WO2009072182A1 - 回路基板および電子機器 - Google Patents

回路基板および電子機器 Download PDF

Info

Publication number
WO2009072182A1
WO2009072182A1 PCT/JP2007/073381 JP2007073381W WO2009072182A1 WO 2009072182 A1 WO2009072182 A1 WO 2009072182A1 JP 2007073381 W JP2007073381 W JP 2007073381W WO 2009072182 A1 WO2009072182 A1 WO 2009072182A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
patterns
electronic device
layer
slit
Prior art date
Application number
PCT/JP2007/073381
Other languages
English (en)
French (fr)
Inventor
Eiji Doi
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/073381 priority Critical patent/WO2009072182A1/ja
Publication of WO2009072182A1 publication Critical patent/WO2009072182A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09245—Crossing layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　本発明は、１０層構造を有する回路基板１５０において、第１０層１５１＿１０に形成された、互いに平行に延びる複数本の導体パターンであって、各々の導体パターンが接地パターンとして用いられるスリット状グラウンドパターン１５１ｂと、第１層１５１＿１に、回路基板１５０に垂直な方向から投影したときの、第１層１５１＿１における上記の表面におけるスリット状グラウンドパターン１５１ｂが形成された領域と重なる領域に形成された、互いに平行に延びる複数本の導体パターンであって信号線として用いられるスリット状配線パターン１５１ａとを備えた。
PCT/JP2007/073381 2007-12-04 2007-12-04 回路基板および電子機器 WO2009072182A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/073381 WO2009072182A1 (ja) 2007-12-04 2007-12-04 回路基板および電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/073381 WO2009072182A1 (ja) 2007-12-04 2007-12-04 回路基板および電子機器

Publications (1)

Publication Number Publication Date
WO2009072182A1 true WO2009072182A1 (ja) 2009-06-11

Family

ID=40717368

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/073381 WO2009072182A1 (ja) 2007-12-04 2007-12-04 回路基板および電子機器

Country Status (1)

Country Link
WO (1) WO2009072182A1 (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522153U (ja) * 1975-06-24 1977-01-08
JPS6154651A (ja) * 1984-07-30 1986-03-18 ゼネラル・エレクトリツク・カンパニイ 低損失の多レベルのシリコン回路板
JPH0260185A (ja) * 1988-08-26 1990-02-28 Seiko Keiyo Kogyo Kk 回路基板
JPH05299786A (ja) * 1992-04-20 1993-11-12 Ibiden Co Ltd プリント配線板
JPH11112142A (ja) * 1997-10-01 1999-04-23 Kyocera Corp 多層配線基板
JPH11145569A (ja) * 1997-11-04 1999-05-28 Canon Inc プリント配線板及びその設計方法
JP2000244133A (ja) * 1999-02-24 2000-09-08 Kyocera Corp 多層配線基板
JP2001053454A (ja) * 1999-08-10 2001-02-23 Nec Corp 多層プリント配線板
JP2002063958A (ja) * 2000-08-17 2002-02-28 Seiko Epson Corp 電気光学装置および電子機器

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522153U (ja) * 1975-06-24 1977-01-08
JPS6154651A (ja) * 1984-07-30 1986-03-18 ゼネラル・エレクトリツク・カンパニイ 低損失の多レベルのシリコン回路板
JPH0260185A (ja) * 1988-08-26 1990-02-28 Seiko Keiyo Kogyo Kk 回路基板
JPH05299786A (ja) * 1992-04-20 1993-11-12 Ibiden Co Ltd プリント配線板
JPH11112142A (ja) * 1997-10-01 1999-04-23 Kyocera Corp 多層配線基板
JPH11145569A (ja) * 1997-11-04 1999-05-28 Canon Inc プリント配線板及びその設計方法
JP2000244133A (ja) * 1999-02-24 2000-09-08 Kyocera Corp 多層配線基板
JP2001053454A (ja) * 1999-08-10 2001-02-23 Nec Corp 多層プリント配線板
JP2002063958A (ja) * 2000-08-17 2002-02-28 Seiko Epson Corp 電気光学装置および電子機器

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