JP5248595B2 - 積層体の屈曲寿命予測方法、積層体の屈曲寿命予測装置、積層体の屈曲寿命予測プログラムおよび記録媒体 - Google Patents

積層体の屈曲寿命予測方法、積層体の屈曲寿命予測装置、積層体の屈曲寿命予測プログラムおよび記録媒体 Download PDF

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JP5248595B2
JP5248595B2 JP2010501901A JP2010501901A JP5248595B2 JP 5248595 B2 JP5248595 B2 JP 5248595B2 JP 2010501901 A JP2010501901 A JP 2010501901A JP 2010501901 A JP2010501901 A JP 2010501901A JP 5248595 B2 JP5248595 B2 JP 5248595B2
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Prior art keywords
stress
laminate
wiring layer
bending
bending life
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JPWO2009110440A1 (ja
Inventor
伸悦 藤元
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Nippon Steel and Sumikin Chemical Co Ltd
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Nippon Steel and Sumikin Chemical Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0041—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining deflection or stress
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0033—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining damage, crack or wear
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0075—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by means of external apparatus, e.g. test benches or portable test systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0023—Bending
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/26—Composites
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/04—Ageing analysis or optimisation against ageing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2010501901A 2008-03-04 2009-03-03 積層体の屈曲寿命予測方法、積層体の屈曲寿命予測装置、積層体の屈曲寿命予測プログラムおよび記録媒体 Active JP5248595B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010501901A JP5248595B2 (ja) 2008-03-04 2009-03-03 積層体の屈曲寿命予測方法、積層体の屈曲寿命予測装置、積層体の屈曲寿命予測プログラムおよび記録媒体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008053763 2008-03-04
JP2008053763 2008-03-04
JP2010501901A JP5248595B2 (ja) 2008-03-04 2009-03-03 積層体の屈曲寿命予測方法、積層体の屈曲寿命予測装置、積層体の屈曲寿命予測プログラムおよび記録媒体
PCT/JP2009/053912 WO2009110440A1 (ja) 2008-03-04 2009-03-03 積層体の屈曲寿命予測方法、積層体の屈曲寿命予測装置、積層体の屈曲寿命予測プログラムおよび記録媒体

Publications (2)

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JPWO2009110440A1 JPWO2009110440A1 (ja) 2011-07-14
JP5248595B2 true JP5248595B2 (ja) 2013-07-31

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JP2010501901A Active JP5248595B2 (ja) 2008-03-04 2009-03-03 積層体の屈曲寿命予測方法、積層体の屈曲寿命予測装置、積層体の屈曲寿命予測プログラムおよび記録媒体

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Country Link
JP (1) JP5248595B2 (zh)
KR (1) KR20100138889A (zh)
CN (1) CN101960283B (zh)
TW (1) TWI460425B (zh)
WO (1) WO2009110440A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101870076B (zh) * 2010-07-02 2012-03-21 西南交通大学 一种基于性能退化模型的数控机床导轨副寿命预测方法
WO2013002271A1 (ja) * 2011-06-30 2013-01-03 大電株式会社 耐屈曲性導電材料の選定方法及びそれを用いたケーブル
JP2014130048A (ja) * 2012-12-28 2014-07-10 Nippon Steel & Sumikin Chemical Co Ltd フレキシブル回路基板の耐折り曲げ性試験装置および方法
KR102404294B1 (ko) * 2014-09-30 2022-05-31 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 플렉시블 회로 기판 및 전자 기기
CN108254949B (zh) * 2018-01-26 2021-01-01 惠州市华星光电技术有限公司 一种曲面状态下液晶面板的寿命及最大曲率的估算方法
CN108801818A (zh) * 2018-05-30 2018-11-13 上海与德通讯技术有限公司 折弯机构
CN109490093B (zh) * 2018-10-17 2021-04-20 欣强电子（清远）有限公司 一种软硬结合板弯折角度性能检测装置
JP7347197B2 (ja) * 2019-12-19 2023-09-20 トヨタ自動車株式会社 回転電機コアの製造方法および製造装置
CN113092281B (zh) * 2021-03-29 2023-03-17 上海南洋-藤仓电缆有限公司 一种扁型电梯随行电缆寿命加速评价试验方法
CN114577451B (zh) * 2022-02-24 2023-08-01 苏州华星光电技术有限公司 显示面板的寿命测试方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02190742A (ja) * 1989-01-20 1990-07-26 Shinetsu Eng Kk 試験片の高速屈曲・振動方法およびその装置
JPH08166333A (ja) * 1994-10-11 1996-06-25 Sumitomo Electric Ind Ltd 複合体の耐屈曲寿命予測方法及び複合体の耐屈曲性評価方法
WO2001008172A1 (fr) * 1999-07-26 2001-02-01 Sumitomo Wiring Systems, Ltd. Procede permettant de prevoir le degre de flexion d'un fil electrique ou d'un faisceau de fils electriques

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100444177C (zh) * 2002-11-28 2008-12-17 矢崎总业株式会社 用于预测由振动引起的电导线和/或导线保护部件的弯曲寿命的方法和装置
TWI300125B (en) * 2005-12-20 2008-08-21 Ind Tech Res Inst Apparatus and method for continuously bending flexible device
KR100961259B1 (ko) * 2008-07-14 2010-06-03 한국전자통신연구원 무선 단말기 및 그의 발향 제어 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02190742A (ja) * 1989-01-20 1990-07-26 Shinetsu Eng Kk 試験片の高速屈曲・振動方法およびその装置
JPH08166333A (ja) * 1994-10-11 1996-06-25 Sumitomo Electric Ind Ltd 複合体の耐屈曲寿命予測方法及び複合体の耐屈曲性評価方法
WO2001008172A1 (fr) * 1999-07-26 2001-02-01 Sumitomo Wiring Systems, Ltd. Procede permettant de prevoir le degre de flexion d'un fil electrique ou d'un faisceau de fils electriques

Also Published As

Publication number Publication date
TWI460425B (zh) 2014-11-11
JPWO2009110440A1 (ja) 2011-07-14
CN101960283A (zh) 2011-01-26
WO2009110440A1 (ja) 2009-09-11
KR20100138889A (ko) 2010-12-31
TW200944793A (en) 2009-11-01
CN101960283B (zh) 2014-02-19

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