WO2009135737A1 - Elektrische bondverbindungsanordnung - Google Patents
Elektrische bondverbindungsanordnung Download PDFInfo
- Publication number
- WO2009135737A1 WO2009135737A1 PCT/EP2009/053987 EP2009053987W WO2009135737A1 WO 2009135737 A1 WO2009135737 A1 WO 2009135737A1 EP 2009053987 W EP2009053987 W EP 2009053987W WO 2009135737 A1 WO2009135737 A1 WO 2009135737A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bond
- electrical
- bonding
- electrical conductor
- connection
- Prior art date
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Definitions
- the invention relates to an electrical bond connection arrangement between a first electrical contact surface and a second electrical contact surface according to the preamble of claim 1.
- the object of the invention is to provide an electrical bond connection arrangement between two electrical contact surfaces, which ensures a high current carrying capacity in a relatively small space with simple production.
- an electrical bond connection arrangement between a first electrical contact surface and a second electrical contact surface is proposed, with at least one, first electrical conductor, which is bonded to at least one of the contact surfaces by means of at least one first bonding compound. It is provided that at least one further, second electrical conductor is bonded to the first electrical conductor by means of at least one second bond connection, the two bond connections being offset from one another.
- the first contact surface is formed, for example, in the region of the electronic chip, whereas the second contact surface is formed, for example, on a copper side on the circuit board side. Both contact surfaces are electrically isolated from each other and are bridged over the bond connection arrangement.
- the first electrical conductor is bonded by means of the bonding connection on at least one of the contact surfaces (on the other contact surface, it may for example be attached in another way and electrically conductively connected).
- the connections known in the prior art is that at least one further, second electrical conductor is bonded to the first electrical conductor by means of the second bonding connection. Both bonds are offset from each other here. This means that the bond line connecting the first electrical conductor to the respective one
- At least one of the conductors is formed as a ribbon bond.
- Ribbon bonds are known in the art, preferably such ribbon bonds are used here, which do not have, as usual in the prior art, a square cross-section, but a substantially rectangular. This brings procedural advantages in the course of the bonding process, since the bond connection can be made simpler and more reliable if there is a smaller cross-sectional area between bonding tool and contact surface in vertical extension.
- at least one of the bond connections is a flat or a line-shaped bond connection. The bond between the conductor and the contact surface is therefore carried out flat or linear.
- the bond connections on the ribbon bonds are in the form of contact strips running transversely to the strip longitudinal extent, which contact strips lie offset in the strip longitudinal direction.
- a first bonding connection, a bonding foot is formed on the first electrical conductor, which is designed as a ribbon bond, and is slightly spaced apart in its band longitudinal extension, another, second bond foot.
- the second electrical conductor which is preferably likewise designed as a ribbon bond, is bonded to the first ribbon bond by means of a further bond, wherein this bond, the third bond foot, is in a region between the first and second bond formed on the first ribbon bond, so that at its attachment neither the first nor the second bond foot of the first ribbon bond is replaced again from the contact surface.
- the bonding connections are preferably designed as ultrasonic bonding connections and / or thermal bonding connections. Consequently, it is preferred to use devices and tools known from the prior art which are present in the respective production facilities in order to produce the bond connection arrangements according to the invention, so that the advantages of the bond connection arrangement according to the invention can be used without significant investments.
- the process technology is implemented by software, wherein given two points, as provided in the prior art, are computationally supplemented by the further points required for producing the bond connection arrangement.
- a further step is provided, in which at least one further, second electrical conductor is bonded to the first electrical conductor by means of at least one second bond such that the two bonds are offset from one another.
- the method is carried out in such a manner that the following steps are carried out:
- the bond connections are formed in the longitudinal extension of the electrical conductors offset from one another, so to speak in a sequential order. As a result, it is very reliably avoided that already existing bond connections loosen when bonding one of the following bond connections.
- the bond connections are formed so that the third bond connection, viewed in the longitudinal direction, is placed between the first and the second bond connection.
- the first and the second bond connection are accordingly, as the first and second bonding feet, spaced successively on the first conductor, wherein they electrically connect and fix the first conductor to the first contact surface.
- the second electrical conductor is bonded onto the first electrical conductor by means of the third bonding connection, the third bonding connection being viewed in the longitudinal direction between the first and the second bond. This allows a very good current carrying capacity with high process reliability of the production.
- third bond connection is offset relative to the first and second bond connection, which are formed on the first electrical conductor.
- Figure a bond connection arrangement with two electrical conductors.
- the figure shows a bond connection arrangement 1 between a first electrical contact surface 2 and a second electrical contact surface 3.
- the first electrical contact surface 2 is in this case, for example, a semiconductor device 4 associated, whereas the second electrical contact surface 3 is a copper surface 5 for HeidelbergungsAuthtechnik.
- electrical conductors 6, namely ribbon bonds 7, are arranged to produce the bond connection arrangement 1.
- the ribbon bonds 7 are bonded to the electrical contact surfaces 2, 3, in particular by means of ultrasonic or thermobonding.
- the electrical conductors 6, one, namely the first electrical conductor 8, first applied, whereas the second electrical conductor 9 is not bonded to the electrical contact surfaces 2, 3, but on the first electrical conductor 8.
- the first electrical conductor 8 is on the first electrical contact surface 2 by means of two bonds 10, each forming the bonding feet 11, applied, namely a first bonding compound 12 and a second bonding compound 13, which, viewed in the longitudinal extension I of the first electrical conductor 8, offset, namely offset in longitudinal extension to each other lie.
- the second electrical conductor 9 is bonded to the first electrical conductor 8, namely with a third Bonded connection 14 in an interconnection region 15 bonded.
- the first bonding connection 12 and the second bonding connection 13 are spaced from one another in the longitudinal extent I of the first electrical conductor 8, whereby the interconnection region 15 is formed between them, to which the third one
- Bond connection 14 of the second electrical conductor 9 is applied.
- the bonding of the bonds 10 is performed by a bonding tool 16, which is shown here only very schematically.
- the procedure is accordingly for the second electrical contact surface 3.
- the bonding tools 16 known from the prior art a high-current load-bearing, cost-effective bond connection arrangement 1 can be produced, wherein the space problems and process problems known from the prior art are avoided by using large cross-sectional heights (in particular by square cross sections) of the electrical conductors.
- the offset and spaced-apart arrangement of the bonding connections 10, namely the first bond connection 12 and the second bond connection 13, creates sufficient space for the access of the bonding tool 16, in particular also for the disconnection / cutting of the endless supply, which is not shown here Material of the electrical conductor 6. This can be ensured that when producing the third
- Bonding 14 on the first electrical conductor 8 upon application of the second electrical conductor 9 no damage occurs, whereby the fully automatic series production is made possible at a relatively high speed.
- this arrangement is very meaningful, because a mechanical damage of already performed bond connections 10 , in particular the first and second bond connection 12, 13, when cutting off the material of the electrical conductor 6, namely the second electrical conductor 9, after production of the third bonding compound 14 is prevented; Likewise, unwanted thermal or ultrasonic influences are prevented or at least minimized.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009801163056A CN102017112B (zh) | 2008-05-09 | 2009-04-03 | 电气压焊连接装置 |
EP09741955A EP2277196A1 (de) | 2008-05-09 | 2009-04-03 | Elektrische bondverbindungsanordnung |
US12/736,711 US8181845B2 (en) | 2008-05-09 | 2009-04-03 | Electrical bond connection system |
JP2011507857A JP5415525B2 (ja) | 2008-05-09 | 2009-04-03 | 電気的なボンディング接続構造 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008001671A DE102008001671A1 (de) | 2008-05-09 | 2008-05-09 | Elektrische Bondverbindungsanordnung |
DE102008001671.3 | 2008-05-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009135737A1 true WO2009135737A1 (de) | 2009-11-12 |
Family
ID=40688517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2009/053987 WO2009135737A1 (de) | 2008-05-09 | 2009-04-03 | Elektrische bondverbindungsanordnung |
Country Status (6)
Country | Link |
---|---|
US (1) | US8181845B2 (de) |
EP (1) | EP2277196A1 (de) |
JP (1) | JP5415525B2 (de) |
CN (1) | CN102017112B (de) |
DE (1) | DE102008001671A1 (de) |
WO (1) | WO2009135737A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015146393A (ja) * | 2014-02-03 | 2015-08-13 | カルソニックカンセイ株式会社 | 超音波ウェッジボンディング構造 |
DE102014205221A1 (de) * | 2014-03-20 | 2015-09-24 | Zf Friedrichshafen Ag | Anordnung zur elektrischen Verbindung mit Wärmedehnungsausgleich |
GB2537895B (en) * | 2015-04-30 | 2021-06-30 | Global Invacom Ltd | Connector and assembly including the same |
DE102018109837B4 (de) * | 2018-04-24 | 2019-11-07 | Te Connectivity Germany Gmbh | Leitungsanordnung und Verfahren zur Herstellung einer Leitungsanordnung |
US11908823B2 (en) * | 2021-01-11 | 2024-02-20 | Wolfspeed, Inc. | Devices incorporating stacked bonds and methods of forming the same |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01268038A (ja) * | 1988-04-19 | 1989-10-25 | Sanyo Electric Co Ltd | ワイヤボンディング方法とボンディングツール及び半導体装置 |
DE10065722C1 (de) * | 2000-12-29 | 2002-04-04 | Bosch Gmbh Robert | Verfahren zur Herstellung einer elektrischen Verbindung und Vorrichtung mit einer elektrischen Verbindung |
US20040217488A1 (en) * | 2003-05-02 | 2004-11-04 | Luechinger Christoph B. | Ribbon bonding |
DE10324069A1 (de) * | 2003-05-27 | 2004-12-23 | Infineon Technologies Ag | Schaltungsanordnung und Verfahren zur leitenden Verbindung von Kontaktflecken bei Halbleiterchips |
US20050258538A1 (en) * | 2004-05-20 | 2005-11-24 | Texas Instruments Incorporated | Double density method for wirebond interconnect |
WO2006007825A2 (de) * | 2004-07-19 | 2006-01-26 | Infineon Technologies Ag | Halbleiter und verfahren zu dessen herstellung |
US20060186554A1 (en) * | 2005-02-10 | 2006-08-24 | Ralf Otremba | Semiconductor device with a number of bonding leads and method for producing the same |
DE102006025867A1 (de) * | 2006-06-02 | 2007-12-06 | Robert Bosch Gmbh | Bondverbindung sowie Verfahren zum Bonden zweier Kontaktflächen |
Family Cites Families (9)
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US3911567A (en) | 1973-04-06 | 1975-10-14 | Fischer Ag Georg | Method of manufacturing an electric conductor of metal strips |
US4513355A (en) | 1983-06-15 | 1985-04-23 | Motorola, Inc. | Metallization and bonding means and method for VLSI packages |
JP3585791B2 (ja) | 1999-11-04 | 2004-11-04 | Necトーキン株式会社 | 固体電解コンデンサ用陽極体の製造方法及びその製造方法に用いられる連続焼結装置 |
US6653723B2 (en) * | 2002-03-09 | 2003-11-25 | Fujitsu Limited | System for providing an open-cavity low profile encapsulated semiconductor package |
US20060163315A1 (en) * | 2005-01-27 | 2006-07-27 | Delsman Mark A | Ribbon bonding tool and process |
DE102005004649A1 (de) | 2005-02-02 | 2006-08-10 | Panta Gmbh | Flachleiter-Bandkabel |
DE102005030247B4 (de) * | 2005-06-29 | 2009-06-04 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Verbindungselementen hoher Stromtragfähigkeit |
JP4612550B2 (ja) * | 2006-01-17 | 2011-01-12 | 超音波工業株式会社 | パワーデバイス用ボンディングリボンおよびこれを用いたボンディング方法 |
JP5017990B2 (ja) * | 2006-09-28 | 2012-09-05 | 富士電機株式会社 | 半導体装置およびその配線接合方法 |
-
2008
- 2008-05-09 DE DE102008001671A patent/DE102008001671A1/de not_active Withdrawn
-
2009
- 2009-04-03 CN CN2009801163056A patent/CN102017112B/zh active Active
- 2009-04-03 JP JP2011507857A patent/JP5415525B2/ja active Active
- 2009-04-03 WO PCT/EP2009/053987 patent/WO2009135737A1/de active Application Filing
- 2009-04-03 US US12/736,711 patent/US8181845B2/en active Active
- 2009-04-03 EP EP09741955A patent/EP2277196A1/de active Pending
Patent Citations (8)
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JPH01268038A (ja) * | 1988-04-19 | 1989-10-25 | Sanyo Electric Co Ltd | ワイヤボンディング方法とボンディングツール及び半導体装置 |
DE10065722C1 (de) * | 2000-12-29 | 2002-04-04 | Bosch Gmbh Robert | Verfahren zur Herstellung einer elektrischen Verbindung und Vorrichtung mit einer elektrischen Verbindung |
US20040217488A1 (en) * | 2003-05-02 | 2004-11-04 | Luechinger Christoph B. | Ribbon bonding |
DE10324069A1 (de) * | 2003-05-27 | 2004-12-23 | Infineon Technologies Ag | Schaltungsanordnung und Verfahren zur leitenden Verbindung von Kontaktflecken bei Halbleiterchips |
US20050258538A1 (en) * | 2004-05-20 | 2005-11-24 | Texas Instruments Incorporated | Double density method for wirebond interconnect |
WO2006007825A2 (de) * | 2004-07-19 | 2006-01-26 | Infineon Technologies Ag | Halbleiter und verfahren zu dessen herstellung |
US20060186554A1 (en) * | 2005-02-10 | 2006-08-24 | Ralf Otremba | Semiconductor device with a number of bonding leads and method for producing the same |
DE102006025867A1 (de) * | 2006-06-02 | 2007-12-06 | Robert Bosch Gmbh | Bondverbindung sowie Verfahren zum Bonden zweier Kontaktflächen |
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Also Published As
Publication number | Publication date |
---|---|
JP2011520276A (ja) | 2011-07-14 |
US8181845B2 (en) | 2012-05-22 |
DE102008001671A1 (de) | 2009-11-12 |
CN102017112B (zh) | 2013-06-19 |
CN102017112A (zh) | 2011-04-13 |
JP5415525B2 (ja) | 2014-02-12 |
EP2277196A1 (de) | 2011-01-26 |
US20110121059A1 (en) | 2011-05-26 |
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