WO2009119346A1

WO2009119346A1 - Magnetic sensor package

Info

Publication number: WO2009119346A1
Application number: PCT/JP2009/054897
Authority: WO
Inventors: 尚樹北浦; 宣明芳賀; 敏明紺野
Original assignee: アルプス電気株式会社
Priority date: 2008-03-28
Filing date: 2009-03-13
Publication date: 2009-10-01
Also published as: JPWO2009119346A1; JP5075979B2

Abstract

Provided is a magnetic sensor package with a reduced size. An IC (2) as a semiconductor element is mounted on the main surface of a base (1). An X-axis magnetic sensor (3a), a Y-axis magnetic sensor (3b), and a Z-axis magnetic sensor (3c) are mounted on the main surface of the IC (2). When mounting the Z-axis magnetic sensor (3c), an auxiliary bump (4) is arranged on an electrode pad (2a) and a corner bump (5) electrically connected to an electrode pad (3d) is arranged on the auxiliary bump (4) so as to electrically connect the Z-axis magnetic sensor (3c) to the IC (2) via the auxiliary bump (4) and the corner bump (5).

Description

Magnetic sensor package

The present invention relates to a magnetic sensor package used for an electronic compass or the like.

The electronic compass including the magnetic sensor for detecting the geomagnetism detects the geomagnetism by, for example, the X axis magnetic sensor, the Y axis magnetic sensor, and the Z axis magnetic sensor. Such an electronic compass is configured by mounting an IC and a magnetic sensor on a base material, electrically connecting them by, for example, wire bonding, and then packaging (Patent Document 1).

In such a package, for example, as shown in FIG. 3, the IC 12 is mounted on the main surface of the base 11, and the X axis magnetic sensor 13a, the Y axis magnetic sensor 13b, and the same main surface A Z axis magnetic sensor 13c is mounted. The X-axis magnetic sensor 13 a, the Y-axis magnetic sensor 13 b, and the Z-axis magnetic sensor 13 c are electrically connected to the IC 12 by the wire 14. Further, the base 11 is packaged by a package material 15.
JP 2005-277364

However, in the magnetic sensor package shown in FIG. 3, since the IC 12 and the X axis magnetic sensor 13a, the Y axis magnetic sensor 13b and the Z axis magnetic sensor 13c are mounted on the base 11, four chips are It is necessary to secure the mounting area of the device, and the device becomes large as a whole. In recent years, the miniaturization of packages has significantly progressed, and further miniaturization of packages is necessary. However, the configuration shown in FIG. 3 can not meet the request for miniaturization.

The present invention has been made in view of such points, and an object thereof is to provide a magnetic sensor package which can be further miniaturized.

The magnetic sensor package of the present invention comprises an X-axis magnetic sensor, a Y-axis magnetic sensor, and a Z-axis magnetic sensor each having a substrate on which a semiconductor element is mounted, and a magnetic detection element and a first electrode pad for mounting on one surface of an insulating substrate. The magnetic sensor for an axis is provided, and the magnetic sensor for the X axis, the magnetic sensor for the Y axis, and the magnetic sensor for the Z axis are directly mounted on the semiconductor element.

According to this configuration, there is no need to provide mounting areas for the X axis magnetic sensor, the Y axis magnetic sensor, and the Z axis magnetic sensor on the base material, so the magnetic sensor package can be miniaturized. .

In the magnetic sensor package according to the present invention, the semiconductor element has a second electrode pad for mounting the magnetic sensor on the surface thereof, and in the Z axis magnetic sensor, the first electrode pad is a semiconductor. The semiconductor device is mounted on the semiconductor device so as to be positioned in a plane substantially orthogonal to the surface of the device, and a bump is formed to connect the first electrode pad and the second electrode pad, and the semiconductor device and the semiconductor device It is preferable that the Z axis magnetic sensor be electrically connected. According to this configuration, the Z-axis magnetic sensor and the semiconductor element can be electrically connected in a small space even if the Z-axis magnetic sensor is arranged on the semiconductor element in a direction different from that of the sensors for other axes. it can. In this case, the semiconductor element has an insulating film having a surface at a position higher than the surface of the second electrode pad, and the Z axis magnetic sensor is mounted on the insulating film. An auxiliary bump provided on the second electrode pad, and the semiconductor element and the Z-axis magnetic sensor are electrically connected to each other via a bump provided on the auxiliary bump and electrically connected to the second electrode pad. It is preferable that they be connected in the same manner. According to this configuration, even if an insulating film such as a passivation film is formed on the semiconductor element, the Z axis magnetic sensor and the semiconductor element can be electrically connected in a small space.

In the magnetic sensor package of the present invention, it is preferable that the X axis magnetic sensor, the Y axis magnetic sensor, and the Z axis magnetic sensor are all the same magnetic sensor. According to this configuration, it is possible to reduce the number of parts.

The magnetic sensor package of the present invention comprises an X-axis magnetic sensor, a Y-axis magnetic sensor and a Z-axis magnetic sensor, each having a magnetic detection element and a first electrode pad for mounting on one surface of an insulating substrate. The X-axis magnetic sensor, the Y-axis magnetic sensor, and the Z-axis magnetic sensor are directly mounted on the semiconductor element, so that the size can be further reduced.

It is a figure for demonstrating the magnetic sensor package which concerns on Embodiment 1 of this invention. It is a side view which shows the magnetic sensor package shown in FIG. It is a figure for demonstrating the conventional magnetic sensor package.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.
FIG. 1 is a view for explaining a magnetic sensor package according to an embodiment of the present invention. The magnetic sensor package shown in FIG. 1 includes a base 1 which is an insulating substrate. An IC 2 which is a semiconductor element is mounted on the main surface of the base 1. That is, a mounting portion (not shown) is formed on the main surface of the substrate 1, and the IC 2 is die-bonded on the mounting portion with an adhesive or the like.

Further, on the main surface of the IC 2, the X axis magnetic sensor 3a, the Y axis magnetic sensor 3b, and the Z axis magnetic sensor 3c are directly mounted. That is, the electrode pad 2a and the mounting portion (not shown) are formed on the main surface of the IC 2, and the X axis magnetic sensor 3a and the Y axis magnetic sensor 3b are bonded or the like on the mounting portion. The electrode pads which are die-bonded and provided on the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b and the electrode pads on the IC 2 are wire-bonded by wires (not shown). The X-axis magnetic sensor 3a, the Y-axis magnetic sensor 3b, and the Z-axis magnetic sensor 3c each have a magnetic detection element and an electrode pad for mounting.

Here, the same magnetic sensor is used as the X-axis magnetic sensor 3a, the Y-axis magnetic sensor 3b, and the Z-axis magnetic sensor 3c. This makes it possible to reduce the number of parts. In this magnetic sensor, the sensitivity axis direction is substantially parallel to the surfaces of the base material 1 and the IC 2 in FIG. 1, and an electrode pad for mounting on the IC 2 is provided on the bottom surface. Since the Z-axis magnetic sensor 3c is also configured as the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b, if the sensitivity axis direction is oriented in the Z-axis direction (perpendicular to the surface of the base 1 or IC 2) Inevitably, the mounting electrode pad is located on the side surface of the Z axis magnetic sensor 3c.

Further, as shown in FIG. 2, the IC 2 which is a semiconductor element has an electrode pad 2a for mounting a magnetic sensor on its surface, and a passivation film 2b which is an insulating film thicker than the thickness of the electrode pad 2a. . The Z-axis magnetic sensor 3 c is mounted on the passivation film 2 b so that the electrode pad 3 d is located on the side surface, and is fixed by the die bonding material 6. That is, the IC 2 has the passivation film 2b having a surface at a position higher than the surface of the electrode pad 2a, and the Z-axis magnetic sensor 3c is mounted on the passivation film 2b. The IC 2 and the Z-axis magnetic sensor 3c are electrically connected via the provided auxiliary bumps 4 and corner bumps 5 described later.

Thus, since the surface of the IC 2 is covered with the passivation film 2 b, when mounting the Z-axis magnetic sensor 3 c on the IC 2, the position where the electrode pad 2 a is lower than the mounting surface of the Z-axis magnetic sensor Become. Therefore, the distance between the electrode pad 3d of the Z-axis magnetic sensor 3c and the electrode pad 2a of the IC 2 is increased. This will require a change in the sensor specifications. Therefore, in the present invention, the auxiliary bump 4 is provided on the electrode pad 2a, and the corner bump 5 electrically connected to the electrode pad 3d is further provided on the auxiliary bump 4 via the auxiliary bump 4 and the corner bump 5 Then, the IC 2 and the Z axis magnetic sensor 3c are electrically connected (corner bump bonding using the auxiliary bump 4). In addition, as a material of an electrode pad, a passivation film, a die-bonding material, a corner bump and an auxiliary bump, a material which is usually used can be used.

In this case, before the Z-axis magnetic sensor 3c is die-bonded onto the IC 2, the auxiliary bumps 4 are formed on the electrode pads 2a of the IC 2 and the Z-axis magnetic sensor 3c is die-bonded onto the IC 2. The corner bumps 5 are formed to electrically connect the auxiliary bumps 4 and the electrode pads 3d of the Z-axis magnetic sensor 3c. That is, the electrode pad 3d is mounted on the IC 2 so that the electrode pad 3d is positioned in a plane substantially orthogonal to the surface of the IC 2 and the bumps 4 and 5 are formed to connect the electrode pad 3d and the electrode pad 2a. And the Z axis magnetic sensor 3c are electrically connected. As a result, even if the passivation film 2b is formed on the IC 2, the Z axis magnetic sensor 3c and the IC 2 can be electrically connected in a small space.

At this time, the auxiliary bump 4 is provided on the electrode pad 2 a in a state where a clearance is provided from the end face of the electrode pad 2 a of the IC 2 on the sensor side. Thus, by providing the clearance, when the Z-axis magnetic sensor 3c is mounted, it is possible to prevent the Z-axis magnetic sensor 3c from riding on the auxiliary bump 4.

Regarding the dimensional relationship between each member in FIG. 2, for example, the size (a) of the electrode pad 3d of the Z-axis magnetic sensor 3c is 30 μm or more, and the size (b) of the electrode pad 2a exposed from the passivation film 2b is The distance (c) from the end of the electrode pad 3d of the Z-axis magnetic sensor 3c to the side surface of the sensor is 15 μm or less, and the thickness of the passivation film 2b When d) is 10 μm or less, the size (e) of the corner bump 5 is 50 μm or more, the diameter (f) of the auxiliary bump 4 is 45 μm or more, and the height (g) of the pedestal portion of the auxiliary bump 4 ) Is 10 μm or more, the height (h) of the auxiliary bump 4 is 50 μm or more, and the distance between the auxiliary bump 4 and the passivation film 2 b on the Z axis magnetic sensor 3 c side (Clearance: i) is 10 μm or more, and between the end face on the electrode pad 3 d side of the Z axis magnetic sensor 3 c and the end on the electrode pad 2 a side of the passivation film 2 b on which the Z axis magnetic sensor 3 c is mounted Preferably, the distance (j) is equal to or less than the clearance i.

In the configuration shown in FIG. 1, the X-axis magnetic sensor 3a and the Y-axis magnetic sensor 3b are electrically connected directly by the IC 2 and the wire 4, respectively, and the Z-axis magnetic sensor 3c is connected via the wiring 1b. It is electrically connected to the IC 2 by the wire 4. Further, the main surface on the sensor mounting side of the substrate 1 is packaged by a package material (not shown). On the other hand, electrode pads and wires (neither of which are shown) are formed on the main surface of the substrate 1 opposite to the sensor mounting side, whereby the magnetic sensor package can be used for other devices and printed wires. When mounted on a board, electrical connection is made through the electrode pads.

In the configuration shown in FIG. 1, since the X axis magnetic sensor 3a, the Y axis magnetic sensor 3b and the Z axis magnetic sensor 3c are mounted on the IC 2, the X axis magnetic sensor 3a for the Y axis is mounted on the substrate 1 There is no need to provide mounting areas for the magnetic sensor 3b and the Z-axis magnetic sensor 3c. As a result, the magnetic sensor package can be miniaturized.

Further, with regard to mounting of the Z-axis magnetic sensor 3c, by using corner bump bonding using the auxiliary corner bump 4, it becomes possible to use a Z-axis magnetic sensor and a control IC which are generally used. In this structure, since the auxiliary bumps 4 are crushed by the corner bumps 5, the bonding area between the corner bumps 5 and the auxiliary bumps 4 relatively increases. Therefore, the die bonding accuracy required for the Z-axis magnetic sensor is lowered, the yield can be increased, and as a result, the cost reduction of the package can be realized.

The present invention is not limited to the above embodiment, and can be implemented with various modifications. In addition, the number, arrangement, material, and the like of members can be appropriately changed and implemented without departing from the scope of the present invention. In addition, it is possible to change suitably and to carry out without departing from the scope of the present invention.

Claims

Equipped with a substrate on which a semiconductor element is mounted, an X-axis magnetic sensor having a magnetic detection element and a first electrode pad for mounting on one surface of an insulating substrate, a Y-axis magnetic sensor, and a Z-axis magnetic sensor A magnetic sensor package in which the X-axis magnetic sensor, the Y-axis magnetic sensor, and the Z-axis magnetic sensor are directly mounted on the semiconductor element;
The semiconductor element has a second electrode pad for mounting the magnetic sensor on the surface thereof, and the magnetic sensor for Z-axis has a surface in which the first electrode pad is substantially orthogonal to the surface of the semiconductor element A bump is mounted on the semiconductor element to be positioned, and a bump is formed to connect the first electrode pad and the second electrode pad, and the semiconductor element and the Z-axis magnetic sensor are electrically connected. The magnetic sensor package according to claim 1, being connected to
The semiconductor element has an insulating film having a surface at a position higher than the surface of the second electrode pad, and the Z-axis magnetic sensor is mounted on the insulating film. The semiconductor element and the Z-axis magnetic sensor are electrically connected via an auxiliary bump provided on the electrode pad and a bump provided on the auxiliary bump and electrically connected to the second electrode pad. The magnetic sensor package according to claim 2, characterized in that:
The magnetic sensor package according to any one of claims 1 to 3, wherein the X-axis magnetic sensor, the Y-axis magnetic sensor, and the Z-axis magnetic sensor are all the same magnetic sensor.