WO2009104362A1 - Container having noncontact id discrimination device, and method for manufacturing the same - Google Patents

Container having noncontact id discrimination device, and method for manufacturing the same Download PDF

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Publication number
WO2009104362A1
WO2009104362A1 PCT/JP2009/000442 JP2009000442W WO2009104362A1 WO 2009104362 A1 WO2009104362 A1 WO 2009104362A1 JP 2009000442 W JP2009000442 W JP 2009000442W WO 2009104362 A1 WO2009104362 A1 WO 2009104362A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
container
identification device
antenna coil
manufacturing
Prior art date
Application number
PCT/JP2009/000442
Other languages
French (fr)
Japanese (ja)
Inventor
星勝治
Original Assignee
スターエンジニアリング株式会社
静岡県
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スターエンジニアリング株式会社, 静岡県 filed Critical スターエンジニアリング株式会社
Publication of WO2009104362A1 publication Critical patent/WO2009104362A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D51/00—Closures not otherwise provided for
    • B65D51/24—Closures not otherwise provided for combined or co-operating with auxiliary devices for non-closing purposes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2203/00—Decoration means, markings, information elements, contents indicators
    • B65D2203/10—Transponders

Definitions

  • the present invention relates to a container with a non-contact ID identification device in which a non-contact ID identification device used for identifying the contained item is attached to various containers that need to identify the contained item by its type, capacity, or other identification information. And a manufacturing method thereof.
  • a barcode or the like is used as an identification means in this case.
  • a radio frequency identification tag using an RFID tag is used from the viewpoint of reading speed, amount of information used for identification, identification reliability and other aspects.
  • the sample containers of Patent Documents 1 and 2 are “a sample container including a holder for holding a sample, a radio frequency discriminator, and a carrier for the radio frequency discriminator,
  • the radio frequency identifier includes an antenna that transmits and receives radio frequency energy, and an integrated circuit chip connected to the antenna, the radio frequency identifier is arranged on the carrier, and the carrier is in the holder It is a connected sample container.
  • the identification information data of the sample that is the content of the sample container is held in the radio frequency identifier, and can be read at high speed and without error by an external reader.
  • far higher performance can be secured in these respects than when a bar code is used.
  • the present invention provides a container with a non-contact ID identification device that takes advantage of the advantages of Patent Documents 1 and 2, solves the problem, and does not attach a large accessory to the container, and a method for manufacturing the same. Doing so is the solution.
  • a non-contact ID identification constituted by an IC chip including a microprocessor and an antenna coil for exchanging power and exchanging information between the IC chip and an external reader for identifying the contents.
  • a container with a non-contact ID identification device attached with a device The non-contact ID identification device is configured such that the antenna coil is wound in an aligned manner, and the IC chip is arranged inside the antenna coil. It is a container with a non-contact ID identification device configured by directly bonding and bonding the non-contact ID identification device to an arbitrary part thereof.
  • the second aspect of the present invention is the container with a non-contact ID identification device according to the first aspect of the present invention, wherein the inner diameter of the antenna coil is at least a limit in which the IC chip can be disposed without deforming the antenna coil. It has a small diameter.
  • an IC chip including a microprocessor and an antenna coil for exchanging power and exchanging information between the IC chip and an external reader are provided in the container to identify the contents.
  • a method of manufacturing a container with a non-contact ID identification device to which a non-contact ID identification device is attached The non-contact ID identification device is configured such that the antenna coil is wound in an aligned manner, and the IC chip is arranged inside the antenna coil.
  • Manufacture of a container with a non-contact ID identification device for manufacturing the container with a non-contact ID identification device of 1 or 2 of the present invention by arranging the non-contact ID identification device directly on an arbitrary part of the container and adhesively bonding it Is the method.
  • the inner diameter of the antenna coil is arranged at least inside the IC chip without deforming the antenna coil. It is configured to have a small diameter as much as possible.
  • the antenna coil is wound in a plurality of stages.
  • 6 of the present invention is a method of manufacturing a container with a non-contact ID identification device according to 3, 4, or 5 of the present invention, in which adjacent coil conductors of the antenna coil are connected with an adhesive.
  • 7 of the present invention is a method for manufacturing a container with a non-contact ID identification device according to 3, 4, 5 or 6 of the present invention, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container. It is a thing.
  • the non-contact ID identification device itself arranges and winds the antenna coil, arranges the IC chip inside thereof, and the terminal of the antenna coil Since both ends are connected, the size is reduced, and in addition, the shape of itself is self-maintained. Therefore, it is directly bonded to the container without arranging it on the carrier. Is now possible.
  • this non-contact ID identification device is very small. Therefore, the container with the non-contact ID identification device is formed by directly bonding the non-contact ID identification device to the container and adhesively bonding it. It can be said that the container is only provided with a very small non-contact ID identification device, and the presence of the non-contact ID identification device is inconvenient for storage, transportation and other handling of the container. There is almost no risk of the occurrence of this. Therefore, as a matter of course, there is almost no risk of inconveniences in shape and dimensions in handling the sample and other objects that are the contents. In addition, since there is no carrier to which the non-contact ID identification device is attached, the process and material for attaching it are not necessary and it is economical.
  • the inner diameter of the antenna coil is configured to be small enough to dispose the IC chip at least inside without deforming the antenna coil.
  • the antenna coil itself has been reduced in size so that the shape of itself can be better maintained.
  • the non-contact ID identification device composed of the antenna coil and the IC chip disposed inside the antenna coil also has a sufficiently high self-holding power of its shape. Adhesive bonding to the container can be performed satisfactorily.
  • the container with a non-contact ID identification device having the effect of 1 of the present invention can be produced easily and reliably.
  • the container with a non-contact ID identification device having the effect of 2 of the present invention can be easily and reliably manufactured.
  • the diameter can be reduced and the self-holding force for self-holding the shape can be increased.
  • the adhesive is disposed between the adjacent coil conductors of the antenna coil so that they are coupled to each other. Can be further increased.
  • the non-contact ID identification device in addition to adhesively bonding the non-contact ID identification device arranged at an arbitrary position of the container, the non-contact ID identification device is covered with a covering material.
  • the coating further protects the container so that it will not be easily damaged even if it comes in contact with anything outside when handling the container.
  • Various types of coating materials can be used. For example, when the container is heat-resistant glass, low-melting glass is used to cover the non-contact ID identification device. Alternatively, a second adhesive can be employed to cover the non-contact ID identification device.
  • this non-contact ID identification device is reinforced by the adhesive used for bonding and fixing to the container, and even if it touches some external member when handling the container.
  • a covering material such as a sheet material or a second adhesive as described above.
  • (a) is sectional drawing of the IC tag of Example 1
  • (b) is sectional drawing of the bottom part of the test tube turned upside down which arranged this IC tag.
  • (a) is sectional drawing of the test tube with a lid which provided the IC tag of Example 2
  • (b) is an expanded sectional view of the part of the lid which arranged the IC tag.
  • (a) is sectional drawing of the bottom part of the test tube turned upside down which arranged the IC tag of Example 3
  • (b) is an enlarged view of the part which arranged the IC tag of (a).
  • (a) is a schematic plan view showing an example of a reel-shaped tape in which an IC tag is inserted into a storage hole
  • (b) is a sectional view thereof
  • (c) is a reel-shaped tape in which an IC tag is inserted into a storage hole.
  • the schematic plan view which shows other examples, (d) is the sectional drawing.
  • the present invention basically includes a non-contact IC chip including an IC chip including a microprocessor and an antenna coil for exchanging power and exchanging information between the IC chip and an external reader for identifying the contents.
  • a container with a non-contact ID identification device to which an ID identification device is attached The non-contact ID identification device is configured such that the antenna coil is wound in an aligned manner, and the IC chip is arranged inside the antenna coil.
  • a container with a non-contact ID identification device configured by directly bonding and bonding the non-contact ID identification device to an arbitrary portion thereof, and an adhesive bonding by arranging the non-contact ID identification device directly at an arbitrary portion of the container It is the manufacturing method manufactured by doing.
  • the IC chip has a communication function for exchanging power and exchanging information with an external reader via the antenna coil, and stores and holds the exchanged information and other information and programs.
  • This is an element that includes storage means, and further includes a microprocessor that performs data processing and other arithmetic processing in accordance with the stored program as described above.
  • the storage capacity of the storage means is preferably large, but the size is not limited to a specific one.
  • Various programs should also be selected or configured depending on the application, and are not limited to specific ones.
  • the antenna coil should be composed of aligned windings as described above, but a circular shape, an elliptical shape, a polygonal shape, or the like can be freely adopted as the shape viewed from the plane. It is preferable to determine the relationship with the container to be attached.
  • the antenna coil can be formed in a single-stage or single-layer spiral shape, or can be formed in a state where it is stacked in a plurality of stages (multiple layers). By configuring the antenna coil in a plurality of stages (multiple layers) as in the latter case, it is possible to obtain the advantage of reducing the diameter although the thickness of the antenna coil is increased. Alternatively, the self-holding force of the antenna shape is increased.
  • the diameter of the coil conductor for making the antenna coil is preferably as large as possible from the viewpoint of reducing the self-holding force for holding the coil shape and the DC resistance. This is a balance between the need to make the overall size as small as possible.
  • the number of turns of the antenna coil is determined in consideration of the required resonance frequency.
  • the antenna coil has an inner diameter that is at least small enough to allow the IC chip to be disposed without deforming the antenna coil inside. This is intended to increase the self-holding force of the shape of the antenna coil itself.
  • the method for winding this antenna coil is free. Wind using a normal jig.
  • an adhesive is provided between adjacent coil conductors of the wound antenna coil so as to couple each other. This can be done by applying an adhesive when winding the coil, but the antenna coil is formed with a coil conductor coated with a hot-melt adhesive, and then the coil conductor. It is also possible to heat-melt the adhesive on the surface using hot air or the like, thereby adhering adjacent to each other. By doing so, the self-holding force of the coil shape of the antenna coil can be increased.
  • the IC chip is positioned inside the antenna coil created as described above, for example, at the center of the antenna coil, and electrically connected by connecting both ends of the antenna coil to the terminal portion, and It is mechanically fixed at the position of the antenna coil. Since the IC chip is small and light, the shape of the antenna coil is not destroyed by this.
  • the connection between the both ends of the antenna coil and the terminal portion of the IC chip can be performed by freely selecting various existing techniques. Of course, it is free to adopt a new connection method with high strength.
  • an outermost layer having a terminal portion made of gold (Au) is employed, an antenna coil using a copper (Cu) coil conductor is placed on the terminal portion, and the antenna coil It is also possible to perform direct bonding by applying pressure while heating from above and forming an Au / Cu total solid solution in the vicinity of the interface between the two. In this way, the bond between the two is extremely strong, which is very preferable.
  • the container is not limited to a specific one. Naturally, for example, a material such as plastic or glass, a length or diameter size, or a shape is determined depending on various conditions required for a sample or the like to be accommodated in the container, or storage conditions. Any of them can be used.
  • the non-contact ID identification device composed of the antenna coil and the IC chip is arranged at an arbitrary part of the container and bonded and fixed with an adhesive. It is free to join and fix to any part such as the side surface, bottom surface or top surface of the lid.
  • Such a non-contact ID identification device can be bonded to a container by applying an adhesive to a predetermined position of the container and then pressing the non-contact ID identification device to the part, or the non-contact ID identification device. After applying an adhesive on the back side of the container, the non-contact ID identification device is pressed against a predetermined position of the container, or the non-contact ID identification device is disposed at a predetermined position of the container, It can be performed by dropping an adhesive having a low viscosity. In both cases, the bonding and fixing is ensured after a slight drying time.
  • Such an adhesion and fixing operation of the non-contact ID identification device to the container can of course be performed manually, but naturally it can also be performed automatically.
  • the non-contact ID identification devices 33 and 43 can be adhesively bonded to a predetermined part of the container.
  • 34 and 44 are positioning holes.
  • the non-contact ID identification device that has arrived at a predetermined work position is sequentially taken out by the take-out device, and further, the adhesive is applied to the back side thereof by the adhesive applicator.
  • the non-contact ID identification device that has reached the predetermined work position is sequentially taken out by the take-out device, and on the other hand, the adhesive application device is applied to the predetermined portion of the predetermined container that has arrived at the same timing. Application can be performed, and then the back side of the non-contact ID identification device is brought into contact with and pressed against the portion of the container where the adhesive is applied.
  • the non-contact ID identification device that has arrived at the predetermined work position is sequentially taken out by the take-out device, and this non-contact ID identification device is similarly arranged at a predetermined part of the predetermined container that has arrived at the same timing. Subsequently, a liquid adhesive can be dropped from above.
  • the non-contact ID identification device of the present invention can hold its shape as described above, it is arranged in the storage holes 32 and 42 of the reel-shaped tapes 31 and 41 as described above. Thus, it is possible to automate the above-described attachment work to the container. Needless to say, not only can the mounting operation be automated, but the tape can be stored, transported, etc. by being stored in the tapes 31 and 41 as described above.
  • the non-contact ID identification device that is bonded and fixed to an arbitrary part of the container in this way is reinforced as a result by the adhesive disposed on the back surface side, so that it has sufficient strength in a state where it is simply bonded and bonded to the container. It does not easily cause damage even if it contacts various external articles.
  • the second adhesive is employed as the covering material, the same adhesive may be applied simultaneously without separating the second adhesive from the adhesive for bonding and fixing.
  • the non-contact ID identification device itself is configured by arranging an IC chip inside the aligned antenna coil. Because it is small and is directly arranged and adhesively bonded to the container without using a carrier, the container is attached with only a very small non-contact ID identification device, and its bulge is extremely It will be small. Therefore, there is almost no risk of any inconvenience in terms of shape and dimensions in storage, transportation and other handling of the container. Therefore, as a matter of course, there is almost no risk of inconvenience in handling the sample or the other contents.
  • the non-contact ID identification device itself is configured by configuring the antenna coil in a small size by aligning windings, arranging an IC chip inside thereof, and connecting both ends of the antenna coil to the terminal portion thereof.
  • the non-contact ID identification device itself is configured by configuring the antenna coil in a small size by aligning windings, arranging an IC chip inside thereof, and connecting both ends of the antenna coil to the terminal portion thereof.
  • the non-contact ID identification device is a device in which the antenna coil is wound in a plurality of stages (multiple layers) to reduce its diameter and at the same time increase the self-holding force for self-holding the shape.
  • the self-holding force for self-holding the shape is further enhanced by arranging an adhesive between adjacent coil conductors of the antenna coil and bonding them together.
  • the non-contact ID identification device in addition to adhesively bonding the non-contact ID identification device disposed at an arbitrary position of the container, the non-contact ID identification device is covered with a covering material, thereby protecting the non-contact ID identification device. It is also designed to prevent damage from being easily caused even if it touches something outside during handling.
  • a square IC chip 2 with a side of ⁇ 1.0 mm and a thickness of 0.25 mm is placed inside a 45-turn aligned wound antenna coil (made of copper conductor) 1 having an outer diameter of 4.0 mm, an inner diameter of 1.6 mm, and a thickness of 0.4 mm.
  • the both ends (input / output ends) of the antenna coil 1 are placed on the gold bumps 2a and 2a of the two terminal portions of the IC chip 2 and heated and pressed, and the copper conductor and the gold bump 2a constituting the antenna coil 1 are placed.
  • An IC tag (non-contact ID identification device) 3 connected by forming an Au—Cu total solid solution at the interface with 2a was prepared.
  • the IC tag 3 has a short lead dimension which is an extension of the antenna coil 1 to the gold bumps 2a and 2a.
  • the IC tag 3 since it is lightweight, it has a feature of extremely high self-holding ability to hold its shape. Therefore, the IC tag 3 does not require a carrier for maintaining its shape as described above.
  • the IC tag 3 is placed on the bottom of a flat-bottomed test tube 4 made of polytetrafluoroethylene having an outer diameter of 10 mm, which is positioned upside down. Thereafter, an adhesive (low-temperature varnish: C5-101 (trade name) manufactured by GE) was diluted to about 15 poise with a 1: 1 mixture of toluene and ethanol, and added dropwise. The dropping amount of the adhesive was such that the IC tag 3 sinks therein. After dripping, it was dried and cured at room temperature for about 15 minutes. In FIGS. 1 (a) and 1 (b), 5 is a cured adhesive.
  • C5-101 trade name
  • the test tube 4 with the above IC tag 3 is placed in a temperature cycle thermostat and the temperature cycle reciprocating between ⁇ 55 ° C. and 150 ° C. is repeated 1000 times every 2 hours, and the test is completed. Later, the state of the IC tag 3 at the bottom of the test tube 4 was observed. As a result, the copper wire constituting the antenna coil 1 was oxidized and turned brown, but the IC tag 3 was maintained in a good appearance without peeling off. Furthermore, even if the tip of the minus driver was pushed in such a manner that it was inserted between the surface of the test tube 4 and the cured adhesive 5, it was not easily peeled off manually. It is considered that a sufficiently good adhesive force is maintained.
  • a square IC chip 2 with a side of ⁇ 1.0 mm and a thickness of 0.25 mm is arranged inside a 15-turn aligned wound antenna coil (made of copper conducting wire) 11 having an outer diameter of ⁇ 12.5 mm, an inner diameter of ⁇ 11 mm, and a thickness of 0.25 mm.
  • the both ends (input / output ends) of the antenna coil 11 are placed on the gold bumps 2a and 2a of the two terminal portions of the IC chip 2 and heated and pressed, and the copper conductors and the gold bumps 2a and 2a constituting the antenna coil 11 are applied.
  • An IC tag (non-contact ID identification device) 13 was prepared by forming an Au—Cu total solid solution at the interface with the interface.
  • this IC tag 13 is similar to that of the IC tag 3 of the first embodiment, and has a lead portion that is an extension of the antenna coil 11 to the gold bumps 2a and 2a. Since the dimensions are short and the IC chip 2 is lightweight, the self-holding force for holding the shape is extremely high. Therefore, the IC tag 13 does not require a carrier for maintaining its shape, like the IC tag 3 of the first embodiment.
  • the IC tag 13 is placed on a lid 14a of a test tube 14 made of fluoroethylene propylene having an outer diameter of 10 mm, and then an adhesive (Aron Melt PES- IIIEHW (trade name, manufactured by Toa Gosei Co., Ltd.) was added dropwise, and the amount of the adhesive dropped into the IC tag 13. After dropping, the adhesive was dried and cured at room temperature for about 15 minutes.
  • reference numeral 15 denotes a cured adhesive.
  • the test tube 14 in which the above IC tag 13 is fixed on the upper surface of the lid 14a is exposed to liquid nitrogen vapor (-140 ° C.) and left for one month, then taken out, and the function of the IC tag 13 and the IC tag 13 And the connection state of the test tube 14 with the lid 14a.
  • the function of the IC tag 13 was not impaired at all when a communication test was performed in the same manner as in Example 1.
  • the test of the coupling state of the test tube 14 with the lid 14a was performed by pushing the tip of a flat-blade screwdriver between the surface of the lid 14a and the cured adhesive 15, but the cured adhesive 15 was manually applied. It did not peel easily. It can be judged that good adhesive strength is maintained.
  • a square IC chip 2 having a side of ⁇ 1.0 mm and a thickness of 0.25 mm is placed inside an 18-turn aligned wound antenna coil (made of copper conductor) 21 having an outer diameter of 10.5 mm, an inner diameter of 5.0 mm, and a thickness of 0.3 mm.
  • the both ends (input / output ends) of the antenna coil 21 are placed on the gold bumps 2a and 2a of the two terminal portions of the IC chip 2 and heated and pressed, and the copper conductor and the gold bump 2a constituting the antenna coil 21 are placed.
  • An IC tag (non-contact ID identification device) 23 was prepared in which an Au—Cu total solid solution was formed at the interface with 2a and connected.
  • the IC tag 23 is an extension of the antenna coil 21 up to the gold bumps 2a and 2a, like the IC tags 3 and 13 of the first and second embodiments. Since the size of a certain lead portion is short and the IC chip 2 is lightweight, the self-holding force for holding the shape is extremely high. Therefore, like the IC tags 3 and 13 of the first and second embodiments, the IC tag 23 does not require a carrier for holding the shape.
  • this IC tag 23 is placed on the bottom of a round bottom type of a test tube 24 made of polytetrafluoroethylene having an outer diameter of 15 mm and turned upside down.
  • an adhesive low temperature varnish: C5-101 (trade name) manufactured by GE
  • C5-101 trade name
  • the dropping amount of the adhesive was such that the IC tag 23 almost sinks therein. After dripping, it was dried and cured at room temperature for about 15 minutes.
  • a cyanoacrylate adhesive C5-105 (trade name, manufactured by Oxford), which is the second adhesive, was further dropped thereon to completely cover the IC tag 23. After dripping, it was dried and cured at room temperature for about 15 minutes. 3 (a) and 3 (b), 25 is a cured adhesive, and 35 is a cured second adhesive (covering material).
  • the test tube 24 having the above IC tag 23 fixed on the bottom was put in a thermostatic bath, kept at 220 ° C. and stored for one month. Thereafter, the IC tag 23 was taken out and the function of the IC tag 23 and the coupling state between the IC tag 23 and the test tube 24 were tested. First, the state of the IC tag 23 at the bottom of the test tube 24 was visually observed. As a result, the copper wire constituting the antenna coil 21 was oxidized to become blackish brown, but the IC tag 23 was maintained in a good appearance without peeling off. Next, when a communication test was performed in the same manner as in Examples 1 and 2, the function of the IC tag 23 was not impaired at all.
  • the test of the coupling state with the test tube 24 was performed by pushing the tip of the minus driver in a mode of being inserted between the surface of the test tube 24 and the cured second adhesive 35, but the cured second adhesive 35 was not peeled off manually. It can be judged that good adhesive strength is sufficiently maintained. Furthermore, in addition to the communication test, the communication test was further performed after hitting the outer surface of the cured second adhesive 35 about 5 times so that the test tube 24 was not broken on the grip side of the minus driver. The function was not impaired at all. The protective effect of the cured second adhesive 35 is sufficient.
  • the container with the non-contact ID identification device of the present invention and the manufacturing method thereof can be applied as the container having the content identifying means in such a field and the manufacturing method thereof.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)

Abstract

Provided is a container having a noncontact ID discrimination device needing no additional large accessory. An IC tag (3) is prepared such that an IC chip (2) of a square having sides of 1.0 mm each and a thickness of 0.27 mm is arranged inside of an antenna coil (1) of 57 turns of traverse winding having an outer diameter (φ) of 5.0 mm, an inner diameter (φ) of 1.11 mm, and a thickness of 0.5 mm, such that the two ends of the antenna coil (1) are placed and heated under pressure on the gold bumps (2a and 2a) of the two terminals of the IC chip (2), and such that a solid solution of 100 % Au-Cu is formed to connect the boundaries of the copper conductors constituting the antenna coil (1) and the gold bumps (2a and 2a). The IC tag (3) thus prepared is placed on the flat bottom of a vertically inverted test tube (5) made of polytetrafluoroethylene and having an outer diameter (φ) of 10 mm, and an adhesive (or a cold varnish: GE Product C7-101 (Trade Name)) diluted to about 17 poises is dropped. The adhesive is dipped in a quantity to sink the IC tag (3). After this dipping operation, the IC tag (3) is dried to set at the room temperature for about 17 minutes.

Description

非接触ＩＤ識別装置付き容器及びその製造方法Container with non-contact ID identification device and manufacturing method thereof
　本発明は、収容物をその種別や容量その他の識別情報により識別する必要のある種々の容器にその収容物の識別のために使用する非接触ＩＤ識別装置を取り付けた非接触ＩＤ識別装置付き容器及びその製造方法に関する。 The present invention relates to a container with a non-contact ID identification device in which a non-contact ID identification device used for identifying the contained item is attached to various containers that need to identify the contained item by its type, capacity, or other identification information. And a manufacturing method thereof.
　容器に識別を必要とする種々の収容物を収容し、該容器に収容物に応じた情報を保持した識別手段を付して個々の容器の収容物を識別することとしている業務分野には非常に多くの例がある。医学、農学、或いは化学の諸分野で各種の多数のサンプルを試験管のような容器に収容し、これらの容器に内容物の識別手段を施した上で保管し、必要に応じて分類し、或いは、種々のテストを行い、得られた情報を記録する等の処理が行われている。 It is very useful in the business field where various containers that need to be identified are stored in a container, and identification means holding information corresponding to the containers is attached to the containers to identify the contents of individual containers. There are many examples. Numerous samples in various fields of medicine, agriculture, or chemistry are stored in containers such as test tubes, and these containers are stored after content identification means, and classified as necessary. Alternatively, various tests are performed and processing such as recording the obtained information is performed.
　この場合の識別手段として、バーコード等が使用されているが、読み取り速度、識別のために利用される情報の量、識別の確実性その他の観点から、ＲＦＩＤタグを利用する無線周波数識別タグを備えるサンプル容器（特許文献１、２）が提案されている A barcode or the like is used as an identification means in this case. However, a radio frequency identification tag using an RFID tag is used from the viewpoint of reading speed, amount of information used for identification, identification reliability and other aspects. Proposed sample containers (Patent Documents 1 and 2)
　この特許文献１、２のサンプル容器は、「サンプルを保持する保持器と、無線周波数識別器と、該無線周波数識別器用のキャリアとを備えるサンプル容器であって、
　前記無線周波数識別器が、無線周波数エネルギーを送受信するアンテナと、該アンテナに接続された集積回路チップとを備え、前記無線周波数識別器が前記キャリア上に配され、かつ前記キャリアが前記保持器に連結されているサンプル容器」である。 The sample containers of Patent Documents 1 and 2 are “a sample container including a holder for holding a sample, a radio frequency discriminator, and a carrier for the radio frequency discriminator,
The radio frequency identifier includes an antenna that transmits and receives radio frequency energy, and an integrated circuit chip connected to the antenna, the radio frequency identifier is arranged on the carrier, and the carrier is in the holder It is a connected sample container.
　従ってこの特許文献１、２のサンプル容器によれば、容器にその内容物であるサンプルの識別情報データが無線周波数識別器に保持されており、外部のリーダにより、高速で、かつ誤りなく読み取り可能であり、バーコードを用いた場合より、これらの点で遥かに高い性能を確保することができる。更に、段階的に行われるテスト等の場合は、集積回路チップの内部の記憶手段を利用して、順次新たなデータを書き込むことも可能であり、新たな高い利便性を確保することも可能である。 Therefore, according to the sample containers of Patent Documents 1 and 2, the identification information data of the sample that is the content of the sample container is held in the radio frequency identifier, and can be read at high speed and without error by an external reader. Thus, far higher performance can be secured in these respects than when a bar code is used. Furthermore, in the case of tests that are performed step by step, it is possible to write new data sequentially using the internal storage means of the integrated circuit chip, and to ensure new high convenience. is there.
　このようにこの特許文献１、２のサンプル容器はそれ以前のバーコード等の技術と比較して極めて優れたものであるが、識別情報を保持する無線周波数識別器をキャリアを介してサンプルを保持する保持器（容器）に取り付けるものであり、それ故、サンプル容器に無用に大きな付属物を付すこととなり、これが、サンプル容器の保管や運搬の際、或いは内容物であるサンプルの取り扱いの際に邪魔になる虞がある。
特表２００３－５３５３４８号公報 ＷＯ０１／０９４０１６　Ａ１ As described above, the sample containers of Patent Documents 1 and 2 are extremely superior to the technology such as the previous barcode, but the radio frequency discriminator that holds the identification information is held through the carrier. Therefore, it is necessary to attach a large attachment to the sample container when it is stored or transported, or when handling the sample as the contents. There is a risk of getting in the way.
Special table 2003-535348 gazette WO01 / 0994016 A1
　本発明は、以上の観点から、特許文献１、２の有する利点を生かし、その問題点を解決し、容器に大きな付属物を付すこととならない非接触ＩＤ識別装置付き容器及びその製造方法を提供することを解決の課題とする。 In view of the above, the present invention provides a container with a non-contact ID identification device that takes advantage of the advantages of Patent Documents 1 and 2, solves the problem, and does not attach a large accessory to the container, and a method for manufacturing the same. Doing so is the solution.
　本発明の１は、収容物の識別のために、マイクロプロセッサを含むＩＣチップ並びに該ＩＣチップと外部のリーダとの間の電力の授受及び情報の交換を行うアンテナコイルで構成した非接触ＩＤ識別装置を取り付けた非接触ＩＤ識別装置付きの容器であって、
　前記非接触ＩＤ識別装置が、前記アンテナコイルを整列巻きし、かつ該ＩＣチップを該アンテナコイルの内側に配して構成したものであり、
　前記非接触ＩＤ識別装置を直接にその任意の部位に接着接合して構成した非接触ＩＤ識別装置付き容器である。 1 of the present invention is a non-contact ID identification constituted by an IC chip including a microprocessor and an antenna coil for exchanging power and exchanging information between the IC chip and an external reader for identifying the contents. A container with a non-contact ID identification device attached with a device,
The non-contact ID identification device is configured such that the antenna coil is wound in an aligned manner, and the IC chip is arranged inside the antenna coil.
It is a container with a non-contact ID identification device configured by directly bonding and bonding the non-contact ID identification device to an arbitrary part thereof.
　本発明の２は、本発明の１の非接触ＩＤ識別装置付き容器に於いて、前記アンテナコイルの内径を、少なくともその内側に該アンテナコイルを変形させることなく前記ＩＣチップを配し得る限度の小径に構成したものである。 The second aspect of the present invention is the container with a non-contact ID identification device according to the first aspect of the present invention, wherein the inner diameter of the antenna coil is at least a limit in which the IC chip can be disposed without deforming the antenna coil. It has a small diameter.
　本発明の３は、容器に、その収容物の識別のために、マイクロプロセッサを含むＩＣチップ並びに該ＩＣチップと外部のリーダとの間の電力の授受及び情報の交換を行うアンテナコイルで構成した非接触ＩＤ識別装置を取り付ける非接触ＩＤ識別装置付き容器の製造方法であって、
　前記非接触ＩＤ識別装置が、前記アンテナコイルを整列巻きし、かつ該ＩＣチップを該アンテナコイルの内側に配して構成したものであり、
　前記非接触ＩＤ識別装置を直接に前記容器の任意の部位に配して接着接合することにより本発明の１又は２の非接触ＩＤ識別装置付き容器を製造する非接触ＩＤ識別装置付き容器の製造方法である。 According to the third aspect of the present invention, an IC chip including a microprocessor and an antenna coil for exchanging power and exchanging information between the IC chip and an external reader are provided in the container to identify the contents. A method of manufacturing a container with a non-contact ID identification device to which a non-contact ID identification device is attached,
The non-contact ID identification device is configured such that the antenna coil is wound in an aligned manner, and the IC chip is arranged inside the antenna coil.
Manufacture of a container with a non-contact ID identification device for manufacturing the container with a non-contact ID identification device of 1 or 2 of the present invention by arranging the non-contact ID identification device directly on an arbitrary part of the container and adhesively bonding it Is the method.
　本発明の４は、本発明の３の非接触ＩＤ識別装置付き容器の製造方法に於いて、前記アンテナコイルの内径を、少なくともその内側に該アンテナコイルを変形させることなく前記ＩＣチップを配し得る限度の小径に構成したものである。 According to a fourth aspect of the present invention, in the method for manufacturing a container with a non-contact ID identification device according to the third aspect of the present invention, the inner diameter of the antenna coil is arranged at least inside the IC chip without deforming the antenna coil. It is configured to have a small diameter as much as possible.
　本発明の５は、本発明の３又は４の非接触ＩＤ識別装置付き容器の製造方法に於いて、前記アンテナコイルを複数段に巻いたものである。 <5> In the method for manufacturing a container with a non-contact ID identification device according to 3 or 4 of the present invention, the antenna coil is wound in a plurality of stages.
　本発明の６は、本発明の３、４又は５の非接触ＩＤ識別装置付き容器の製造方法に於いて、前記アンテナコイルの隣接するコイル導体間を接着剤で結合したものである。 6 of the present invention is a method of manufacturing a container with a non-contact ID identification device according to 3, 4, or 5 of the present invention, in which adjacent coil conductors of the antenna coil are connected with an adhesive.
　本発明の７は、本発明の３、４、５又は６の非接触ＩＤ識別装置付き容器の製造方法に於いて、前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施したものである。 7 of the present invention is a method for manufacturing a container with a non-contact ID identification device according to 3, 4, 5 or 6 of the present invention, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container. It is a thing.
　本発明の１の非接触ＩＤ識別装置付き容器によれば、非接触ＩＤ識別装置自体が、そのアンテナコイルを整列巻きし、その内側にＩＣチップを配し、かつその端子部に該アンテナコイルの両端を接続することとしたものであるため、小型になり、加えてそれ自体の形状が自己保持されるものとなり、それ故、これをキャリアに配することなく、直接に容器に接着接合することが可能となったものである。 According to the container with a non-contact ID identification device of 1 of the present invention, the non-contact ID identification device itself arranges and winds the antenna coil, arranges the IC chip inside thereof, and the terminal of the antenna coil Since both ends are connected, the size is reduced, and in addition, the shape of itself is self-maintained. Therefore, it is directly bonded to the container without arranging it on the carrier. Is now possible.
　以上のように、この非接触ＩＤ識別装置は非常に小型であり、それ故、非接触ＩＤ識別装置付き容器は、該非接触ＩＤ識別装置を直接に容器に配して接着接合したものであるから、容器には極めて小型の非接触ＩＤ識別装置が付属しているだけと云って良い状態になり、その非接触ＩＤ識別装置の存在の故に、該容器の保管上、運搬上その他の取り扱いに不都合が生じる虞は殆ど皆無となったものである。そのため、当然、その内容物であるサンプルその他の物の取り扱い上でも形状・寸法上の不都合が生じる虞は殆どない。また非接触ＩＤ識別装置を付属させるキャリアがないので、これを付属させるための工程及び材料が不要となり、経済的でもある。 As described above, this non-contact ID identification device is very small. Therefore, the container with the non-contact ID identification device is formed by directly bonding the non-contact ID identification device to the container and adhesively bonding it. It can be said that the container is only provided with a very small non-contact ID identification device, and the presence of the non-contact ID identification device is inconvenient for storage, transportation and other handling of the container. There is almost no risk of the occurrence of this. Therefore, as a matter of course, there is almost no risk of inconveniences in shape and dimensions in handling the sample and other objects that are the contents. In addition, since there is no carrier to which the non-contact ID identification device is attached, the process and material for attaching it are not necessary and it is economical.
　本発明の２の非接触ＩＤ識別装置付き容器によれば、アンテナコイルの内径を少なくともその内側に該アンテナコイルを変形させることなくＩＣチップを配置し得る限度の小径に構成したものであるため、アンテナコイル自体が小型となり、それ自体の形状を一層良好に自己保持可能となったものである。その結果、該アンテナコイルとその内側に配したＩＣチップとからなる非接触ＩＤ識別装置もその形状の自己保持力が十分に高いものとなり、それ故、これをキャリアに配することなく、直接に容器に接着接合することが良好に行われうるようになったものである。 According to the container with a non-contact ID identification device of 2 of the present invention, the inner diameter of the antenna coil is configured to be small enough to dispose the IC chip at least inside without deforming the antenna coil. The antenna coil itself has been reduced in size so that the shape of itself can be better maintained. As a result, the non-contact ID identification device composed of the antenna coil and the IC chip disposed inside the antenna coil also has a sufficiently high self-holding power of its shape. Adhesive bonding to the container can be performed satisfactorily.
　本発明の３の非接触ＩＤ識別装置付き容器の製造方法によれば、本発明の１の効果を有する非接触ＩＤ識別装置付き容器を、容易かつ確実に製造することができる。 According to the method for producing a container with a non-contact ID identification device of 3 of the present invention, the container with a non-contact ID identification device having the effect of 1 of the present invention can be produced easily and reliably.
　本発明の４の非接触ＩＤ識別装置付き容器の製造方法によれば、本発明の２の効果を有する非接触ＩＤ識別装置付き容器を、容易かつ確実に製造することができる。 According to the method 4 for manufacturing a container with a non-contact ID identification device of the present invention, the container with a non-contact ID identification device having the effect of 2 of the present invention can be easily and reliably manufactured.
　本発明の５の非接触ＩＤ識別装置付き容器の製造方法によれば、アンテナコイルを複数段に巻くことにより、その径を小さくすると共に、形状を自己保持する自己保持力を高めることができる。 According to the method for manufacturing a container with a non-contact ID identification device according to 5 of the present invention, by winding the antenna coil in a plurality of stages, the diameter can be reduced and the self-holding force for self-holding the shape can be increased.
　本発明の６の非接触ＩＤ識別装置付き容器の製造方法によれば、アンテナコイルの隣接するコイル導体間に接着剤を配して相互を結合することとしたため、形状を自己保持する自己保持力を更に高めることができる。 According to the method for manufacturing a container with a non-contact ID identification device according to 6 of the present invention, the adhesive is disposed between the adjacent coil conductors of the antenna coil so that they are coupled to each other. Can be further increased.
　本発明の７の非接触ＩＤ識別装置付き容器の製造方法によれば、容器の任意の位置に配した非接触ＩＤ識別装置を接着接合することに加えて、該非接触ＩＤ識別装置を被覆材で被覆することにより、一層、その保護を図り、該容器の取り扱いの際等に外部の何物かに接触しても容易に損傷を生じることのないようにしたものである。被覆材は、種々のそれが採用可能であり、例えば、該容器が耐熱ガラスの場合は低融点ガラスを採用し、これで該非接触ＩＤ識別装置を被覆することができる。或いは第２の接着剤を採用し、これで該非接触ＩＤ識別装置を被覆することもできる。 According to the manufacturing method of a container with a non-contact ID identification device of 7 of the present invention, in addition to adhesively bonding the non-contact ID identification device arranged at an arbitrary position of the container, the non-contact ID identification device is covered with a covering material. The coating further protects the container so that it will not be easily damaged even if it comes in contact with anything outside when handling the container. Various types of coating materials can be used. For example, when the container is heat-resistant glass, low-melting glass is used to cover the non-contact ID identification device. Alternatively, a second adhesive can be employed to cover the non-contact ID identification device.
　これらの被覆材による保護がなくても、この非接触ＩＤ識別装置は、容器との接合固定のために用いた接着剤により補強され、容器の取り扱いの際に外部の何らかの部材に接触しても容易に損傷を生じることはないが、以上のようにシート材又は第２の接着剤等の被覆材で保護することにより、一層、損傷の虞を少なくすることができる。 Even without protection by these covering materials, this non-contact ID identification device is reinforced by the adhesive used for bonding and fixing to the container, and even if it touches some external member when handling the container Although damage is not easily caused, the risk of damage can be further reduced by protecting with a covering material such as a sheet material or a second adhesive as described above.
(a)は実施例１のＩＣタグの断面図、(b)は該ＩＣタグを配した、上下反転した試験管の底部の断面図。(a) is sectional drawing of the IC tag of Example 1, (b) is sectional drawing of the bottom part of the test tube turned upside down which arranged this IC tag. (a)は実施例２のＩＣタグを配した蓋付きの試験管の断面図、(b)はＩＣタグを配した蓋の部分の拡大断面図。(a) is sectional drawing of the test tube with a lid which provided the IC tag of Example 2, (b) is an expanded sectional view of the part of the lid which arranged the IC tag. (a)は実施例３のＩＣタグを配した、上下反転した試験管の底部の断面図、(b)は(a)のＩＣタグを配した部分の拡大図。(a) is sectional drawing of the bottom part of the test tube turned upside down which arranged the IC tag of Example 3, (b) is an enlarged view of the part which arranged the IC tag of (a). (a)はＩＣタグを収納穴に装入したリール形状のテープの一例を示す概略平面図、(b)はその断面図、(c)はＩＣタグを収納穴に装入したリール形状のテープの他の例を示す概略平面図、(d)はその断面図。(a) is a schematic plan view showing an example of a reel-shaped tape in which an IC tag is inserted into a storage hole, (b) is a sectional view thereof, and (c) is a reel-shaped tape in which an IC tag is inserted into a storage hole. The schematic plan view which shows other examples, (d) is the sectional drawing.
符号の説明Explanation of symbols
　１　　アンテナコイル
　２　　ＩＣチップ
　２ａ　金バンプ
　３　　ＩＣタグ（非接触ＩＤ識別装置）
　４　　平底の試験管
　５　　硬化した接着剤
　１１　アンテナコイル
　１３　ＩＣタグ（非接触ＩＤ識別装置）
　１４　試験管
　１４ａ　試験管の蓋
　１５　硬化した接着剤
　２１　アンテナコイル
　２３　ＩＣタグ（非接触ＩＤ識別装置）
　２４　試験管
　２５　硬化した接着剤
　３１、４１　テープ
　３２、４２　収納穴
　３３、４３　非接触ＩＤ識別装置
　３４、４４　位置決め穴
　３５　硬化した第２の接着剤（被覆材） 1 Antenna coil 2 IC chip 2a Gold bump 3 IC tag (non-contact ID identification device)
4 Flat bottom test tube 5 Cured adhesive 11 Antenna coil 13 IC tag (non-contact ID identification device)
14 Test tube 14a Test tube lid 15 Cured adhesive 21 Antenna coil 23 IC tag (non-contact ID identification device)
24 Test tube 25 Cured adhesive 31, 41 Tape 32, 42 Storage hole 33, 43 Non-contact ID identification device 34, 44 Positioning hole 35 Cured second adhesive (coating material)
　本発明は、基本的に、収容物の識別のために、マイクロプロセッサを含むＩＣチップ並びに該ＩＣチップと外部のリーダとの間の電力の授受及び情報の交換を行うアンテナコイルで構成した非接触ＩＤ識別装置を取り付けた非接触ＩＤ識別装置付きの容器であって、
　前記非接触ＩＤ識別装置が、前記アンテナコイルを整列巻きし、かつ該ＩＣチップを該アンテナコイルの内側に配して構成したものであり、
　前記非接触ＩＤ識別装置を直接にその任意の部位に接着接合して構成した非接触ＩＤ識別装置付き容器、及び前記非接触ＩＤ識別装置を直接に前記容器の任意の部位に配して接着接合することにより製造するその製造方法である。 The present invention basically includes a non-contact IC chip including an IC chip including a microprocessor and an antenna coil for exchanging power and exchanging information between the IC chip and an external reader for identifying the contents. A container with a non-contact ID identification device to which an ID identification device is attached,
The non-contact ID identification device is configured such that the antenna coil is wound in an aligned manner, and the IC chip is arranged inside the antenna coil.
A container with a non-contact ID identification device configured by directly bonding and bonding the non-contact ID identification device to an arbitrary portion thereof, and an adhesive bonding by arranging the non-contact ID identification device directly at an arbitrary portion of the container It is the manufacturing method manufactured by doing.
　前記ＩＣチップは、前記したように、前記アンテナコイルを介して外部のリーダとの間で電力の授受及び情報の交換を行う通信機能を備え、かつ交換した情報その他の情報及びプログラムを格納保持する記憶手段を備え、更には、前記のように、保持するプログラムに従ってデータの処理その他の演算処理を行うマイクロプロセッサを備えた要素である。記憶手段の記憶容量は大きい方が好ましいが、そのサイズは特定のそれに限定されない。プログラムもその用途により種々選択され、或いは構成されるべきであり、特定のそれに限定されない。 As described above, the IC chip has a communication function for exchanging power and exchanging information with an external reader via the antenna coil, and stores and holds the exchanged information and other information and programs. This is an element that includes storage means, and further includes a microprocessor that performs data processing and other arithmetic processing in accordance with the stored program as described above. The storage capacity of the storage means is preferably large, but the size is not limited to a specific one. Various programs should also be selected or configured depending on the application, and are not limited to specific ones.
　前記アンテナコイルは、前記のように整列巻きで構成されるべきものであるが、その平面から見た形状は、円形、楕円形、或いは多角形等を自由に採用可能である。取付対象の容器との関係を考慮して決定するのが好ましい。また該アンテナコイルは、一段又は一層の渦巻き状に形成することも、これを複数段（複数層）に重ねた状態に形成することも自由である。後者のように複数段（複数層）に構成することによって、アンテナコイルの厚みは増すが径を小さくする利点を得ることができる。或いは、アンテナ形状の自己保持力を高めることにもなる。アンテナコイルを作るためのコイル導体の径は、コイル形状を保持する自己保持力及び直流抵抗を小さくする観点からはできるだけ大径であることが好ましい。これは、全体のサイズをできるだけ小さくする要求との間でバランスを取って決定する。なおアンテナコイルの巻き数は要求される共振周波数を考慮して決定される。 The antenna coil should be composed of aligned windings as described above, but a circular shape, an elliptical shape, a polygonal shape, or the like can be freely adopted as the shape viewed from the plane. It is preferable to determine the relationship with the container to be attached. In addition, the antenna coil can be formed in a single-stage or single-layer spiral shape, or can be formed in a state where it is stacked in a plurality of stages (multiple layers). By configuring the antenna coil in a plurality of stages (multiple layers) as in the latter case, it is possible to obtain the advantage of reducing the diameter although the thickness of the antenna coil is increased. Alternatively, the self-holding force of the antenna shape is increased. The diameter of the coil conductor for making the antenna coil is preferably as large as possible from the viewpoint of reducing the self-holding force for holding the coil shape and the DC resistance. This is a balance between the need to make the overall size as small as possible. The number of turns of the antenna coil is determined in consideration of the required resonance frequency.
　前記アンテナコイルは、またその内径を、少なくともその内側に該アンテナコイルを変形させることなく、前記ＩＣチップを配し得る限度の小径に構成するのが適当である。これによってアンテナコイル自体の形状の自己保持力を高める趣旨である。 It is appropriate that the antenna coil has an inner diameter that is at least small enough to allow the IC chip to be disposed without deforming the antenna coil inside. This is intended to increase the self-holding force of the shape of the antenna coil itself.
　このアンテナコイルを巻くための方法は自由である。通常治具を利用して巻回する。なお、このとき、巻回されるアンテナコイルの隣接するコイル導体間には接着剤を配し相互間を結合するようにするのが好ましい。これは、コイルを巻回形成する際に接着剤を塗布してそのようにすることも可能であるが、熱溶融性の接着剤をコーティングしたコイル導体でアンテナコイルを形成し、その後、コイル導体表面の接着剤を熱風等を利用して加熱溶融し、これによって隣接する相互を接着結合するようにすることも可能である。このようにすることによってアンテナコイルのコイル形状の自己保持力を高めることができることになる。 The method for winding this antenna coil is free. Wind using a normal jig. At this time, it is preferable that an adhesive is provided between adjacent coil conductors of the wound antenna coil so as to couple each other. This can be done by applying an adhesive when winding the coil, but the antenna coil is formed with a coil conductor coated with a hot-melt adhesive, and then the coil conductor. It is also possible to heat-melt the adhesive on the surface using hot air or the like, thereby adhering adjacent to each other. By doing so, the self-holding force of the coil shape of the antenna coil can be increased.
　前記ＩＣチップは、以上のようにして作成されたアンテナコイルの内側、例えば、該アンテナコイルの中央部に位置決めし、その端子部に該アンテナコイルの両端を接続して電気的に接続し、かつアンテナコイルの該位置に機械的に固定する。ＩＣチップは小さく軽量であるので、アンテナコイルの形状がこれで崩されるようなことはない。なおアンテナコイルの両端と該ＩＣチップの端子部との接続は既存の種々の技法を自由に選択して行うことが可能である。勿論、強度の高い新たな接続法を採用することも自由である。ＩＣチップとして、最外層が金（Ａｕ）で構成された端子部を備えたそれを採用し、銅（Ｃｕ）製のコイル導体を用いたアンテナコイルをその端子部上に載せ、かつアンテナコイルの上から加熱しながら加圧し、両者の界面付近にＡｕ／Ｃｕ全率固溶体を形成させることにより、直接接合するようにすることも可能である。このようにすれば、両者間の結合は極めて強固になって非常に好ましい。 The IC chip is positioned inside the antenna coil created as described above, for example, at the center of the antenna coil, and electrically connected by connecting both ends of the antenna coil to the terminal portion, and It is mechanically fixed at the position of the antenna coil. Since the IC chip is small and light, the shape of the antenna coil is not destroyed by this. The connection between the both ends of the antenna coil and the terminal portion of the IC chip can be performed by freely selecting various existing techniques. Of course, it is free to adopt a new connection method with high strength. As the IC chip, an outermost layer having a terminal portion made of gold (Au) is employed, an antenna coil using a copper (Cu) coil conductor is placed on the terminal portion, and the antenna coil It is also possible to perform direct bonding by applying pressure while heating from above and forming an Au / Cu total solid solution in the vicinity of the interface between the two. In this way, the bond between the two is extremely strong, which is very preferable.
　前記容器は特定のそれに限定されない。容器は、当然、その中に収容すべきサンプル等の要求する種々の条件、或いは保管条件等によって、例えば、プラスチックやガラス等の材質、長さや径のサイズ、或いは形状等が決定されるが、それらのいずれでも対応可能である。 The container is not limited to a specific one. Naturally, for example, a material such as plastic or glass, a length or diameter size, or a shape is determined depending on various conditions required for a sample or the like to be accommodated in the container, or storage conditions. Any of them can be used.
　前記アンテナコイルと前記ＩＣチップとで構成した非接触ＩＤ識別装置は、前記のように、容器の任意の部位に配して接着剤で接合固定する。容器の側面、底面、或いは蓋の上面等のいずれの部位に接合固定することも自由である。 As described above, the non-contact ID identification device composed of the antenna coil and the IC chip is arranged at an arbitrary part of the container and bonded and fixed with an adhesive. It is free to join and fix to any part such as the side surface, bottom surface or top surface of the lid.
　このような非接触ＩＤ識別装置の容器への接着接合は、容器の所定の位置に接着剤を塗布した上で、該部位に該非接触ＩＤ識別装置を圧接すること、或いは、該非接触ＩＤ識別装置の裏面側に接着剤を塗布した上で、その非接触ＩＤ識別装置を容器の所定の位置に圧接すること、若しくは、該非接触ＩＤ識別装置を容器の所定の位置に配した上で、その上に粘度の低い接着剤を滴下することにより行うことができる。いずれも若干の乾燥時間の経過後に結合固定が確実なものになる。このような非接触ＩＤ識別装置の容器への接着固定作業は、手作業によって行うことは勿論可能であるが、自動的に行うことも当然可能である。 Such a non-contact ID identification device can be bonded to a container by applying an adhesive to a predetermined position of the container and then pressing the non-contact ID identification device to the part, or the non-contact ID identification device. After applying an adhesive on the back side of the container, the non-contact ID identification device is pressed against a predetermined position of the container, or the non-contact ID identification device is disposed at a predetermined position of the container, It can be performed by dropping an adhesive having a low viscosity. In both cases, the bonding and fixing is ensured after a slight drying time. Such an adhesion and fixing operation of the non-contact ID identification device to the container can of course be performed manually, but naturally it can also be performed automatically.
　この場合は、図４(a)、(b)、(c)、(d)に示すように、リール形状のテープ３１、４１の長さ方向に定間隔で形成した収納穴３２、３２…、４２、４２…に各々前記非接触ＩＤ識別装置３３、３３…、４３、４３…を入れておき、該テープ３１、４１を所定の作業位置を通過するように配した上で、該テープ３１、４１を間欠的にその長さ方向に移動させて、該作業位置で収納穴３２、４２中の非接触ＩＤ識別装置３３、４３を供給し、他方、同じタイミングで該作業位置に順次運ばれる対象容器の所定の部位に、該非接触ＩＤ識別装置３３、４３を接着接合するようにすることができる。なお、図中３４、４４は位置決め穴である。 In this case, as shown in FIGS. 4 (a), (b), (c), (d), the storage holes 32, 32,... Formed at regular intervals in the length direction of the reel-shaped tapes 31, 41, 42, 42... Are placed in the non-contact ID identification devices 33, 33... 43, 43, respectively, and the tapes 31, 41 are arranged so as to pass through a predetermined working position. 41 is intermittently moved in the length direction thereof, and the non-contact ID identification devices 33 and 43 in the storage holes 32 and 42 are supplied at the work position, and on the other hand, the objects sequentially carried to the work position at the same timing The non-contact ID identification devices 33 and 43 can be adhesively bonded to a predetermined part of the container. In the figure, 34 and 44 are positioning holes.
　上記接着接合は、例えば、所定の作業位置に届いた非接触ＩＤ識別装置を、順次、取り出し装置で取り出し、更に接着剤の塗布装置でその裏面側に接着剤の塗布を行い、同様に同じタイミングで届いている前記所定の容器の所定の部位に、該非接触ＩＤ識別装置の裏面側を当接し、圧接することで行うことができる。 In the above-mentioned adhesive bonding, for example, the non-contact ID identification device that has arrived at a predetermined work position is sequentially taken out by the take-out device, and further, the adhesive is applied to the back side thereof by the adhesive applicator. Can be carried out by bringing the back surface side of the non-contact ID identification device into contact with a predetermined part of the predetermined container that has been received in step (1).
　或いは、所定の作業位置に届いた非接触ＩＤ識別装置を、順次、取り出し装置で取り出し、他方、同様に同じタイミングで届いている前記所定の容器の所定の部位に、接着剤の塗布装置でその塗布を行い、次いで、該容器の該接着剤の塗布が行われている部位に、該非接触ＩＤ識別装置の裏面側を当接し、圧接することで行うことができる。 Alternatively, the non-contact ID identification device that has reached the predetermined work position is sequentially taken out by the take-out device, and on the other hand, the adhesive application device is applied to the predetermined portion of the predetermined container that has arrived at the same timing. Application can be performed, and then the back side of the non-contact ID identification device is brought into contact with and pressed against the portion of the container where the adhesive is applied.
　若しくは、所定の作業位置に届いた非接触ＩＤ識別装置を、順次、取り出し装置で取り出し、この非接触ＩＤ識別装置を、同様に同じタイミングで届いている前記所定の容器の所定の部位に配し、続いてその上から液状の接着剤を滴下することで行うことができる。 Alternatively, the non-contact ID identification device that has arrived at the predetermined work position is sequentially taken out by the take-out device, and this non-contact ID identification device is similarly arranged at a predetermined part of the predetermined container that has arrived at the same timing. Subsequently, a liquid adhesive can be dropped from above.
　本発明の非接触ＩＤ識別装置は、前記のように、その形状を自己保持することができるものであるから、以上のように、リール形状のテープ３１、４１の収納穴３２、４２に配して、以上のような容器への取り付け作業を自動化することも可能となるものである。
　また取り付け作業の自動化ばかりでなく、以上のようなテープ３１、４１に収納して、保管、運搬等に供することができるのも云うまでもない。 Since the non-contact ID identification device of the present invention can hold its shape as described above, it is arranged in the storage holes 32 and 42 of the reel-shaped tapes 31 and 41 as described above. Thus, it is possible to automate the above-described attachment work to the container.
Needless to say, not only can the mounting operation be automated, but the tape can be stored, transported, etc. by being stored in the tapes 31 and 41 as described above.
　ところで、このように容器の任意の部位に接合固定する非接触ＩＤ識別装置は、裏面側に配した接着剤により結果的に補強されているので、容器に単に接着接合した状態で十分な強度を有しており、外部の種々の物品等に接触してもこれが容易に損傷を生じることはない。しかし、該非接触ＩＤ識別装置の外面側を更に低融点ガラス又は第２の接着剤等の被覆材で保護することは好ましい。これによって非接触ＩＤ識別装置の外部の物品等と接触した場合に生じうる損傷からの保護を一層確実にする趣旨である。なおこの被覆材として第２の接着剤を採用した場合は、この第２の接着剤を接合固定用の接着剤と分けることなく同質のそれを同時に施しても良いことは云うまでもない。 By the way, the non-contact ID identification device that is bonded and fixed to an arbitrary part of the container in this way is reinforced as a result by the adhesive disposed on the back surface side, so that it has sufficient strength in a state where it is simply bonded and bonded to the container. It does not easily cause damage even if it contacts various external articles. However, it is preferable to further protect the outer surface side of the non-contact ID identification device with a coating material such as a low-melting glass or a second adhesive. The purpose of this is to further ensure protection from damage that may occur when contacting an article or the like outside the non-contact ID identification device. Needless to say, when the second adhesive is employed as the covering material, the same adhesive may be applied simultaneously without separating the second adhesive from the adhesive for bonding and fixing.
　従って本発明の非接触ＩＤ識別装置付き容器及びその製造方法によれば、以上のように、非接触ＩＤ識別装置自体が、整列巻きしたアンテナコイルの内側にＩＣチップを配して構成したもので、小型であり、更にキャリアを用いることなく、直接に容器に配して接着接合したものであるため、容器は極めて小型の非接触ＩＤ識別装置のみが付属している態様となり、その膨らみは極めて小さなものとなる。そのため、その容器の保管上、運搬上その他の取り扱い上に於いて、形状、寸法上の何らかの不都合が生じる虞は殆ど無い。従って、当然、その内容物であるサンプルその他の物の取り扱い上も不都合が生じる虞は殆どない。 Therefore, according to the container with a non-contact ID identification device and the manufacturing method thereof according to the present invention, as described above, the non-contact ID identification device itself is configured by arranging an IC chip inside the aligned antenna coil. Because it is small and is directly arranged and adhesively bonded to the container without using a carrier, the container is attached with only a very small non-contact ID identification device, and its bulge is extremely It will be small. Therefore, there is almost no risk of any inconvenience in terms of shape and dimensions in storage, transportation and other handling of the container. Therefore, as a matter of course, there is almost no risk of inconvenience in handling the sample or the other contents.
　以上に於いて、前記非接触ＩＤ識別装置は、アンテナコイルを整列巻きにより小型に構成し、その内側にＩＣチップを配して、その端子部に該アンテナコイルの両端を接続することによってそれ自体の形状を自己保持できるようにしたものであり、それ故、これを、前記のように、キャリアに配することなく、直接に容器に接着接合することを可能ならしめたものである。 In the above, the non-contact ID identification device itself is configured by configuring the antenna coil in a small size by aligning windings, arranging an IC chip inside thereof, and connecting both ends of the antenna coil to the terminal portion thereof. Thus, it is possible to directly bond and bond the shape to the container without placing it on the carrier as described above.
　前記非接触ＩＤ識別装置は、アンテナコイルを複数段（複数層）に巻くことにより、その径を小さくし、同時に形状を自己保持する自己保持力を高めたものでもある。また、前記のように、アンテナコイルの隣接するコイル導体間に接着剤を配して相互を結合することにより、形状を自己保持する自己保持力を更に高めたものである。 The non-contact ID identification device is a device in which the antenna coil is wound in a plurality of stages (multiple layers) to reduce its diameter and at the same time increase the self-holding force for self-holding the shape. In addition, as described above, the self-holding force for self-holding the shape is further enhanced by arranging an adhesive between adjacent coil conductors of the antenna coil and bonding them together.
　更に前記したように、容器の任意の位置に配した非接触ＩＤ識別装置を接着接合することに加えて、該非接触ＩＤ識別装置を被覆材で被覆することにより、その保護を図り、該容器の取り扱いの際等に外部の何物かに接触しても容易に損傷を生じることにないようにしたものでもある。 Further, as described above, in addition to adhesively bonding the non-contact ID identification device disposed at an arbitrary position of the container, the non-contact ID identification device is covered with a covering material, thereby protecting the non-contact ID identification device. It is also designed to prevent damage from being easily caused even if it touches something outside during handling.
　外径φ４．０ｍｍ、内径φ１．６ｍｍ、厚さ０．４ｍｍの４５ターン整列巻きアンテナコイル（銅導線製）１の内側に一辺□１．０ｍｍ、厚さ０．２５ｍｍの正方形のＩＣチップ２を配し、該アンテナコイル１の両端（入出力端）を該ＩＣチップ２の二つの端子部の金バンプ２ａ、２ａ上に載せて加熱加圧し、アンテナコイル１を構成する銅導線と金バンプ２ａ、２ａとの界面にＡｕ－Ｃｕ全率固溶体を形成させて接続したＩＣタグ（非接触ＩＤ識別装置）３を用意した。 A square IC chip 2 with a side of □ 1.0 mm and a thickness of 0.25 mm is placed inside a 45-turn aligned wound antenna coil (made of copper conductor) 1 having an outer diameter of 4.0 mm, an inner diameter of 1.6 mm, and a thickness of 0.4 mm. The both ends (input / output ends) of the antenna coil 1 are placed on the gold bumps 2a and 2a of the two terminal portions of the IC chip 2 and heated and pressed, and the copper conductor and the gold bump 2a constituting the antenna coil 1 are placed. An IC tag (non-contact ID identification device) 3 connected by forming an Au—Cu total solid solution at the interface with 2a was prepared.
　このＩＣタグ３は、図１(a)、(b)に示すように、アンテナコイル１の金バンプ２ａ、２ａまでの延長部であるリード部の寸法が短く、かつＩＣチップ２は、云うまでもなく、軽量であるため、その形状を保持する自己保持性が極めて高い特徴を有する。従ってこのＩＣタグ３は、前記のように、その形状を保持するためのキャリアを必要としない。 As shown in FIGS. 1 (a) and 1 (b), the IC tag 3 has a short lead dimension which is an extension of the antenna coil 1 to the gold bumps 2a and 2a. In addition, since it is lightweight, it has a feature of extremely high self-holding ability to hold its shape. Therefore, the IC tag 3 does not require a carrier for maintaining its shape as described above.
　このＩＣタグ３を、図１(a)、(b)に示すように、上下反転させて位置させた、外径φ１０ｍｍのポリテトラフルオロエチレン製の平底の試験管４の底の上に載せ、その後その上から、接着剤（低温ワニス：ＧＥ社製C5-101（商品名））をトルエンとエタノールの１：１混合液で約１５ポアズに希釈して滴下した。該接着剤の滴下量は該ＩＣタグ３がその中に沈む量とした。滴下後、室温で約１５分間乾燥して硬化させた。図１(a)、(b)中、５は硬化した接着剤である。 As shown in FIGS. 1 (a) and 1 (b), the IC tag 3 is placed on the bottom of a flat-bottomed test tube 4 made of polytetrafluoroethylene having an outer diameter of 10 mm, which is positioned upside down. Thereafter, an adhesive (low-temperature varnish: C5-101 (trade name) manufactured by GE) was diluted to about 15 poise with a 1: 1 mixture of toluene and ethanol, and added dropwise. The dropping amount of the adhesive was such that the IC tag 3 sinks therein. After dripping, it was dried and cured at room temperature for about 15 minutes. In FIGS. 1 (a) and 1 (b), 5 is a cured adhesive.
　以上のＩＣタグ３付き試験管４を、温度サイクル恒温槽内に配置し、－５５℃と１５０℃の間を往復する温度サイクルを２時間に１回の割合で１０００サイクル繰り返し、その試験の終了後に、該試験管４の底部のＩＣタグ３の状態を観察した。その結果、アンテナコイル１を構成する銅線は酸化されて茶褐色になったが、ＩＣタグ３は剥離することなく外観上良好な状態を維持していた。更にマイナスドライバの先端を試験管４の表面と硬化した接着剤５の間に差し込む態様で押しても人力で容易に剥離することはなかった。十分良好な接着力を維持していると考えられる。またＩＣタグ３と通信テストをしたところ、その機能は全く損なわれていなかった。通信テストは、硬化した接着剤５の外面を、前記マイナスドライバのグリップ側で該試験管４が壊れない程度に５回ほど打撃した後に更に行ってみたが、その機能はやはり全く損なわれていなかった。硬化した接着剤５による保護効果も十分である。 The test tube 4 with the above IC tag 3 is placed in a temperature cycle thermostat and the temperature cycle reciprocating between −55 ° C. and 150 ° C. is repeated 1000 times every 2 hours, and the test is completed. Later, the state of the IC tag 3 at the bottom of the test tube 4 was observed. As a result, the copper wire constituting the antenna coil 1 was oxidized and turned brown, but the IC tag 3 was maintained in a good appearance without peeling off. Furthermore, even if the tip of the minus driver was pushed in such a manner that it was inserted between the surface of the test tube 4 and the cured adhesive 5, it was not easily peeled off manually. It is considered that a sufficiently good adhesive force is maintained. When a communication test with the IC tag 3 was performed, the function was not impaired at all. The communication test was further performed after hitting the outer surface of the cured adhesive 5 about 5 times on the grip side of the minus driver so that the test tube 4 was not broken, but its function was not impaired at all. It was. The protective effect of the cured adhesive 5 is sufficient.
　外径φ１２．５ｍｍ、内径φ１１ｍｍ、厚さ０．２５ｍｍの１５ターン整列巻きアンテナコイル（銅導線製）１１の内側に一辺□１．０ｍｍ、厚さ０．２５ｍｍの正方形のＩＣチップ２を配し、該アンテナコイル１１の両端（入出力端）を該ＩＣチップ２の二つの端子部の金バンプ２ａ、２ａ上に載せて加熱加圧し、アンテナコイル１１を構成する銅導線と金バンプ２ａ、２ａとの界面にＡｕ－Ｃｕ全率固溶体を形成させて接続したＩＣタグ（非接触ＩＤ識別装置）１３を用意した。 A square IC chip 2 with a side of □ 1.0 mm and a thickness of 0.25 mm is arranged inside a 15-turn aligned wound antenna coil (made of copper conducting wire) 11 having an outer diameter of φ12.5 mm, an inner diameter of φ11 mm, and a thickness of 0.25 mm. The both ends (input / output ends) of the antenna coil 11 are placed on the gold bumps 2a and 2a of the two terminal portions of the IC chip 2 and heated and pressed, and the copper conductors and the gold bumps 2a and 2a constituting the antenna coil 11 are applied. An IC tag (non-contact ID identification device) 13 was prepared by forming an Au—Cu total solid solution at the interface with the interface.
　このＩＣタグ１３は、図２(a)、(b)に示すように、実施例１のＩＣタグ３のそれと同様に、アンテナコイル１１の金バンプ２ａ、２ａまでの延長部であるリード部の寸法が短く、かつＩＣチップ２は軽量であるため、その形状を保持する自己保持力が極めて高い。従ってこのＩＣタグ１３は、実施例１のＩＣタグ３と同様に、その形状を保持するためのキャリアを必要としない。 As shown in FIGS. 2 (a) and 2 (b), this IC tag 13 is similar to that of the IC tag 3 of the first embodiment, and has a lead portion that is an extension of the antenna coil 11 to the gold bumps 2a and 2a. Since the dimensions are short and the IC chip 2 is lightweight, the self-holding force for holding the shape is extremely high. Therefore, the IC tag 13 does not require a carrier for maintaining its shape, like the IC tag 3 of the first embodiment.
　このＩＣタグ１３を、図２(a)、(b)に示すように、外径φ１０ｍｍのフルオロエチレンプロピレン製の試験管１４の蓋１４ａの上に載せ、その後その上から接着剤（アロンメルトPES-IIIEHW（商品名、東亜合成株式会社製）を滴下した。該接着剤の滴下量は該ＩＣタグ１３がその中に沈む量とした。滴下後、室温で約１５分間乾燥して硬化させた。図２(a)、(b)中、１５は硬化した接着剤である。 As shown in FIGS. 2 (a) and 2 (b), the IC tag 13 is placed on a lid 14a of a test tube 14 made of fluoroethylene propylene having an outer diameter of 10 mm, and then an adhesive (Aron Melt PES- IIIEHW (trade name, manufactured by Toa Gosei Co., Ltd.) was added dropwise, and the amount of the adhesive dropped into the IC tag 13. After dropping, the adhesive was dried and cured at room temperature for about 15 minutes. 2 (a) and 2 (b), reference numeral 15 denotes a cured adhesive.
　以上のＩＣタグ１３を蓋１４ａの上面に固設した試験管１４を液体窒素蒸気（－１４０℃）中に暴露して１か月放置し、その後取り出して、ＩＣタグ１３の機能及びＩＣタグ１３と試験管１４の蓋１４ａとの結合状態をテストした。ＩＣタグ１３の機能は、実施例１と同様に、通信テストを行ったところ、その機能は全く損なわれていなかった。また試験管１４の蓋１４ａとの結合状態のテストは、マイナスドライバの先端を該蓋１４ａの表面と硬化した接着剤１５の間に差し込む態様で押して行ったが、硬化した接着剤１５は人力で容易に剥離することはなかった。良好な接着力を維持していると判断できる。更に前記通信テストに加えて、更に、硬化した接着剤１５の外面を、前記マイナスドライバのグリップ側で該試験管１４が壊れない程度に５回ほど打撃した後に更に通信テストを行ってみたが、その機能はやはり全く損なわれていなかった。硬化した接着剤１５による保護効果も十分である。 The test tube 14 in which the above IC tag 13 is fixed on the upper surface of the lid 14a is exposed to liquid nitrogen vapor (-140 ° C.) and left for one month, then taken out, and the function of the IC tag 13 and the IC tag 13 And the connection state of the test tube 14 with the lid 14a. The function of the IC tag 13 was not impaired at all when a communication test was performed in the same manner as in Example 1. In addition, the test of the coupling state of the test tube 14 with the lid 14a was performed by pushing the tip of a flat-blade screwdriver between the surface of the lid 14a and the cured adhesive 15, but the cured adhesive 15 was manually applied. It did not peel easily. It can be judged that good adhesive strength is maintained. Furthermore, in addition to the communication test, a further communication test was performed after hitting the outer surface of the cured adhesive 15 about 5 times so that the test tube 14 was not broken on the grip side of the minus driver. Its function was still intact. The protective effect of the cured adhesive 15 is sufficient.
　外径φ１０．５ｍｍ、内径φ５．０ｍｍ、厚さ０．３ｍｍの１８ターン整列巻きアンテナコイル（銅導線製）２１の内側に一辺□１．０ｍｍ、厚さ０．２５ｍｍの正方形のＩＣチップ２を配し、該アンテナコイル２１の両端（入出力端）を該ＩＣチップ２の二つの端子部の金バンプ２ａ、２ａ上に載せて加熱加圧し、アンテナコイル２１を構成する銅導線と金バンプ２ａ、２ａとの界面にＡｕ－Ｃｕ全率固溶体を形成させて接続したＩＣタグ（非接触ＩＤ識別装置）２３を用意した。 A square IC chip 2 having a side of □ 1.0 mm and a thickness of 0.25 mm is placed inside an 18-turn aligned wound antenna coil (made of copper conductor) 21 having an outer diameter of 10.5 mm, an inner diameter of 5.0 mm, and a thickness of 0.3 mm. The both ends (input / output ends) of the antenna coil 21 are placed on the gold bumps 2a and 2a of the two terminal portions of the IC chip 2 and heated and pressed, and the copper conductor and the gold bump 2a constituting the antenna coil 21 are placed. An IC tag (non-contact ID identification device) 23 was prepared in which an Au—Cu total solid solution was formed at the interface with 2a and connected.
　このＩＣタグ２３は、図３(a)、(b)に示すように、実施例１、２のＩＣタグ３、１３のそれと同様に、アンテナコイル２１の金バンプ２ａ、２ａまでの延長部であるリード部の寸法が短く、かつＩＣチップ２は軽量であるため、その形状を保持する自己保持力が極めて高い。従ってこのＩＣタグ２３は、実施例１、２のＩＣタグ３、１３と同様に、その形状を保持するためのキャリアを必要としない。 As shown in FIGS. 3A and 3B, the IC tag 23 is an extension of the antenna coil 21 up to the gold bumps 2a and 2a, like the IC tags 3 and 13 of the first and second embodiments. Since the size of a certain lead portion is short and the IC chip 2 is lightweight, the self-holding force for holding the shape is extremely high. Therefore, like the IC tags 3 and 13 of the first and second embodiments, the IC tag 23 does not require a carrier for holding the shape.
　このＩＣタグ２３を、図３(a)、(b)に示すように、上下反転させた、外径φ１５ｍｍのポリテトラフルオロエチレン製の試験管２４の丸底型の底の上に載せ、その後その上から接着剤（低温ワニス：ＧＥ社製C5-101（商品名））をトルエンとエタノールの１：１混合液で約１５ポアズに希釈して滴下した。該接着剤の滴下量は該ＩＣタグ２３がその中にほぼ沈む量とした。滴下後、室温で約１５分間乾燥して硬化させた。その後更にその上に第２の接着剤であるシアノアクリレート系接着剤C5-105（商品名、オックスフォード社製）を滴下し、完全にＩＣタグ２３を被覆するようにした。滴下後、室温で約１５分間乾燥して硬化させた。図３(a)、(b)中、２５は硬化した接着剤、３５は硬化した第２の接着剤（被覆材）である。 As shown in FIGS. 3 (a) and 3 (b), this IC tag 23 is placed on the bottom of a round bottom type of a test tube 24 made of polytetrafluoroethylene having an outer diameter of 15 mm and turned upside down. On top of that, an adhesive (low temperature varnish: C5-101 (trade name) manufactured by GE) was diluted to about 15 poise with a 1: 1 mixture of toluene and ethanol and added dropwise. The dropping amount of the adhesive was such that the IC tag 23 almost sinks therein. After dripping, it was dried and cured at room temperature for about 15 minutes. Thereafter, a cyanoacrylate adhesive C5-105 (trade name, manufactured by Oxford), which is the second adhesive, was further dropped thereon to completely cover the IC tag 23. After dripping, it was dried and cured at room temperature for about 15 minutes. 3 (a) and 3 (b), 25 is a cured adhesive, and 35 is a cured second adhesive (covering material).
　以上のＩＣタグ２３を底に固設した試験管２４を恒温槽中に入れて２２０℃に保持して１ヶ月間保管した。その後取り出してＩＣタグ２３の機能及びＩＣタグ２３と試験管２４との結合状態をテストした。まず初めに該試験管２４の底部のＩＣタグ２３の状態を目視により観察した。その結果、アンテナコイル２１を構成する銅線は酸化されて黒褐色になったが、ＩＣタグ２３は剥離することなく外観上良好な状態を維持していた。次に実施例１、２と同様に通信テストを行ったところ、ＩＣタグ２３の機能は全く損なわれていなかった。また試験管２４との結合状態のテストを、マイナスドライバの先端を試験管２４の表面と硬化した第２の接着剤３５との間に差し込む態様で押して行ったが、硬化した第２の接着剤３５が人力で剥離することはなかった。良好な接着力を十分に維持していると判断できる。更に前記通信テストに加えて、硬化した第２の接着剤３５の外面を、前記マイナスドライバのグリップ側で該試験管２４が壊れない程度に５回ほど打撃した後に更に通信テストを行ってみたが、その機能はやはり全く損なわれていなかった。硬化した第２の接着剤３５による保護効果も十分である。 The test tube 24 having the above IC tag 23 fixed on the bottom was put in a thermostatic bath, kept at 220 ° C. and stored for one month. Thereafter, the IC tag 23 was taken out and the function of the IC tag 23 and the coupling state between the IC tag 23 and the test tube 24 were tested. First, the state of the IC tag 23 at the bottom of the test tube 24 was visually observed. As a result, the copper wire constituting the antenna coil 21 was oxidized to become blackish brown, but the IC tag 23 was maintained in a good appearance without peeling off. Next, when a communication test was performed in the same manner as in Examples 1 and 2, the function of the IC tag 23 was not impaired at all. In addition, the test of the coupling state with the test tube 24 was performed by pushing the tip of the minus driver in a mode of being inserted between the surface of the test tube 24 and the cured second adhesive 35, but the cured second adhesive 35 was not peeled off manually. It can be judged that good adhesive strength is sufficiently maintained. Furthermore, in addition to the communication test, the communication test was further performed after hitting the outer surface of the cured second adhesive 35 about 5 times so that the test tube 24 was not broken on the grip side of the minus driver. The function was not impaired at all. The protective effect of the cured second adhesive 35 is sufficient.
　医学、農学、或いは化学の諸分野で各種の多数のサンプルを試験管のような容器に収容し、これらの容器に内容物の識別手段を施した上で保管し、必要に応じて分類し、或いは、種々のテストを行い、得られた情報を記録する等の処理が行われている。このような分野の内容物の識別手段を施した容器及びその製造方法として、本発明の非接触ＩＤ識別装置付き容器及びその製造方法を適用することができる。 Numerous samples in various fields of medicine, agriculture, or chemistry are stored in containers such as test tubes, and these containers are stored after content identification means, and classified as necessary. Alternatively, various tests are performed and processing such as recording the obtained information is performed. The container with the non-contact ID identification device of the present invention and the manufacturing method thereof can be applied as the container having the content identifying means in such a field and the manufacturing method thereof.

Claims (34)

  1. 　収容物の識別のために、マイクロプロセッサを含むＩＣチップ並びに該ＩＣチップと外部のリーダとの間の電力の授受及び情報の交換を行うアンテナコイルで構成した非接触ＩＤ識別装置を取り付けた非接触ＩＤ識別装置付きの容器であって、
    　前記非接触ＩＤ識別装置が、前記アンテナコイルを整列巻きし、かつ該ＩＣチップを該アンテナコイルの内側に配して構成したものであり、
    　前記非接触ＩＤ識別装置を直接にその任意の部位に接着接合して構成した非接触ＩＤ識別装置付き容器。     Non-contact ID identification device comprising an IC chip including a microprocessor and an antenna coil for exchanging power and exchanging information between the IC chip and an external reader for identification of the contents A container with an ID identification device,
    The non-contact ID identification device is configured such that the antenna coil is wound in an aligned manner, and the IC chip is arranged inside the antenna coil.
    A container with a non-contact ID identification device formed by directly bonding and bonding the non-contact ID identification device to an arbitrary part thereof.
  2. 　前記アンテナコイルの内径を、少なくともその内側に該アンテナコイルを変形させることなく前記ＩＣチップを配し得る限度の小径に構成した請求項１の非接触ＩＤ識別装置付き容器。 The container with a non-contact ID identification device according to claim 1, wherein the inner diameter of the antenna coil is configured to be small enough to allow the IC chip to be disposed without deforming the antenna coil at least inside thereof.
  3. 　容器に、その収容物の識別のために、マイクロプロセッサを含むＩＣチップ並びに該ＩＣチップと外部のリーダとの間の電力の授受及び情報の交換を行うアンテナコイルで構成した非接触ＩＤ識別装置を取り付ける非接触ＩＤ識別装置付き容器の製造方法であって、
    　前記非接触ＩＤ識別装置が、前記アンテナコイルを整列巻きし、かつ該ＩＣチップを該アンテナコイルの内側に配して構成したものであり、
    　前記非接触ＩＤ識別装置を直接に前記容器の任意の部位に配して接着接合することにより請求項１の非接触ＩＤ識別装置付き容器を製造する非接触ＩＤ識別装置付き容器の製造方法。     A non-contact ID identification device comprising an IC chip including a microprocessor and an antenna coil for exchanging power and exchanging information between the IC chip and an external reader for identifying the contents of the container. A method of manufacturing a container with a non-contact ID identification device to be attached,
    The non-contact ID identification device is configured such that the antenna coil is wound in an aligned manner, and the IC chip is arranged inside the antenna coil.
    The manufacturing method of the container with a non-contact ID identification device which manufactures the container with a non-contact ID identification device of Claim 1 by arrange | positioning the said non-contact ID identification device directly to the arbitrary site | parts of the said container, and adhesively bonding.
  4. 　容器に、その収容物の識別のために、マイクロプロセッサを含むＩＣチップ並びに該ＩＣチップと外部のリーダとの間の電力の授受及び情報の交換を行うアンテナコイルで構成した非接触ＩＤ識別装置を取り付ける非接触ＩＤ識別装置付き容器の製造方法であって、
    　前記非接触ＩＤ識別装置が、前記アンテナコイルを整列巻きし、かつ該ＩＣチップを該アンテナコイルの内側に配して構成したものであり、
    　前記非接触ＩＤ識別装置を直接に前記容器の任意の部位に配して接着接合することにより請求項２の非接触ＩＤ識別装置付き容器を製造する非接触ＩＤ識別装置付き容器の製造方法。     A non-contact ID identification device comprising an IC chip including a microprocessor and an antenna coil for exchanging power and exchanging information between the IC chip and an external reader for identifying the contents of the container. A method of manufacturing a container with a non-contact ID identification device to be attached,
    The non-contact ID identification device is configured such that the antenna coil is wound in an aligned manner, and the IC chip is arranged inside the antenna coil.
    The manufacturing method of the container with a non-contact ID identification device which manufactures the container with a non-contact ID identification device of Claim 2 by arrange | positioning the said non-contact ID identification device directly to the arbitrary parts of the said container, and adhesively bonding.
  5. 　前記アンテナコイルの内径を、少なくともその内側に該アンテナコイルを変形させることなく前記ＩＣチップを配し得る限度の小径に構成した請求項３の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 3, wherein the inner diameter of the antenna coil is configured to be small enough to allow the IC chip to be disposed at least without deforming the antenna coil.
  6. 　前記アンテナコイルの内径を、少なくともその内側に該アンテナコイルを変形させることなく前記ＩＣチップを配し得る限度の小径に構成した請求項４の非接触ＩＤ識別装置付き容器の製造方法。 The method of manufacturing a container with a non-contact ID identification device according to claim 4, wherein the inner diameter of the antenna coil is configured to be small enough to allow the IC chip to be disposed without deforming the antenna coil at least inside thereof.
  7. 　前記アンテナコイルを複数段に巻いた請求項３の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 3, wherein the antenna coil is wound in a plurality of stages.
  8. 　前記アンテナコイルを複数段に巻いた請求項４の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 4, wherein the antenna coil is wound in a plurality of stages.
  9. 　前記アンテナコイルを複数段に巻いた請求項５の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 5, wherein the antenna coil is wound in a plurality of stages.
  10. 　前記アンテナコイルを複数段に巻いた請求項６の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 6, wherein the antenna coil is wound in a plurality of stages.
  11. 　前記アンテナコイルの隣接するコイル導体間を接着剤で結合した請求項３の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 3, wherein adjacent coil conductors of the antenna coil are coupled with an adhesive.
  12. 　前記アンテナコイルの隣接するコイル導体間を接着剤で結合した請求項４の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 4, wherein adjacent coil conductors of the antenna coil are coupled with an adhesive.
  13. 　前記アンテナコイルの隣接するコイル導体間を接着剤で結合した請求項５の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 5, wherein adjacent coil conductors of the antenna coil are coupled with an adhesive.
  14. 　前記アンテナコイルの隣接するコイル導体間を接着剤で結合した請求項６の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 6, wherein the coil conductors adjacent to each other of the antenna coil are coupled with an adhesive.
  15. 　前記アンテナコイルの隣接するコイル導体間を接着剤で結合した請求項７の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 7, wherein adjacent coil conductors of the antenna coil are coupled with an adhesive.
  16. 　前記アンテナコイルの隣接するコイル導体間を接着剤で結合した請求項８の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 8, wherein adjacent coil conductors of the antenna coil are coupled with an adhesive.
  17. 　前記アンテナコイルの隣接するコイル導体間を接着剤で結合した請求項９の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 9, wherein adjacent coil conductors of the antenna coil are coupled with an adhesive.
  18. 　前記アンテナコイルの隣接するコイル導体間を接着剤で結合した請求項１０の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 10, wherein adjacent coil conductors of the antenna coil are coupled with an adhesive.
  19. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項３の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 3, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  20. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項４の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 4, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  21. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項５の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 5, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  22. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項６の非接触ＩＤ識別装置付き容器の製造方法。 The method of manufacturing a container with a non-contact ID identification device according to claim 6, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  23. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項７の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 7, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  24. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項８の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 8, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  25. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項９の非接触ＩＤ識別装置付き容器の製造方法。 10. The method of manufacturing a container with a non-contact ID identification device according to claim 9, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  26. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項１０の非接触ＩＤ識別装置付き容器の製造方法。 The method of manufacturing a container with a non-contact ID identification device according to claim 10, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  27. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項１１の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 11, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  28. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項１２の非接触ＩＤ識別装置付き容器の製造方法。 The method of manufacturing a container with a non-contact ID identification device according to claim 12, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  29. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項１３の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 13, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  30. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項１４の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 14, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  31. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項１５の非接触ＩＤ識別装置付き容器の製造方法。 The method of manufacturing a container with a non-contact ID identification device according to claim 15, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  32. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項１６の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 16, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  33. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項１７の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 17, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
  34. 　前記容器に配した前記非接触ＩＤ識別装置を被覆すべく被覆材を施した請求項１８の非接触ＩＤ識別装置付き容器の製造方法。 The method for manufacturing a container with a non-contact ID identification device according to claim 18, wherein a coating material is applied to cover the non-contact ID identification device arranged in the container.
PCT/JP2009/000442 2008-02-21 2009-02-05 Container having noncontact id discrimination device, and method for manufacturing the same WO2009104362A1 (en)

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JP2018082677A (en) * 2016-11-25 2018-05-31 正成 桑山 Egg cryopreservation container
EP3514550A4 (en) * 2016-09-13 2019-09-11 FUJIFILM Corporation Pcr tube, rfid specimen managing system, and rfid specimen managing method
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EP3514550A4 (en) * 2016-09-13 2019-09-11 FUJIFILM Corporation Pcr tube, rfid specimen managing system, and rfid specimen managing method
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