WO2009072474A1 - 圧電トランス装置の製造方法及び圧電トランス装置 - Google Patents
圧電トランス装置の製造方法及び圧電トランス装置 Download PDFInfo
- Publication number
- WO2009072474A1 WO2009072474A1 PCT/JP2008/071823 JP2008071823W WO2009072474A1 WO 2009072474 A1 WO2009072474 A1 WO 2009072474A1 JP 2008071823 W JP2008071823 W JP 2008071823W WO 2009072474 A1 WO2009072474 A1 WO 2009072474A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- piezoelectric transformer
- transformer device
- pyroelectric element
- manufacturing
- electric charges
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000003990 capacitor Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/802—Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits
- H10N30/804—Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits for piezoelectric transformers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Dc-Dc Converters (AREA)
Abstract
圧電トランス装置(100)は、端子を介して回路基板に半田付けされる圧電トランス(4)と、回路基板に形成されて圧電トランス(4)の一次側電極に接続された入力回路と、この入力回路と並列に設けられた焦電対策素子(22)とを有している。焦電対策素子(22)は、例えばコンデンサや抵抗等であり、製造過程で圧電トランス(4)より先に焦電対策素子(22)が半田付けされている。このため、半田付け時の温度変化で焦電効果による電荷が発生しても、焦電対策素子(22)によって電荷を消失させることができる。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009544666A JP5622395B2 (ja) | 2007-12-05 | 2008-12-01 | 圧電トランス装置の製造方法及び圧電トランス装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-315083 | 2007-12-05 | ||
JP2007315083 | 2007-12-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009072474A1 true WO2009072474A1 (ja) | 2009-06-11 |
Family
ID=40717654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/071823 WO2009072474A1 (ja) | 2007-12-05 | 2008-12-01 | 圧電トランス装置の製造方法及び圧電トランス装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5622395B2 (ja) |
WO (1) | WO2009072474A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013033929A (ja) * | 2011-06-29 | 2013-02-14 | Canon Inc | プリント配線基板、電源装置、画像形成装置およびプリント配線基板の製造方法 |
JP2014099638A (ja) * | 2014-01-14 | 2014-05-29 | Tamura Seisakusho Co Ltd | 圧電体モジュール |
US11307525B2 (en) | 2017-02-13 | 2022-04-19 | Canon Kabushiki Kaisha | Printed circuit board mounting piezoelectric transformer |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08289568A (ja) * | 1995-02-15 | 1996-11-01 | Toto Ltd | 高電圧発生装置 |
JP2004134688A (ja) * | 2002-10-15 | 2004-04-30 | Taiheiyo Cement Corp | 圧電トランス |
JP2008193804A (ja) * | 2007-02-05 | 2008-08-21 | Canon Inc | 圧電トランス式高圧電源装置、その実装方法および画像形成装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3430668B2 (ja) * | 1994-09-16 | 2003-07-28 | 東陶機器株式会社 | 圧電トランスの実装構造 |
JP2000307166A (ja) * | 1999-04-21 | 2000-11-02 | Tdk Corp | 圧電トランスおよびそのための駆動安定化装置 |
-
2008
- 2008-12-01 WO PCT/JP2008/071823 patent/WO2009072474A1/ja active Application Filing
- 2008-12-01 JP JP2009544666A patent/JP5622395B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08289568A (ja) * | 1995-02-15 | 1996-11-01 | Toto Ltd | 高電圧発生装置 |
JP2004134688A (ja) * | 2002-10-15 | 2004-04-30 | Taiheiyo Cement Corp | 圧電トランス |
JP2008193804A (ja) * | 2007-02-05 | 2008-08-21 | Canon Inc | 圧電トランス式高圧電源装置、その実装方法および画像形成装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013033929A (ja) * | 2011-06-29 | 2013-02-14 | Canon Inc | プリント配線基板、電源装置、画像形成装置およびプリント配線基板の製造方法 |
JP2014099638A (ja) * | 2014-01-14 | 2014-05-29 | Tamura Seisakusho Co Ltd | 圧電体モジュール |
US11307525B2 (en) | 2017-02-13 | 2022-04-19 | Canon Kabushiki Kaisha | Printed circuit board mounting piezoelectric transformer |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009072474A1 (ja) | 2011-04-21 |
JP5622395B2 (ja) | 2014-11-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200742249A (en) | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus | |
TW200634915A (en) | Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus | |
WO2008102476A1 (ja) | 電子回路装置、その製造方法及び表示装置 | |
TWI266568B (en) | Method for manufacturing embedded thin film resistor on printed circuit board | |
WO2008146243A3 (en) | An electronic device comprising a convertible structure, and a method of manufacturing an electronic device | |
WO2009086496A3 (en) | Manufacturability of smd and through-hole fuses using laser process | |
DE602005016814D1 (de) | Enten | |
WO2007124050A3 (en) | Probe structures with electronic components | |
MY190601A (en) | Electronic device and method for manufacturing the same | |
MY153355A (en) | Fuse element | |
TW200632956A (en) | Laminated electronic components | |
EP1895543A3 (en) | Electric fuse circuit and electronic component | |
TW200733843A (en) | Filter and its coils connecting frame | |
WO2013023926A3 (en) | Electronic device comprising a capacitor in a holder for a circuit board and method for production thereof | |
WO2006114267A3 (en) | Electronic component and electronic configuration | |
WO2008129704A1 (ja) | 多層プリント配線板及びその製造方法 | |
WO2009011419A1 (ja) | 電子部品実装装置及びその製造方法 | |
WO2012175207A3 (de) | Elektronische baugruppe und verfahren zu deren herstellung | |
WO2008117679A1 (ja) | 抵抗変化素子およびその製造方法、並びに電子デバイス | |
WO2006044430A3 (en) | Cordless soldering tool | |
WO2011140141A3 (en) | Printed circuit board with embossed hollow heatsink pad | |
TW200636769A (en) | Laminated ceramic electronic component and method for manufacturing same | |
WO2008120513A1 (ja) | 積層基板の電極端子接続構造 | |
EP2542040A3 (en) | Printed circuit board, power supply apparatus, image forming apparatus, and printed circuit board manufacturing method | |
WO2009072474A1 (ja) | 圧電トランス装置の製造方法及び圧電トランス装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08855969 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009544666 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08855969 Country of ref document: EP Kind code of ref document: A1 |