WO2009149640A1 - 一种热量传递装置 - Google Patents

一种热量传递装置 Download PDF

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Publication number
WO2009149640A1
WO2009149640A1 PCT/CN2009/071984 CN2009071984W WO2009149640A1 WO 2009149640 A1 WO2009149640 A1 WO 2009149640A1 CN 2009071984 W CN2009071984 W CN 2009071984W WO 2009149640 A1 WO2009149640 A1 WO 2009149640A1
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WO
WIPO (PCT)
Prior art keywords
cold plate
heat transfer
chute
slide
transfer device
Prior art date
Application number
PCT/CN2009/071984
Other languages
English (en)
French (fr)
Inventor
敖峰
李志坚
李尧
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2009149640A1 publication Critical patent/WO2009149640A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards

Definitions

  • the present invention relates to a heat conduction technique, and more particularly to a heat transfer device for use in an electronic device such as communication.
  • an effective heat dissipation method is conduction cooling, that is, the heat generating device is in thermal contact with the device casing directly or through other heat conduction paths, and conducts heat to the outer surface of the casing of the device casing to be emitted into the environment. .
  • This type of small telecommunication equipment is usually composed of a plurality of PCB boards inserted into the casing of the casing through slots, and is connected with the backplane connector. In order to facilitate the maintenance of the equipment, the board requirements can be easily inserted or removed from the slot.
  • the prior art uses the wedge locking device shown in FIG. 1 to achieve close contact and convenient insertion and removal of the circuit board and the device housing.
  • the wedge locking device is composed of a screw 1, a moving block 3, and two static blocks. 2, 5 and trigger block 4 composition.
  • the screw 1 is loosened, as shown by the broken line in Fig. 1, the moving block 3 is parallel to the surfaces of the static blocks 2, 5, and the moving block 3 is parallel to the surface of the trigger block 4; the rotating screw 1 triggers the block 4 relative to the static block 2
  • the relative motion with the static block 5 causes the moving block 3 to move upward.
  • the above wedge locking device uses ⁇ , as shown in FIG. 2, the power consuming device 22 on the circuit board 21 is in contact with the cold plate 24 through the thermal conductive adhesive 23, and the wedge locking device 25 is mounted on the edge of the cold plate 24, the device
  • the width of the chute 28 on the casing 27 is slightly larger than the sum of the thickness of the cold plate 24 and the height of the wedge locking device 25, and the circuit board including the cold plate 24 in the unscrewing state of the screw 1 of the wedge locking device 25. 21 can be easily inserted into the slide 28 or pulled out of the slide 28.
  • the screw 1 of the wedge lock device 25 is tightened, and the wedge lock device 25 is The moving block 3 moves upwardly in contact with the slide 28, and generates a reaction force to press the cold plate 24 against the other contact surface 26 of the slide 28 to achieve close contact heat conduction.
  • the cold plate 24 is made of a material having a good thermal conductivity.
  • the power consuming device 23 on the circuit board 21 is generally in contact with the cold plate 24 through the thermal conductive adhesive 22, and the heat generated by the power consuming device 23 is conducted to the edge of the cold plate 24 through the cold plate 24, and the cold plate 24 is in the wedge locking device.
  • the heat is conducted to the runner 28, which is generally integral with the device housing 27 to conduct heat to the device housing 27 for conduction out through the device housing 27. Cooling.
  • the present invention provides a heat transfer device in which a cold plate contacts a bevel chute groove to eliminate thermal resistance between the cold plate and the chute, thereby achieving a better heat dissipation effect.
  • a heat transfer device comprising: a heat conducting wall, a cold plate, and a circuit board fixedly connected to the cold plate; wherein the heat conducting wall is provided with a sloped chute groove, and the cold plate is provided There is a contact end, and the contact end is inserted along the inclined slide channel to fix the cold plate to which the circuit board is fixed.
  • the contact end of the cold plate in the embodiment of the present invention cooperates with the inclined slide channel of the heat conductive wall to make the heat generating device of the circuit board connected to the cold plate
  • the slide has reduced thermal resistance and has good heat dissipation effect, and the device facilitates insertion and removal of the cold plate in the inclined slide channel of the heat conductive wall.
  • the heat transfer device is simple and convenient to use, and no additional locking device is provided, which reduces cost.
  • FIG. 1 is a schematic structural view of a wedge locking device provided by the prior art
  • FIG. 2 is a schematic view of a heat conduction structure provided with a wedge locking device provided by the prior art
  • FIG. 3 is a schematic structural diagram of a heat transfer device according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a ramp slide groove in a heat transfer device according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural view of a TIM filled between a ramp chute and a cold plate according to an embodiment of the present invention
  • FIG. 6 is a schematic structural view of a ramp slide groove of a heat transfer device according to Embodiment 2 of the present invention
  • FIG. 7 is a schematic structural diagram of a sloped chute groove of a heat transfer device according to Embodiment 3 of the present invention
  • FIG. 8 is a schematic structural view of a ramp chute of a heat transfer device according to Embodiment 4 of the present invention
  • FIG. 9 is a schematic structural diagram of a heat transfer device according to Embodiment 5 of the present invention.
  • FIG. 10 is a schematic structural view of a power wrench disposed on a panel of a circuit board according to an embodiment of the present invention.
  • An embodiment of the present invention provides a heat transfer device that can be applied to a small-sized telecommunication device, the heat transfer device including a heat conductive wall, a cold plate, and a circuit board fixedly connected to the cold plate;
  • the wall is provided with a beveled chute groove, and the cold plate is provided with a contact end, and the contact end is inserted along the inclined chute groove to fix the cold plate to which the circuit board is fixed.
  • this embodiment provides a heat transfer device that can be used in a small telecommunications device, the transfer device comprising: a heat transfer wall 33, a cold plate 31, and the cold
  • the circuit board 35 is fixedly connected to the board; wherein, the heat conducting wall 33, the heat conducting wall 33 is provided with a sloped chute groove 32; the cold plate 31 is fixedly connected with the power consumption heat generating device of the circuit board 35 to form an integral component, and the cold plate 31 is provided with The beveled chute groove 32 is matched with the contact end 34, wherein the cold plate 31-end is a panel 36 connected to the circuit board 35, and the assembly formed by the cold plate 31 and the fixedly connected circuit board 35 can pass through the contact end 34.
  • the heat transfer path may be: the power consumption of the circuit board 35 is in contact with the cold plate 31, so that the heat of the power consumption heat generating device is transferred to the cold plate 31; the cold plate 31 passes through the contact end 34 and the heat conducting wall 33.
  • the ramp slide grooves 32 are in contact to transfer heat to the heat transfer wall 33 and then to the surrounding air.
  • the heat conducting wall 33 can be a housing of a communication device.
  • the heat transfer device can be a communication device; or the heat transfer device can also be a frame device.
  • the communication device may be a frame device, and the housing of the frame device may serve as a heat conducting wall 33
  • the housing of the frame device may be provided with a ramp slide groove 32.
  • the ramp chute 32 may include two opposing slides, namely a slide 321 and a slide 32.
  • the chute 321 , the chute 322 and the heat transfer wall 33 constitute a ramp chute groove 32.
  • the heat conducting wall 33 can be provided with a plurality of sloped chute grooves 32 according to the number of components formed by the mounting circuit board 35 and the cold plate 31.
  • the ramp chute 32 may be formed by two opposite chutes 321 disposed on the heat conducting wall 33.
  • the cold plate may be a "[" shaped trough structure, a trough structure on the cold plate
  • the lower end surface is a contact end 34 with the inclined surface chute 32, and a side surface of the contact end 34 may be a sloped surface to form a wide to narrow structure matching the inclined surface chute groove 32;
  • the bevel chute 32 can also be in various forms, as long as the components formed by inserting the circuit board and the cold plate can be compacted, which is advantageous for heat transfer.
  • the inclined slide channel 32 in this embodiment is composed of two complete slides 321 and 322, and the contact ends 34 of the cold plate 31 are matched with each other.
  • the structure forms the inclined plate chute 32 of the cold plate 31 and the heat transfer wall. The contact surface is the most, which can achieve better heat dissipation.
  • the gap between the cold plate 31 and the bevel chute groove 32 may be filled with a flexible heat conductive material.
  • a TIM (thermal interface material) 312 may be added between the chute of the ramp chute 32 and the contact end 34 of the cold plate 31, and the chute and the cold plate of the ramp chute 32 may be made by the TIM. The close contact between the contact ends 34 of the 31 can effectively reduce the thermal resistance of the contact between the cold plate and the slide.
  • the TIM is often filled between the non-inclined chute forming the inclined chute groove and the contact end of the cold plate ( Thermal interface material); where TIM (thermal interface) Material) It is possible to use a metal foil or other wear-resistant material on one side, so that the TIM can withstand a certain number of insertions and removals, and the heat dissipation capability of the structure is not deteriorated due to the destruction of the TIM structure.
  • the PCM (Phase Change Material) TIM is placed between the chute of the ramp chute and the contact end of the cold plate, which can effectively reduce the thermal resistance of the entire transmission structure, and the PCM itself can provide TIM and cold plate. The adhesion between them.
  • This embodiment provides a ramp-shaped chute groove of another structure.
  • the non-inclined slide 41 provided by the heat-conducting wall 44 and the multi-slide corresponding thereto are shown in FIG.
  • the 421, 422, and 423 are formed, wherein the plurality of slides 421, 422, and 423 form an inclined slide, and the inclined slide and the slide 41 form a sloped slide groove.
  • the plurality of slides 421, 422, and 423 form a plurality of contact points in contact with the cold plate 43.
  • the beveled chute groove of this structure can ensure that the contact end of the cold plate 43 is pressed to the chute surface of the chute 41, thereby ensuring the heat dissipation and fixing effect of the cold plate.
  • the other structure of the transfer device is the same as that of the first embodiment.
  • This embodiment provides a ramp type chute groove of another structure.
  • a slide path 51 constituting the slope chute groove, and a heat transfer wall 55 opposite to the side of the slide path 51.
  • a plurality of convex points 521, 522, and 523 (such as elastic protrusions in the form of a mounting stud or the like) are provided, and the plurality of convex points 521, 522, and 523 form a slope, and the formed inclined surface and the slide 41 constitute a sloped slide groove 52.
  • the inclined chute groove is at an angle.
  • the transfer device is simple and convenient to use.
  • the other structure of the transfer device is the same as that of the first embodiment.
  • the inclined surface of the contact end of the cold plate provided in this embodiment is as shown in FIG. 8.
  • a partial protruding point 42 is provided on the inclined surface of the contact end of the cold plate 43, and after the cold plate 43 is inserted into the chute groove 41, a part of the cold plate 43 is provided.
  • the protruding point 42 is in contact with the inclined surface of the slide 41.
  • the other structure of the transfer device is the same as that of the first embodiment.
  • one side of the contact end of the cold plate 43 may be curved, so that the cold plate 43 is inserted into the chute groove 41. Thereafter, the curved surface is in point contact with the chute groove 41.
  • the chute grooves described in the above embodiments are each designed to be inclined as shown in FIG. 1 to at least one of the two chutes of the chute groove to form a wide to narrow bevel chute groove.
  • the inclined ramp can also be provided with two parallel slides on the heat conducting wall, and the slide surface of the slide groove formed by the two parallel slides is arranged as a slope, and the contact end of the corresponding cold plate can also be Designed as a bevel to insert a compression cold plate in a beveled manner.
  • the embodiment provides a cold plate contact end of the structure. As shown in FIG. 9, the contact ends of the flat end of the cold plate 74 are formed in parallel, and the panel 76 connected to the circuit board is provided. There are at least one fixing screw 75, and the sliding path of at least one of the two chutes 71, 73 constituting the inclined chute groove 72 is an inclined chute, so that the opposite two chutes form an angled form. After the cold plate 74 and the circuit board are inserted into the inclined slide channel 72, a gap gradually increases from the inside to the outside between the contact end of the cold plate 74 and the inclined slide groove 72. After the cold plate assembly is inserted, the cold plate assembly is inserted.
  • the fixing screw 53 of the panel 76 connected to the circuit board is screwed inwardly, and the contact end of the cold plate 76 is pressed by the fixing screw 53 to the other slide 71 of the inclined slide channel 72, which is specifically formed in FIG.
  • the contact mode shown in turn causes the cold plate 74 and the assembly formed by the circuit board to be in close contact with the beveled slide channel 72 of the heat conducting wall 77 to achieve conduction heat dissipation.
  • the circuit board-mounted cold plate assembly in the above embodiments is inserted into the ramp slide groove to overcome a certain resistance, and the resistance can be overcome by the screws provided on the panel and the cold plate to which the circuit board is fixed can be fixed.
  • the assembly is fastened to the telecommunications equipment housing, and the resistance can also be overcome by providing a power wrench 81 at a panel commonly used in telecommunications equipment boards, as shown in FIG.
  • the cold plate to which the circuit board is fixed in the heat transfer device is inserted through the contact end of the cold plate along the inclined slide groove, thereby contacting the cold plate with the heat conducting wall, thereby eliminating the The thermal resistance between the cold plate and the inclined slide channel has a good heat dissipation effect.
  • the heat transfer device in the embodiment of the present invention does not need a similar wedge locking device (wedg elock), and the cost is low, and the installation process reduces the operation process and makes the operation more convenient.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

一种热量传递装置
[1] 本申请要求于 2008年 06月 13日提交中国专利局、 申请号为 200820108554.3
、 发明名称为"一种热量传递装置"的中国专利申请的优先权， 其全部内容通过引 用结合在本申请中。
[2] 技术领域
[3] 本发明涉及一种导热技术， 尤其涉及一种应用在通信等电子设备中的热量传递 装置。
[4] 发明背景
[5] 许多小型电信设备出于可靠性的要求 （如防水、 防尘、 防异物掉入等） ， 其外 壳通常要求完全密封 （如室外设备） 或部分密封 （如室内设备） 。 为了降低设 备内部电子器件的工作温度， 一种有效的散热方法就是传导冷却， 即将发热器 件直接或通过其它导热途径与设备外壳热接触， 将热量传导至设备外壳的壳体 外表面从而散发到环境中。
[6] 该类小型电信设备通常由多块 PCB电路板通过槽位插入外壳的壳体内， 与背板 连接器连接组成。 为便于设备的维护， 电路板要求可以方便从槽位插入或拔出
[7] 现有技术釆用如图 1所示的楔形锁紧装置实现电路板与设备壳体的紧密接触与 方便插拔， 该楔形锁紧装置由螺杆 1、 动块 3、 两个静块 2、 5和触发块 4组成。 螺 杆 1旋松状态下， 如图 1中虚线所示， 动块 3与静块 2、 5表面平行， 动块 3与触发 块 4的表面平行； 旋动螺杆 1则触发块 4相对静块 2与静块 5作相对运动， 同吋使得 动块 3向上运动。
[8] 上述的楔形锁紧装置使用吋， 如图 2所示， 电路板 21上的功耗器件 22通过导热 胶 23与冷板 24接触， 楔形锁紧装置 25安装在冷板 24边缘， 设备壳体 27上的滑道 2 8的宽度稍大于冷板 24厚度与楔形锁紧装置 25高度之和， 在楔形锁紧装置 25的螺 杆 1旋松状态下， 包括冷板 24在内的电路板 21可以方便插入滑道 28或从滑道 28内 拔出。 冷板 24插入滑道 28后， 拧紧楔形锁紧装置 25的螺杆 1， 楔形锁紧装置 25的 动块 3向上运动与滑道 28—个面接触， 并产生一个反作用力将冷板 24压紧在滑道 28相对的另一个接触面 26上， 实现紧密接触导热。 冷板 24由导热性能较好的材 料制成。 此吋， 电路板 21上的功耗器件 23—般通过导热胶 22与冷板 24接触， 功 耗器件 23产生的热量通过冷板 24传导到冷板 24边缘， 冷板 24在楔形锁紧装置 25 的作用下与滑道 28接触， 将热量传导到滑道 28， 滑道 28通常与设备壳体 27为一 整体， 从而将热量传导到设备壳体 27上， 通过设备壳体 27传导向外散热。
[9] 发明人在实现本发明的过程中， 发现现有技术至少存在如下问题：
[10] 现有技术中电路板上的功耗器件产生的热量通过冷板传递到冷板的边缘， 冷板 在楔形锁紧装置的作用下与滑道接触， 将热量传导到滑道， 这样电路板上的功 耗器件产生的热量需要经过冷板、 楔形锁紧装置和滑道， 传递路径较长， 导致 冷板与滑道接触的热阻比较大， 散热效果比较差。
[11] 发明内容
[12] 本发明提供一种热量传递装置， 该热量传递装置中的冷板与斜面滑道槽接触， 消除了冷板与滑道之间的热阻， 从而散热效果较好。
[13] 一种热量传递装置， 该热量传递装置包括： 导热壁、 冷板以及与所述冷板固定 连接的电路板； 其中， 所述导热壁设有斜面滑道槽， 所述冷板设有接触端， 所 述接触端沿所述斜面滑道槽插入， 从而将固定有电路板的冷板固定。
[14] 由上述本发明实施例提供的技术方案可以看出， 本发明实施方式中的冷板的接 触端与导热壁的斜面滑道槽配合， 使与冷板连接的电路板的发热器件与滑道减 小了热阻， 散热效果好， 且该装置方便冷板在导热壁的斜面滑道槽内插拔与固 定， 该热量传递装置简单， 使用方便， 不用另外设置锁紧装置， 降低了成本。
[15] 附图简要说明
[16] 图 1为现有技术提供的楔形锁紧装置的结构示意图；
[17] 图 2为现有技术提供的设有楔形锁紧装置的热量传导结构的示意图；
[18] 图 3为本发明实施例提供的热量传递装置的结构示意图；
[19] 图 4为本发明实施例提供的热量传递装置中的斜面滑道槽的结构示意图；
[20] 图 5为本发明实施例中的斜面滑道槽与冷板之间填充 TIM的结构示意图；
[21] 图 6为本发明实施例二提供的热量传递装置的斜面滑道槽的结构示意图； [22] 图 7为本发明实施例三提供的热量传递装置的斜面滑道槽的结构示意图； [23] 图 8为本发明实施例四提供的热量传递装置的斜面滑道槽的结构示意图； [24] 图 9为本发明实施例五提供的热量传递装置的结构示意图；
[25] 图 10为本发明实施例的电路板的面板上设置助力扳手的结构示意图。
[26] 实施本发明的方式
[27] 本发明实施例提供了一种热量传递装置， 可以应用在小型电信设备中， 该热量 传递装置包括导热壁、 冷板以及与所述冷板固定连接的电路板； 其中， 所述导 热壁设有斜面滑道槽， 所述冷板设有接触端， 所述接触端沿所述斜面滑道槽插 入， 从而将固定有电路板的冷板固定。
[28] 由上可以看出， 该热量传递装置中的固定有电路板的冷板通过冷板的接触端沿 该斜面滑道槽插入， 从而使该冷板与该导热壁接触， 从而消除了冷板与斜面滑 道槽之间的热阻， 散热效果较好。
[29] 为便于理解， 下面结合附图和具体实施例进行说明。
[30] 实施例一
[31] 如图 3所示， 本实施例提供了一种热量传递装置， 该热量传递装置可以用在小 型的电信设备中， 该传递装置包括： 导热壁 33、 冷板 31以及与所述冷板固定连 接的电路板 35 ; 其中， 导热壁 33， 导热壁 33设置斜面滑道槽 32; 冷板 31与电路 板 35的功耗发热器件固定连接形成一个整体的组件， 冷板 31设有与所述斜面滑 道槽 32匹配的接触端 34， 其中， 冷板 31—端为与电路板 35连接的面板 36， 所述 冷板 31与固定连接的电路板 35形成的组件通过接触端 34可以方便的在斜面滑道 槽 32内插拔， 从而使固定连接的电路板 35通过冷板 31的接触端 34固定在斜面滑 道槽 32内。 该冷板 31的接触端 34与该斜面滑道槽 32紧密接触， 由于该斜面滑道 槽 32设于该导热壁 33， 因而该电路板 35的功耗发热器件产生的热量能够通过冷 板 31将热量传递至导热壁 33， 从而能够有效地将电路板 35的功耗发热器件产生 的热量散发出去。 其中， 热量传递路径可以为： 电路板 35的功耗发热器件表面 与冷板 31接触， 从而使该功耗发热器件的热量传递到冷板 31 ; 冷板 31通过接触 端 34和导热壁 33的斜面滑道槽 32接触， 从而将热量传递到导热壁 33， 然后散发 到周围空气中。 [32] 其中， 该导热壁 33可以为通信设备的壳体。 该热量传递装置可以为通信设备； 或该热量传递装置也可以为插框设备。
[33] 更进一步， 该通信设备可以为插框设备， 该插框设备的壳体可以作为导热壁 33
， 该插框设备的壳体可以设有斜面滑道槽 32。
[34] 续请参阅图 3， 该斜面滑道槽 32可以包括两条相对的滑道， 即滑道 321和滑道 32
2。 由该滑道 321、 滑道 322和导热壁 33构成斜面滑道槽 32。 其中， 导热壁 33可以 根据需要安装电路板 35与冷板 31形成的组件的数量设置多条斜面滑道槽 32。
[35] 如图 4所示， 斜面滑道槽 32可以是由设置在所述导热壁 33的两条相对的滑道 321
、 322构成， 其中至少一条滑道 322倾斜 （即该滑道与另一滑道不平行） ， 两条 滑道 321、 322之间呈夹角形式， 形成由宽至窄的滑道槽， 与该斜面滑道槽 32配 合的冷板 31边缘的接触端 34的一侧也为斜面结构。
[36] 续请参阅图 3， 其中， 所述的冷板可以为" ["形的槽形结构， 槽形结构冷板的上
、 下端面为与斜面滑道槽 32的接触端 34， 所述接触端 34的一侧面可以为斜面， 形成与所述斜面滑道槽 32匹配的由宽至窄的结构；
[37] 电路板 35与冷板 31形成的组件插入斜面滑道槽 32后， 由于斜面滑道槽 32的两条 滑道 321、 322形成由宽至窄的结构可以很好的压紧冷板 31的接触端 34， 从而实 现热量的传递散发。
[38] 需要说明的是： 斜面滑道槽 32还可以有多种形式， 只要能实现插入电路板与冷 板形成的组件后压紧， 有利于热传递即可。 本实施例中的斜面滑道槽 32是由两 条完整的滑道 321、 322构成， 与冷板 31的接触端 34相互匹配， 该结构形式使冷 板 31与导热壁的斜面滑道槽 32之间的接触面最多， 可以达到较好的散热效果。
[39] 续请参阅图 4， 更进一步， 在冷板 31与斜面滑道槽 32之间的缝隙可以用弹簧片 3 11来填充。
[40] 更进一步， 在冷板 31与斜面滑道槽 32之间的缝隙可以用柔性导热材料填充。 如 图 5所示， 可以在斜面滑道槽 32的滑道与冷板 31的接触端 34之间加入 TIM (热介 面材料） 312， 通过该 TIM使斜面滑道槽 32的滑道与冷板 31的接触端 34之间紧密 接触， 可以有效减小冷板与滑道的接触热阻， 实际中， 常在构成斜面滑道槽的 非倾斜滑道与冷板的接触端之间填充 TIM (热介面材料） ； 其中， TIM (热介面 材料） 可以釆用一面附加金属箔或者其他耐磨受力材料的方式， 使得 TIM能承受 一定次数的插拔， 不至于因为 TIM结构的破坏而导致结构的散热能力恶化。
实际应用中， 釆用 PCM (相变材料） TIM设置在斜面滑道槽的滑道与冷板接触 端之间， 可以有效降低整个传递结构的热阻， 同吋 PCM本身能提供 TIM与冷板之 间的粘合力。
[42] 上述在斜面滑道槽的滑道与冷板的接触端之间加入 TIM (热介面材料） 的方式
， 适用于本发明所有的实施例。
[43] 实施例二
[44] 本实施例提供了另一种结构形式的斜面滑道槽， 具体如图 6所示， 该斜面滑道 槽由导热壁 44设置的一条非倾斜滑道 41和与之对应的多段滑道 421、 422、 423构 成， 其中， 多段滑道 421、 422、 423形成一条倾斜滑道， 该倾斜滑道与所述滑道 41形成斜面滑道槽。 当冷板 43插入该斜面滑道槽中， 所述的多段滑道 421、 422 、 423形成多个与冷板 43接触的接触点。 这种结构的斜面滑道槽可以保证将冷板 43的接触端压紧至滑道 41的滑道面， 进而保证冷板的散热和固定效果， 该传递 装置的其它结构同实施例一。
[45] 实施例三
[46] 本实施例提供了又一种结构形式的斜面滑道槽， 如图 7所示， 构成所述斜面滑 道槽的一个滑道 51， 在该滑道 51—侧相对的导热壁 55设置多个凸起点 521、 522 、 523 (如安装螺柱等形式的弹性凸起等） ， 多个凸起点 521、 522、 523形成斜 面， 所形成的斜面与滑道 41构成斜面滑道槽 52， 该斜面滑道槽呈一定角度。 当 冷板 53的接触端插入所形成的斜面滑道槽 52后， 通过导热壁 55面设置的弹性凸 起点 521、 522、 523将冷板 53压紧至另一侧滑道 51的滑道面。 该传递装置简单， 使用较方便。 该传递装置的其它结构同实施例一。
[47] 实施例四
[48] 本实施例中提供的冷板的接触端的斜面如图 8所示， 在冷板 43的接触端的斜面 设置局部突起点 42， 冷板 43插入滑道槽 41后， 冷板 43的局部突起点 42与滑道 41 斜面接触。 该传递装置的其它结构同实施例一。
[49] 更进一步， 该冷板 43接触端的一侧可以釆用曲面， 这样， 冷板 43插入滑道槽 41 后， 曲面与该滑道槽 41点接触。
[50] 上述各实施例中所述的滑道槽， 均是类似图 1中所示将滑道槽的两条滑道中的 至少一个设计成斜面来实现形成由宽至窄的斜面滑道槽来插入压紧冷板。 更进 一步， 上述斜面滑道也可以在导热壁设置两条平行的滑道， 由该两条平行的滑 道形成的滑道槽的滑道面设置成斜面， 相应的冷板的接触端也可以设计为斜面 ， 来实现以斜面方式插入压紧冷板。
[51] 实施例五
[52] 本实施例提供了一种结构的冷板接触端， 如图 9所示， 冷板 74的接触端两侧边 平行形成平板结构的接触端， 冷板与电路板连接的面板 76设有至少一颗固定螺 钉 75， 构成斜面滑道槽 72的两条滑道 71、 73的至少一条滑道的滑道为倾斜滑道 ， 使相对的两条滑道形成夹角形式。 冷板 74与电路板形成的组件插入斜面滑道 槽 72后在冷板 74的接触端和斜面滑道槽 72之间形成一个从里至外逐渐增大的间 隙， 冷板组件插入后， 将冷板与电路板连接的面板 76的固定螺钉 53向里旋动， 通过该固定螺钉 53将冷板 76的接触端挤压至斜面滑道槽 72的另一滑道 71， 具体 形成图 9中所示的接触方式， 进而使冷板 74及电路板形成的组件与导热壁 77斜面 滑道槽 72紧密接触， 实现传导散热。
[53] 以上各实施例中的固定有电路板的冷板组件插入斜面滑道槽吋要克服一定的阻 力， 可以通过设置于面板上的螺钉来克服这个阻力并将固定有电路板的冷板组 件紧固至电信设备壳体， 也可以通过在电信设备电路板常用的面板处设置助力 扳手 81来克服阻力， 如图 10所示。
[54] 由上可以看出， 该热量传递装置中的固定有电路板的冷板通过冷板的接触端沿 该斜面滑道槽插入， 从而使该冷板与该导热壁接触， 从而消除了冷板与斜面滑 道槽之间的热阻， 散热效果较好。
[55] 更进一步， 本发明实施例中的热量传递装置， 不需要类似楔形锁紧装置 （wedg elock) ， 成本低， 安装吋减少了操作工序， 使操作更方便。
[56] 以上所述的各实施例是为说明本发明的技术方案， 各实施例之间不具有前后的 次序关系， 并且不因各实施例的序号造成任何限制。 各实施例仅为本发明较佳 的具体实施方式， 但本发明的保护范围并不局限于此， 任何熟悉本技术领域的 技术人员在本发明揭露的技术范围内， 可轻易想到的变化或替换， 都应涵盖在 本发明的保护范围之内。 因此， 本发明的保护范围应该以权利要求的保护范围 为准。

Claims

权利要求书
[1] 一种热量传递装置， 其特征在于， 所述热量传递装置包括： 导热壁、 冷板 以及与所述冷板固定连接的电路板； 其中， 所述导热壁设有斜面滑道槽， 所述冷板设有接触端， 所述接触端沿所述斜面滑道槽插入， 从而将固定有 电路板的冷板固定。
[2] 根据权利要求 1所述的一种热量传递装置， 其特征在于， 所述斜面滑道槽为 由设置在所述导热壁的两条相对的滑道构成， 其中至少一条滑道为倾斜滑 道。
[3] 根据权利要求 2所述的装置， 其特征在于， 所述倾斜滑道为多段滑道形成的 倾斜滑道， 所述多段滑道形成多个与所述冷板接触的接触点。
[4] 根据权利要求 1所述的一种热量传递装置， 其特征在于， 所述斜面滑道槽由 一条滑道及设置在导热壁的多个凸起点构成。
[5] 根据权利要求 1或 2所述的一种热量传递装置， 其特征在于， 所述斜面滑道 槽的滑道设有多个突起作为与冷板接触的接触点。
[6] 根据权利要求 1所述的一种热量传递装置， 其特征在于， 所述冷板的接触端 为两侧边平行的平板结构， 冷板与电路板连接的面板至少设置一个固定螺 钉。
[7] 根据权利要求 1或 6所述的一种热量传递装置， 其特征在于， 所述冷板为槽 型结构。
[8] 根据权利要求 1所述的一种热量传递装置， 其特征在于， 所述斜面滑道槽的 两条滑道为平行滑道， 两平行滑道之间的滑道槽的滑道面为斜面。
[9] 根据权利要求 1、 2、 3、 4、 6或 8中任一项所述的装置， 其特征在于， 所述 斜面滑道槽的滑道与冷板的接触端之间设置 TIM热介面材料涂层。
[10] 根据权利要求 9所述的一种热量传递装置， 其特征在于， 所述 TIM热介面材 料涂层设置在斜面滑道槽与冷板的接触端平行的平行滑道。
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