WO2011055655A1 - Image pickup device, optical unit, wafer lens laminated body, and method for manufacturing wafer lens laminated body - Google Patents

Image pickup device, optical unit, wafer lens laminated body, and method for manufacturing wafer lens laminated body Download PDF

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Publication number
WO2011055655A1
WO2011055655A1 PCT/JP2010/068918 JP2010068918W WO2011055655A1 WO 2011055655 A1 WO2011055655 A1 WO 2011055655A1 JP 2010068918 W JP2010068918 W JP 2010068918W WO 2011055655 A1 WO2011055655 A1 WO 2011055655A1
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WO
WIPO (PCT)
Prior art keywords
lens
portion
resin
wafer
formed
Prior art date
Application number
PCT/JP2010/068918
Other languages
French (fr)
Japanese (ja)
Inventor
東吾 寺本
康司 飯島
節夫 徳弘
Original Assignee
コニカミノルタオプト株式会社
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Priority to JP2009-254387 priority Critical
Priority to JP2009254387 priority
Application filed by コニカミノルタオプト株式会社 filed Critical コニカミノルタオプト株式会社
Publication of WO2011055655A1 publication Critical patent/WO2011055655A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B13/00Optical objectives specially designed for the purposes specified below
    • G02B13/001Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B13/00Optical objectives specially designed for the purposes specified below
    • G02B13/001Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/003Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/2251Constructional details
    • H04N5/2253Mounting of pick-up device, electronic image sensor, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/2257Mechanical and electrical details of cameras or camera modules for embedding in other devices

Abstract

Disclosed is a wafer lens laminated body wherein a plurality of wafer lenses are laminated, each of said wafer lenses having, on a glass substrate, a resin section having a plurality of lens sections. The resin section has a non lens section on the outer circumference of each lens section, and the non lens section is partitioned from other lens sections by means of a groove section, which has the side circumferential surface thereof as the side wall. In the laminated wafer lenses, a space formed by means of the groove section of one wafer lens and the groove section of another wafer lens is filled with resin or a flat plate.

Description

Imaging device, an optical unit producing method of a wafer lens laminate and wafer lens laminate

The present invention relates to an imaging device, an optical unit, a method of manufacturing a wafer lens laminate and wafer lens laminate.

Conventionally, in the field of manufacturing optical lens, by providing the lens portion comprising the cured resin to the glass substrate, a technique for obtaining a high heat-resistant optical lenses have been studied. As an example of a method of manufacturing the optical lens of applying this technique to form the so-called "wafer lens" in which plurality of optical members made of a curable resin on the surface of the glass substrate, to cut the glass substrate for each subsequent lens unit the method has also been proposed.

As a method for producing a wafer lens, for example, to create a first resin from the mold, followed by similarly create a second resin mold from the first resin mold, by using the second resin type resin such producing manufacturing of wafer lens may use a die and two resin types (e.g., see Patent documents 1 and 2). In particular Patent Document 2, such will molded part are sequentially formed with respect to the large diameter of the glass substrate, a so-called step-and-repeat method is disclosed.

Here, the die is the master mold, a resin mold is the sub master mold. When fabricating a wafer lens with the sub master mold can reduce the number of times of use of expensive master mold, the cost can be reduced as a result, the wafer lens.

JP-T 2006-519711 JP U.S. Patent Application Publication 2006/0259546 discloses

However, in the step-and-repeat method, the molded part so successively formed on the first resin mold substrate having a large diameter by using a small master molding die, after forming in the first region, adjacent a predetermined amount of clearance is produced between the second region. This is what occurs for the position of the mold in the first region, it can not be matched closely the positional accuracy of the mold in the second region.

As a result, the resin is not from turning in the formed gap, on one surface of the first resin-type substrate, a first resin mold having a groove matrix of the first resin-type substrate is exposed is produced . Further, by using the first resin mold having such grooves, to produce a second resin type, the using the second resin mold to produce a wafer lens, a first resin to a wafer lens a position corresponding to the groove portion of the mold, so that the groove is formed.

Then, joined by laminating two wafer lens together, each having a groove with each other, and a wafer lens laminate by dicing collectively glass substrates of both wafer lens, singulated each pair of lens portion to case, the dicing position with the cavity formed by the grooves between the stacked two wafer lens.

Therefore, or cause bending or cracks by impact during dicing, peeling between the glass substrate and the resin portion may occur. Of course such a cavity has only one of the grooves of the wafer lens directly laminated, also occurs when the other stacking the wafer lens together no groove.

The present invention has been made in view of the above circumstances, without the wafer lens into a complicated configuration or large in size, to prevent the occurrence of deflection and cracks at the time of dicing, also peeling between the glass substrate and the resin It can prevent, it is an object to provide a method for producing a wafer lens laminate and wafer lens laminate. Further, the present invention aims to provide yet compact structure, while preventing the peeling of the cracks and the glass substrate and the resin portion in the surrounding lens, an imaging device and an optical unit capable of preventing the occurrence of ghost It is set to.

According to one aspect of the present invention, a first lens block and the first non-lens portion of the periphery of the first lens unit and the first lens unit is formed of a resin on at least one surface of the first glass substrate , a second lens block and a second non-lens portion of the periphery of the second lens unit and the second lens unit is formed of a resin on at least one surface of the second glass substrate, and the first non-lens portion It said second non-lens portion is an optical unit which is joined to face,
Exposing at least a portion of the joint portion between the second non-lens portion and the first non-lens unit, a light shielding member having a light-shielding property with respect to the incident light, a side surface of the first and second lens block thereby to form, the shielding member, the first optical unit, characterized by forming the side portion flush with the side surface portion of the second lens block is provided.

According to another aspect of the present invention, a first lens block and the first non-lens portion of the periphery of the first lens unit and the first lens unit is formed of a resin on at least one surface of the first glass substrate , a second lens block and a second non-lens portion of the periphery of the second lens unit and the second lens unit is formed of a resin on at least one surface of the second glass substrate, and the first non-lens portion an optical unit and the second non-lens portion are joined so as to face,
The end surface on the opposite side to the second lens unit and the formed surface of the second non-lens portion of the second lens block is bonded, an opening at a position corresponding to the first and second lens portions a spacer made of glass having,
Wherein is joined to the other end surface of the spacer, a cover member made of glass, an imaging apparatus, comprising: a sensor unit, an having an imaging elements arranged drives out predetermined distance from said cover member,
Exposing at least a portion of the joint portion between the second non-lens portion and the first non-lens unit, a light shielding member having a light-shielding property with respect to the incident light, a side surface of the first and second lens block thereby to form, the shielding member includes a feature that forms a side portion flush with said first side surfaces of the second lens block, the side surface portion of the spacer, the side surface portion of the sensor unit imaging device that is provided.

According to another aspect of the present invention, a convex surface directed toward the object side, towards a first lens portion formed in a part of the resin portion provided on one surface of a first glass substrate, a concave surface on the image side a first lens block and a second lens portion formed in a part of the resin portion provided on the other surface of the first glass substrate,
A concave surface facing the object side, a third lens unit which is formed in a part of the resin portion provided on one surface of the second glass substrate, one resin portion provided on the other surface of the second glass substrate and a second lens block with a fourth lens portion formed in part, an optical unit formed by joining a resin portion formed between the second lens unit and the third lens unit,
A light shielding member having a light-shielding property with respect to the incident light between the resin portion to which the third lens unit and the resin portion in which the second lens portion is formed is formed, the side surface of the first and second lens block thereby forming exposed to, the first optical unit, characterized by forming the side portion flush with the side surface portion of the second lens block is provided.

According to another aspect of the present invention, a convex surface directed toward the object side, towards a first lens portion formed in a part of the resin portion provided on one surface of a first glass substrate, a concave surface on the image side a first lens block and a second lens portion formed in a part of the resin portion provided on the other surface of the first glass substrate, a concave surface on the object side, one surface of the second glass substrate a second lens having a second lens portion formed in a part of the resin portion provided, and a fourth lens portion formed on a part of the resin portion provided on the other surface of the second glass substrate and a block, an optical unit formed by joining a resin portion formed of said third lens unit and the second lens unit,
A spacer made of glass having a first end surface resin portion to which the fourth lens unit is formed of the second lens block is bonded, the opening position corresponding to the fourth lens unit from said first lens portion,
The other end surface of the spacer are joined, an imaging apparatus having a cover member made of glass, and a sensor unit having an imaging elements arranged drives out predetermined distance from said cover member,
A light shielding member having a light-shielding property with respect to the incident light between the resin portion to which the third lens unit and the resin portion in which the second lens portion is formed is formed, the side surface of the first and second lens block thereby forming exposed to, the light shielding member is formed so as to be exposed to the side surface of the first and second lens block, and side surface portions of the first, second lens block, the side surface portion of the spacer, the sensor imaging apparatus is provided which is characterized in that to form the side portions of the same surface with the side surface of the unit.

According to another aspect of the present invention, there is provided a wafer lens laminate wafer lens resin part is formed are stacked with a plurality of lens portions on the substrate, at least two wafer lens to be laminated directly one is,
Has a non-lens portion wherein the resin portion on the outer periphery of the lens portion,
The non-lens portion has a structure partitioned from the other of the lens unit by the groove portion for a side wall having its side circumferential surface,
Between wafer lens stacked together, the grooves and, wafer lens laminate resin into a cavity formed between the wafer lens is characterized in that it is filled to be other lamination of one wafer lens There is provided.

According to another aspect of the present invention, there is provided a wafer lens laminate wafer lens resin part is formed are stacked with a plurality of lens portions on the substrate, at least two wafer lens to be laminated directly one is,
Has a non-lens portion wherein the resin portion on the outer periphery of the lens portion,
The non-lens portion has a structure partitioned from the other of the lens unit by the groove portion for a side wall having its side circumferential surface,
Between wafer lens stacked together, and the groove portion of one of the wafer lenses, in a cavity formed between the other wafer lens, is arranged a small flat than the cavity, between the plate and the cavity wafer lens laminate resin is characterized in that it is filled is provided between.

According to another aspect of the present invention, two wafer wafer lens in which the resin part is formed to have a plurality of lens portions on the substrate a plurality stacked method of manufacturing a wafer lens laminate to be laminated directly At least one lens,
It has a non-lens portion of the resin portion of the wafer lens on the outer periphery of the lens portion,
The non-lens portion has a structure partitioned from the other of the lens unit by the groove portion for a side wall having its side circumferential surface,
The wafer lens are stacked with each other by arranging,
And the groove portion of one of the wafer lenses, in a cavity formed between the other wafer lens, a manufacturing method of a wafer lens laminate, characterized in that the resin is filled is provided.

According to another aspect of the present invention, two wafer wafer lens in which the resin part is formed to have a plurality of lens portions on the substrate a plurality stacked method of manufacturing a wafer lens laminate to be laminated directly At least one lens,
It has a non-lens portion of the resin portion of the wafer lens on the outer periphery of the lens portion,
The non-lens portion has a structure partitioned from the other of the lens unit by the groove portion for a side wall having its side circumferential surface,
The wafer lens are stacked with each other by arranging,
Wherein said grooves of one of the wafer lenses, in a cavity formed between the other wafer lens, the filling the resin between the flat plate and the cavity together than the cavity to place a small flat method for producing a wafer lens laminate to is provided.

According to the production method of a wafer lens laminate and wafer lens laminate of the present invention, without or in complex configuration or size of the wafer lens, to prevent the occurrence of deflection and cracks at the time of dicing, also, a glass substrate and with peeling can be prevented with the resin, it is possible to prevent ghost from light and unwanted light reflected by the light shielding member. Further, according to the imaging device and the optical unit of the present invention, though it is a compact structure, while preventing the peeling of the cracks and the glass substrate and the resin portion in the surrounding lens, it is possible to prevent the occurrence of a ghost.

(A) is a sectional view showing a schematic configuration of an imaging device, (b) are drawings showing a state in which release the package a plan view of the imaging device. It is a perspective view showing a schematic configuration of a wafer lens laminate. The pattern of the iris and IR cut coating of the glass substrate of wafer lens is a plan view schematically showing. (A), (b) is part of a manufacturing method of a wafer lens, is a side view showing the case of producing the first convex resin mold. (A), (b) is part of a manufacturing method of a wafer lens, is a side view showing a case of manufacturing the second concave resin type from the state of FIG. (A), (b) is part of a manufacturing method of a wafer lens, is a side view showing the case of producing a wafer lens from the state of FIG. (A), (b) is a side view showing a part of a method of manufacturing the wafer lens laminate. (A), (b) is part of a manufacturing method of a wafer lens laminate is a side view showing a case of producing a wafer lens laminate from the state of FIG. (A), in producing a wafer lens laminate plan view showing a case where the resin is filled into the cavity, (b) are a side view of (a). (A) is a sectional view showing a schematic configuration of an imaging apparatus of the second embodiment is the drawing showing the (b) state, disconnecting the package a plan view of an imaging apparatus of the second embodiment . (A), (b) is a side view showing a part of a method of manufacturing the wafer lens laminate of the second embodiment. (A), (b) is part of a method of manufacturing a wafer lens laminate of the second embodiment is a side view showing a case of producing a wafer lens laminate from the state of FIG. A diagram for explaining a method for manufacturing a wafer lens according to a step-and-repeat system is a plan view of a case of manufacturing the first convex resin mold.

Hereinafter, with reference to the accompanying drawings preferred embodiments of the present invention will be described.

First Embodiment
<Imaging device>
As shown in FIG. 1 (a), the imaging device 2 is mainly composed of a lens unit 4 and the sensor unit 6, the lens unit 4 is disposed on the sensor unit 6.

Lens unit 4 has an optical unit and the spacer 12 and the cover package 14 consisting of the lens block 8 and 10, the lens block 8 and 10 and the spacer 12 is covered with the cover package 14 while being bonded and laminated ing.

Lens block 8 has a glass substrate 16 exhibited flat. Stop at the top of the glass substrate 16 18, IR cut coating 21 has the resin portion 20 is formed, the diaphragm in the lower portion of the glass substrate 16 22, IR cut coating 23, resin section 24 is formed.

A substantially central portion of the resin portion 20 convex portion 20a which exhibits a convex shape is formed. Sites other than the resin portion 20 convex portion 20a is in the non-lens portion 20b. Non-lens portion 20b toward the outer periphery from the convex lens portion 20a, an inclined portion 20c inclined upwardly, substantially a flat planar portion 20d which is convex upward continuously to the inclined portion 20c, the outer flat portion 20d in and a is the groove 20e a portion formed to be recessed downward.

A substantially central portion of the resin portion 24 concave portion 24a which exhibits a concave is formed. Sites other than the resin section 24 concave portion 24a is in the non-lens portion 24b. Non-lens portion 24b has a substantially flat planar portion 24d formed on the outer peripheral portion of the concave portion 24a, and a is the groove 24e a portion formed to be recessed upwardly at the outside of the flat portion 24d. Here, an upward, downward refers upward, downward in FIG. 1 (a).

Lens block 10 also has a glass substrate 26 exhibited flat. On top of the glass substrate 26 is formed with a resin portion 28, the bottom of the glass substrate 26 is an aperture 30 and the resin portion 32 is formed.

A substantially central portion of the resin portion 28 concave portion 28a which exhibits a concave is formed. Sites other than the resin section 28 concave portion 28a is in the non-lens portion 28b. Non-lens portion 28b has a substantially flat planar portion 28c formed on the outer peripheral portion of the concave portion 28a, and a is the groove 28d a site formed recessed downward outside the flat portion 28c.

A substantially central portion of the resin portion 32 convex portion 32a which exhibits a convex shape is formed. Sites other than the resin section 32 in the convex portion 32a is in the non-lens portion 32b. Non-lens portion 32b has substantially a flat planar portion 32c formed on the outer peripheral portion of the convex lens portion 32a, and a is the groove 32d a portion formed on the concave downward outside the flat portion 32c.

Resin portions 20,24,28,32 has optical transparency at sites forming a photocurable resin. Convex lens portion 20a in the resin portion 20,24,28,32, concave portion 24a, a concave lens portion 28a, the convex lens portion 32a and has a lens effective portion exerting lens function (optical function).

When viewed lens block 8 and 10 from the object side (convex portion 20a side), as shown in FIG. 1 (b), the convex lens portion 20a, a concave lens portion 24a, a concave lens portion 28a, the convex lens portion 32a is disposed concentrically are, the optical axis 34 in the lenses portions are stacked vertically to match each other.

The sensor unit 6 is mainly consists sensors 36, packages 38, a cover glass 40. Sensor 36 is a light receiving sensor for receiving the light transmitted through the lens unit 4, and can output an electric signal received light by photoelectric conversion to an external device (not shown).

Package 38 has the shape of a bottomed box shape, the upper is open. A substantially central portion of the package 38 the sensor 36 is disposed. Cover glass 40 is provided as a lid on the top of the package 38, sensor 36 is sealed in a space surrounded by the package 38 and the cover glass 40.

The spacer 12 is interposed between the lens block 10 and the sensor 36, and imparting a constant spacing between these members.

<Wafer lens laminate>
The lens unit 4 in FIG. 1 illustrating a wafer lens laminate prior to singulation by dicing, as shown in FIG. 2, the wafer lens laminate 50 is mainly the wafer lens 52, 54 and the spacer substrate 56 in is configured, it has a structure in which these members are stacked.

By dicing respectively the wafer lens stack 50 at a predetermined position, a pair of units and the lens block 8 and 10 and the spacer 12 are bonded and laminated is formed with a plurality.

As shown in FIG. 8 (b), the wafer lens 52 has a glass substrate 16 exhibited a wafer-like, aperture on top of the glass substrate 16 18, resin section 20, IR cut coating 21 is formed.

Aperture 18 is formed a large number on the glass substrate 16 a rectangular shape, at the center of each aperture 18, is removed is a portion corresponding to the convex portion 20a of the resin portion 20 is a circular opening 18a It is formed (see FIG. 3).

Diaphragm 18 is composed of a light-shielding photoresist. The light-shielding photoresist and photoresist is applied obtained by mixing carbon black.

IR cut coating 21 are respectively formed at positions corresponding to the convex portion 20a, it is formed by an array of a number of those small circular shape on a glass substrate 16 (see FIG. 3).

IR cut coating 21 is for shielding the infrared rays to be incident on the sensor 36 when the imaging device 2. Transmittance is limited to 50% or less by reflection or optical absorption with respect to ultraviolet light. For more information, IR cut coating 21, although not shown, and a low refractive index layer composed of a low refractive index material and a high refractive index layer composed of a high refractive index material, alternate multilayer film alternately stacked it is. Preferably in the low refractive index layer of the IR cut coating 21 is formed so as to be in contact with directly on the glass substrate 16.

As a method of forming the IR cut coating 21, while using the mask, known vacuum deposition or sputtering, CVD (Chemical Vapor Deposition) method, a method of patterning, and the like. The mask, use what holes are formed only in the portion corresponding to the convex portion 20a, so that IR cut coating 21 is formed only at locations corresponding to the convex lens portion 20a.

The glass substrate 16 on the first stop 18 and the IR cut coating 21 is formed, then forming the convex lens portion 20a, a non-lens portion 20b by molding putting resin between the mold and the glass substrate. Accordingly, the diaphragm 18 and the IR cut coating 21 is covered with the resin portions 20.

Aperture 22 in the lower portion of the glass substrate 16, resin section 24, IR cut coating 23 is formed.

Diaphragm 22, diaphragm 18 and are formed a large number on the glass substrate 16 in the same shape, at the center of each aperture 18, is removed is a portion corresponding to the concave portion 24a of the resin portion 24 circular aperture 22a There has been formed. Moreover, and it is made of light-shielding photoresist Like the stop 18.

IR cut coating 23 is formed a large number on the glass substrate 26, it is formed at positions corresponding to the concave portion 24a. IR cut coating 23 exhibits the same shape as the IR cut coating 21, are formed in the same manner as the IR cut coating 21.

Diaphragm 22 and the IR cut coating 23 is formed similarly to the diaphragm 18 and the IR cut coating 21 is covered with the resin portions 24 of concave portion 24a, a non-lens portion 24b. Concave portion 24a is in the convex lens portion 20a coaxial position.

A pair of convex portions 20a, the diaphragm 18, diaphragm 22, concave portion 24a, the portion constituted by the IR cut coating 21, IR cut coating 23 corresponds to one unit of the part, it has been a number held in the glass substrate 16 state, is wafer lens 54 and the spacer substrate 56 and unitized.

As shown in FIG. 8 (b), the wafer lens 54 has a glass substrate 26 exhibited a wafer-shaped, the top of the glass substrate 26 is a resin part 28 is formed. Resin portion 28 constitutes a concave portion 28a in the convex portion 20a coaxial position.

The bottom of the glass substrate 26, the diaphragm 30, the resin portion 32 is formed.

Aperture 30 is formed a large number on the glass substrate 26 a rectangular shape, at the center of each aperture 30, is removed is a portion corresponding to the convex portion 30a of the resin portion 32 is a circular opening 30a It is formed.

Diaphragm 30 is covered with the resin portions 32 of the convex lens portion 32a, the convex lens portion 32a is in the convex lens portion 20a coaxial position.

A pair of concave portions 28a, the diaphragm 30, the portion constituted by the convex lens portion 32a corresponds to one unit of the part, they are wafer lens 52 and the spacer substrate 56 and unitized in a state of being held a number on a glass substrate 26 that.

Spacer substrate 56, as shown in FIG. 2, a glass flat plate exhibited similarly wafer-shaped glass substrate 16 and 26. The spacer substrate 56, the opening of a number of circular are formed.

The wafer lens stack 50, in FIG. 8 (b), sequentially from the upper side toward the lower side, (the opening 18a of the diaphragm 18) convex lens portion 20a, IR cut coating 21, the opening of the IR cut coating 23 (diaphragm 22 part 22a), concave portions 24a, a concave lens portion 28a, the opening 30a of the diaphragm 30, the convex lens portion 32a, and the opening 56a of the spacer board 56 is disposed on the optical axis 34, dicing the wafer lens laminate 50 lines taken along the 62, a plurality of lens unit 4 is formed.

<Lens material>
Resin portion 20,24,28,32 is constituted by a light-curing resin 44 (see FIG. 6) is basically.

The resin 44, an acrylic resin, allyl ester resin, epoxy resin, and silicone resin is used. Acrylic resin, allyl ester resin may be reacted cured by radical polymerization, the epoxy resin can be reacted cured by cationic polymerization.

Resin portion 20,24,28,32 may be constituted by a thermosetting resin. According to the thermosetting resin can be cured by addition polymerization like silicone or the like in addition to the radical polymerization or cationic polymerization.

Details of the resin 44 are as (1) to (4).

(1) can be used an acrylic resin polymer used in the reaction (meth) acrylate is not particularly limited, a general production method produced the following (meth) acrylate. Ester (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, ether (meth) acrylates, alkyl (meth) acrylate, alkylene (meth) acrylate, having an aromatic ring (meth) acrylate, an alicyclic structure a (meth) acrylate. These may be used alone or in combination.

Especially with an alicyclic structure-containing (meth) acrylate are preferable, it may be a cycloaliphatic structure containing an oxygen atom or a nitrogen atom. For example, cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, cycloheptyl (meth) acrylate, bicycloheptyl (meth) acrylate, tricyclo decyl (meth) acrylate, and tricyclodecane dimethanol (meth) acrylate, isobornyl (meth ) acrylate, di (meth) acrylate of hydrogenated bisphenol and the like. The preferred and especially with the adamantane skeleton. For example, 2-alkyl-2-adamantyl (meth) acrylate (JP 2002-193883 JP), Adamanchiruji (meth) acrylate (JP 57-500785 JP), adamantyl dicarboxylic acid diallyl (JP 60- 100537 JP), perfluoro adamantyl acrylate (JP 2004-123687 JP), manufactured by Shin-Nakamura chemical Co., 2-methyl-2-adamantyl methacrylate, 1,3-adamantane diol diacrylate, 1,3,5-adamantan triol triacrylate, unsaturated carboxylic acid adamantyl ester (JP 2000-119220 JP), 3,3'-alkoxycarbonyl-1,1 'biadamantane (JP 2001-253835 JP), 1,1' biadamantane compound (US Patent No. 3342880 Pat), tetra adamantane (JP 2006-169177), 2-alkyl-2-hydroxy adamantane, 2-alkylene adamantane, 1,3-adamantane dicarboxylic acid di -tert- butyl aromatic ring such curable resin having an adamantane skeleton having no (JP 2001-322950 JP), bis (hydroxyphenyl) adamantanes or bis (glycidyloxyphenyl) adamantane (JP-a-11-35522, JP-a No. 10-130371 publication), and the like.

It is also possible to contain other reactive monomers. (Meth) if acrylates such as methyl acrylate, methyl methacrylate, n- butyl acrylate, n- butyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert- butyl acrylate , tert- butyl methacrylate, phenyl acrylate, phenyl methacrylate, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, and the like.

Examples of the polyfunctional (meth) acrylates, such as trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta ( meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, tripentaerythritol octa (meth) acrylate, tripentaerythritol septa (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tri dipentaerythritol penta (meth) acrylate, tripentaerythritol tetra (meth) acrylate, tri pentaerythritol And tri (meth) acrylate.

(2) a resin that is cured by radical polymerization have allyl ester resin allyl group, for example, include the following, but not particularly limited to the following.

Bromine-containing containing no aromatic ring (meth) allyl ester (JP 2003-66201), allyl (meth) acrylate (JP-A-5-286896), an allyl ester resin (JP-A-5-286896, JP open 2003-66201 JP), copolymer compound of acryl acid ester and an epoxy group-containing unsaturated compound (2003-128725 JP) acrylate compound (JP 2003-147072 JP) acrylic ester compound (JP JP), etc. 2005-2064 can be mentioned.

(3) As the epoxy resin epoxy resin, as long as it is polymerized and cured by light or heat has the epoxy group is not particularly limited, and may be an acid anhydride or cation generator such as a curing initiator. Epoxy resin has a low cure shrinkage is preferable in that it can be an excellent lens molding precision.

The types of epoxy, novolac phenol epoxy resin, biphenyl type epoxy resins, dicyclopentadiene type epoxy resin. As an example, bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, 2,2'-bis (4-glycidyloxy cyclohexyl) propane, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carbonate carboxylate, vinyl cyclohexene dioxide, 2- (3,4-epoxycyclohexyl) -5,5-spiro - (3,4-epoxycyclohexane) -1,3-dioxane, bis (3,4-epoxycyclohexyl) adipate, 1,2 - it can be exemplified cyclopropane dicarboxylic acid bisglycidyl ester.

Curing agents are those which are used in constructing the curable resin material is not particularly limited. Further, in the present invention, a curable resin material, when comparing the transmittance of the optical material after the addition of additives, curing agent it shall not be included in the additive. As the curing agent, it can be preferably used an acid anhydride curing agent and phenol curing agent.

Specific examples of the acid anhydride curing agent include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, 3-methyl - hexahydrophthalic anhydride, 4-methyl - hexahydrophthalic anhydride acid or 3-methyl, - hexahydrophthalic anhydride and 4-methyl - a mixture of hexahydrophthalic anhydride, tetrahydrophthalic anhydride, nadic acid, and the like methylnadic anhydride.

Further, the curing accelerator is contained if necessary. As the curing accelerator, curing is good, colorization, as long as it does not impair the transparency of the thermosetting resin, is not particularly limited, for example, 2-ethyl-4-methylimidazole imidazoles such as (2E4MZ), 3 amine, can be used quaternary ammonium salts, bicyclic amidines such as diazabicycloundecene and derivatives thereof, phosphine, phosphonium salts, and these one or it may be used as a mixture of two or more.

(4) can be used silicone resins having a siloxane bond as a main chain of the silicone resin Si-O-Si. As the silicone resin, a silicone resin consisting of a predetermined amount of polyorganosiloxane resins can be used (e.g., JP-A 6-9937 Patent Publication).

Thermosetting polyorganosiloxane resin is continuously hydrolyzed by heating - by dehydration condensation reaction, as long as the three dimensional network structure by siloxane bonding skeleton is not particularly limited, generally elevated temperature, prolonged heating It shows the curability, has a re-softened hard nature by heating once cured.

Such polyorganosiloxane resin is represented by the following general formula (A) is contained as a constitutional unit, the shape of the chain, cyclic, it may be any reticulated shape.

((R 1) (R 2 ) SiO) n ... (A)
In the general formula (A), it shows "R 1" and "R 2" is substituted the same or different, or a non-substituted monovalent hydrocarbon group. Specifically, as "R 1" and "R 2", a methyl group, an ethyl group, a propyl group, an alkyl group such as butyl group, alkenyl groups such as vinyl and allyl group, a phenyl group, allyl tolyl group group, a cyclohexyl group, cycloalkyl groups such as cyclooctyl group, or a hydrogen atom a halogen atom bonded to the carbon atoms of these groups, a cyano group, group obtained by substituting at an amino group, such as chloromethyl group, 3,3, 3- trifluoropropyl group, cyanomethyl group, .gamma.-aminopropyl group, etc. N-(beta-aminoethyl)-.gamma.-aminopropyl groups. "R 1" and "R 2" may be a group selected from hydroxyl and alkoxy groups. Further, in the above general formula (A), "n" represents an integer of more than 50.

Polyorganosiloxane resin is usually toluene, xylene, used by dissolving in a mixture of hydrocarbon solvents, or these with polar solvents such as petroleum-based solvents. Furthermore, to the extent that mutually dissolved in each other, it may be used by blending different compositions.

Method for producing polyorganosiloxane resin is not limited in particular, it can be used any known method. For example, it can be obtained by one or hydrolysis or alcoholysis of a mixture of two or more of organohalogenosilanes polyorganosiloxane resin generally contains a hydrolyzable group such as silanol group or alkoxy group, these by converting the group to a silanol group containing 1 to 10% by weight.

These reactions are carried out in the presence of a solvent capable of melting the organohalogenosilane is common. Further, hydroxyl groups at the molecular chain terminal, a linear polyorganosiloxane having an alkoxy group or a halogen atom, by cohydrolysis and organotrichlorosilane can be obtained by a method of synthesizing a block copolymer. This way, the polyorganosiloxane resin obtained by including a HCl remaining general, in the compositions of the present embodiment, since the storage stability is good, 10 ppm or less, of preferably used those 1ppm or less good.

<Method of manufacturing a wafer lens>
In forming the wafer lens 52, as shown in FIG. 4 (a), (b), first, a convex lens portion 20a concave mold 100 negative shape corresponding to the optical surface shape of the first convex positive shape molding a resin mold 210 (first resin mold manufacturing process). Then, FIG. 5 (a), the as shown in (b), the first convex resin mold 210 to mold the second concave resin mold 220 negative shape (second resin mold manufacturing process), Fig. 6 ( a), (as shown in b), the wafer lens 52 is molded by the second concave resin mold 220 molded (wafer lens manufacturing process).

Hereinafter, the first resin mold manufacturing process, the second resin mold manufacturing process, the wafer lens manufacturing process will be described.

"The first resin mold manufacturing process"
As shown in FIG. 4 (a), the upper surface of the concave mold 100, was added dropwise a resin 218 as a material of the first molded portion 212 of the convex resin mold 210 (dispensing step) above the concave mold 100 the first resin-type substrate 214 is a glass substrate previously sucked and fixed. At this time, the concave mold 100 to a portion (first region R1) of the first resin-type substrate 214 is previously arranged, respectively so as to correspond.

Thereafter, a concave die 100, toward the first resin-type substrate 214 disposed above was raised to a predetermined height position, it presses the resin 218 in the first resin-type substrate 214 (imprint process) .

Then, while keep the height position of the concave die 100, the resin 218 filled between the concave mold 100 and the first resin-type substrate 214, above the first resin-type substrate 214 is irradiated with light from causes the resin 218 photocured (exposure step).

After irradiation lowers the concave die 100, thereby releasing the resin 218 from the concave mold 100 (mold release step).

As a result, as shown in FIG. 4 (b), forming a positive configuration corresponding to the optical surface shape of the first lower surface of the portion of the resin type substrate 214 (first region R1) in the wafer lens 52 convex section 20a the first convex resin mold 210 having a section 212 is formed. In other words, the molding portion 212 of the first convex resin mold 210 corresponding to one of the concave mold 100 is formed in the first resin-type substrate 214.

Thereafter, as shown in FIG. 4 (a), first other positions of the lower surface of the resin type substrate 214 (second area R2 adjacent to the first region), a gap of a predetermined amount from the first region R1 shifting the X moving a concave die 100 (see FIG. 4 (a)), similarly to the above dispensing step, imprint process, exposure process, as one cycle the process of releasing step, the cycle repeats predetermined times Te, further sequentially forming a plurality of shaped portions 212, to produce a first convex resin mold 210 in the first resin-type substrate 214 (see Figure 4 (b)).

Figure 13 shows a process for manufacturing the first convex resin mold 210 manufactured using the mold 100. By employing such a step-and-repeat method, from a small mold 100, so producing a first resin mold having a large area (first convex resin mold 210) during the formation of the first resin mold only mold 100 is used, the wafer lens 52 can be formed at low cost, it can achieve cost reduction.

The above gap X is one that occurs for the position of the mold 100 in the first region R1, can not be matched closely the positional accuracy of the mold 100 in the second region R2. As a result, the resin 218 is not from turning the formed gap in the X, on one surface of the first resin-type substrate 214, a first resin having a groove M of matrix of the first resin-type substrate 214 is exposed so that the mold 210 is manufactured (see Figure 4 (b)). In FIG. 4, the mold 100, is shown only near the right end portion of the front of the left end and after the movement.

"The second resin mold manufacturing process"
Figure 5 As shown in (a), on the upper surface of the first convex resin mold 210 was dropped resin 228 (dispensing step), the second resin mold is a glass substrate over the first convex resin mold 210 keep sucking and fixing the substrate 224.

Thereafter, the first convex resin mold 210, toward the second resin-type substrate 224 disposed above was raised to a predetermined height position, presses the resin 228 in the second resin-type substrate 224 ( imprint process).

Then, while the height position of the first convex resin mold 210 held there, the resin 228 filled between the first convex resin mold 210 and the second resin-type substrate 224, the irradiated with light from above the second resin-type substrate 224, thereby the resin 228 photocured (exposure step).

After irradiation, it lowers the first convex resin mold 210, thereby releasing the resin 228 from the first convex resin mold 210 (mold release step).

As a result, as shown in FIG. 5 (b), the second concave resin mold having a molding portion 222 of the negative shape corresponding to the optical surface shape of the convex lens portion 20a of the wafer lens 52 on the lower surface of the second resin-type substrate 224 220 is manufactured. Since the first resin mold 210 having a through groove M described above, in the second resin mold 220, so that the groove from the groove M is formed.

"Wafer lens manufacturing process"
The wafer lens manufacturing process, on a glass substrate 16 for pre-wafer lens, previously formed aperture 18 and IR cut coating 21 serving as the optical component. Specifically, a photoresist is applied to the carbon black is mixed on a glass substrate 16, then, by a known patterning exposure and development process, and selectively removing the material layer, the glass substrate 16 a stop 18 Form. Further, on the glass substrate 16, to form the IR cut coating 21 in a known manner.

Then, as shown in FIG. 6 (a), the upper surface of the second concave resin mold 220 was dropped resin 44 (dispensing step), the second glass substrate 16 of the wafer lens above the concave resin mold 220 sucking Fireproof fixed.

Thereafter, the second concave resin mold 220, toward the glass substrate 16 positioned above is raised to a predetermined height position, presses the resin 44 on the glass substrate 16 (imprint process).

Then, while the height position of the second concave resin mold 220 held there, the resin 44 filled between the second concave resin mold 220 and the glass substrate 16, the light from above the glass substrate 16 irradiated, causing the resin 44 to light curing (exposure step).

After irradiation lowers the second concave resin mold 220, thereby releasing the resin 44 from the second concave resin mold 220 (mold release step).

As a result, as shown in FIG. 6 (b), the plurality of bottom surface of the glass substrate 16 a convex lens portion 20a is formed. To wafer lens 52 lens portion is formed on one surface of the substrate thus, at a position corresponding to the groove M of the first resin mold 210, the grooves 20e are formed (refer to Figure 6 (b)).

Thereafter, although not shown, the glass substrate 16 upside down, on the surface opposite to the convex lens portion 20a is provided a surface of the glass substrate 16 even after forming the aperture 22, IR cut coating 23, described above dispensing process, imprint process in the wafer lens manufacturing process, exposure process, through the releasing step of forming a plurality of concave portions 24a. Wafer lens 52 is manufactured in this way. Incidentally, the mold to be used, the first resin mold, the second resin mold shall correspondingly shaped respectively to the shape of the concave lens part 24a for molding.

As for the manufacturing method of the wafer lens 54, a first resin mold manufacturing process described above, the second resin mold manufacturing process, since through the wafer lens manufacturing process can be manufactured similarly, here not be described to.

<Method of manufacturing a wafer lens laminate>
As shown in FIG. 7 (a), an adhesive 281 is applied to the upper surface of the non-lens portion 28b (the flat portion 28c) of the resin portion 28 of wafer lens 54 to the wafer lens 52, 54 pressed together. The adhesive 281 is made of, for example, a light curable resin is intended to cure by light irradiation. Other, or it may be composed of a thermosetting resin. Then, from the lower side of the wafer lens 52 by light irradiation to cure the adhesive 281 to fix the wafer lens 52 (see FIG. 7 (b)).

Then, filled as shown in FIG. 8 (a), the groove 24e of the wafer lens 52, the resin J into the cavity K formed by the groove 28d of the wafer lens 54. As the filling method, FIG. 9 (a), the advance filled through the resin J into the syringe 101 shown in (b), filling the resin J into the cavity K through the needle 102.

As the resin J, it may be a photo-curable resin similar to the lens material may be a thermosetting resin, particularly, a ghost may use the black resin with light-shielding property with respect to the incident light preferred in terms of measures. Further, if the photocurable resin may be used the same resin 44 as the resin portion 20,24,28,30 of wafer lens 52,54.

When using a photocurable resin as the resin J, after filling the resin J, irradiated with light to cure the resin J.

Thereafter, as shown in FIG. 8 (b), an adhesive 321 is applied to the lower surface of the non-lens portion 32 b (the groove 32d) of the resin portion 32 of wafer lens 54 to the wafer lens 54 and the spacer substrate 56 pressed together . The adhesive 321 may use the same photo-curable resin or a thermosetting resin such as an adhesive 281 described above. Then, light irradiation to cure the adhesive 321 to fix the wafer lens 54 and the spacer substrate 56. This wafer lens laminate 50 is manufactured.

Wafer lens laminate 50 manufactured, the glass substrate 16, 26 respectively at the position of the filled resin J, by dicing the spacer substrate 56 by dicing line 62, the adhesive-laminated and lens block 8, 10 and the spacer 12 has been set in the unit is formed with a plurality.

As described above, in the step-and-repeat method, after forming in the first region R1, a predetermined amount of gap X between the second region R2 adjacent occurs, as a result, the first resin mold on one surface of the substrate 214, a first resin mold 210 having a groove M of matrix of the first resin-type substrate 214 is exposed it is produced. Further, by using the first resin mold 210 having such a groove portion M, the second resin mold 220 to manufacture, when using the second resin mold 220 for producing a wafer lens 52, the wafer lens 52 in a position corresponding to the groove M of the first resin mold 210, the grooves 20e are formed. Then, as shown in FIG. 7 (a), (b), the groove 24e, joined by laminating together a wafer lens 52 and 54 each having a 28d, and wafer lens stack 50, a glass substrate of a wafer lens 52 If singulating each section a pair of lenses by dicing the 16 and 26, so that the dicing groove 24e, a cavity K which is formed by 28d between the position of the laminated wafer lens 52 .

Therefore, as described above, when not filled with the resin into the cavity K, the or cause bending or cracks by impact during dicing, peeling between the glass substrate 16, 26 and the resin portion 24, 28 may occur. Of course such a cavity has only one of the grooves of the wafer lens directly laminated, also occurs when the other stacking the wafer lens together no groove.

In the present embodiment, since the filling of the resin into the cavity K, the occurrence of deflection and cracks due to impact during dicing can be prevented, peeling between the glass substrate 16, 26 and the resin portion 24 and 28 occurs even be prevented that.

In the description up to now, it has been a wafer lens laminate 50 spacer 12 including the lens block 8 and 10, a wafer lens stack 50 only by the lens block 8 and 10, an optical unit those diced this it may be. In this case the spacer 12 is pre-cut to the same size as the optical unit is attached to the optical unit with the sensor unit 6.

Accordingly, when viewed in the optical unit obtained by cutting, the groove 24e, when the material filling the 28d composed of a light shielding material, as shown in FIG. 1, the resin concave portion 24a of the lens block 8 is formed together with the light shielding member having a light-shielding property with respect to the incident light between the resin portion 28 of concave portion 28a of the parts 24 and lens block 10 is formed is formed, for collectively cutting a wafer lens laminate 50 after filling , the shielding member becomes to be formed is exposed to the side surface of the lens lock 8,10, and a light-shielding material exposed to the side surface portion is a cut surface of the lens block 8 and 10 the side portions of the same surface the formation and configurations.

Thus, configured with problems such as cracks at the time of cutting the wafer lens can be reduced, even when viewed in the optical unit is a finished product, because it cuts the resin which is light-shielding member after filling, the side surface are the same surface It can be, without hassle as configured in dare irregularly shaped cover package covering separately side portion can be provided a compact optical unit, the lens unit as a whole.

Of course, by employing the configuration in which the sensor unit 6 in addition to the spacer 12 is also cut together, the side surface portion of the spacer 12 as an imaging device 2, also forms a side surface portion of the same coplanar side surfaces of the sensor unit 6 configuration and become.

As described above, the resin portion 20,24,28,32 of wafer lens 52, a convex lens portion 20a is an optical surface, 24a, 28a, the non-lens portion 20b on the outer periphery of the 32a, 24b, 28b, and 32b together with, the non-lens portion 20b, 24b, 28b, the groove portion 20e to the side wall of the side peripheral surface of the 32 b, 24e, 28d, are partitioned from the other lens portions 20a, 24a, 28a, 32a by 32d, stacked together in between wafer lens 52 and 54, and the groove 24e of one of the wafer lens 52, the resin J is filled into the cavity K formed by the groove 28d of the other wafer lens 54, the deflection at the time of dicing to prevent and cracks, also glass substrates 16 and 26 of wafer lens 52 and the resin portion 20,24,28,3 Peeling and can also be prevented.

Further, by making the resin J filled in the cavity K as black resin, it is excellent in ghost measures.

Furthermore, IR cut coating 21, 23 formed on the glass substrate 16 of the wafer lens 52 is formed only at positions corresponding to the convex portion 20a and the concave portion 24a, those small circular shape on the glass substrate 16 and 26 because side by side are formed, it can be reliably infrared shielding to the convex lens portion 20a and the concave portion 24a. Further, as compared with the case of forming the IR cut coating on the entire surface of the glass substrate 16, it is possible to reduce the warpage of the glass substrate 16.

Second Embodiment
<Method of manufacturing a wafer lens laminate>
In the second embodiment, as shown in FIG. 10 (a), (b), in the manufacturing method of a wafer lens laminate of the first embodiment, instead of filling the resin J into the cavity K, the lens unit and the surrounding using a plate 58 is a plate member having an opening in the region facing the flat portion of the lens portion and is opposed to the opening of the flat portion and the flat plate 58 of the surrounding, arranged such flat 58 is located within the cavity K to. Flat 58 Use a pre smaller than the size of the cavity K, is filled with an adhesive 581 between the cavity K and the flat plate 58.

More specifically, as shown in FIG. 11 (a), an adhesive 581 is applied to the lower surface of the plate 58, an adhesive 581, to adhere to the groove portion 28d to form the cavity K, flat 58 and the wafer lens 54 to be pressed against each other.

Furthermore, as shown in FIG. 11 (b), an adhesive 582 is applied to the upper surface of the flat plate 58, while the adhesive 241 is applied to the lower surface of the flat portion 24c of the resin portion 24 of wafer lens 52, the flat plate 58 and the wafer the lens 52 is pressed together. Adhesive 582,241 may use the same photo-curable resin or a thermosetting resin such as an adhesive 281 in the first embodiment described above.

When using a photocurable resin as an adhesive 582,241, as shown in FIG. 12 (a), from above the wafer lens 52 by light irradiation to cure the adhesive 581,582,241, wafer lens 52 , to fix the 54 and the flat plate 58. In this case, the adhesive 581, 582 is cured is filled into the gap between the flat plate 58 and the cavity K.

Thereafter, as in the case of FIG. 8 (b), the adhesive 321 is applied to the lower surface of the non-lens portion 32 b (the groove 32d) of FIG. 12 as shown in (b), the resin portion 32 of wafer lens 54, the wafer the lens 54 and the spacer substrate 56 is pressed together. Thereafter, irradiated with light to cure the adhesive 321 to fix the wafer lens 52 and the spacer substrate 56. This wafer lens laminate 50 is manufactured.

Wafer lens laminate 50 manufactured each glass substrate 16 and 26 by dicing line 62 flat 58 is located a plate 58, by dicing the spacer substrate 56, and the lens block 8 and 10 and the spacer 12 a pair of units which are adhesively laminated is formed with a plurality.

As described above, the resin portion 20,24,28,32 of wafer lens 52, a convex lens portion 20a is an optical surface, 24a, 28a, the non-lens portion 20b on the outer periphery of the 32a, 24b, 28b, and 32b together with the non-lens portion 20b, 24b, 28b, the groove portion 20e to the side wall of the side peripheral surface of the 32 b, 24e, 28d, the other lens portion 20a by 32d, 24a, 28a, are partitioned from 32a, are laminated to each other was in between the wafer lens 52, and the groove 24e of one of the wafer lens 52, into the cavity K formed by the groove 28d of the other wafer lens 54 is disposed a small flat 58 than the cavity K, flat adhesives 581 and 582 is a resin is filled between the 58 and the cavity K. Therefore, to prevent the occurrence of deflection and cracks at the time of dicing and peeling can be prevented between the glass substrate 16, 26 and the resin portion 20,24,28,32 of wafer lens 52,54.

Further, the flat plate 58 is smaller than the size of the cavity K, so to fill the gap between the cavity K and the flat plate 58 with resin adhesive, even when bonding a wafer lens 52 and 54 to each other, the convex lens portion 24a and the concave portion in the heart thickness uniformity in 28a, it is possible to highly accurate wafer lens stack 50.

2 imaging device 4 lens unit (optical unit)
6 sensor unit 8 lens block (first lens block)
10 lens block (second lens block)
12 spacer 14 covers the package (cover member)
16 glass substrate 18 stop 20 resin portion 20a convex portion (first lens portion)
20b non-lens portion 20c inclined portion 20d flat section 20e groove 21 IR cut filter 22 aperture 23 IR cut filter 24a concave portion (second lens unit)
24b non-lens portion 24d flat section 24e groove 26 glass substrate 28 resin portion 28a concave portion (third lens unit)
28b non-lens portion 28c flat section 28d groove 30 stop 32 resin portion 32a convex portion (fourth lens unit)
32b non-lens portion 32c flat section 32d groove 50 wafer lens laminate 52,54 wafer lens 56 spacer substrate 58 flat 100 concave mold 210 first convex resin mold 212 forming part 214 first resin-type substrate 220 second concave resin mold 222 forming part 224 second resin-type substrate 581 adhesive 582 adhesive K cavity J resins

Claims (15)

  1. A first lens block and the first non-lens portion of the periphery of the first lens unit and the first lens unit is formed of a resin on at least one surface of the first glass substrate, at least one surface of the second glass substrate as the second the second non-lens portion and a non-lens portion and the second lens block formed from a resin, said first non-lens portion of the periphery of the second lens unit and the second lens unit is opposed to the an optical unit which is bonded to,
    Exposing at least a portion of the joint portion between the second non-lens portion and the first non-lens unit, a light shielding member having a light-shielding property with respect to the incident light, a side surface of the first and second lens block thereby to form, the shielding member, the first optical unit, characterized by forming the side portion flush with the side surface portion of the second lens block.
  2. The light blocking member, an optical unit according to claim 1, characterized in that said injected into the cavity made in the junction a resin, or a flat plate installed in the cavity portion.
  3. A first lens block and the first non-lens portion of the periphery of the first lens unit and the first lens unit is formed of a resin on at least one surface of the first glass substrate, at least one surface of the second glass substrate as the second the second non-lens portion and a non-lens portion and the second lens block formed from a resin, said first non-lens portion of the periphery of the second lens unit and the second lens unit is opposed to the an optical unit which is bonded to,
    The end surface on the opposite side to the second lens unit and the formed surface of the second non-lens portion of the second lens block is bonded, an opening at a position corresponding to the first and second lens portions a spacer made of glass having,
    Wherein is joined to the other end surface of the spacer, a cover member made of glass, an imaging apparatus, comprising: a sensor unit, an having an imaging elements arranged drives out predetermined distance from said cover member,
    Exposing at least a portion of the joint portion between the second non-lens portion and the first non-lens unit, a light shielding member having a light-shielding property with respect to the incident light, a side surface of the first and second lens block thereby to form, the shielding member includes a feature that forms a side portion flush with said first side surfaces of the second lens block, the side surface portion of the spacer, the side surface portion of the sensor unit imaging device for.
  4. The light blocking member, an imaging apparatus according to claim 3, wherein the resin injected into the cavity made in the joint portion, or a flat plate installed in the cavity portion.
  5. A convex surface directed toward the object side, a first lens portion formed in a part of the resin portion provided on one surface of a first glass substrate, a concave surface facing the image side, the other surface of the first glass substrate a first lens block and a second lens portion formed in a part of the provided resin portion,
    A concave surface facing the object side, a third lens unit which is formed in a part of the resin portion provided on one surface of the second glass substrate, one resin portion provided on the other surface of the second glass substrate and a second lens block with a fourth lens portion formed in part, an optical unit formed by joining a resin portion formed between the second lens unit and the third lens unit,
    A light shielding member having a light-shielding property with respect to the incident light between the resin portion to which the third lens unit and the resin portion in which the second lens portion is formed is formed, the side surface of the first and second lens block thereby forming exposed to, the first optical unit, characterized by forming the side portion flush with the side surface portion of the second lens block.
  6. A convex surface directed toward the object side, a first lens portion formed in a part of the resin portion provided on one surface of a first glass substrate, a concave surface facing the image side, the other surface of the first glass substrate a first lens block and a second lens portion formed in a part of the provided resin portion, a concave surface facing the object side, a part of the resin portion provided on one surface of the second glass substrate a third lens unit which is formed, and a second lens block with a fourth lens portion formed on a part of the resin portion provided on the other surface of the second glass substrate, and the second lens unit an optical unit formed by joining a resin portion formed of the third lens unit,
    A spacer made of glass having a first end surface resin portion to which the fourth lens unit is formed of the second lens block is bonded, the opening position corresponding to the fourth lens unit from said first lens portion,
    The other end surface of the spacer are joined, an imaging apparatus having a cover member made of glass, and a sensor unit having an imaging elements arranged drives out predetermined distance from said cover member,
    A light shielding member having a light-shielding property with respect to the incident light between the resin portion to which the third lens unit and the resin portion in which the second lens portion is formed is formed, the side surface of the first and second lens block thereby forming exposed to, the light shielding member is formed so as to be exposed to the side surface of the first and second lens block, and the first, side of the second lens block, the side surface portion of the spacer substrate, the imaging apparatus characterized by forming the side surface portions of the same surface with the side surface portion of the sensor unit.
  7. Wafer lens in which the resin part is formed to have a plurality of lens portions on the substrate a wafer lens laminate formed by stacking a plurality, at least one of the two wafer lens to be stacked directly,
    Has a non-lens portion wherein the resin portion on the outer periphery of the lens portion,
    The non-lens portion has a structure partitioned from the other of the lens unit by the groove portion for a side wall having its side circumferential surface,
    Between wafer lens stacked together, the grooves and, wafer lens laminate resin into a cavity formed between the wafer lens is characterized in that it is filled to be other lamination of one wafer lens .
  8. Resin filled in the cavity is, wafer lens laminate according to claim 7, characterized in that a black resin having a light-shielding property with respect to the incident light.
  9. Wafer lens laminate according to claim 7 wherein the groove, characterized in that formed on both wafer lens to be laminated.
  10. Wafer lens in which the resin part is formed to have a plurality of lens portions on the substrate a wafer lens laminate formed by stacking a plurality, at least one of the two wafer lens to be stacked directly,
    Has a non-lens portion wherein the resin portion on the outer periphery of the lens portion,
    The non-lens portion has a structure partitioned from the other of the lens unit by the groove portion for a side wall having its side circumferential surface,
    Between wafer lens stacked together, and the groove portion of one of the wafer lenses, in a cavity formed between the other wafer lens, is arranged a small flat than the cavity, between the plate and the cavity wafer lens laminate resin is characterized in that it is filled between.
  11. Wafer lens resin portion is formed with a plurality of lens portions on the substrate a plurality stacked method of manufacturing a wafer lens laminate, at least one of the two wafer lens to be stacked directly,
    It has a non-lens portion of the resin portion of the wafer lens on the outer periphery of the lens portion,
    The non-lens portion has a structure partitioned from the other of the lens unit by the groove portion for a side wall having its side circumferential surface,
    The wafer lens are stacked with each other by arranging,
    And the groove portion of one of the wafer lenses, in a cavity formed between the other wafer lens, a manufacturing method of a wafer lens laminate, characterized in that a resin is filled.
  12. A resin filled in the cavity, the production method of a wafer lens laminate according to claim 11, characterized in that a black resin having a light-shielding property with respect to the incident light.
  13. The wafer lens manufacturing method of a wafer lens laminate according to claim 11, characterized in that it is produced by the step-and-repeat method.
  14. Wafer lens resin portion is formed with a plurality of lens portions on the substrate a plurality stacked method of manufacturing a wafer lens laminate, at least one of the two wafer lens to be stacked directly,
    It has a non-lens portion of the resin portion of the wafer lens on the outer periphery of the lens portion,
    The non-lens portion has a structure partitioned from the other of the lens unit by the groove portion for a side wall having its side circumferential surface,
    The wafer lens are stacked with each other by arranging,
    Wherein said grooves of one of the wafer lenses, in a cavity formed between the other wafer lens, the filling the resin between the flat plate and the cavity together than the cavity to place a small flat method for producing a wafer lens laminate to.
  15. The wafer lens manufacturing method of a wafer lens laminate according to claim 14, characterized in that it is produced by the step-and-repeat method.
PCT/JP2010/068918 2009-11-05 2010-10-26 Image pickup device, optical unit, wafer lens laminated body, and method for manufacturing wafer lens laminated body WO2011055655A1 (en)

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