WO2009115673A3 - Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif - Google Patents

Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif Download PDF

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Publication number
WO2009115673A3
WO2009115673A3 PCT/FR2009/000163 FR2009000163W WO2009115673A3 WO 2009115673 A3 WO2009115673 A3 WO 2009115673A3 FR 2009000163 W FR2009000163 W FR 2009000163W WO 2009115673 A3 WO2009115673 A3 WO 2009115673A3
Authority
WO
WIPO (PCT)
Prior art keywords
capacitive coupling
terminals
integrated circuits
passivation layer
integrated circuit
Prior art date
Application number
PCT/FR2009/000163
Other languages
English (en)
Other versions
WO2009115673A2 (fr
Inventor
Yannick Grasset
Original Assignee
Yannick Grasset
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yannick Grasset filed Critical Yannick Grasset
Priority to US12/867,405 priority Critical patent/US9142485B2/en
Priority to EP09722630A priority patent/EP2243160A2/fr
Publication of WO2009115673A2 publication Critical patent/WO2009115673A2/fr
Publication of WO2009115673A3 publication Critical patent/WO2009115673A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

L'invention concerne des circuits intégrés (1) comportant, à leur face active, une première couche diélectrique formant couche de passivation (6) et des plages de contact (5) affleurant au travers d'ouvertures (7) de ladite couche de passivation, lesdits circuits intégrés étant destinés à être incorporés dans des objets portatifs sans contact (10) pour une connexion, par couplage capacitif, aux bornes (13) d'un circuit formant antenne (11) monté sur un support (12) dudit objet, ainsi que des objets portatifs sans contact comportant de tels circuits. L'invention se caractérise en ce que le couplage capacitif est réalisé au moyen de plaques de connexion (8) des circuits intégrés positionnées à la surface de la couche de passivation et électriquement connectées aux plages de contact. L'invention s'applique en particulier aux objets RFID UHF.
PCT/FR2009/000163 2008-02-13 2009-02-13 Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif WO2009115673A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/867,405 US9142485B2 (en) 2008-02-13 2009-02-13 Contactless object with integrated circuit connected to circuit terminals by capacitive coupling
EP09722630A EP2243160A2 (fr) 2008-02-13 2009-02-13 Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR08/00775 2008-02-13
FR0800775A FR2927441B1 (fr) 2008-02-13 2008-02-13 Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif

Publications (2)

Publication Number Publication Date
WO2009115673A2 WO2009115673A2 (fr) 2009-09-24
WO2009115673A3 true WO2009115673A3 (fr) 2009-11-19

Family

ID=39684596

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2009/000163 WO2009115673A2 (fr) 2008-02-13 2009-02-13 Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif

Country Status (4)

Country Link
US (1) US9142485B2 (fr)
EP (1) EP2243160A2 (fr)
FR (1) FR2927441B1 (fr)
WO (1) WO2009115673A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2936096B1 (fr) 2008-09-12 2011-01-28 Yannick Grasset Procede de fabrication d'objets portatifs sans contact
US9490768B2 (en) 2012-06-25 2016-11-08 Knowles Cazenovia Inc. High frequency band pass filter with coupled surface mount transition
US9697455B2 (en) * 2014-12-26 2017-07-04 Avery Dennison Retail Information Services, Llc Using reactive coupling of a printed RFID chip on a strap to allow the printed material to be over-laminated with a barrier film against oxygen and moisture ingress
WO2017222471A1 (fr) * 2016-06-24 2017-12-28 Agency For Science, Technology And Research Boîtier de semi-conducteur et son procédé de formation
FR3086082B1 (fr) 2018-09-18 2021-04-30 Smart Packaging Solutions Procede de connexion d'un circuit integre a un circuit electrique
DE102019110840A1 (de) * 2019-04-26 2020-10-29 Infineon Technologies Ag Rf-vorrichtungen mit konformen antennen und verfahren zu deren herstellung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997024740A1 (fr) * 1995-12-18 1997-07-10 Douglass Barry G Connexions haute densite entre pastilles par des couplages electromagnetiques
DE10133588A1 (de) * 2001-07-11 2002-09-05 Infineon Technologies Ag Anordnung eines Chips und einer Leiterstruktur
WO2006009934A1 (fr) * 2004-06-18 2006-01-26 Avery Dennison Corporation Dispositif d'identification par radiofrequence (rfid) et procede de fabrication
FR2894714A1 (fr) * 2005-12-13 2007-06-15 K Sa As Procede de connexion d'une puce electronique sur un dispositif d'identification radiofrequence

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EP0740361B1 (fr) * 1995-04-20 1998-03-04 FUBA Automotive GmbH Système d'antenne plane
KR0175267B1 (ko) 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
EP1034942A4 (fr) 1996-12-26 2005-07-06 Hitachi Ltd Dispositif a semiconducteur et son procede de production
US6310400B1 (en) * 1997-12-29 2001-10-30 Intel Corporation Apparatus for capacitively coupling electronic devices
US6043144A (en) * 1998-05-25 2000-03-28 United Microelectronics Corp. Bonding-pad structure for integrated circuit and method of fabricating the same
JP3167296B2 (ja) * 1998-07-31 2001-05-21 日本特殊陶業株式会社 樹脂製配線基板
US6421013B1 (en) 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US6559531B1 (en) * 1999-10-14 2003-05-06 Sun Microsystems, Inc. Face to face chips
WO2001061644A1 (fr) * 2000-02-14 2001-08-23 Koninklijke Philips Electronics N.V. Transpondeur et dispositif
DE10117929A1 (de) 2001-01-24 2002-08-14 Fraunhofer Ges Forschung Verfahren zum Verbinden eines Chips mit einem Substrat unter Verwendung einer isotropen Verbindungsschicht und Verbundsystem aus Chip und Substrat
US6900536B1 (en) * 2002-04-26 2005-05-31 Celis Semiconductor Corporation Method for producing an electrical circuit
JP4023285B2 (ja) * 2002-10-24 2007-12-19 ソニー株式会社 光・電気配線混載ハイブリッド回路基板及びその製造方法並びに光・電気配線混載ハイブリッド回路モジュール及びその製造方法
WO2005008726A2 (fr) 2003-07-09 2005-01-27 Newport Corporation Machine de puce a bosse
GB2407207B (en) * 2003-10-13 2006-06-07 Micron Technology Inc Structure and method for forming a capacitively coupled chip-to-chip signalling interface
EP2572626B1 (fr) 2004-01-19 2016-03-23 Olympus Corporation Endoscope du type capsule
JP4672384B2 (ja) 2004-04-27 2011-04-20 大日本印刷株式会社 Ｉｃタグ付シートの製造方法、ｉｃタグ付シートの製造装置、ｉｃタグ付シート、ｉｃチップの固定方法、ｉｃチップの固定装置、およびｉｃタグ
US7335556B2 (en) 2004-06-14 2008-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US20060057763A1 (en) 2004-09-14 2006-03-16 Agency For Science, Technology And Research Method of forming a surface mountable IC and its assembly
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7551141B1 (en) * 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7452748B1 (en) * 2004-11-08 2008-11-18 Alien Technology Corporation Strap assembly comprising functional block deposited therein and method of making same
AU2006230238A1 (en) 2005-03-29 2006-10-05 Symbol Technologies, Inc. Smart radio frequency identification (RFID) items
US7687327B2 (en) * 2005-07-08 2010-03-30 Kovio, Inc, Methods for manufacturing RFID tags and structures formed therefrom
TW200715645A (en) 2005-08-02 2007-04-16 Koninkl Philips Electronics Nv Antenna structure, transponder and method of manufacturing an antenna structure
WO2007030768A2 (fr) 2005-09-09 2007-03-15 Delaware Capital Formation, Inc. Procede et appareil d'insertion de bandes/inserts
JP2009540418A (ja) * 2006-06-07 2009-11-19 エヌエックスピー ビー ヴィ 半導体チップ、トランスポンダおよびトランスポンダの製造方法
WO2008006947A1 (fr) 2006-07-13 2008-01-17 Confidex Oy Étiquettes d'identification radiofréquence
US7701352B2 (en) 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
US7612676B2 (en) * 2006-12-05 2009-11-03 The Hong Kong University Of Science And Technology RFID tag and antenna
EP2102799B1 (fr) * 2006-12-18 2011-06-01 Mikoh Corporation Etiquette d'identification par radiofrequence capable d'offrir securite et confidentialite
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FR2917534B1 (fr) 2007-06-15 2009-10-02 Ask Sa Procede de connexion d'une puce electronique sur un dispositif d'identification radiofrequence
US7943897B2 (en) * 2007-06-20 2011-05-17 Sharp Kabushiki Kaisha Optical encoder and electronic equipment
US20090128332A1 (en) * 2007-11-15 2009-05-21 Claridy Solutions, Inc. Rfid-enabled hologram laser tag
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FR2936096B1 (fr) 2008-09-12 2011-01-28 Yannick Grasset Procede de fabrication d'objets portatifs sans contact

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997024740A1 (fr) * 1995-12-18 1997-07-10 Douglass Barry G Connexions haute densite entre pastilles par des couplages electromagnetiques
DE10133588A1 (de) * 2001-07-11 2002-09-05 Infineon Technologies Ag Anordnung eines Chips und einer Leiterstruktur
WO2006009934A1 (fr) * 2004-06-18 2006-01-26 Avery Dennison Corporation Dispositif d'identification par radiofrequence (rfid) et procede de fabrication
FR2894714A1 (fr) * 2005-12-13 2007-06-15 K Sa As Procede de connexion d'une puce electronique sur un dispositif d'identification radiofrequence

Also Published As

Publication number Publication date
US9142485B2 (en) 2015-09-22
FR2927441A1 (fr) 2009-08-14
US20110139878A1 (en) 2011-06-16
EP2243160A2 (fr) 2010-10-27
FR2927441B1 (fr) 2011-06-17
WO2009115673A2 (fr) 2009-09-24

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