WO2009091333A3 - Method and apparatus for laminating a bumped wafer - Google Patents
Method and apparatus for laminating a bumped wafer Download PDFInfo
- Publication number
- WO2009091333A3 WO2009091333A3 PCT/SG2008/000014 SG2008000014W WO2009091333A3 WO 2009091333 A3 WO2009091333 A3 WO 2009091333A3 SG 2008000014 W SG2008000014 W SG 2008000014W WO 2009091333 A3 WO2009091333 A3 WO 2009091333A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- tape
- laminate
- laminating
- vaccuum
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Abstract
The present invention relates to an improved lamination process for a semiconductor wafer by reducing the occurrence of air bubbles between the wafer and the backgrinding tape in a vaccuum environment. A pre-cut laminate tape is held by vaccuum suction means and air is blown in an airbrushing manner to push the laminating tape onto the wafer. The apparatus provides a laminate tape reel loading and dispensing mechanism (30) which includes a tape dispenser (32) and a mechanism (50) for loading a cassette of stacked wafers. A robotic arm places wafers from the cassette on a table (52) which holds a wafer (54) to be laminated. An upper carriage (72) is able to pick up the laminate tape (35) and adheres the tape onto the wafer (54). The laminate tape (35) is supplied in a bobbin (34) and is pre-cut (35a) to a shape covering the corresponding topographic surface of the wafer (54).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2008/000014 WO2009091333A2 (en) | 2008-01-14 | 2008-01-14 | Method and apparatus for laminating a bumped wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2008/000014 WO2009091333A2 (en) | 2008-01-14 | 2008-01-14 | Method and apparatus for laminating a bumped wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009091333A2 WO2009091333A2 (en) | 2009-07-23 |
WO2009091333A3 true WO2009091333A3 (en) | 2009-12-30 |
Family
ID=40885835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SG2008/000014 WO2009091333A2 (en) | 2008-01-14 | 2008-01-14 | Method and apparatus for laminating a bumped wafer |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009091333A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5687647B2 (en) * | 2012-03-14 | 2015-03-18 | 株式会社東芝 | Semiconductor device manufacturing method and semiconductor manufacturing apparatus |
JP6871812B2 (en) * | 2017-06-21 | 2021-05-12 | リンテック株式会社 | Sheet pasting device and pasting method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5094709A (en) * | 1986-09-26 | 1992-03-10 | General Electric Company | Apparatus for packaging integrated circuit chips employing a polymer film overlay layer |
DE102005060456A1 (en) * | 2005-12-17 | 2007-06-28 | Schott Ag | Plastic film fabricating method for fabricating semiconductor components, involves filling fluid in area separated by film, so that pressure difference caused by filling presses film on wafer, where plastic coating is formed on film |
-
2008
- 2008-01-14 WO PCT/SG2008/000014 patent/WO2009091333A2/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5094709A (en) * | 1986-09-26 | 1992-03-10 | General Electric Company | Apparatus for packaging integrated circuit chips employing a polymer film overlay layer |
DE102005060456A1 (en) * | 2005-12-17 | 2007-06-28 | Schott Ag | Plastic film fabricating method for fabricating semiconductor components, involves filling fluid in area separated by film, so that pressure difference caused by filling presses film on wafer, where plastic coating is formed on film |
Also Published As
Publication number | Publication date |
---|---|
WO2009091333A2 (en) | 2009-07-23 |
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