacked with the spacers 40, 50 interposed therebetween, and between the imaging lenses 10, 20 adjacent to each other.
- the lens portions 13 and 22 have a concave shape, and the IR cut coats 110 and 120 are formed on the spacers 40 arranged at the portions. Therefore, an IR cut member can be provided in the imaging optical system 2 without causing a problem with the adhesion between the IR cut coats 110 and 120 and the lens portions 12, 13, 22, 23, 32, and 33.
- the lens portions 13 and 22 are concave and opposed to each other, it is not necessary to provide an opening corresponding to the lens portions 13 and 22 in the spacer 40 disposed at that portion, and the spacer 40 is punched out. Save time and effort.
- the IR cut coats 110 and 120 are formed on the spacer 40 so as to have the relationships of the above formulas (1) to (3), the stress due to the formation of the IR cut coat can be alleviated and the spacer is warped. Can be accurately controlled. Further, it is not necessary to provide a separate IR cut filter in the imaging optical system 2, and the configuration itself of the imaging optical system 2 can be simplified.
- Imaging unit 1 Imaging unit 2
- Imaging optical system 4 Sensor device 5 Casing 51 Cylindrical part 51a Light transmission hole 53 Base part 10, 20, 30 Imaging lens 11, 21, 31 Glass substrate 12, 13, 22, 23, 32, 33 Lens part 40, 50 Spacer 52 Opening 110, 120 IR cut coat
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Abstract
Description
ガラス基板に硬化性樹脂製のレンズ部を形成した複数の撮像用レンズを、スペーサを介在させながら積層した撮像光学系であって、
互いに隣り合う前記撮像用レンズ間で前記レンズ部同士が凹状を呈する部位が存在し、その部位にレンズ部に接触しないように密着してスペーサが配置され、配置される前記スペーサにはIRカットコートが形成されていることを特徴とする撮像光学系が提供される。 According to the present invention,
An imaging optical system in which a plurality of imaging lenses each having a lens portion made of a curable resin formed on a glass substrate are stacked with a spacer interposed therebetween,
There is a portion where the lens portions are concave between the imaging lenses adjacent to each other, and a spacer is disposed in close contact with the portion so as not to contact the lens portion. An imaging optical system characterized in that is formed is provided.
(1)硬化性樹脂
硬化性樹脂としては、以下の、(1)アクリル樹脂、(2)アリルエステル樹脂、(3)エポキシ樹脂,のいずれかが好適に使用され、下記ではこれら物質について具体的に説明する。
(1)アクリル樹脂
重合反応に用いられる(メタ)アクリレートは特に制限はなく、一般的な製造方法により製造された下記(メタ)アクリレートを使用することができる。エステル(メタ)アクリレート、ウレタン(メタ)アクリレート、エポキシ(メタ)アクリレート、エーテル(メタ)アクリレート、アルキル(メタ)アクリレート、アルキレン(メタ)アクリレート、芳香環を有する(メタ)アクリレート、脂環式構造を有する(メタ)アクリレートが挙げられる。これらを1種類又は2種類以上を用いることができる。 The
(1) Curable resin As the curable resin, any one of the following (1) acrylic resin, (2) allyl ester resin, and (3) epoxy resin is preferably used. Explained.
(1) Acrylic resin The (meth) acrylate used for the polymerization reaction is not particularly limited, and the following (meth) acrylate produced by a general production method can be used. Ester (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, ether (meth) acrylate, alkyl (meth) acrylate, alkylene (meth) acrylate, (meth) acrylate having an aromatic ring, alicyclic structure The (meth) acrylate which has is mentioned. One or more of these can be used.
[熱重合開始剤]
当該熱重合開始剤としては、例えば、ハイドロパーオキサイド、ジアルキルパーオキサイド、パーオキシエステル、ジアシルパーオキサイド、パーオキシカーボネート、パーオキシケタール、ケトンパーオキサイド等が挙げられる。具体的にはベンゾイルパーオキシド、ジイソプロピルパーオキシカーボネート、t-ブチルパーオキシ(2-エチルヘキサノエート)ジクミルパーオキサイド、ジt-ブチルパーオキサイド、t-ブチルパーオキシベンゾエート、t-ブチルハイドロパーキサイド、ジイソプロピルベンゼンハイドロパーオキサイド、1,1,3,3-テトラメチルブチルハイドロパーオキサイド等を用いることができる。これらの熱重合開始剤は単独で用いても、2種以上を併用してもよい。
[光重合開始剤]
当該光重合開始剤としては、例えば、ベンゾフェノン、アセトフェノン、ベンゾイン、ベンゾインエチルエーテル、ベンゾインイソブチルエーテル、ベンジルメチルケタール、アゾビスイソブチロニトリル、ヒドロキシシクロヘキシルフェニルケトン、2-ヒドロキシ-2-メチル-1-フェニルプロパン-1-オン等を使用することができる。これらの光重合開始剤は、単独で用いても、2種以上を併用してもよい。必要に応じてアミン化合物、又はリン化合物等の光増感剤を添加し、重合をより迅速化することができる。
(2)アリルエステル樹脂
アリル基を持ちラジカル重合による硬化する樹脂で、例えば次のものが挙げられるが、特に以下のものに限定されるわけではない。 Examples of the polyfunctional (meth) acrylate include trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) ) Acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, tripentaerythritol octa (meth) acrylate, tripentaerythritol septa (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripenta Erythritol penta (meth) acrylate, tripentaerythritol tetra (meth) acrylate, tripentaerythritol Such as Li (meth) acrylate.
[Thermal polymerization initiator]
Examples of the thermal polymerization initiator include hydroperoxide, dialkyl peroxide, peroxy ester, diacyl peroxide, peroxy carbonate, peroxy ketal, and ketone peroxide. Specifically, benzoyl peroxide, diisopropyl peroxy carbonate, t-butyl peroxy (2-ethylhexanoate) dicumyl peroxide, di-t-butyl peroxide, t-butyl peroxybenzoate, t-butyl hydroperoxide Side, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide and the like can be used. These thermal polymerization initiators may be used alone or in combination of two or more.
[Photopolymerization initiator]
Examples of the photopolymerization initiator include benzophenone, acetophenone, benzoin, benzoin ethyl ether, benzoin isobutyl ether, benzyl methyl ketal, azobisisobutyronitrile, hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1- Phenylpropan-1-one or the like can be used. These photopolymerization initiators may be used alone or in combination of two or more. If necessary, a photosensitizer such as an amine compound or a phosphorus compound can be added to speed up the polymerization.
(2) Allyl ester resin A resin having an allyl group and cured by radical polymerization. Examples thereof include the following, but are not particularly limited to the following.
(3)エポキシ樹脂
エポキシ樹脂としては、エポキシ基を持ち光又は熱により重合硬化するものであれば特に限定されず、硬化開始剤としても酸無水物やカチオン発生剤等を用いることができる。エポキシ樹脂は硬化収縮率が低いため、成形精度の優れたレンズとすることができる点で好ましい。 Bromine-containing (meth) allyl ester not containing an aromatic ring (see JP-A-2003-66201), allyl (meth) acrylate (see JP-A-5-286896), allyl ester resin (JP-A-5-286896) , JP 2003-66201 A), a copolymer of an acrylate ester and an epoxy group-containing unsaturated compound (see JP 2003-128725 A), an acrylate compound (see JP 2003-147072 A), an acrylic And ester compounds (see JP 2005-2064 A).
(3) Epoxy resin The epoxy resin is not particularly limited as long as it has an epoxy group and is polymerized and cured by light or heat, and an acid anhydride, a cation generator, or the like can be used as a curing initiator. Epoxy resin is preferable in that it has a low cure shrinkage and can be a lens with excellent molding accuracy.
[光重合開始剤]
光重合開始剤としては、光ラジカル重合開始剤または光カチオン重合開始剤などを使用することができる。 A hardening | curing agent is used when comprising curable resin material, and there is no limitation in particular. As the curing agent, an acid anhydride curing agent, a phenol curing agent, or the like can be preferably used. Specific examples of acid anhydride curing agents include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride Examples thereof include an acid, a mixture of 3-methyl-hexahydrophthalic anhydride and 4-methyl-hexahydrophthalic anhydride, tetrahydrophthalic anhydride, nadic anhydride, and methyl nadic anhydride. Moreover, a hardening accelerator is contained as needed. The curing accelerator is not particularly limited as long as it has good curability, is not colored, and does not impair the transparency of the thermosetting resin. For example, 2-ethyl-4-methylimidazole is not limited. Imidazoles such as (2E4MZ), tertiary amines, quaternary ammonium salts, bicyclic amidines such as diazabicycloundecene and their derivatives, phosphines, phosphonium salts, etc. can be used, Two or more kinds may be mixed and used.
[Photopolymerization initiator]
As the photopolymerization initiator, a radical photopolymerization initiator or a cationic photopolymerization initiator can be used.
また、そのためには、さらにスペーサ40では、好ましくは表面42に形成されたIRカットコート110の低屈折率層A1の総膜厚r(A1)と、裏面44に形成されたIRカットコート120の低屈折率層A2の総膜厚r(A2)との総膜厚比率r(A)が、式(2)の条件を満たし、かつ、表面42に形成されたIRカットコート110の高屈折率層B1の総膜厚r(B1)と、裏面44に形成されたIRカットコート120の高屈折率層B2の総膜厚r(B2)との総膜厚比率r(B)が、式(3)の条件を満たしていることが好ましい。 0.9 ≦ r (= r1 / r2) ≦ 1.1 (1)
For this purpose, in the
0.9≦r(B)(=r(B1)/r(B2))≦1.1 … (3)
スペーサ部材は、多くは、0.1mmから0.3mm程度の薄い板状部材であるため、IRカットコート110、120が以上式(1)~(3)を満たさない場合、応力緩和が出来ずにスペーサの反りや変形が起きるため組み立ての精度が保てない。また、スペーサ部材の製造自体においても複数の部材を同じ基板に製造するため例えば片面の応力変形が大きいと(前記式(1)~(3)の範囲を超えると)、基板の反りが大きくなり、打ち抜き精度等も問題となる。 0.9 ≦ r (A) (= r (A1) / r (A2)) ≦ 1.1 (2)
0.9 ≦ r (B) (= r (B1) / r (B2)) ≦ 1.1 (3)
Since the spacer member is often a thin plate member having a thickness of about 0.1 mm to 0.3 mm, if the IR cut coats 110 and 120 do not satisfy the above formulas (1) to (3), the stress cannot be relaxed. As a result, spacers are warped and deformed, and assembly accuracy cannot be maintained. Also in the manufacture of the spacer member itself, since a plurality of members are manufactured on the same substrate, for example, if the stress deformation on one side is large (exceeding the range of the above formulas (1) to (3)), the warpage of the substrate increases. The punching accuracy is also a problem.
2 撮像光学系
4 センサデバイス
5 ケーシング
51 円筒部
51a 光透過孔
53 ベース部
10,20,30 撮像用レンズ
11,21,31 ガラス基板
12,13,22,23,32,33 レンズ部
40,50 スペーサ
52 開口部
110,120 IRカットコート DESCRIPTION OF
Claims (4)
- ガラス基板に硬化性樹脂製のレンズ部を形成した複数の撮像用レンズを、スペーサを介在させながら積層した撮像光学系であって、
互いに隣り合う前記撮像用レンズ間で前記レンズ部同士が凹状を呈する部位が存在し、その部位に配置される前記スペーサにはIRカットコートが形成されていることを特徴とする撮像光学系。 An imaging optical system in which a plurality of imaging lenses each having a lens portion made of a curable resin formed on a glass substrate are stacked with a spacer interposed therebetween,
An imaging optical system, wherein a portion where the lens portions exhibit a concave shape exists between the imaging lenses adjacent to each other, and an IR cut coat is formed on the spacer disposed in the portion. - 請求項1に記載の撮像光学系において、
前記スペーサの表裏両面に対しそれぞれ前記IRカットコートが形成されており、
前記スペーサの一方の面に形成されたIRカットコートの総膜厚r1と、前記スペーサの他方の面に形成されたIRカットコートの総膜厚r2との総膜厚比率rが、式(1)の条件を満たすことを特徴とする撮像光学系。
0.9≦r(=r1/r2)≦1.1 … (1) The imaging optical system according to claim 1,
The IR cut coat is formed on both the front and back surfaces of the spacer,
The total film thickness ratio r of the total film thickness r1 of the IR cut coat formed on one surface of the spacer and the total film thickness r2 of the IR cut coat formed on the other surface of the spacer is expressed by the formula (1). The imaging optical system characterized by satisfying the condition of
0.9 ≦ r (= r1 / r2) ≦ 1.1 (1) - 請求項1又は2に記載の撮像光学系において、
前記スペーサの表裏両面に対しそれぞれ前記IRカットコートが形成されており、
前記IRカットコートが、低屈折率材料から構成された低屈折率層Aと、高屈折率材料から構成された高屈折率層Bとを交互に複数積層した交互多層膜であり、
前記スペーサの一方の面に形成されたIRカットコートの低屈折率層A1の総膜厚r(A1)と、前記スペーサの他方の面に形成されたIRカットコートの低屈折率層A2の総膜厚r(A2)との総膜厚比率r(A)が、式(2)の条件を満たし、かつ、前記スペーサの一方の面に形成されたIRカットコートの高屈折率層B1の総膜厚r(B1)と、前記スペーサの他方の面に形成されたIRカットコートの高屈折率層B2の総膜厚r(B2)との総膜厚比率r(B)が、式(3)の条件を満たすことを特徴とする撮像光学系。
0.9≦r(A)(=r(A1)/r(A2))≦1.1 … (2)
0.9≦r(B)(=r(B1)/r(B2))≦1.1 … (3) The imaging optical system according to claim 1 or 2,
The IR cut coat is formed on both the front and back surfaces of the spacer,
The IR cut coat is an alternating multilayer film in which a plurality of low refractive index layers A made of a low refractive index material and high refractive index layers B made of a high refractive index material are alternately stacked.
The total thickness r (A1) of the IR cut coat low refractive index layer A1 formed on one surface of the spacer and the IR cut coat low refractive index layer A2 formed on the other surface of the spacer. The total film thickness ratio r (A) to the film thickness r (A2) satisfies the condition of the formula (2), and the total of the high refractive index layers B1 of the IR cut coat formed on one surface of the spacer The total film thickness ratio r (B) between the film thickness r (B1) and the total film thickness r (B2) of the high refractive index layer B2 of the IR cut coat formed on the other surface of the spacer is expressed by the equation (3). The imaging optical system characterized by satisfying the condition of
0.9 ≦ r (A) (= r (A1) / r (A2)) ≦ 1.1 (2)
0.9 ≦ r (B) (= r (B1) / r (B2)) ≦ 1.1 (3) - 請求項1~3のいずれか一項に記載の撮像光学系において、
前記硬化性樹脂が光硬化性樹脂であり、
前記光硬化性樹脂がアクリル樹脂又はエポキシ樹脂であることを特徴とする撮像光学系。 The imaging optical system according to any one of claims 1 to 3,
The curable resin is a photocurable resin,
An imaging optical system, wherein the photocurable resin is an acrylic resin or an epoxy resin.
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WO2012117904A1 (en) * | 2011-02-28 | 2012-09-07 | 富士フイルム株式会社 | Lens module and imaging device |
JP2013003542A (en) * | 2011-06-21 | 2013-01-07 | Konica Minolta Advanced Layers Inc | Optical element assembly, optical element, production method of optical element assembly, and production method of optical element |
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JPS62299921A (en) * | 1986-06-20 | 1987-12-26 | Matsushita Electric Ind Co Ltd | Lens assembling body |
JP2003179786A (en) * | 2001-12-11 | 2003-06-27 | Nippon Sheet Glass Co Ltd | Image pickup optical system and electronic imaging apparatus using the same |
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JP2006173855A (en) * | 2004-12-14 | 2006-06-29 | Shinko Electric Ind Co Ltd | Imaging module and infrared ray-cut film attached spacer |
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JP2006023321A (en) * | 2000-09-29 | 2006-01-26 | Matsushita Electric Ind Co Ltd | Imaging lens, imaging unit and miniature electronic camera |
JP2004020653A (en) * | 2002-06-12 | 2004-01-22 | Fujikura Ltd | Dielectric multilayer film filter element and optical part using the same |
JP2006227324A (en) * | 2005-02-17 | 2006-08-31 | Citizen Electronics Co Ltd | Solid-state imaging apparatus |
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JPS62299921A (en) * | 1986-06-20 | 1987-12-26 | Matsushita Electric Ind Co Ltd | Lens assembling body |
JP2003179786A (en) * | 2001-12-11 | 2003-06-27 | Nippon Sheet Glass Co Ltd | Image pickup optical system and electronic imaging apparatus using the same |
JP2004088713A (en) * | 2002-06-27 | 2004-03-18 | Olympus Corp | Image pickup lens unit and image pickup device |
JP2006173855A (en) * | 2004-12-14 | 2006-06-29 | Shinko Electric Ind Co Ltd | Imaging module and infrared ray-cut film attached spacer |
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JP2013003542A (en) * | 2011-06-21 | 2013-01-07 | Konica Minolta Advanced Layers Inc | Optical element assembly, optical element, production method of optical element assembly, and production method of optical element |
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