WO2009110440A1 - 積層体の屈曲寿命予測方法、積層体の屈曲寿命予測装置、積層体の屈曲寿命予測プログラムおよび記録媒体 - Google Patents

積層体の屈曲寿命予測方法、積層体の屈曲寿命予測装置、積層体の屈曲寿命予測プログラムおよび記録媒体 Download PDF

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Publication number
WO2009110440A1
WO2009110440A1 PCT/JP2009/053912 JP2009053912W WO2009110440A1 WO 2009110440 A1 WO2009110440 A1 WO 2009110440A1 JP 2009053912 W JP2009053912 W JP 2009053912W WO 2009110440 A1 WO2009110440 A1 WO 2009110440A1
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WO
WIPO (PCT)
Prior art keywords
stress
bending
laminate
life
wiring layer
Prior art date
Application number
PCT/JP2009/053912
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English (en)
French (fr)
Japanese (ja)
Inventor
伸悦 藤元
Original Assignee
新日鐵化学株式会社
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Application filed by 新日鐵化学株式会社 filed Critical 新日鐵化学株式会社
Priority to JP2010501901A priority Critical patent/JP5248595B2/ja
Priority to CN200980107719.2A priority patent/CN101960283B/zh
Publication of WO2009110440A1 publication Critical patent/WO2009110440A1/ja

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0041—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining deflection or stress
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0033—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining damage, crack or wear
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0075—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by means of external apparatus, e.g. test benches or portable test systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0023—Bending
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/26—Composites
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/04—Ageing analysis or optimisation against ageing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Definitions

  • the present invention relates to a method and apparatus for predicting the bending life of a bendable laminate having a plurality of laminated layers including a base layer and a wiring layer made of a patterned conductor, and bending of the laminate
  • the present invention relates to a program and a recording medium used for predicting a lifetime.
  • the FPC includes, for example, a base layer, a wiring layer made of a patterned conductor bonded to one surface of the base layer, an adhesive layer covering the wiring layer, and a cover layer bonded to the adhesive layer. And have.
  • FPCs used in electronic devices having moving parts are required to have high bending resistance.
  • One of the tests for evaluating the bending resistance characteristics of FPC is a bending test called an IPC test.
  • IPC test a bending test
  • an FPC is bent and inserted in a U shape between a fixed plate and a movable plate arranged at a predetermined interval, and each end in the longitudinal direction of the FPC is fixed to the fixed plate and the movable plate, respectively. This is done by reciprocating the movable plate in a direction parallel to the surface.
  • the number of reciprocating motions of the movable plate from the start of the test until the wiring layer breaks is measured as the bending life.
  • the first method is a method using a master curve and an actual measurement value of a prediction target, as described in Patent Document 1, for example.
  • the second method is a method using a finite element method as described in Patent Document 2 and Patent Document 3, for example.
  • Patent Document 1 describes a method for predicting the bending life of a composite such as a flat cable.
  • a master that shows the relationship between the maximum distortion amount of the conductor portion of the composite and / or the deviation of the bent shape from the ideal radius when mounted on the bending resistance evaluation test apparatus, and the actually measured bending life. Create a curve.
  • the maximum strain amount of the conductor portion and / or the deviation amount of the bent shape from the ideal radius in the composite body to be predicted mounted on the bending resistance evaluation test apparatus is measured.
  • the maximum distortion amount of the conductor portion and / or the deviation amount of the bent shape from the ideal radius in the measured composite object is collated with the master curve to predict the bending life of the composite object to be predicted.
  • Patent Document 2 describes a method for predicting the bending life of an electric wire or electric wire bundle having at least a central conductor wire.
  • a master curve indicating the relationship between the bending life of a single electric wire and the amount of change in strain is obtained.
  • the maximum strain change amount of the central conductor wire of the electric wire or electric wire bundle to be predicted is calculated using the finite element method.
  • the calculated maximum strain variation is collated with the master curve to predict the bending life of the prediction target electric wire or electric wire bundle.
  • Patent Document 3 describes a method for predicting the bending durability of a plurality of electric wires and a bending protection member attached to a bent portion.
  • a finite element model of each of a plurality of electric wires and a bending protection member is created.
  • the stress in each finite element of the finite element model is calculated.
  • the maximum stress is searched from among the calculated stresses.
  • the number of bending durability times corresponding to the maximum stress for each of the plurality of electric wires and the bending protection member is acquired, and the shortest bending durability number is obtained from these.
  • a number of configurations can be considered by changing the conditions of the plurality of layers. Repeating trial production and bending test for each of such a large number of configurations requires a great deal of labor, time and cost. Therefore, if you want to design a laminate that has the desired bending life, if you can simulate the prediction of the bending life by arbitrarily setting the conditions of each layer that makes up the laminate, you can significantly reduce labor, time, and cost. It becomes possible to reduce. Further, if such a simulation is possible, it is possible to easily obtain a preferable combination of conditions of each layer constituting the laminated body.
  • the condition of each layer constituting the laminate is arbitrarily set and the simulation is performed. There is a problem that cannot be performed. In the first method, it is also impossible to obtain a preferable combination of conditions for each layer constituting the stacked body using simulation.
  • the second method of the conventional methods for predicting the bending resistance such as the bending life by simulation uses the finite element method, so that it takes a lot of time and labor to create a finite element model. is there.
  • An object of the present invention is to easily set a bending life prediction method for a laminated body and a bending life prediction apparatus for a laminated body by arbitrarily setting the conditions of each layer constituting the laminated body and predicting the bending life of the laminated body.
  • Another object of the present invention is to provide a bending life prediction program for a laminate and a recording medium.
  • the method for predicting the bending life of a laminate of the present invention has a plurality of laminated layers including a base layer and a wiring layer made of a patterned conductor, extends in one direction, and is a bendable laminate.
  • the laminate is bent and inserted in a U shape between a fixed plate and a movable plate arranged at a predetermined interval, and each end in the longitudinal direction of the laminate is fixed to the fixed plate and the movable plate, respectively.
  • This is a method for predicting a bending life to be measured by a bending test performed by reciprocating a plate in a direction parallel to its surface.
  • the bending life prediction method of the laminate of the present invention is For each of a plurality of laminate samples having different configurations, the thickness of each layer constituting the sample, the relationship between stress and strain in each layer constituting the sample, the interval between the fixed plate and the movable plate in the bending test, A first calculation procedure for calculating a stress generated in the wiring layer of the sample using each information of the line width and the line width in the wiring layer; For each of a plurality of samples, a procedure for measuring the bending life by a bending test, Based on the stress generated in the wiring layer of each sample calculated by the first calculation procedure and the bending life of each sample measured by the procedure of measuring the bending life, the wiring layer in the laminated body having an arbitrary configuration is generated.
  • a procedure for determining the relationship between stress and flex life Regarding the virtual laminate that is the object of predicting the flex life, the thickness of each layer constituting the virtual laminate, the relationship between the stress and strain in each layer constituting the virtual laminate, and the fixed plate and the movable plate in the bending test
  • the elastic modulus of the material constituting each layer may be used as the relationship between stress and strain in each layer.
  • the relationship between stress and strain in each layer may be obtained by a tensile test on the material constituting each layer.
  • the main stress obtained from the normal stress and the shear stress is calculated as the stress generated in the wiring layer of the sample
  • the second calculation procedure As a stress generated in the wiring layer of the virtual laminate, a main stress obtained from a normal stress and a shear stress may be calculated.
  • the relationship between the stress generated in the wiring layer and the flexing life using the temperature when the flexing test is performed as a parameter.
  • the virtual lamination under an arbitrary temperature is based on the stress calculated by the second calculation procedure and the relationship between the stress and the bending life using the temperature as a parameter.
  • the flexion life of the body may be predicted.
  • the stress generated in the wiring layer and the bending life using the frequency of the reciprocating motion of the movable plate in the bending test as parameters.
  • the virtual life under an arbitrary frequency is calculated based on the stress calculated by the second calculation procedure and the relationship between the stress using the frequency as a parameter and the bending life.
  • the bending life of the laminate may be predicted.
  • the bending life prediction apparatus for a laminate has a plurality of laminated layers including a base layer and a wiring layer made of a patterned conductor, extends in one direction, and is a bendable laminate.
  • the laminate is bent and inserted in a U shape between a fixed plate and a movable plate arranged at a predetermined interval, and each end in the longitudinal direction of the laminate is fixed to the fixed plate and the movable plate, respectively. It is a device that predicts the bending life to be measured by a bending test performed by reciprocating a plate in a direction parallel to its surface.
  • the bending life prediction apparatus of the laminate of the present invention is For each of a plurality of laminate samples having different configurations, the thickness of each layer constituting the sample, the relationship between stress and strain in each layer constituting the sample, the interval between the fixed plate and the movable plate in the bending test, First input means for inputting information on the line width and the line width in the wiring layer; First calculation means for calculating stress generated in the wiring layer of the sample using information input by the first input means; A second input means for inputting the bending life of each of the plurality of samples measured by the bending test; Based on the stress generated in the wiring layer of each sample calculated by the first calculation means and the bending life of each sample input by the second input means, the stress generated in the wiring layer in the laminate having an arbitrary configuration Means for determining the relationship between the bending life and Regarding the virtual laminate that is the object of predicting the flex life, the thickness of each layer constituting the virtual laminate, the relationship between the stress and strain in each layer constituting the virtual laminate, and the fixed plate and the mov
  • the first calculation means calculates the main stress obtained from the normal stress and the shear stress as the stress generated in the wiring layer of the sample
  • the second calculation means As the stress generated in the wiring layer of the laminated body, the main stress obtained from the normal stress and the shear stress may be calculated.
  • the means for obtaining the relationship between the stress and the bending life is the relationship between the stress generated in the wiring layer and the bending life with the temperature when the bending test is performed as a parameter. And calculating the bending life based on the stress calculated by the second calculating means and the relationship between the stress and the bending life with the temperature as a parameter and the virtual lamination under an arbitrary temperature.
  • the flexion life of the body may be predicted.
  • the means for obtaining the relationship between the stress and the bending life is the stress generated in the wiring layer and the bending life using the frequency of the reciprocating motion of the movable plate in the bending test as a parameter.
  • the means for calculating the relationship between the bending life and the bending life is calculated based on the stress calculated by the second calculation means and the relationship between the stress and the bending life with the frequency as a parameter.
  • the bending life of the laminate may be predicted.
  • the bending life prediction program for a laminated body of the present invention has a plurality of laminated layers including a base layer and a wiring layer made of a patterned conductor, extends in one direction, and can be bent.
  • the laminate is bent and inserted in a U shape between a fixed plate and a movable plate arranged at a predetermined interval, and each end in the longitudinal direction of the laminate is fixed to the fixed plate and the movable plate, respectively.
  • the bending life prediction program for a laminate includes a computer, For each of a plurality of laminate samples having different configurations, the thickness of each layer constituting the sample, the relationship between stress and strain in each layer constituting the sample, the interval between the fixed plate and the movable plate in the bending test, A first input means for inputting information on the line width and the inter-line width in the wiring layer; First calculation means for calculating stress generated in the wiring layer of the sample using information input by the first input means; A second input means for inputting the bending life of each of the plurality of samples measured by the bending test; Based on the stress generated in the wiring layer of each sample calculated by the first calculation means and the bending life of each sample input by the second input means, the stress generated in the wiring layer in the laminate having an arbitrary configuration Means for determining the relationship between the bending life and Regarding the virtual laminate that is the object of predicting the flex life, the thickness of each layer constituting the virtual laminate, the relationship between the stress and strain in each layer constituting the virtual laminate,
  • the computer-readable recording medium of the present invention records the bending life prediction program for the laminate of the present invention.
  • the thickness of each layer constituting the virtual laminate and the virtual laminate The relationship between the stress and strain in each layer constituting the virtual laminate, the distance between the fixed plate and the movable plate in the bending test, and the line width and the inter-line width in the wiring layer of the virtual laminate, It is possible to calculate the stress generated in the wiring layer of the virtual laminate and predict the flex life of the virtual laminate based on the calculated stress and the relationship between the stress and the flex life. Thereby, according to this invention, it becomes possible to set the conditions of each layer which comprises a laminated body arbitrarily, and to predict the bending life of a laminated body easily.
  • FIG. 6 is a characteristic diagram showing a relationship between a principal stress and a bending life represented by a stress-bending life relational expression in an embodiment of the present invention.
  • SYMBOLS 1 Laminated body, 11 ... Base layer, 12 ... Wiring layer, 13 ... Adhesive layer, 14 ... Cover layer, 21 ... Fixed plate, 22 ... Movable plate, 30 ... Bending life prediction apparatus.
  • the laminated body in this Embodiment has a plurality of laminated layers including a base layer and a wiring layer made of a patterned conductor, extends in one direction, and can be bent.
  • FPC flexible printed wiring board
  • FIG. 1 is a perspective view showing a part of the laminate.
  • the hatched surface represents a cross section.
  • FIG. 2 is a plan view showing a wiring layer of the laminate.
  • the laminate shown in FIGS. 1 and 2 is specifically an FPC.
  • this FPC is a test FPC used for measuring a flex life by a flex test.
  • the laminate 1 includes a base layer 11, a wiring layer 12 made of a patterned conductor joined to one surface of the base layer 11, and an adhesive layer covering the wiring layer 12. 13 and a cover layer 14 bonded to the adhesive layer 13.
  • the laminate 1 extends in one direction and can be bent.
  • the laminated body 1 may further include another adhesive layer disposed between the base layer 11 and the wiring layer 12.
  • the wiring layer 12 has a meander shape. More specifically, the wiring layer 12 includes two adjacent linear portions 12a extending in the longitudinal direction of the laminate 1 (left and right direction in FIG. 2) and two adjacent wiring layers 12 so that the entire wiring layer 12 has a meander shape. It has the connection part 12b which connects the edge parts of the linear part 12a.
  • the width of the linear portion 12a (the vertical dimension in FIG. 2) is defined as a line width LW
  • the interval between two adjacent linear portions 12a is defined as a line width SW.
  • a resin such as a polyimide resin is used.
  • a metal such as copper is used.
  • a synthetic adhesive such as an epoxy adhesive or an acrylic adhesive is used.
  • laminate sample In the following description, the terms “laminate sample”, “arbitrary laminate”, and “virtual laminate” are used in relation to the laminate 1.
  • the “laminate sample” is actually produced in order to create a stress-bending life relationship as a relation between the stress generated in the wiring layer 12 and the flexing life in a laminated body having an arbitrary configuration described later. It is the laminated body 1 which is.
  • “Arbitrary laminated body” is an imaginary laminated body 1 in which conditions other than the minimum requirements of the laminated body 1 are not specified.
  • the “virtual laminated body” is an imaginary laminated body 1 that is a target for predicting a flex life.
  • the “virtual laminate” includes the thickness of each layer constituting the laminate 1, the relationship between stress and strain in each layer constituting the laminate 1, the distance between the fixed plate and the movable plate in the bending test, It is specified by each information of the line width LW and the line width SW in the wiring layer 12.
  • “laminate sample”, “arbitrary laminate”, and “virtual laminate” “laminate sample” is denoted by reference numeral 1A, and “arbitrary laminate”
  • the “body” is denoted by reference numeral 1B, and the “virtual stacked body” is denoted by reference numeral 1C.
  • FIG. 3 is an explanatory view showing a state in which the laminate 1 is mounted on a bending test apparatus used for a bending test.
  • the bending test apparatus includes a fixed plate 21 and a movable plate 22 that are arranged with a predetermined interval H therebetween.
  • the laminate 1 is bent in a U shape between the fixed plate 21 and the movable plate 22 and the longitudinal ends of the laminate 1 are fixed to the fixed plate 21 by the fixtures 23 and 24, respectively.
  • the movable plate 22 is fixed to the movable plate 22, and the movable plate 22 is reciprocated in a direction parallel to the surface.
  • the wiring layer 12 is energized and the resistance value of the wiring layer 12 is detected. Then, when the resistance value of the wiring layer 12 becomes equal to or higher than a predetermined value, it is determined that the wiring layer 12 is broken. In the bending test, the number of reciprocating motions of the movable plate 22 from the start of the test until the wiring layer 12 breaks, that is, until the resistance value of the wiring layer 12 becomes a predetermined value or more is measured as the bending life.
  • the bending life prediction apparatus 30 is an apparatus that predicts the bending life to be measured for the laminate 1 by the above-described bending test.
  • the bending life prediction apparatus 30 is realized using a computer.
  • FIG. 4 is a block diagram showing a configuration of a computer 30C that realizes the bending life prediction apparatus 30.
  • the computer 30 ⁇ / b> C includes a main control unit 31, an input device 32, an output device 33, a display device 34, a storage device 35, and a bus 36 that connects them to each other.
  • the main control unit 31 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory).
  • the storage device 35 is not particularly limited as long as it can store information, but is, for example, a hard disk device or an optical disk device.
  • the storage device 35 records information on a computer-readable recording medium 37 and reproduces information from the recording medium 37.
  • the recording medium 37 may be in any form as long as it can store information, but is, for example, a hard disk or an optical disk.
  • the recording medium 37 may be a recording medium in which the bending life prediction program for the laminate according to the present embodiment is recorded.
  • FIG. 5 is a functional block diagram showing a functional configuration of the bending life prediction apparatus 30.
  • the bending life prediction apparatus 30 includes a first input means 41, a first calculation means 42, a second input means 43, a stress-bending life relational expression creating means 44, A third input unit 45, a second calculation unit 46, and a bending life prediction unit 47 are provided.
  • the first input means 41 includes, for each of a plurality of laminate samples 1A having different configurations, the thickness of each layer constituting the sample 1A, the relationship between the stress and strain in each layer constituting the sample 1A, and the bending test. Information on the distance H between the fixed plate 21 and the movable plate 22, and the line width LW and the line width SW in the wiring layer 12 of the sample 1A are input.
  • the first calculation means 42 uses the information input by the first input means 41 to calculate the stress generated in the wiring layer 12 of the sample 1A.
  • the second input means 43 inputs the bending life of each of the plurality of samples 1A measured by the bending test.
  • the stress-bending life relation formula creating means 44 includes the stress generated in the wiring layer 12 of each sample 1A calculated by the first calculating means 42 and the bending life of each sample 1A input by the second input means 43. Based on the above, the relationship between the stress generated in the wiring layer 12 in the laminate 1B having an arbitrary configuration and the flex life is obtained. Specifically, the stress-bending life relation formula creating means 44 creates a stress-bending life relation formula as a relation between the stress generated in the wiring layer 12 and the flex life in the laminate 1B having an arbitrary configuration.
  • the stress-bending life relationship formula creating means 44 corresponds to “means for obtaining the relationship between stress and bending life” in the present invention.
  • the third input means 45 includes, for the virtual laminate 1C, the thickness of each layer constituting the virtual laminate 1C, the relationship between the stress and strain in each layer constituting the virtual laminate 1C, and the fixed plate in the bending test. Information on the distance H between the movable plate 22 and the line width LW and the line width SW in the wiring layer 12 of the virtual laminate 1C is input.
  • the second calculation means 46 uses the information input by the third input means 45 to calculate the stress generated in the wiring layer 12 of the virtual laminate 1C.
  • the bending life prediction means 47 is a stress-bending life relational expression created by the stress generated in the wiring layer 12 of the virtual laminate 1C calculated by the second calculation means 46 and the stress-bending life relation creating means 44. Based on the above, the bending life of the virtual laminate 1C is predicted.
  • the program for predicting the bending life of the laminate shows the computer 30C shown in FIG. 4 in order to predict the bending life to be measured for the laminate 1 by the above-described bending test. It functions as each means.
  • the bending life prediction program for the laminate is recorded in the recording medium 37 in FIG. 4 or the ROM in the main control unit 31.
  • the bending life prediction method of the laminated body according to the present embodiment is a method of predicting the bending life to be measured for the laminated body 1 by the above-described bending test.
  • FIG. 6 is a flowchart showing a method for predicting the bending life of the laminate according to the present embodiment.
  • the bending life prediction method for a laminate according to the present embodiment first, for each of a plurality of laminate samples 1A having different configurations, the thickness of each layer constituting sample 1A, Using information on the relationship between stress and strain in each layer constituting the sample 1A, the distance H between the fixed plate 21 and the movable plate 22 in the bending test, and the line width LW and the line width SW in the wiring layer 12 of the sample 1A. Then, the stress generated in the wiring layer 12 of the sample 1A is calculated (step S101). This step S101 corresponds to the first calculation procedure in the present invention. Next, the bending life of each of the plurality of samples 1A is measured by a bending test (step S102).
  • step S103 based on the stress generated in the wiring layer 12 of each sample 1A calculated in step S101 and the bending life of each sample 1A measured in step S102, the wiring layer 12 in the laminate 1B having an arbitrary configuration As a relationship between the generated stress and the flex life, a stress-flex life relationship is obtained (step S103).
  • step S104 corresponds to the second calculation procedure in the present invention.
  • step S105 based on the stress generated in the wiring layer 12 of the virtual laminate 1C calculated in step S104 and the relationship between the stress obtained in step S103 and the flex life, the flex life of the virtual laminate 1C is calculated. Prediction is made (step S105).
  • step S101 and step S102 may be reversed from the above description.
  • step S101 first, the thickness of each layer constituting the sample 1A and the stress and strain in each layer constituting the sample 1A are measured by the first input means 41 for each of the samples 1A of the plurality of stacked bodies 1 having different configurations. , The distance H between the fixed plate 21 and the movable plate 22 in the bending test, and the line width LW and the line width SW in the wiring layer 12 of the sample 1A are input. Next, the stress generated in the wiring layer 12 of the sample 1 ⁇ / b> A is calculated by the first calculation unit 42 using the information input by the first input unit 41.
  • step S102 the bending life of each of the plurality of samples 1A measured by the bending test is input by the second input means 43.
  • step S103 based on the stress generated in the wiring layer 12 of each sample 1A calculated by the first calculation means 42 and the bending life of each sample 1A input by the second input means 43, stress-bending is performed.
  • the life relation formula creating means 44 creates a stress-bending life relation formula as a relation between the stress generated in the wiring layer 12 and the flex life in the laminate 1B having an arbitrary configuration.
  • step S104 the third input unit 45 causes the virtual laminated body 1C to have a thickness of each layer constituting the virtual laminated body 1C, a relationship between stress and strain in each layer constituting the virtual laminated body 1C, and bending.
  • Information on the distance H between the fixed plate 21 and the movable plate 22 in the test and the line width and the line width in the wiring layer 12 of the virtual laminate 1C are input.
  • the stress generated in the wiring layer 12 of the virtual laminate 1C is calculated by the second calculation unit 46 using the information input by the third input unit 45.
  • step S105 based on the stress generated in the wiring layer 12 of the virtual laminated body 1C calculated by the second calculation means 46 and the stress-bending life relation formula created by the stress-bending life relation formula creation means 44.
  • the bending life prediction means 47 predicts the bending life of the virtual laminate 1C.
  • FIG. 7 is a cross-sectional view of a model of the laminate 1 used for explaining the stress calculation method.
  • FIG. 7 shows a model in which the laminate 1 has three layers, but the following description applies to the case where the laminate has two or more layers.
  • the number of layers of the stacked body 1 is n (n is an integer of 2 or more).
  • the symbol B represents the width of the stacked body 1. The width here is a dimension in a direction parallel to the lower surface of the first layer and perpendicular to the longitudinal direction of the laminate 1.
  • the wiring layer 12 is patterned as shown in FIG. 2, for example. Therefore, when the laminated body 1 is viewed from above, the laminated body 1 includes the wiring layer 12. There are portions where the wiring layer 12 does not exist. Here, a portion where the wiring layer 12 exists is called a wiring portion, and a portion where the wiring layer 12 does not exist is called a space portion.
  • the wiring part and the space part have different configurations. For example, in the case of the laminated body 1 shown in FIG. 1, the wiring part is composed of four layers, and the space part is composed of three layers. Therefore, hereinafter, the wiring portion and the space portion are considered separately as necessary.
  • the lower surface of the first layer is defined as a reference surface SP.
  • the symbol NP represents the neutral surface of the laminate 1.
  • the distance between the neutral plane NP and the reference plane SP is defined as a neutral plane position [NP]
  • the neutral plane position [NP] is calculated separately for the wiring portion and the space portion.
  • the neutral plane position [NP] is calculated by the following equation (1).
  • E i is the elastic modulus of the material constituting the i-th layer.
  • This elastic modulus E i corresponds to “relation between stress and strain in each layer” in the present embodiment.
  • B i is the width of the i-th layer and corresponds to the width B shown in FIG.
  • the value of the line width LW is used as B i
  • the line width SW is used as B i.
  • the value of is used.
  • h i is the distance between the center plane of the i-th layer and the reference plane SP.
  • the central surface of the i-th layer is a virtual surface located at the center in the thickness direction of the i-th layer.
  • the neutral plane position of the wiring portion is referred to as [NP] Line .
  • a bending normal stress ⁇ c that is a maximum tensile normal stress in the longitudinal direction generated in the wiring layer 12 by pure bending is calculated.
  • the bending normal stress ⁇ c is calculated by the following equation (3).
  • Ec is the elastic modulus of the wiring layer 12.
  • yc is the distance from the reference plane SP to the surface (here, the lower surface) that becomes convex when bent between the upper surface and the lower surface of the wiring layer 12.
  • B Line is the sum of the line widths LW
  • B Space is the sum of the line widths SW.
  • a i is the distance between the upper surface of the i-th layer and the neutral plane NP
  • b i is the distance between the lower surface of the i-th layer and the neutral plane NP.
  • k is the shear correction factor.
  • R in the bending test is about 1 mm
  • Le is a half value of the circumference of the effective bent portion.
  • A is the cross-sectional area of the laminate 1 perpendicular to the longitudinal direction of the laminate 1.
  • the principal stress S generated in the wiring layer 12 is calculated.
  • the main stress S is calculated by the following equation (7).
  • the main stress S as the stress generated in the wiring layer 12 is calculated from the vertical stress ⁇ c and the shear stress ⁇ . Further, as described above, the principal stress S is the thickness of each layer constituting the laminated body 1, the relationship between the stress and strain (elastic modulus) in each layer constituting the laminated body 1, and the fixed plate 21 in the bending test. And the distance H between the movable plate 22 and the information on the line width LW and the line width SW in the wiring layer 12.
  • step S101 the principal stress S generated in the wiring layer 12 is calculated for each of a plurality of laminate samples 1A having different configurations by the above method.
  • step S104 the principal stress S generated in the wiring layer 12 is calculated by the above method for the virtual laminated body 1C that is a target for predicting the bending life.
  • step S102 the bending life N of each of the plurality of samples 1A is measured by the bending test described with reference to FIG.
  • f be the frequency of the reciprocating motion of the movable plate 22 in this bending test.
  • T is the temperature at which the bending test is performed.
  • the bending test may be performed with the frequency f and the temperature T being constant for all the samples 1A, or may be performed with at least one of the frequency f and the temperature T being different for each sample 1A.
  • a plurality of types of samples 1A are prepared for each type, and a bending test is performed on each of the plurality of samples 1A of one type by changing at least one of frequency f and temperature T. Good.
  • the stress-bending life relation equation created in step S103 is used, and at least one of the frequency f and the temperature T is a parameter. It becomes possible to make it a function.
  • the relationship between the main stress S generated in the wiring layer 12 and the bending life N for the laminate 1B having an arbitrary configuration is as follows. It was found that it can be approximated by equation (8). Therefore, in the present embodiment, the following equation (8) is a stress-bending life relationship expression that represents the relationship between the principal stress S generated in the wiring layer 12 and the bending life N in the laminate 1B having an arbitrary configuration.
  • the relationship between the principal stress S and the bending life N expressed by the equation (8) is as shown in FIG.
  • N ⁇ ⁇ (f ⁇ / S ⁇ ) ⁇ exp ( ⁇ / T) (8)
  • ⁇ , ⁇ , ⁇ , and ⁇ are physical property parameters (constants).
  • ⁇ , ⁇ , ⁇ , ⁇ are obtained by the least square method so that the equation (8) becomes an equation that approximates the data of the principal stress S and the bending life N generated in the wiring layer 12 for the plurality of samples 1A. Determine the value of.
  • Formula (8) becomes a formula showing the relation between principal stress S and bending life N about layered product 1B of arbitrary composition.
  • step S105 the principal stress S generated in the wiring layer 12 of the virtual laminate 1C calculated in step S104 is substituted into the above equation (8) obtained in step S103, whereby the virtual laminate 1C.
  • the bending life N is calculated.
  • the value of the parameter is specified, Substitute into equation (8).
  • the equation (8) Is an equation representing the relationship between the principal stress S and the bending life N when the bending test is performed under the condition where the frequency f and the temperature T are the above-described constant values.
  • Equation (8) predict the bending life N when the bending test is performed on the virtual laminated body 1C under the conditions where the frequency f and the temperature T are the above-described constant values, respectively. Is possible.
  • the bending test is performed on the plurality of samples 1A, and the equation (8) is created using the data obtained by the bending test, the equation (8) ) Is an expression representing the relationship between the principal stress S and the bending life N, using the temperature T as a parameter when the bending test is performed under the condition that the frequency f is the above-mentioned constant value.
  • the bending life N in the case where the bending test is performed on the virtual laminated body 1C using the equation (8) under the condition that the frequency f is the above-described constant value at an arbitrary temperature T. Can be predicted.
  • the bending test is performed on the plurality of samples 1A, and the formula (8) is created using the data obtained by the bending test, the formula (8 ) Is an expression representing the relationship between the principal stress S and the bending life N using the frequency f as a parameter when the bending test is performed under the condition where the temperature T is the above constant value.
  • the bending life N in the case where the bending test is performed on the virtual laminated body 1C using the equation (8) under the condition that the temperature T is the above-described constant value under an arbitrary frequency f. Can be predicted.
  • the equation (8) is This is an equation representing the relationship between the principal stress S and the bending life N, with the frequency f and the temperature T as parameters. In this case, it is possible to predict the bending life N when the bending test is performed on the virtual laminated body 1C under an arbitrary temperature T and an arbitrary frequency f using the equation (8). .
  • the elastic modulus of the material constituting each layer is used as the relationship between the stress and the strain in each layer constituting the laminate 1, but the laminate 1 is constituted.
  • the relationship between stress and strain in each layer may be obtained by a tensile test on the material constituting each layer. Specifically, what is acquired by the tensile test on the material constituting each layer is actually measured data (hereinafter referred to as SS curve) of the relationship between stress and strain acquired by the tensile test.
  • an SS curve is obtained by performing a tensile test on each of the materials (hereinafter referred to as constituent materials) constituting each layer.
  • the laminate 1 is divided into a plurality of calculation steps that are sufficiently fine so that the calculation does not diverge from the straight state to the bent state in the bending test.
  • the slope for each calculation step is calculated in the SS curve of each constituent material.
  • the inclination for each calculation step is the elastic modulus for each calculation step in each constituent material.
  • the elastic modulus for each calculation step in each constituent material thus obtained is used in place of the elastic modulus used in the series of calculations of Equations (1) to (7), and an updated Lagrangian method is used.
  • the series of calculations of the formulas (1) to (7) are repeatedly performed for each calculation step, and wiring is performed in the bent state at the time of the bending test.
  • the principal stress S generated in the layer 12 is calculated. According to the calculation method of the principal stress S using such an updated Lagrangian method, the principal stress S can be accurately calculated even when the relationship between stress and strain (SS curve) in each layer is nonlinear. become.
  • the thickness of each layer constituting the virtual laminated body 1C and the relationship between the stress and strain in each layer constituting the virtual laminated body 1C is obtained using the information on the distance H between the fixed plate 21 and the movable plate 22 in the bending test and the line width LW and the line width SW in the wiring layer 12 of the virtual laminate 1C.
  • the bending life N of the virtual laminate 1C can be predicted based on the calculated stress and the stress-bending life relational expression. In the present embodiment, when the bending life N of the virtual laminated body 1C is predicted, it is not necessary to actually make the prototype of the laminated body 1.
  • the bending life N of the virtual laminated body 1C can be estimated by the calculation using each said information, without using a finite element method. Therefore, according to the present embodiment, it is possible to easily set the conditions of each layer constituting the multilayer body 1 and predict the bending life of the multilayer body 1. Thereby, according to this Embodiment, it becomes possible to obtain
  • the laminated body to which the present invention is applied is not limited to the FPC in which the wiring layer is provided on only one surface of the base layer, but may be an FPC in which the wiring layer is provided on both surfaces of the base layer.

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PCT/JP2009/053912 2008-03-04 2009-03-03 積層体の屈曲寿命予測方法、積層体の屈曲寿命予測装置、積層体の屈曲寿命予測プログラムおよび記録媒体 WO2009110440A1 (ja)

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WO2013002271A1 (ja) * 2011-06-30 2013-01-03 大電株式会社 耐屈曲性導電材料の選定方法及びそれを用いたケーブル
JP2014130048A (ja) * 2012-12-28 2014-07-10 Nippon Steel & Sumikin Chemical Co Ltd フレキシブル回路基板の耐折り曲げ性試験装置および方法
CN108801818A (zh) * 2018-05-30 2018-11-13 上海与德通讯技术有限公司 折弯机构
CN113092281A (zh) * 2021-03-29 2021-07-09 上海南洋-藤仓电缆有限公司 一种扁型电梯随行电缆寿命加速评价试验方法

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KR102404294B1 (ko) * 2014-09-30 2022-05-31 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 플렉시블 회로 기판 및 전자 기기
CN108254949B (zh) * 2018-01-26 2021-01-01 惠州市华星光电技术有限公司 一种曲面状态下液晶面板的寿命及最大曲率的估算方法
CN109490093B (zh) * 2018-10-17 2021-04-20 欣强电子（清远）有限公司 一种软硬结合板弯折角度性能检测装置
JP7347197B2 (ja) * 2019-12-19 2023-09-20 トヨタ自動車株式会社 回転電機コアの製造方法および製造装置
CN114577451B (zh) * 2022-02-24 2023-08-01 苏州华星光电技术有限公司 显示面板的寿命测试方法

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JPH08166333A (ja) * 1994-10-11 1996-06-25 Sumitomo Electric Ind Ltd 複合体の耐屈曲寿命予測方法及び複合体の耐屈曲性評価方法
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CN101870076A (zh) * 2010-07-02 2010-10-27 西南交通大学 一种基于性能退化模型的数控机床导轨副寿命预测方法
WO2013002271A1 (ja) * 2011-06-30 2013-01-03 大電株式会社 耐屈曲性導電材料の選定方法及びそれを用いたケーブル
JP2014130048A (ja) * 2012-12-28 2014-07-10 Nippon Steel & Sumikin Chemical Co Ltd フレキシブル回路基板の耐折り曲げ性試験装置および方法
CN108801818A (zh) * 2018-05-30 2018-11-13 上海与德通讯技术有限公司 折弯机构
CN113092281A (zh) * 2021-03-29 2021-07-09 上海南洋-藤仓电缆有限公司 一种扁型电梯随行电缆寿命加速评价试验方法
CN113092281B (zh) * 2021-03-29 2023-03-17 上海南洋-藤仓电缆有限公司 一种扁型电梯随行电缆寿命加速评价试验方法

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