WO2009146694A2 - Elément de refroidissement d’un composant électronique et dispositif équipé d’un composant électronique - Google Patents

Elément de refroidissement d’un composant électronique et dispositif équipé d’un composant électronique Download PDF

Info

Publication number
WO2009146694A2
WO2009146694A2 PCT/DE2009/000795 DE2009000795W WO2009146694A2 WO 2009146694 A2 WO2009146694 A2 WO 2009146694A2 DE 2009000795 W DE2009000795 W DE 2009000795W WO 2009146694 A2 WO2009146694 A2 WO 2009146694A2
Authority
WO
WIPO (PCT)
Prior art keywords
channel sections
group
cooling element
element according
sections
Prior art date
Application number
PCT/DE2009/000795
Other languages
German (de)
English (en)
Other versions
WO2009146694A3 (fr
Inventor
Dirk Lorenzen
Original Assignee
Dirk Lorenzen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dirk Lorenzen filed Critical Dirk Lorenzen
Publication of WO2009146694A2 publication Critical patent/WO2009146694A2/fr
Publication of WO2009146694A3 publication Critical patent/WO2009146694A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Definitions

  • Cooling element for an electronic component and device with an electronic component
  • the invention relates to a cooling element for at least one electronic component, in particular a laser diode or a laser diode bar or stack thereof and a device with an electronic component.
  • a cooling element typically comprises channels, which are arranged in superimposed planes and flowed through by a cooling liquid.
  • the cooling element for cooling the electronic component on the one hand should be as small and compact as possible, but on the other hand allow efficient cooling.
  • Such efficient cooling requires a high heat exchange performance, which in turn can only be achieved with a high coolant throughput.
  • the structural design of the cooling element i. In the arrangement and geometric shaping of the channels running in the interior of the cooling element for supplying and discharging the coolant to the microchannels or of the microchannels, it is therefore desirable to ensure that the pressure drop within the cooling element is sufficient for a given cooling element of the electronic component Coolant flow rate is as low as possible.
  • the multiplicity of known microchannel heat sinks contain different functional levels in a sequence of merged structured layers, wherein the electronic component to be cooled is applied to an upper cover layer, eg by soldering.
  • the layer structure also the functions of the supply and the discharge of the cooling liquid and the actual cooling are accommodated via the microchannels.
  • DE 43 15580 A1 discloses a five-layer microchannel heat sink.
  • the coolant supplied via an inflow is distributed to the microchannels which are located below the diode laser mounted on the cover layer.
  • Via connecting channels in an intermediate layer the cooling liquid is led into a collection plate, from where there is a connection to a drain.
  • a baseplate closes the microchannel heat sink down.
  • the modular structure is in principle suitable for vertical stacking.
  • DE 10047780 A1 provides a device for cooling diode lasers in which the heat transfer coefficient is increased at a low overall height of the device in such a way that the occurring pressure losses also effectively ensure parallel operation of stacked heat sinks in a fluidic manner.
  • the channels in each level are divided into fluidically successive groups connected in series, which open for the succession circuit in common for the superimposed planes fluidic connection links.
  • the groups of channels a first group with a common inflow and another, last downstream group with a common outlet for the cooling liquid in combination.
  • the object of the invention is to disclose a cooling element for an electronic component, in particular a laser diode or a laser diode bar or a stack thereof, in which the flow required to produce a predetermined coolant throughput can be kept low.
  • the invention provides a cooling element for at least one electronic component with at least one receiving surface for the at least one electronic component, which is at least one Part of the width of the cooling element extends and is equipped with at least a first coolant guide structure.
  • the first coolant guide structure comprises a first number of substantially parallel first channel sections which are distributed over the width of the receiving surface and in particular form a microchannel structure, wherein a first part number of the first channel sections of a first group of channel sections and at least a second part number of the first channel sections of a second group of channel sections are assigned.
  • the channel sections of the second group are downstream of the channel sections of the first group.
  • the channel sections of the first and second group of channel sections are coupled to one another such that they can all be flowed through by coolant in the same direction.
  • the assignment of the first and second part numbers of the first channel sections to a first and second group of channel sections and their fluidic succession ensure that the channel sections of the respective group are flowed through in succession by coolant.
  • pressure loss and flow conditions compared to cooling elements, which rely on Strömungssp Dahl- or -Verengung chambers, better avoid.
  • a feed cross section need not be widened / spread to the entire width of the cooling element, in particular not to the entire width of the receiving surface, but depending on the number of first part number of the first channel sections of the first group of channel sections only on the smaller Width.
  • the pressure loss can thereby be reduced in comparison to a conventional arrangement both in the inlet and in the outlet.
  • the pressure loss of an optionally existing riser of a stack of several cooling elements can be reduced.
  • the cooling element according to the invention also has the advantage that it has a reduced thermal resistance compared to known cooling elements with constant coolant flow rate. In other words, when the coolant flow rate is halved, the thermal resistance can be kept constant. The low flow allows for a thinner configuration of the cooling element, whereby a larger number of diode laser elements can be arranged in a stack.
  • a cooling element according to the invention can be combined with known microchannel structures, in particular with so-called cascade coolers, as described, for example, in DE 10047780 A1.
  • a "cascading" is to be understood as meaning the fluidic series connection of adjacent, mutually parallel channel sections. - A -
  • the inventive arrangement and fluidic connection of the channel sections advantageously enforces a spiralfömigen in cross-section of the cooling element flow of the coolant, the fluiddynamic advantages in particular at Generalangro of channel sections of greater than three opposite, for example, a serpentine flow with groupwise alternately opposite directions of flow
  • the refrigerant exiting the first group of passage portions may be supplied to the second group of passage portions via a connection portion in another plane, the width of the connection portion being substantially equal to those of the first and second sets of passage portions.
  • a resulting from the deflection of the coolant from the first to the second group of channel sections pressure loss can be kept so low.
  • parallel channel sections is to be understood as meaning that the longitudinal axes of the (first) channel sections are adjacent to one another and parallel to one another in a direction perpendicular to their longitudinal axes. "Substantially parallel” means that small angular deviations of parallelism is allowed.
  • the distribution of the first channel sections can be made over the entire width of the receiving surface. It is particularly expedient if the first channel sections are distributed over at least 90% of the width. In a preferred variant, the first channel sections can be arranged at an equidistant distance from each other. The first channel sections may also be distributed discontinuously across the width of the receiving surface.
  • the channel sections of the first group of channel sections are adjacent to one another and / or the channel sections of the second group of channel sections are arranged adjacent to one another.
  • the channel sections of the first group of channel sections and / or the channel sections of the second group of channel sections can be flowed through in parallel by coolant.
  • Particularly favorable flow conditions are obtained when a first and a second subgroup of the second group of channel sections are arranged on opposite sides of the first group of channel sections and are connected in parallel in terms of flow.
  • Another concrete embodiment provides that the channel sections of the first group of channel sections are distributed over less than 60% of the width of the receiving surface. As already explained, this does not require that the inlet cross-section be widened to the entire width of the receiving surface of the cooling element, whereby the pressure loss and flow conditions are favored.
  • the cooling element according to the invention has a first recess for the inlet or outlet of the coolant, which is connected to a first group of channel sections and upstream of this flow. Furthermore, a second recess is provided for the outlet or inlet of the coolant, which is connected to the second group of channel sections and is stored downstream of this in terms of flow.
  • first channel sections are formed parallel to Resonatorlteilsachsen of the formed as a laser diode bar electronic component.
  • the first group of channel sections is connected to the first recess via a first connecting section, the first connecting section having at least at one point a width which is less than 60% of the width of the receiving area.
  • the first connecting portion has a portion with a constriction, which has a smaller width than the first recess. The constriction ensures that the coolant flowing out of the first group of channel sections can be supplied via further channel sections to the second group of channel sections,
  • the second group of channel sections is connected to the first group of channel sections via the following connection sections: a second connection section arranged in a first plane in which the first and the second group of channel sections are located and that of the second Group of channel end remote end into the constriction of the first connection portion projects, a third connection portion, which is located in a third plane in which the second recess is disposed, a fourth connection portion, which is located in a second plane, which the second and third connection portion connects to each other, and a fifth connection portion which is located in the second plane and connects the third connection portion with the first group of channel sections.
  • a cooling element according to the invention by the interconnection of the various connecting sections in cross-section, has a spiral-shaped coolant guide structure which makes it possible to improve pressure losses and flow conditions.
  • the second group of channel sections is further coupled to the second recess via a sixth connection section in the third plane.
  • the first to third levels are arranged as layers one above the other and between an upper and lower cover layer. It can be provided that the third connecting portion and / or the sixth connecting portion each have a number of parallel extending second channel sections, which are distributed over the width of the receiving surface. In particular, the number of second channel sections corresponds to the number of first channel sections. This embodiment enables improved heat input into the cooling element.
  • a further embodiment provides that the channel sections of the first group of channel sections and / or the channel sections of the second group of channel sections have a different length.
  • the length of at least two in a group of adjacent channel sections may increase with increasing distance of the channel sections from the respective other group. This version also helps to optimize pressure losses and flow conditions.
  • cooling element has at least one second coolant guide structure having the features of the first coolant guide structure of the type described above.
  • the invention further comprises a device with at least one electronic component, in particular a laser diode or a laser diode bar or stack thereof, which has at least one cooling element of the type described above.
  • the device according to the invention in this case has the same advantages as have been described in connection with the above cooling element.
  • 1a to 1d a first embodiment of a coolant guide structure of a cooling element according to the invention, 2a to 2d, a second embodiment of a coolant guide structure of a cooling element according to the invention, and
  • FIG. 2e shows a cross section through a stackable cooling element with a laser diode bar on a coolant guide structure of the second embodiment
  • Fig. 2f the cooling element of Fig. 2e in a plan view.
  • the illustrated coolant guide structures are incomplete in that their connection to inlets and outlets in the cooling element is not shown.
  • FIG. 1a here shows a plan view of the first coolant-carrying structure, which is composed of the planes arranged one above another in FIGS. 1b, 1c and 1d, lying parallel to one another.
  • Each of the planes shown in FIGS. 1b to 1d may for example be in a layer S1, S2 and S3, which are arranged one above the other between an upper and a lower cover layer.
  • the coolant guide structure described in the exemplary embodiments does not necessarily have to be formed from layers arranged one above the other. Instead, the coolant guide structure may be e.g. be made by molding in the whole. Therefore, when reference is made to layers in the following description, this is not to be construed as limiting.
  • the coolant guide structure KM1 is formed in a good heat-conductive material of the cooling element 1.
  • the edge boundaries of the cooling element 1 are not shown in the present figures, since they are of minor importance to the invention.
  • the cooling element 1 has a receiving surface 2 whose dimensions are marked bA and IA in FIG. 1a.
  • bA denotes the width of the receiving surface 2
  • IA the length of the receiving surface.
  • the receiving surface 2 serves to receive an electronic component, wherein in the region of the receiving surface 2 due to the channel structure of the cooling element 1, a reliable cooling of the electronic component is ensured.
  • the electronic component (not shown) is in particular in particular around a laser diode or a laser diode bar or stacking thereof.
  • the cooling element according to the invention or the coolant guide structure formed therein is in principle also suitable for cooling other and / or a plurality of electronic components.
  • the coolant structure KM 1 has a first number of first channel sections 3 running parallel to one another. These are distributed in the embodiment over the width bA of the receiving surface 2 approximately uniformly, i. the longitudinal axes of two adjacent channel sections 3 each have the same distance from each other.
  • the first channel sections 3 form a microchannel structure. In the exemplary embodiment shown in FIG. 1, a total of 16 first channel sections 3 arranged parallel to one another are shown. In principle, a different number of first channel sections 3 can also be provided.
  • a first part number of eight first channel sections 3 is assigned to a first group 11 of channel sections.
  • a second part number of eight of the first channel sections is associated with a second group 12 of 5 channel sections.
  • the first and second part number of the first channel sections 3, which is assigned to the first and second group 11, 12 of channel sections is selected to be identical. However, this is not mandatory.
  • the channel sections of the first group 11 of channel sections are advantageously distributed over less than 60% of the width bA of the receiving surface 2.
  • the channel sections of the first groups 11, 12 of channel sections have a lower section.
  • the length of at least two in a group 11, 12 adjacent channel sections increases with increasing distance of the channel sections of the other group.
  • this embodiment is not mandatory.
  • the channel sections of one or both groups could be the same length.
  • FIG. 1b The assignment of respective channel sections 3 to the first or the second group 11, 12 can best be taken from FIG. 1b. It can be clearly seen that the eight channel sections of the first group 11 of channel sections are arranged adjacent to each other. Further, the four channel portions of the second group 12 of channel portions are arranged adjacent to each other and provided on the left of the first group 11, while the four channel portions of the second group 12, which are also mutually are adjacent to the right of the first group 11 of channel sections are provided. In this case, the four channel sections of the second group 12 of channel sections, which are arranged in the plan view of the left of the first group 11, a first subgroup 19 of channel sections of the second group 12 and the right of the first group 11 arranged channel sections of the second group 12 form a second subgroup 20 of channel sections.
  • a coolant structure KM1 according to the invention could also be formed only by the part shown on the left or right of the axis of symmetry 10.
  • the channel sections of the first group 11 of channel sections are fluidically connected via a first connecting section 13 with a first recess 4, which forms an inlet.
  • the channel sections of the first group 11 of channel sections can be flowed through in parallel by coolant.
  • the first connecting portion is provided on both sides with a constriction 18, so that the connecting portion 13 has at this point a width b ⁇ , which is less than 60% of the width bA of the receiving surface 2.
  • the first connecting section 13 has a width which is smaller than the width of the first group 11 of channel sections.
  • the width b ⁇ is also smaller than a width bANi of the first recess 4, which is formed by two horseshoe-shaped interconnected chambers and results from the symmetrical shape of the coolant guide structure.
  • the other end of the second connection section 14 is connected to the channel sections of the second group 12 of channel sections, which can be flowed through in parallel by coolant in each of the subgroups 19, 20.
  • the subgroups 19, 20 of the second group 12 of channel sections can also be flowed through in parallel by coolant.
  • a second recess 6, which is designed to be mirrored to the left and to the right of the symmetry axis 10 due to the symmetrical design of the coolant guide structure KM1, can also be seen in the first layer S1.
  • the channel sections of the first group 11 of channel sections in the first layer S1 are coupled via a fifth connecting section 21 in the second layer S2 to a third connecting section 15 in the third layer S3.
  • connection section 15 is fluidly connected via a fourth connection section 16 located in the second layer S2 to the ends of the second connection section 14 projecting into the constriction 18. It follows that the channel sections of the second group 12 are downstream of the channel sections of the first group 11, wherein the channel sections of the first and second groups 11, 12 of channel sections are coupled together in such a way that they (in temporal succession) in the same direction can flow through the coolant.
  • the third connecting portion 15 which extends away from the first recess 4 in the third layer S3, formed as an uninterruptible chamber.
  • the third connection section 15 has a number of parallel channel sections associated with a first group of second channel sections 24.
  • the sixth connection portion 17 which extends away from the second recess 6 in the third layer S3, formed as an uninterruptible chamber.
  • the sixth connection portion 17 has a number of parallel channel portions associated with a second group of second channel portions 24.
  • the second channel sections 24 are distributed over the width of the receiving surface 2 corresponding to the first channel sections 3. 1, the fifth and seventh connecting portions 21 (see Fig.
  • the second channel sections 24 a corresponding shape.
  • FIG. 2e shows a cross-sectional view of a stackable cooling element 1 with a laser diode bar 2a mounted on the receiving surface 2 as an electronic component, wherein the coolant guide structure KM1 of the cooling element 1 according to FIG. 2a is formed. 5
  • FIG. 2f shows the stackable cooling element 1 provided with the laser diode bar 2a in a top view, wherein the uppermost layer (S1) of the internal coolant guide structure KM1 is indicated by dots.
  • An inlet 26 designed as a breakthrough is connected to the inlet 4, and an outlet 27 designed as an opening is connected to the outlet 6. 0
  • FIG. 3 shows a further exemplary embodiment of a cooling element 1, which has two coolant guide structures KM1 and KM2 arranged symmetrically with respect to an axis of symmetry 25.
  • the receiving surface 2 which is virtually square in the exemplary embodiment, is for the or the electronic components, wherein on two opposite sides of the receiving surface 2
  • the coolant guide structure KM1 corresponds in principle to that of the exemplary embodiment in FIG. 1a. The same applies to the coolant guide structure KM2, which is mirrored on the symmetry axis 25.
  • the sixth connecting portion 17 is formed approximately U-shaped to the side of the receiving surface of the second
  • the Ausappeltingen 4 is at least one - not shown - inlet of the cooling element pre-connected.
  • the recesses 6 is at least one - not shown - outlet of the cooling element downstream.
  • first recess e.g., inlet
  • second recess e.g., drain

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)

Abstract

La présente invention concerne un élément de refroidissement (1) d’au moins un composant électronique, en particulier une diode laser ou une barre à diode laser, comportant au moins une surface de logement (2) pour le ou les composants électroniques. La surface de logement (2) s’étend au moins sur une partie de la largeur de l’élément de refroidissement (1) et présente au moins une première structure de conduite du réfrigérant (KM1). La structure de conduite du réfrigérant comprend un premier nombre de premiers segments de canal (3) s’étendant de manière sensiblement parallèle, lesquels sont répartis sur la largeur (bA) de la surface de logement (2) et forment notamment une structure à micro-canaux, un premier nombre partiel des premiers segments de canal (3) étant attribué à un premier groupe (11) de segments de canal et au moins un second nombre partiel des premiers segments de canal (3) étant attribué à un second groupe (12) de segments de canal. Les segments de canal du second groupe (12) sont placés en aval des segments de canal du premier groupe (11) du point de vue de la technique d'écoulement. Les segments de canal du premier et du second groupe (11, 12) de segments de canal sont couplés de telle sorte qu’ils peuvent être tous traversés dans le même sens par le réfrigérant.
PCT/DE2009/000795 2008-06-05 2009-06-05 Elément de refroidissement d’un composant électronique et dispositif équipé d’un composant électronique WO2009146694A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008026856.9 2008-06-05
DE102008026856A DE102008026856A1 (de) 2008-06-05 2008-06-05 Kühlelement für ein elektronisches Bauelement und Vorrichtung mit einem elektronischen Bauelement

Publications (2)

Publication Number Publication Date
WO2009146694A2 true WO2009146694A2 (fr) 2009-12-10
WO2009146694A3 WO2009146694A3 (fr) 2010-09-02

Family

ID=41266751

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2009/000795 WO2009146694A2 (fr) 2008-06-05 2009-06-05 Elément de refroidissement d’un composant électronique et dispositif équipé d’un composant électronique

Country Status (2)

Country Link
DE (1) DE102008026856A1 (fr)
WO (1) WO2009146694A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109794698A (zh) * 2019-04-01 2019-05-24 苏州匠恒智造科技有限公司 一种具有微通道散热装置的激光加工设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051952B (zh) * 2014-07-04 2017-06-16 成都三鼎日新激光科技有限公司 一种内微通道冷却热沉

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5005640A (en) * 1989-06-05 1991-04-09 Mcdonnell Douglas Corporation Isothermal multi-passage cooler
DE19710716A1 (de) * 1997-03-14 1998-09-24 Fraunhofer Ges Forschung Vorrichtung zum Kühlen von elektronischen Bauelementen
DE10047780A1 (de) * 1999-10-21 2001-05-10 Jenoptik Jena Gmbh Einrichtung zur Kühlung von Diodenlasern
EP1271723A2 (fr) * 2001-06-25 2003-01-02 Fanuc Ltd Dispositif de refroidissement
JP2005217033A (ja) * 2004-01-28 2005-08-11 Fuji Electric Systems Co Ltd 放熱器
US20050211418A1 (en) * 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
DE102006023177A1 (de) * 2005-05-18 2007-02-15 National Central University, Chung-Li Planare Wärmeableitungsvorrichtung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4315580A1 (de) 1993-05-11 1994-11-17 Fraunhofer Ges Forschung Anordnung aus Laserdioden und einem Kühlsystem sowie Verfahren zu deren Herstellung
JPH09102568A (ja) * 1995-10-05 1997-04-15 Mitsubishi Electric Corp プレート型ヒートシンク
DE19733455B4 (de) * 1997-08-02 2012-03-29 Curamik Electronics Gmbh Wärmetauscheranordnung sowie Kühlsystem mit wenigstens einer derartigen Wärmetauscheranordnung
JP2005093614A (ja) * 2003-09-16 2005-04-07 Fuji Electric Systems Co Ltd 放熱器
JP2005203560A (ja) * 2004-01-15 2005-07-28 Fuji Electric Systems Co Ltd 放熱器
JP4305253B2 (ja) * 2004-04-06 2009-07-29 富士電機システムズ株式会社 放熱器
US7218519B2 (en) * 2004-06-15 2007-05-15 Intel Corporation Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5005640A (en) * 1989-06-05 1991-04-09 Mcdonnell Douglas Corporation Isothermal multi-passage cooler
DE19710716A1 (de) * 1997-03-14 1998-09-24 Fraunhofer Ges Forschung Vorrichtung zum Kühlen von elektronischen Bauelementen
DE10047780A1 (de) * 1999-10-21 2001-05-10 Jenoptik Jena Gmbh Einrichtung zur Kühlung von Diodenlasern
EP1271723A2 (fr) * 2001-06-25 2003-01-02 Fanuc Ltd Dispositif de refroidissement
US20050211418A1 (en) * 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
JP2005217033A (ja) * 2004-01-28 2005-08-11 Fuji Electric Systems Co Ltd 放熱器
DE102006023177A1 (de) * 2005-05-18 2007-02-15 National Central University, Chung-Li Planare Wärmeableitungsvorrichtung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109794698A (zh) * 2019-04-01 2019-05-24 苏州匠恒智造科技有限公司 一种具有微通道散热装置的激光加工设备

Also Published As

Publication number Publication date
DE102008026856A1 (de) 2009-12-17
WO2009146694A3 (fr) 2010-09-02

Similar Documents

Publication Publication Date Title
EP0828980B1 (fr) Echangeur de chaleur
DE69720506T2 (de) Wärmetauscher
EP0109097B2 (fr) Echangeur de chaleur à plaques
DE2241407A1 (de) Waermetauscher und verfahren zu ihrer herstellung
EP2843348A1 (fr) Echangeur de chaleur à plaques doté de blocs d'échangeur de chaleur reliés par une mousse métallique
EP0978874A2 (fr) Refroidisseur
EP3106823B1 (fr) Échangeur de chaleur
DE102017219433B4 (de) Wärmeübertrager für einen Verbrennungsmotor
DE102005059920B4 (de) Wärmetauscher, insbesondere Verdampfer
DE202021104673U1 (de) Radiator und Kühlvorrichtung
WO2009146694A2 (fr) Elément de refroidissement d’un composant électronique et dispositif équipé d’un composant électronique
DE102019105980B4 (de) Umkehrsammler für ein Kühlsystem einer Traktionsbatterie eines elektrisch betriebenen Fahrzeugs und Kühlsystem für eine Traktionsbatterie
DE3148941A1 (de) Oelkuehler in scheibenbauweise
DE10203239A1 (de) Kühlbaustein
DE10047780B4 (de) Einrichtung zur Kühlung von Diodenlasern
DE102017004671A1 (de) Vorrichtung zum Kühlen, Wärmen oder Wärmeübertragen
WO2004071743A1 (fr) Systeme de refroidissement permettant de refroidir des parties d'outil
DE19853750A1 (de) Kühler zur Verwendung als Wärmesenke für elektrische oder elektronische Komponenten
DE19737247A1 (de) Wärmetauscher mit einer Mehrzahl übereinander gestapelter Wärmetauscherplatten
DE102009024310A1 (de) Vorrichtung mit einer Halbleiterbauelement-Anordnung und einem Kühlelement
EP2871671B1 (fr) Dissipateur thermique
DE102018126802B4 (de) Kühlvorrichtung für ein erstes Elektronikmodul und mindestens ein zweites Elektronikmodul, Versorgungsvorrichtung für eine solche Kühlvorrichtung und Verfahren zum Kühlen eines ersten Elektronikmoduls und mindestens eines zweiten Elektronikmoduls
WO2023051990A1 (fr) Refroidisseur pour l'électronique de puissance de refroidissement
DE102023210867A1 (de) Kühler mit zwei weitgehend parallelen Platten
DE102023105230A1 (de) Heiz- und/oder Kühlmodul

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09757128

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 09757128

Country of ref document: EP

Kind code of ref document: A2