WO2009121330A2 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage Download PDF

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Publication number
WO2009121330A2
WO2009121330A2 PCT/DE2009/000400 DE2009000400W WO2009121330A2 WO 2009121330 A2 WO2009121330 A2 WO 2009121330A2 DE 2009000400 W DE2009000400 W DE 2009000400W WO 2009121330 A2 WO2009121330 A2 WO 2009121330A2
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
light modules
light
radiation
emitting semiconductor
Prior art date
Application number
PCT/DE2009/000400
Other languages
German (de)
English (en)
Other versions
WO2009121330A3 (fr
Inventor
Ludwig Plötz
Horst Varga
Thorsten Kunz
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2009121330A2 publication Critical patent/WO2009121330A2/fr
Publication of WO2009121330A3 publication Critical patent/WO2009121330A3/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F21V23/0457—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor sensing the operating status of the lighting device, e.g. to detect failure of a light source or to provide feedback to the device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2360/00—Aspects of the architecture of display systems
    • G09G2360/14—Detecting light within display terminals, e.g. using a single or a plurality of photosensors
    • G09G2360/145—Detecting light within display terminals, e.g. using a single or a plurality of photosensors the light originating from the display screen
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/3406—Control of illumination source
    • G09G3/342—Control of illumination source using several illumination sources separately controlled corresponding to different display panel areas, e.g. along one dimension such as lines
    • G09G3/3426—Control of illumination source using several illumination sources separately controlled corresponding to different display panel areas, e.g. along one dimension such as lines the different display panel areas being distributed in two dimensions, e.g. matrix

Definitions

  • the invention relates to a lighting device.
  • An object of at least one embodiment is to provide a lighting device with a brightness control.
  • An object of at least one further embodiment is to specify a lighting device with a heat regulation.
  • Lighting devices are characterized in the dependent claims and will be further apparent from the following description.
  • the disclosure of the claims is hereby explicitly incorporated by reference into the description.
  • a lighting device comprises
  • Radiation-emitting semiconductor devices is arranged in a plurality of rows, wherein
  • Control device is assigned to control the brightness of the respective light module
  • Each of the plurality of light modules is associated with a sensor unit for determining at least one measured value, comprising the brightness of the plurality of radiation-emitting semiconductor components of the respective light module.
  • Light module can here and below mean an arrangement of the plurality of radiation-emitting semiconductor components in groups, partial areas, fields or so-called “local dimming areas”.
  • Physical or “multiple” may refer to a number, such as light modules or radiation-emitting semiconductor devices, that is greater than or equal to two, here and below.
  • first device such as a plurality of light modules
  • second device such as a carrier
  • first device is directly in direct mechanical and / or electrical contact with the second
  • first device is arranged indirectly "on” the second device. It can then other devices be arranged between the first and the second device.
  • a light module is arranged on the carrier can furthermore mean that the carrier is suitable and intended to carry the light module.
  • the light module can be arranged flat on the carrier.
  • the light module and the carrier can also interlock.
  • the carrier may also partially enclose the light module, for example in edge regions of the light module.
  • a row with a plurality of elements may here and below mean an arrangement of the elements along a line extension direction, that is to say a linear arrangement of the elements or an arrangement of the elements along a curved line.
  • a plurality of lines can be arranged such that the
  • Row extents are parallel to each other and that elements of different rows are arranged in columns.
  • An arrangement of a plurality of rows each having a plurality of elements may particularly preferably mean a matrix-like arrangement of the elements.
  • the rows and columns do not necessarily have to be perpendicular to each other.
  • the matrix-like arrangement may have a rectangular, square or hexagonal arrangement of elements.
  • each of the light modules is associated with a control device and a sensor unit, which may advantageously mean that each of the multicellular light modules individually through the respective control device can be controlled.
  • a control device can regulate the brightness of each light module individually by the control device reacting to the at least one measured value, which was determined by the sensor unit.
  • the measured value is determined by the respective sensor unit which is assigned to each of the plurality of light modules.
  • the brightness of a light module corresponds to a measure of the light output and / or light intensity emitted by the semiconductor components of the light module. Accordingly, a so-called actual value for the brightness of each light module can be determined by the sensor unit of each light module, which is compared by the control device with a given target value. Accordingly, a specific brightness value, which is based on the desired value, can be set for each of the light modules by the control device.
  • the control device may be adapted to correct a difference between the actual value and the target value of the brightness of the individual light modules and to synchronize the respective brightness of a plurality of the light modules.
  • radiation may mean electromagnetic radiation having at least one wavelength or one spectral component in an infrared to ultraviolet wavelength range, in particular infra-red, visible and / or ultraviolet electromagnetic radiation be.
  • a “desired value” here and below may denote a command or target variable or a measured value to be achieved, for example for the brightness, which is reached in a control loop and is to be maintained by a controller, such as a control device.
  • Value here and below may mean a controlled variable such as, for example, a measured value currently determined for the brightness of a single light module. If the actual value deviates from the desired value, an attempt is made to eliminate this so-called control difference by means of the controller.
  • the sensor unit can furthermore be arranged between two rows of the plurality of radiation-emitting semiconductor components.
  • the multicellularly arranged radiation-emitting semiconductor components of a light module can be arranged uniformly spaced from the sensor unit on each light module.
  • the light modules may have a polygonal shape or be circular in shape, so that the radiation-emitting semiconductor components on the light module have the same distance as possible from the sensor unit.
  • the sensor unit can preferably be arranged centrally between the individual radiation-emitting semiconductor components, so that the radiation-emitting components can have a uniform spacing from the sensor unit.
  • the polygonal shape of the light modules preferably a rectangular, a square or a hexagonal shape, may be advantageous, since this can enable a more efficient arrangement of the light modules on the carrier and thus a more cost-effective mode of production.
  • a polygonal shape and in particular a rectangular, a square or a hexagonal shape of the light modules may be preferable, since this may allow an arrangement of the radiation-emitting semiconductor components in a matrix form on the light module.
  • the multi-line radiation-emitting semiconductor components can also be controlled or driven on the light module in rows and columns (so-called 2D dimming).
  • 2D dimming Such a summary of radiation-emitting semiconductor components to light modules can be used for example in a backlight application.
  • each control device of each light module can be suitable for imparting an operating current to each of the radiation-emitting semiconductor components of the respective light module and for regulating this as a function of the at least one measured value determined by the sensor unit of the respective light module.
  • each control device is designed as a driver.
  • the sensor unit and the control device may further be components of a control loop.
  • a control loop represent a feedback system having a controller, such as the control device, which in feedback with the sensor unit the Operating current through each of the radiation-emitting semiconductor devices controls.
  • the illumination device may comprise a heat-regulating device for heat regulation of the plurality of radiation-emitting semiconductor components of the respective light module.
  • a heat-regulating device may have features and / or feature combinations which are described below.
  • the carrier, the light modules and the semiconductor devices may include features and / or feature combinations that are described below.
  • a lighting device comprises
  • a heat-regulating device for heat regulation of the plurality of radiation-emitting semiconductor components of the respective light module.
  • the light modules can be arranged on a common support so that the individual light modules can influence one another thermally.
  • a thermal influence may be possible, for example, by a heat conduction between the light modules through partial regions of the carrier.
  • the arrangement of the heat-regulating device allow thermal decoupling of the light modules from each other, so that they can be treated as isothermal in itself.
  • the thermal decoupling can for example be made possible by the fact that a heat conduction between two light modules in comparison to known
  • Lighting devices is reduced or prevented.
  • a heat conduction path between two light modules can be achieved, which has a lower thermal conductivity compared to known lighting devices.
  • the heat-regulating device can also enable the dissipation of the heat generated at the radiation-emitting semiconductor components away from the light modules.
  • Semiconductor devices represent heat sources that may have different brightness levels during operation.
  • the different brightnesses can lead to different thermal states of the radiation-emitting semiconductor components.
  • radiation-emitting semiconductor components such as light-emitting diodes, which emit light having a red color spectrum
  • thermal interference with one another may be disadvantageous since the thermal Influencing can lead to color distortions and brightness differences of the red LEDs.
  • a derivation of the heat generated by the heat source by means of such a heat-regulating device can thereby allow a thermal influence adjacent to arranged on different light modules radiation-emitting semiconductor components largely omitted.
  • a thermal control device may include a thermal insulator that thermally isolates at least two of the plurality of light modules from each other. Such a thermal insulator can thus thermally decouple the at least two light modules from one another, so that these light modules, which can represent, for example, subregions of a backlight back wall, can not be thermally influenced.
  • Thermal insulation and “thermally decoupling” can mean here and below that the heat flow or heat input from a first light module to another, for example adjacent, second light module is reduced or completely prevented compared to known lighting devices that the operating state
  • the brightness of the second light module is at least substantially or not at all influenced by the first light module.
  • This may mean that, for example, a difference in the brightness or a difference in the operating current impressed in each case on the semiconductor components, which may exist between the at least two of the plurality of light modules, results in different thermal ones States of the individual light modules can lead. Due to the thermal insulation of the individual light modules from each other, a mutual thermal influence of the light modules can be prevented or at least reduced.
  • the thermal insulator may be formed of a thermally non-conductive material, for example of a plastic such as a thermoplastic or a thermoset or a combination of these. Furthermore, it may be advantageous in the embodiment of the thermal insulator if such a plastic additionally has reflective properties in order to prevent or at least reduce absorption losses. As such a reflective plastic, it is possible to use, for example, the material from the material group of polybutylene terephthalate (PBT) available under the brand name POCAN from Bayer. Additionally or alternatively, combinations of other polyester materials, combinations of thermoplastics or combinations of thermally nonconductive plastics are conceivable, which have reflective properties.
  • PBT polybutylene terephthalate
  • the thermal insulator can be arranged between at least two light modules. Furthermore, a thermal insulator can be arranged between in each case two light modules arranged adjacently on the support.
  • a thermal insulator may, for example, be designed as a web which is arranged on the carrier or is formed in the carrier.
  • the bridge can be a thermal Decoupling of two adjacent arranged light modules, each with different brightness states, which lead to different thermal states of the individual light modules, allow by reducing the heat conduction between the light modules.
  • the carrier itself can also be embodied as a heat-regulating device and in particular as a thermal insulator, in that the carrier is made of a thermally nonconductive material, for example of one of the plastics already described or of another thermally non-conductive material, such as, for example Polyvinyl chloride can be selected, is formed.
  • the carrier is arranged as a thermal insulator between the at least two light modules and the two light modules are designed, for example, each as printed circuit boards.
  • thermal insulator may be advantageous in such an embodiment of the thermal insulator as a bridge between the at least two light modules when the thermal insulator is formed such that no shading of the radiation-emitting semiconductor components and thus no reduction in the light emission caused thereby occurs due to the thermal insulator.
  • the thermal insulator may have a thinning, an incision, a recess, a notch or a taper of the carrier between two light modules.
  • this may mean that the cross section of the carrier through the thinning, the incision, the recess, the Notch or is reduced by the taper and thereby the at least two light modules in the sense described above are thermally isolated from each other.
  • Such an embodiment of the thermal insulator can allow the thermal path between two light modules to be tapered by the reduced carrier cross-section and thus impedes, ie prevents or at least reduces, heat transfer between the two light modules.
  • a particularly preferred embodiment of the reduced carrier cross-section between the two of the plurality of light modules may be in the form of an air bridge or in an air gap.
  • the carrier may preferably be designed as a printed circuit board, which may have on one of the plurality of light modules side facing electrical contacts for making electrical contact with the arranged on the light modules radiation-emitting semiconductor devices.
  • the carrier embodied as a printed circuit board can comprise, for example, an electrically insulating main body such as a glass fiber fabric with an epoxy coating, wherein the electrical contacts arranged on one of the plurality of light modules can be embodied as printed conductors. Accordingly, the radiation-emitting semiconductor components of each light module can be electrically contacted via the conductor tracks on the printed circuit board.
  • the carrier can also be designed as a metal core board.
  • the carrier may be inelastic or designed as a flexible printed circuit board.
  • the printed circuit board may comprise a flexible main body made of a flexible, electrically insulating material such as polyimide, Polyethylene naphthalate or polyethylene or may contain at least one of these materials. On the main body electrical conductors can be structured.
  • the flexible printed circuit board can be designed, for example, as a flexible printed circuit board (Printed Flex Board).
  • the circuit board is designed so flexible that it can be rolled up. This may mean that the circuit board is in a "roll-to-roll" process with the radiation-emitting
  • Semiconductor devices can be populated.
  • the populated circuit board is then preferably also rolled up again.
  • the majority of the light modules can also be designed as printed circuit boards and in each case have all the features and combinations described for printed circuit boards.
  • the thermal insulation of at least two light modules can be formed in that the at least two light modules on the support with a distance of greater than or equal to 5 mm to less than or equal to 50 mm, preferably with a distance of greater than or equal to 20 mm to less than or equal to 30 mm, adjacent to each other.
  • the distance between the two of the plurality of light modules should be suitable for thermally separating the two light modules from one another.
  • the heat-regulating device can dissipate the resulting heat alternatively or additionally.
  • the heat-regulating device may comprise a heat sink which is emitted on one of the plurality of radiation-emitting Semiconductor components facing away from the surface of the light modules or the carrier is arranged.
  • a "heat sink” may here and hereinafter designate a thermodynamic environment with a high heat capacity and be further characterized in that it is able to maintain a quasi-stationary temperature state with a high heat absorption (Through) conductivity of the material of the heat sink to be characterized.
  • a metal layer such as a bottom plate made of aluminum or another metal such as copper or silver, or a metal foil may be used as the heat sink disposed on the surface of the light modules or the carrier facing away from the radiation-emitting semiconductor devices.
  • a metal foil or metal layer can absorb and dissipate the heat of the radiation-emitting semiconductor components in order to keep the carrier and the light modules arranged thereon at a quasi-stationary temperature.
  • the metal foil may, for example, be glued, printed, stamped or painted onto the surface of the light modules or of the carrier facing away from the majority of the radiation-emitting semiconductor components.
  • the heat sink arranged on a surface of the light modules or of the carrier facing away from the radiation-emitting semiconductor components can be arranged over the whole area according to a further embodiment. This can allow the largest possible dissipation of the heat generated.
  • the heat sink may comprise a heat sink or be designed as a heat sink.
  • a metal block applied on the side of the carrier remote from the majority of the light modules is conceivable, a metal layer or a bottom plate made of aluminum or of another thermally conductive metal such as copper or silver.
  • Such a heat sink may additionally have surface structures, such as roughenings, a waviness or a rib structure with cooling fins, fins and / or fins for cooling and by riveting, gluing or screwing on that of the radiation-emitting
  • the surface structures can additionally increase the surface of the heat sink and thus increase the cooling effect of the heat sink.
  • a solid metal plate with pressed or soldered slats of copper or aluminum or solid material milled, stamped or formed cooling plates, or attachable cooling stars and cooling vanes made of aluminum spring bronze or steel sheet can be used as a heat sink.
  • a metal layer such as a base plate made of aluminum
  • a passive heat sink is characterized by the fact that it acts primarily by convection.
  • aluminum may be used for a passive heat sink due to its low material cost, ease of processing, lower density, heat capacity, and satisfactory conductivity.
  • Copper has a higher thermal conductivity, but is more expensive and difficult to work and is therefore mainly used for active heatsinks such as fans or in liquid coolers.
  • the heat sink and at least one light module or the heat sink and the carrier may be integrally formed.
  • the carrier and / or the light modules may preferably comprise a metal, which may, for example, have a waviness as a heat sink on the surface facing away from the radiation-emitting semiconductor components.
  • a further heat sink for example in the form of a heat sink, may be applied. This can enable a direct thermal coupling of the radiation-emitting semiconductor components to the heat sink and the most efficient dissipation of heat to the surface facing away from the radiation-emitting semiconductor components.
  • the heat sink can be recessed in the carrier or arranged in at least one of the light modules.
  • a metal core can be used which is recessed in the carrier or arranged in at least one of the light modules.
  • the heat sink can extend in the horizontal and / or vertical direction through the carrier or through at least one light module.
  • a metal core In the case of a metal core
  • an increased lateral thermal conductivity can be achieved.
  • the carrier or at least one light module can have openings, wherein the heat sink can be arranged in the openings.
  • This may mean that vias or preferably so-called thermal vias may be arranged in the carrier or in the light module as a heat sink, which extend through the carrier or through the light module and which can improve the heat transport perpendicular to the carrier or to the light module.
  • thermal vias may be referred to vias, which are formed of copper and thus can use the high thermal conductivity of copper for heat dissipation.
  • These plated-through holes may preferably be arranged regularly in a dense arrangement, such as, for example, in a grid of, for example, greater than or equal to 0.1 mm to less than or equal to 2.0 mm in the carrier.
  • the thermal vias may comprise a diameter of greater than or equal to 0.25 mm to less than or equal to 1.5 mm.
  • the openings may be filled with a thermally conductive material. These filled with, for example, a thermal grease openings may be advantageous for further processing, as can be soldered on the filled openings. Furthermore, these filled openings may allow a direct conductive connection between the light modules as heat sources on one side of the support and a heat sink on the side of the support facing away from the plurality of light modules.
  • the carrier may be subdivided into a plurality of segments, wherein each of the plurality of light modules is disposed on each one of the plurality of segments of the carrier and each of the plurality of light modules is disposed on the side of the carrier remote from the plurality of radiation-emitting semiconductor devices having the heat sink. This may mean, on the one hand, that each of the plurality of light modules can be arranged on one carrier segment in each case and is thus thermally insulated by a further light module on a further carrier segment.
  • each carrier segment an individual heat sink, such as a heat sink, which may be arranged on one side of the carrier facing away from the radiation-emitting semiconductor components or alternatively may also be arranged in the carrier, wherein the carrier itself may also constitute the heat sink ,
  • At least one segment of the carrier or at least one light module can be arranged between thermally insulating holders.
  • These holders may preferably be so-called I-profiles, which may be formed for example from materials such as polyimide, Teflon, polystyrene, polyamide and plastics, such as thermoplastics.
  • the carrier segments may be arranged between the two electrically insulating holders, which are also referred to as I-profiles, I-carriers or double-T carriers, each of these electrically insulating holders having two main surfaces which are connected by a tapered web ,
  • the two main surfaces may be, for example, a length of greater than or equal to 20 mm, preferably have a length of about 10 mm.
  • Such an arrangement of the carrier segments between two thermally insulating holders can help to largely suppress the thermal influence which emanates from two light modules with different brightness states, so that the light modules are thermally insulated by such a holder between two such holders.
  • the carrier or a carrier segment can preferably be designed as a thermally insulating holder. It is also conceivable on the of the radiation-emitting
  • a heat-regulating device for example, to arrange a heat sink, wherein the light module may alternatively include the heat-regulating device.
  • combinations of light modules and carrier segments are possible, which can be arranged between thermally insulating holders.
  • FIG. 1A shows a schematic illustration of a lighting device according to an exemplary embodiment in a plan view
  • FIG. 1B shows a schematic illustration of a lighting device according to a further exemplary embodiment
  • FIGS. 2A and 2B schematic representations of illumination devices according to further exemplary embodiments in plan view
  • FIGS. 3A, 3B, 3C and 3D show schematic representations of illumination devices according to further exemplary embodiments
  • FIG. 4A shows a schematic sectional representation of a lighting device according to a further exemplary embodiment
  • FIG. 4B is a schematic representation of a lighting device according to the embodiment of Figure 4A in plan view
  • FIG. 4C shows a schematic sectional view of a lighting device according to a further exemplary embodiment
  • FIG. 4D shows a schematic representation of a lighting device according to the exemplary embodiment of FIG. 4C in a plan view
  • Figures 5A to 5D are schematic representations of a lighting device according to another embodiment in three-dimensional views.
  • Figure 6 is a schematic representation of a lighting device according to another embodiment.
  • FIG. 1A shows an exemplary embodiment of a lighting device with a carrier 1, on which two light modules 21, 22 are arranged.
  • a carrier 1 On each of the light modules 21, 22, four radiation-emitting semiconductor components 311, 312, 313, 314 and 321, 322, 323, 324 are respectively arranged in two rows 411, 412 and 421, 422.
  • each of the rows 411, 412, 421, 422 has at least two radiation-emitting semiconductor components 311, 312, 313, 314, 321, 322, 323, 324.
  • more than two radiation-emitting semiconductor components are arranged in one row and / or that more than two rows per Light module are present and / or that more than two light modules are arranged on the carrier 1.
  • the two radiation emitters each arranged in a row 411, 412 and 421, 422, respectively.
  • Semiconductor devices 311, 312, 313, 314 and 321, 322, 323, 324 may preferably include light emitting diodes.
  • Four light-emitting diodes such as in each case one light-emitting diode which emits light of a wavelength of a red spectral range, one light-emitting diode which emits light of one wavelength of a blue spectral range, and two light-emitting diodes which emit light of one wavelength of a green spectral range preferably always form a radiation-emitting semiconductor component 311, 312, 313, 314, 321, 322, 323, 324.
  • This may mean that at least two light-emitting diodes can emit light with at least two different spectra, so that the superimposition of the spectra yields, for example, white light.
  • Such a radiation-emitting semiconductor component 311, 312, 313, 314, 321, 322, 323, 324 can furthermore comprise one or more multilayer stacks of functional layers with at least one light-emitting layer.
  • the functional layers may be selected from n- and p-type layers, such as electron injection layers, electron transport layers, hole blocking layers, electron blocking layers, hole transport layers, and hole injection layers.
  • the light-emitting layer may include, for example, a conventional pn junction, a double heterostructure, a single quantum well structure (SQW structure), or a multiple quantum well structure (MQW structure) luminescent or fluorescent material, wherein light is generated by the recombination of electrons and holes in the light-emitting layer.
  • the functional layers may comprise organic and / or inorganic materials.
  • An organic material may include organic polymers or small organic molecules.
  • organic polymers comprise fully or partially conjugated polymers.
  • Suitable organic polymeric materials include at least one of the following materials in any combination: poly (p-phenylenevinylene) (PPV), poly (2-methoxy-5- (2-ethyl) hexyloxyphenylenevinylene) (MEH-PPV), at least one PPV derivative (for example dialkoxy or dialkyl derivatives) polyfluorenes and / or copolymers
  • PPV poly (p-phenylenevinylene)
  • MEH-PPV poly (2-methoxy-5- (2-ethyl) hexyloxyphenylenevinylene)
  • PPV derivative for example dialkoxy or dialkyl derivatives
  • small organic molecules in the organic functional layer.
  • small molecules are, for example: aluminum tris (8-hydroxyquinoline) (Alq 3 ), aluminum 1,3-bis (N, N-dimethylaminophenyl) -1,3,4-oxydazole (OXD-8), aluminum oxo-bis (2-methyl-8-quinoline), aluminum bis (2-methyl-8-hydroxyquinoline), beryllium bis (hydroxybenzoquinoline) (BEQ 2 ),
  • DSA amines Bis (diphenylvinyl) biphenylene (DPVBI) and arylamine-substituted distyrylarylenes (DSA amines).
  • the functional layer may include inorganic materials such as III / V compound semiconductors such as nitride and / or phosphide compound semiconductors based materials.
  • the functional layer comprises a nitride III / V compound semiconductor material, preferably Al n Ga m In min - m N, where O ⁇ n ⁇ l, O ⁇ m ⁇ l and n + m ⁇ 1.
  • this material does not necessarily have to have a mathematically exact composition according to the above formula Rather, it may have one or more dopants and additional ingredients that the characteristic physical properties of the Al n Ga m ini- n -. m
  • the above formula contains only the essential components of the crystal lattice (Al, Ga, In, N), even though these may be partially replaced by small amounts of other substances.
  • phosphide compound semiconductors based means that the functional layer comprises a phosphide III / V compound semiconductor material, preferably Al n Ga m In min - m P, where O ⁇ n ⁇ l, O ⁇ m ⁇ l and n + m ⁇ 1.
  • the functional layers may additionally or alternatively also comprise a semiconductor material based on AlGaAs or an II / VI compound semiconductor material. At least one of the radiation emitters
  • Semiconductor components 311, 312, 313, 314, 321, 322, 323, 324 may in particular have features of a thin-film light-emitting diode chip.
  • a thin-film light-emitting diode chip is characterized by at least one of the following characteristic features:
  • the light-emitting diode chip comprises an epitaxially grown semiconductor layer sequence with a main surface facing a carrier element, in particular with a carrier substrate, on which a mirror layer is further applied or formed, which reflects back at least part of the electromagnetic radiation generated in the semiconductor layer sequence,
  • the thin-film light-emitting diode chip has a carrier element which is not the growth substrate on which the semiconductor layer sequence has been epitaxially grown, but rather a separate carrier element, which was subsequently attached to the semiconductor layer sequence,
  • the semiconductor layer sequence has a thickness in the range of 20 ⁇ m or less, in particular in the range of 10 ⁇ m or less,
  • the semiconductor layer sequence is free of a growth substrate.
  • free from a growth substrate means that a growth substrate which has possibly been used for growth is removed from the semiconductor layer sequence or at least greatly thinned out. In particular, it is so thinned that it alone or together with the epitaxial semiconductor layer sequence alone is not is self-supporting. The remainder of the highly thinned growth substrate is in particular unsuitable as such for the function of a growth substrate, and
  • the semiconductor layer sequence contains at least one semiconductor layer having at least one surface having a mixing structure, which leads in the ideal case to an approximately ergodic distribution of light in the semiconductor layer sequence, that is, it has the most ergodisch stochastic scattering behavior.
  • a basic principle of a thin-film light-emitting diode chip is described, for example, in the publication Schnitzer et al. , Applied Physical Letters 63 (16), 18 October 1993, pages 2174 to 2176, the disclosure content of which is hereby incorporated by reference.
  • Examples of thin-film light-emitting diode chips are described in the publications EP 0905797 A2 and WO 02/13281 A1, the disclosure contents of which are hereby also incorporated by reference.
  • a thin-film light-emitting diode chip is, to a good approximation, a Lambertian surface radiator and is therefore suitable, for example, well for use in a headlight, for example a motor vehicle headlight.
  • the light modules 21, 22 may have a polygonal or a circular shape, with a rectangular shape of the light modules 21, 22 being preferred.
  • a rectangular embodiment of the light modules 21, 22 as in the embodiment shown allows a matrix-like arrangement of the radiation-emitting semiconductor components 311, 312, 313, 314, 321, 322, 323, 324, each on a light module 21, 22 and the control of the light modules in rows and columns (2D dimming).
  • such a configuration of the light modules 21, 22 is to be preferred, in which the plurality of radiation-emitting semiconductor components 311, 312, 313, 314, 321, 322, 323, 324 are arranged uniformly spaced from a sensor unit 61, 62 on the light module 21, 22 could be.
  • a sensor unit 61, 62 may be suitable for determining the brightnesses of each radiation-emitting semiconductor component 311, 312, 313, 314, 321, 322, 323, 324 of the respective light module 21, 22.
  • the sensor units 61, 62 in the embodiment shown as light detectors, such as photodiodes or light-sensitive resistors formed.
  • the sensor units 61 and 62 are designed such that in each case a part of the light emitted by the radiation-emitting semiconductor components 311, 312, 313 and 414 or 321, 322, 323 and 324 can be detected. From the brightness values of each radiation-emitting semiconductor component 311, 312, 313, 314, 321, 322, 323, 324 of each light module 21, 22, it is then possible to determine an actual value of the brightness of the respective light module 21, 22, which is sent to a control device 51 , 52 can be transmitted and compared with a target value.
  • control device 51, 52 which may be designed as a driver or as a microcontroller, can therefore be set for each of the light modules 21, 22, a certain brightness value, which is based on the desired value. Also, the control device 51, 52 may be suitable for, a difference between the actual value and the target value of the brightness of the individual light modules 21, 22 to correct and to synchronize the brightness of a plurality of the light modules 21, 22.
  • control device 51, 52 of each light module 21, 22 is suitable for the operating current impressed on each of the radiation-emitting semiconductor components 311, 312, 313, 314, 321, 322, 323, 324 of the respective light module 21, 22 as a function of each sensor unit 61, 62 to determine the respective light module 21, 22 measured value.
  • the individual light modules 21, 22 are controlled individually by such a control device 51, 52.
  • such an individual control of the individual light modules 21, 22 in addition to the correction of the brightness by the regulation of the operating current by the respective control device 51, 52, the synchronization of the individual light modules 21, 22.
  • Figure IB is another embodiment of a lighting device, for example, for backlighting a screen.
  • a plurality of light modules are arranged on a carrier 1, which is shown only as a section, wherein for the sake of clarity, only the light modules 21 and 22 are marked.
  • the number of light modules and the arrangement in rows and columns on the support 1 can be selected according to the requirements of the lighting device, for example, in terms of their size.
  • the light modules which are executed rectangular in the embodiment shown, another, for example, polygonal shape, such as a square or hexagonal shape, have.
  • Each of the light modules, which are designed as lyre plates has radiation-emitting semiconductor components which are arranged in four rows of six radiation-emitting semiconductor components.
  • each of the radiation-emitting semiconductor components comprises four light-emitting diodes (LEDs), of which one LED red light, one LED blue Light and two LEDs emit green light.
  • LEDs light-emitting diodes
  • Each of the radiation-emitting semiconductor components can thus be adjusted in terms of its emission intensity and its radiated color by superposition of the emission spectra of the four LEDs.
  • the LEDs of a radiation-emitting semiconductor component can be arranged individually or in a housing (packaging) provided thereon on the respective light module.
  • Each four of the radiation-emitting semiconductor components are combined in the exemplary embodiment shown to form a group, as indicated by the lines marked 41 to 46.
  • Each of the groups 41 to 46 thus comprises two rows of two radiation-emitting semiconductor components, to each of which a sensor unit is equidistantly assigned to the radiation-emitting semiconductor components of a group.
  • a sensor unit is equidistantly assigned to the radiation-emitting semiconductor components of a group.
  • the sensor units of the groups 41 and 42 are provided with the reference numerals 61 and 62.
  • Each of the sensor units which are additionally coupled to a respective control device (not shown), serves for the electrical and thermal synchronization of the associated radiation-emitting semiconductor components a group, so that for the radiation-emitting semiconductor components of each of the groups 41 to 46 are independently adjustable stable operating conditions on a light module.
  • the number of groups of radiation-emitting semiconductor components and the number of radiation-emitting semiconductor components per group on a light module can be selected according to the requirements of the illumination device and each be greater than or equal to 1.
  • each of the groups of a light module can have its own subcarrier on the light module, on which the radiation-emitting semiconductor components and the sensor unit are respectively arranged.
  • the carrier 1, the light modules and optionally the subcarriers can be produced as individual components or as a common component, for example by a metal-plastic molding process.
  • the thermal isolation of the groups of radiation-emitting semiconductor components on a light module can take place by means of the distance of the groups from each other and / or by a heat-regulating device such as a thermal insulator or a heat sink as described in the following embodiments.
  • control devices 51, 52 and the sensor units 61, 62 shown in FIGS other embodiments of the clarity not shown, but may also be present in these.
  • FIG. 2A shows a further exemplary embodiment of a lighting device which corresponds to a detail of the carrier 1 illustrated in FIG. 1A with the respectively first rows 411, 421 with at least two light modules 21, 22.
  • the illumination device additionally comprises a heat-regulating device, which is arranged on the carrier 1 and designed as a thermal insulator 71.
  • the thermal insulator 71 is arranged as a web between the two light modules 21, 22 and thus thermally insulates the two light modules 21, 22 from each other.
  • the designed as a web thermal insulator 71 is disposed in a recess of the carrier and has a thermally poorly conductive plastic as in the general part performed on.
  • the carrier cross-section, via which a heat conduction between the light modules 21 and 22 can take place, is reduced, as a result of which the heat exchange between the light modules 21 and 22 can be considerably reduced.
  • the thermal insulator 71 may also be designed as an air gap in the carrier 1, for example in the form of an opening in the carrier 1.
  • FIG. 2B shows a section of a further exemplary embodiment of a carrier 1 shown similarly to FIG. 1A with the respectively first rows 411, 421 with at least two light modules 21, 22.
  • the two Light modules 21, 22 in an alternative embodiment of the heat-regulating device via a thermal insulator 71 in the form of a taper 72 of the support 1 thermally insulated.
  • the cross section of the carrier 1 in the region of the taper 72 is reduced relative to the region on which the light modules 21, 22 are arranged.
  • the light modules 21, 22 are thermally insulated from each other by the cross-sectional area of the thermal path 73 between the two light modules 21, 22 reduced by the taper 72 and thus the thermal influence of the two light modules 21, 22 due to heat transfer through the Carrier 1 is largely reduced.
  • the illumination devices shown there can each have a plurality of semiconductor components per row, a plurality of rows with semiconductor components, and / or a plurality of light modules.
  • a plurality of thermal insulators 71 in the form of a plurality of webs and / or a plurality of tapers in or on the carrier 1 can be arranged or formed.
  • FIG. 3A shows a further exemplary embodiment of a lighting device in a sectional representation with a carrier 1 with the respective second lines 412, 422 with two light modules 21, 22 shown in FIG. 1A.
  • two radiation-emitting semiconductor components 313 are each exemplary on each light module 21, 22 , 314 and 323, 324.
  • the illumination device has a heat-regulating device in the form of a heat sink 8 on the carrier 1.
  • the carrier 1 and the heat sink 8 are integrally formed so that the carrier 1 comprises the heat sink 8.
  • the heat sink 8 is arranged over the whole area on the surface of the carrier 1 facing away from the light modules 21, 22.
  • Such an arrangement can enable the largest possible dissipation of the heat generated by the semiconductor components of the light modules 21, 22 to the environment.
  • heat transfer between the light modules 21, 22 themselves can be effectively reduced.
  • the heat sink 8 surface structures such as in the embodiment shown, a ripple, which increases the surface of the carrier 1 and thus allow improved heat dissipation to the environment.
  • the carrier 1 is designed as a metal block, as a metallic circuit board, as a metal foil or as a metal layer.
  • Embodiment shown heat sink 8 may be adapted to absorb the heat of the arranged on the support 1 light modules 21, 22 and dissipate to the environment of the carrier 1, while the carrier 1 and arranged thereon light modules 21, 22 at a quasi-stationary temperature hold.
  • the heat sink 8 may also comprise a heat sink which is arranged on the surface of the carrier 1 facing away from the light modules 21, 22.
  • the heat sink 8 is arranged in the carrier 1.
  • the carrier 1 has a metal core 81, which is arranged in the interior of the carrier 1.
  • a copper block or alternatively copper or aluminum may be arranged in multilayer layers in the carrier 1.
  • the heat sink 8 extends in a horizontal direction through the carrier 1.
  • a metal core 81 an increased lateral thermal conductivity can thus be achieved and effective heat conduction of the heat generated by the light modules 21, 22 to the surface of the carrier 1 facing away from the light modules 21, 22.
  • heat sink 8 of FIG. 3A formed as a surface structure and the heat sink 8 of FIG. 3B designed as a metal core 81 can be combined.
  • FIG. 3C shows, in a further exemplary embodiment, openings 911, 912, 921, 922 which are arranged in the carrier 1 and extend through the carrier 1.
  • the openings 911, 912, 921, 922 can be embodied as plated-through holes or preferably as so-called thermal vias and thus formed as part of a heat sink 8.
  • thermal vias can be formed of copper and thus use the thermal conductivity of copper as heat dissipation and thus improve the heat transfer perpendicular to the carrier 1 therethrough.
  • the openings 911, 912, 921, 922 which comprise the thermal vias, are arranged in direct contact with the light modules 21, 22 in order to direct the heat generated there directly onto the side of the side facing away from the light modules 21, 22 Derive carrier 1.
  • the openings 911, 912, 921, 922 can preferably be arranged regularly in an arrangement, such as a grid in the carrier 1.
  • blind via may, for example, be in direct contact with one of the light modules 21, 22, pass through a copper layer, such as the metal core already shown in FIG. 3B, and then end blind on an insulating layer adjoining the copper layer
  • vias are conceivable which each connect two copper layers to each other and thereby extend (buried via) an insulating layer adjoining the copper layers,
  • the openings 911, 912, 921, 922 can be filled with a thermally conductive material.
  • FIG. 3D shows a further exemplary embodiment of a lighting device with two light modules 21, 22 shown purely by way of example and two radiation-emitting semiconductor components 313, 314 and 323, 324 on the light modules 21, 22.
  • openings 911, 912, in the light modules 21, 22 921, 922 which extend through the light modules 21, 22 to a surface 20 of the light modules 21, 22 facing away from the radiation-emitting semiconductor components 313, 314, 323, 324.
  • thermal vias are arranged in each case as part of a heat sink 8, the heat generated by the radiation-emitting semiconductor components 313, 314, 323, 324 to one of the
  • a carrier 1 is arranged, which is simultaneously designed as a further part of the heat sink 8 in the form of a heat sink 82, wherein the light modules 21, 22 respectively over the entire surface are arranged on the carrier 1 designed as a heat sink 82, so that as large as possible heat dissipation can be done.
  • FIG. 3D shows, the thermal vias arranged in the openings 911, 912, 921, 922 and the cooling body 82 are formed as a carrier 1 in one piece.
  • the heat-regulating devices shown in FIGS. 2A to 3D can also be combined with each other.
  • FIG. 4A shows a further exemplary embodiment of a lighting device with thermally insulating holders 101, 102, 103, which has one or a combination of the elements shown in FIG General part mentioned materials for thermal insulation.
  • the thermally insulating holders 101, 102, 103 are in cross-section as I- or U-profiles for mounting and thermal insulation of at least two carriers 1, in the illustrated embodiment in the form of purely shown by way of example two carrier segments 11, 12 each having a light module 21, 22 executed.
  • the I or U profiles used each have two base surfaces 104, which have a preferred length of 10 mm, and inner surfaces 105, which preferably have a width of 2 mm, which may mean that 2 mm of the carrier 1, ie the Carrier segments 11, 12 protrude into the I or U-profile.
  • thermally insulating holders 101, 102, 103 enable the thermal decoupling of the light modules 21, 22 and the radiation-emitting semiconductor components 313, 314 arranged on the light modules 21, 22 , 323, 324 through the thermally insulating holders 101, 102, 103. Therefore, the thermally insulating holders 101, 102, 103 can allow the thermal decoupling of the light modules 21, 22 from each other, and therefore, another example of a heat regulating device, or for a represent thermal insulator 71.
  • Such an arrangement of the light modules 21, 22 between thermally insulating holders 101, 102, 103 may additionally allow the two light modules 21, 22 to be arranged at a distance of 5 mm to 50 mm and preferably at a distance of 20 mm to 30 mm ,
  • a heat sink 8 designed as a heat sink 82 is arranged on the surfaces of the carrier 1 and the light modules 21, 22 facing away from the radiation-emitting semiconductor components 313, 314, 323.
  • FIG. 4B shows the embodiment of FIG. 4A in a plan view with the two light modules 21, 22 shown purely by way of example, each having two radiation-emitting semiconductor components 313, 314, 323, 324 arranged in a row.
  • the light modules 21, 22 are each arranged on a carrier segment 11, 12, which are arranged between thermally insulating holders 101, 102, 103.
  • the boundary line 10, up to which the carrier segments 11, 12 project into the thermally insulating holders 101, 102, 103 and thus adjoin the thermally insulating holders 101, 102, 103, is marked by the dashed line.
  • the two carrier segments 11, 12 with the light modules 21, 22 in a designed as an insulating frame thermally insulating holder with the three thermally insulating holder 101, 102, 103 are arranged.
  • the three thermally insulating holders 101, 102, 103 form a unit with openings in which the carrier segments 11, 12 are arranged with the light modules 21, 22 and thus enclose the light modules 21, 22.
  • the line indicated by the reference numeral 9 marks the Sectional plane of the sectional view of Figure 4A.
  • the thermally insulating holders 101, 102 and 103 may also be designed as separate components separated from one another.
  • FIG. 4C shows a further exemplary embodiment of a lighting device with thermally insulating holders 101, 102, 103, which are designed with respect to their geometry as in the previous exemplary embodiment.
  • the thermally insulating holders 101, 102, 103 are formed as parts of a carrier 1, on which purely by way of example two light modules 21, 22 are arranged.
  • the carrier 1 As already described in the general part of the carrier 1 as a thermally insulating holder and the light modules 21, 22 designed as printed circuit boards.
  • FIG. 4D shows the embodiment of FIG. 4C in a plan view with the two light modules 21, 22, each of which has two radiation-emitting semiconductor components 313, 314, 323, 324 arranged in a row.
  • the carrier is formed as a frame with the holders 101, 102 and 103.
  • the light modules 21, 22 are each arranged between the thermally insulating holders 101, 102, 103.
  • the further reference symbols designate features which have already been described in connection with FIG. 4B.
  • a lighting device can also have a combination of the features of the exemplary embodiments shown in FIGS. 4A to 4D.
  • the light modules 21, 22 may be embodied in particular as printed circuit boards (PCB), for example made of FR4, as metal core boards (MCPCB) or as flexboards or as a combination thereof, and conductor tracks, for example made of copper with a thickness of about 35 .mu.m, over which the radiation-emitting semiconductor components in shape of LEDs in packages or in the form of individual LEDs are electrically connected.
  • PCB printed circuit boards
  • MCPCB metal core boards
  • conductor tracks for example made of copper with a thickness of about 35 .mu.m, over which the radiation-emitting semiconductor components in shape of LEDs in packages or in the form of individual LEDs are electrically connected.
  • FIG. 5A shows a further exemplary embodiment of a lighting device in a three-dimensional plan view with a plurality of light modules 21, 22, 23, which are each connected to one another via a thermally insulating carrier 1.
  • the carrier 1 is designed as a thermally insulating holder with a circumferential I-profile.
  • four light-emitting semiconductor components 311, 312, 313, 314 are arranged in two rows with two semiconductor components 311, 312 or 313, 314, ie two columns, only on the light module 21, but more or less than four radiation-emitting semiconductor components are also used in more or less than two columns or rows conceivable.
  • no radiation-emitting semiconductor components are shown on the light modules 22, 23.
  • the carrier 1 is designed as a polygonal I-profile with a thermally insulating material, which is arranged between the light modules 21, 22, 23 and two of the plurality of light modules such as the light modules 21 and 22 and the light modules 21 and 23 thermally from each other decoupled.
  • a thermally insulating material which is arranged between the light modules 21, 22, 23 and two of the plurality of light modules such as the light modules 21 and 22 and the light modules 21 and 23 thermally from each other decoupled.
  • another carrier with other light modules for thermal Connect decoupling can also connect other light modules.
  • FIG. 5B shows the exemplary embodiment of FIG. 5A in a three-dimensional side view with the carrier 1 configured as an I-profile. Adjacent to the I-profile of the carrier 1 are in each case the light modules 21, 22, 23 which, in addition to the thermal decoupling by the carrier 1 have a designed as a heat sink 82 heat sink for heat dissipation. In each case, a light module 21, 22, 23 and with a heat sink 82 are made in one piece.
  • the respective light module 21, 22, 23 in each case comprises a heat sink 82, direct heat dissipation of the heat generated by the radiation-emitting semiconductor components 311, 312, 313, 314 shown by way of example only on the light module 21 to one of the radiation-emitting semiconductor components 311, 312 , 313, 314 opposite surface possible.
  • FIG. 5C shows a detail of the exemplary embodiment of FIG. 5A in a three-dimensional view of the rear side of the light module 21, which corresponds to the surface 20 of the light module 21 facing away from the radiation-emitting semiconductor components 311, 312, 313, 314.
  • the detail shown in FIG. 5C shows the light module 21, which is surrounded by the carrier 1 and extends through the carrier 1.
  • the heat sink 82 has surface patterns to those of the arranged on the light module 21
  • FIG. 5D accordingly shows a rear view of the illustration according to FIG. 5A.
  • FIG. 6 shows a further exemplary embodiment of an illumination device which has a multiplicity of light modules, of which only three light modules 21, 22, 23 are provided with reference symbols for the sake of clarity.
  • the light modules are arranged on a carrier 1 described in accordance with FIGS. 4A to 4D and 5A to 5D and thermally insulated by means of this.
  • the carrier 1 is only indicated as edge lines of the light modules and, according to the preceding descriptions, forms a frame with carrier segments on which the light modules are arranged.
  • the arrangement of the light modules may be carried out on a carrier or carrier segments according to one of the further preceding embodiments or a combination thereof.
  • Each of the light modules has a plurality of radiation-emitting semiconductor components with four semiconductor components in three lines, of which only the lines 411, 412 and 413 of the light module 21 and the semiconductor components 311, 312, 313 and 314 of the line 411 provided with reference numerals for clarity are.
  • the light modules have, for example, a visible, that is not covered by the carrier 1, 95.5 mm length and 64.25 mm width, on which the 12 executed as LEDs radiation-emitting semiconductor devices with a line spacing of about 23.88 mm and a Column spacing of about 25.48 mm are arranged.
  • the lightweight modules are designed as printed circuit boards. Furthermore, sensor units and control devices can also be arranged on the light modules as described in conjunction with FIGS. 1A and 1B.
  • the illumination device has a matrix-like arrangement of the light modules in eight rows and ten columns and is particularly suitable as a backlighting device, for example for screens suitable. Due to the modular design and the individual thermal management of the individual light modules, a scaling to larger or smaller lighting devices is easily possible. As an alternative to the embodiment shown with rectangular lighting modules, they can also be hexagonal or square, for example.

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  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un dispositif d'éclairage comportant un support (1) et une pluralité de modules d'éclairage (21, 22) dotés chacun d'une pluralité d'éléments semiconducteurs (311, 312, 313, 314, 321, 322, 323, 324) émettant un rayonnement et disposés en plusieurs rangées (411, 412, 421, 422). Chacune des rangées (411, 412, 421, 422) comporte au moins deux éléments semiconducteurs (311, 312, 313, 314, 321, 322, 323, 324) émettant un rayonnement. Chacun des modules d'éclairage (21, 22) est associé à un dispositif de régulation (51, 52) destiné à réguler la luminosité du module (21, 22). Chacun des modules d'éclairage (21, 22) est associé à une unité de détection (61, 62) qui détermine au moins une valeur de mesure comportant la luminosité de la pluralité des éléments semiconducteurs (311, 312, 313, 314, 321, 322, 323, 324). L'invention porte également sur un dispositif d'éclairage comportant un support (1) et une pluralité de modules d'éclairage (21, 22, 23), une pluralité d'éléments semiconducteurs (311, 312, 313, 314, 321, 322, 323, 324) émettant un rayonnement et un dispositif thermorégulateur.
PCT/DE2009/000400 2008-03-31 2009-03-23 Dispositif d'éclairage WO2009121330A2 (fr)

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